MAXIM MAX17080

19-4175; Rev 1; 5/09
AMD 2-/3-Output Mobile Serial
VID Controller
The MAX17080 is a triple-output, step-down, fixedfrequency controller for AMD’s serial VID interface (SVI)
CPU and northbridge (NB) core supplies. The MAX17080
consists of two high-current SMPSs for the CPU cores
and one 3A internal switch SMPS for the NB core. The
two CPU core SMPSs run 180° out-of-phase for true
interleaved operation, minimizing input capacitance.
The 3A internal switch SMPS runs at twice the switching
frequency of the core SMPS, reducing the size of the
external components.
The MAX17080 is fully AMD SVI compliant. Output voltages are dynamically changed through a 2-wire SVI,
allowing the SMPSs to be individually programmed to
different voltages. A slew-rate controller allows controlled transitions between VID codes and controlled
soft-start. SVI also allows each SMPS to be individually
set into a low-power pulse-skipping state.
Transient phase repeat improves the response of the
fixed-frequency architecture, reducing the total output
capacitance for the CPU core. A thermistor-based temperature sensor provides a programmable thermal-fault
output (VRHOT).
The MAX17080 includes output overvoltage protection
(OVP), undervoltage protection (UVP), and thermal protection. When any of these protection features detect a
fault, the controller shuts down. True differential current
sensing improves current limit and load-line accuracy.
The MAX17080 has an adjustable switching frequency,
allowing 100kHz to 600kHz operation per core SMPS,
and twice that for the NB SMPS.
Applications
Mobile AMD SVI Core Supplies
Multiphase CPU Core Supplies
Voltage-Positioned, Step-Down Converters
Notebook/Desktop Computers
Features
o Dual-Output Fixed-Frequency Core Supply
Controller
Split or Combinable Outputs Detected at
Power-Up
Dynamic Phase Selection Optimizes
Active/Sleep Efficiency
Transient Phase Repeat Reduces Output
Capacitance
True Out-of-Phase Operation Reduces Input
Capacitance
Programmable AC and DC Droop
Accurate Current Balance and Current Limit
Integrated Drivers for Large SynchronousRectifier MOSFETs
Programmable 100kHz to 600kHz Switching
Frequency
4V to 26V Battery Input Voltage Range
o 3A Internal Switch Northbridge SMPS
2.7V to 5.5V Input Voltage Range
2x Programmable Switching Frequency
100mΩ/50mΩ Power Switches
o ±0.5% VOUT Accuracy over Line, Load, and
Temperature
o AMD SVI-Compliant Serial Interface with
Switchable Address
o 7-Bit On-Board DAC: 0 to +1.550V Output Adjust
Range
o Integrated Boost Switches
o Adjustable Slew-Rate Control
o Power-Good (PWRGD) and Thermal-Fault
(VRHOT) Outputs
o System Power-OK (PGD_IN) Input
o Overvoltage, Undervoltage, and Thermal-Fault
Protection
o Voltage Soft-Startup and Passive Shutdown
o < 1µA Typical Shutdown Current
Ordering Information
PART
Pin Configuration appears at end of data sheet.
TEMP RANGE
PIN-PACKAGE
MAX17080GTL+
-40°C to +105°C
40 TQFN
+Denotes a lead(Pb)-free and RoHS-compliant package.
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
1
MAX17080
General Description
MAX17080
AMD 2-/3-Output Mobile Serial
VID Controller
ABSOLUTE MAXIMUM RATINGS
(Note 1)
VDD, VIN3, VCC, VDDIO to AGND ..............................-0.3V to +6V
LX2 to BST2..............................................................-6V to +0.3V
PWRGD to AGND .....................................................-0.3V to +6V
LX3 to PGND (Note 2) ..............................................-0.6V to +6V
SHDN to AGND ........................................................-0.3V to +6V
DH1 to LX1 ..............................................-0.3V to (VBST1 + 0.3V)
DH2 to LX2 ..............................................-0.3V to (VBST2 + 0.3V)
GNDS1, GNDS2, THRM, VRHOT to AGND..............-0.3V to +6V
DL1 to PGND ..............................................-0.3V to (VDD + 0.3V)
CSP_, CSN_, ILIM12 to AGND .................................-0.3V to +6V
DL2 to PGND ..............................................-0.3V to (VDD + 0.3V)
SVC, SVD, PGD_IN to AGND ...................................-0.3V to +6V
Continuous Power Dissipation (TA = +70°C)
FBDC_, FBAC_, OUT3 to AGND ..............................-0.3V to +6V
40-Pin TQFN (derate 22.2mW/°C above +70°C) .......1778mW
OSC, TIME, OPTION, ILIM3 to AGND ........-0.3V to (VCC + 0.3V)
BST1, BST2 to AGND .............................................-0.3V to +36V
Operating Temperature Range .........................-40°C to +105°C
BST1, BST2 to VDD .................................................-0.3V to +30V
Junction Temperature ......................................................+150°C
BST3 to AGND...................................(VDD - 0.3V) to (VLX3 + 6V)
Storage Temperature Range .............................-65°C to +150°C
LX1 to BST1..............................................................-6V to +0.3V
Lead Temperature (soldering, 10s) .................................+300°C
LX3 RMS Current (Note 2) .....................................................±3A
Note 1: Absolute Maximum Ratings measured with 20MHz scope bandwidth.
Note 2: LX3 has clamp diodes to PGND and IN3. If continuous current is applied through these diodes, thermal limits must be observed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(Circuit of Figure 2, VIN = 12V, VCC = VDD = VIN3 = VSHDN = VPGD_IN = 5V, VDDIO = 1.8V, VOPTION = VGNDS_ = VAGND = VPGND,
VFBDC_ = VFBAC_ = VOUT3 = VCSP_ = VCSN_ = 1.2V, all DAC codes set to the 1.2V code, TA = 0°C to +85°C, unless otherwise noted.
Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
INPUT SUPPLIES
VIN
Input Voltage Range
VCC Undervoltage-Lockout
Threshold
VBIAS
Drain of external high-side MOSFET
26
4.5
5.5
VIN3
2.7
5.5
VDDIO
1.0
2.7
VUVLO
VCC, VDD
4
VCC rising, 50mV typical hysteresis,
latched, UV fault
4.10
4.25
4.45
V
V
VCC Power-On Reset Threshold
Falling edge, typical hysteresis = 1.1V,
faults cleared and DL_ forced high when
VCC falls below this level
VDDIO Undervoltage-Lockout
Threshold
VDDIO rising, 100mV typical hysteresis,
latched, UV fault
0.7
0.8
0.9
V
VIN3 Undervoltage-Lockout
Threshold
VIN3 rising, 100mV typical hysteresis
2.5
2.6
2.7
V
5
10
mA
0.01
1
µA
10
25
µA
80
200
µA
0.01
1
µA
Quiescent Supply Current (VCC)
ICC
Skip mode, FBDC_ and OUT3 forced
above their regulation points
Quiescent Supply Currents (VDD)
IDD
Skip mode, FBDC_ and OUT3 forced
above their regulation points, TA = +25°C
Quiescent Supply Current (VDDIO)
IDDIO
Quiescent Supply Current (IN3)
Shutdown Supply Current (VCC)
2
I IN3
Skip mode, OUT3 forced above its
regulation point
SHDN = GND, TA = +25°C
1.8
_______________________________________________________________________________________
V
AMD 2-/3-Output Mobile Serial
VID Controller
(Circuit of Figure 2, VIN = 12V, VCC = VDD = VIN3 = VSHDN = VPGD_IN = 5V, VDDIO = 1.8V, VOPTION = VGNDS_ = VAGND = VPGND,
VFBDC_ = VFBAC_ = VOUT3 = VCSP_ = VCSN_ = 1.2V, all DAC codes set to the 1.2V code, TA = 0°C to +85°C, unless otherwise noted.
Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Shutdown Supply Currents (VDD)
SHDN = GND, TA = +25°C
0.01
1
µA
Shutdown Supply Current (VDDIO)
SHDN = GND, TA = +25°C
0.01
1
µA
Shutdown Supply Current (IN3)
SHDN = GND, TA = +25°C
0.01
1
µA
%
INTERNAL DACs, SLEW RATE, PHASE SHIFT
DC Output Voltage Accuracy
(Note 1)
VOUT
OUT3 Offset
Measured at FBDC_
for the core SMPSs;
measured at OUT3
for the NB SMPS;
30% duty cycle, no
load, VILIM3 = VCC,
VOUT3 = VDAC3 +
12.5mV (Note 3)
DAC codes from
0.8375V to 1.5500V
-0.5
+0.5
DAC codes from
0.5000V to 0.8250V
-5
+5
mV
DAC codes from
12.5mV to 0.4875V
VILIM3 = VCC or 3.3V
12.5
6.25
SMPS2 starts after SMPS1
SMPS3 to SMPS1 and SMPS2
Phase Shift
SMPS3 starts after SMPS1 or SMPS2
RTIME = 143k, SR = 6.25mV/µs
During
R
TIME = 35.7k to 357k,
transition
SR = 25mV/µs to 2.5mV/µs
IFBAC_
CSP_ = CSN_, TA = +25°C
FBDC_ Input Bias Current
IFBDC_
TA = +25°C
f OSC1,
f OSC2,
f OSC3
R OSC = 143k (fOSC1 = f OSC2 = 300kHz
nominal, f OSC3 = 600kHz nominal)
R OSC = 71.4k (f OSC1 = f OSC2 = 600kHz
nominal, f OSC3 = 1.2MHz nominal) to
432k (f OSC1 = f OSC2 = 99kHz nominal,
f OSC3 = 199kHz nominal)
mV
50
%
180
Degrees
25
%
-10
+10
-15
+15
Startup
FBAC_ Input Bias Current
Switching Frequency Accuracy
+10
VILIM3 = 2V or GND
SMPS1 to SMPS2 Phase Shift
Slew-Rate Accuracy
-10
1
%
mV/µs
-3
+3
µA
-250
+250
nA
-5
+5
%
-7.5
+7.5
SMPS1 AND SMPS2 CONTROLLERS
Either SMPS, PWM mode, droop disabled;
zero to full load
DC Load Regulation
Line Regulation Error
GNDS_ Input Range
VGNDS_
Either SMPS, 4V < VIN < 26V
Separate mode
GNDS_ Gain
A GNDS_
Separate: VOUT_/VGNDS_, -200mV VGNDS_
+200mV; combined: VOUT/VGNDS_,
-200mV VGNDS_ +200mV
GNDS_ Input Bias Current
I GNDS _
TA = +25°C
-0.1
%
0.03
%/V
-200
0.95
-2
1.00
+200
mV
1.05
V/V
+2
µA
_______________________________________________________________________________________
3
MAX17080
ELECTRICAL CHARACTERISTICS (continued)
MAX17080
AMD 2-/3-Output Mobile Serial
VID Controller
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 2, VIN = 12V, VCC = VDD = VIN3 = VSHDN = VPGD_IN = 5V, VDDIO = 1.8V, VOPTION = VGNDS_ = VAGND = VPGND,
VFBDC_ = VFBAC_ = VOUT3 = VCSP_ = VCSN_ = 1.2V, all DAC codes set to the 1.2V code, TA = 0°C to +85°C, unless otherwise noted.
Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
Combined-Mode Detection
Threshold
Maximum Duty Factor
Minimum On-Time
CONDITIONS
GNDS1, GNDS2, detection after REFOK,
latched, cleared by cycling SHDN
DMAX
MIN
TYP
MAX
UNITS
0.7
0.8
0.9
V
90
92
150
ns
+3
mV
t ONMIN
%
SMPS1 AND SMPS2 CURRENT LIMIT
Current-Limit Threshold
Tolerance
VLIMIT
Zero-Crossing Threshold
VZX
Idle Mode™ Threshold
VIMIN
VCSP_ - VCSN _ = 0.052 x (VREF - VILIM),
(VREF - VILM) = 0.2V to 1.0V
-3
VGND_ - VLX_, skip mode
VCSP_ - VCSN _, skip mode, 0.15 x VLIMIT
CS_ Input Leakage Current
CSP_ and CSN_, TA = +25°C
CS_ Common-Mode Input Range
CSP_ and CSN_
1
mV
-2
+2
mV
-0.2
+0.2
µA
0
2
V
2.06
mS
+1.5
mV
SMPS1 AND SMPS2 DROOP, CURRENT BALANCE, AND TRANSIENT RESPONSE
IFBAC_/(VCS_), VFBAC _ = VCSN _ = 1.2V,
VCSP_ - VCSN _ = 0mV to +40mV
1.94
AC Droop and Current Balance
Amplifier Offset
IFBAC_/Gm(FBAC_)
-1.5
No-Load Positive Offset
OPTION = 2V or GND
Transient Detection Threshold
Measured at FBDC_ with respect to
steady-state FBDC_ regulation voltage,
5mV hysteresis (typ)
AC Droop and Current Balance
Amplifier Transconductance
Gm(FBAC_)
2.00
+12.5
-47
mV
-28
mV
8.5
mV/A
SMPS3 INTERNAL 3A STEP-DOWN CONVERTER
OUT3 Load Regulation
RDROOP3
OUT3 Line Regulation
OUT3 Input Current
LX3 Leakage Current
Internal MOSFET On-Resistance
TA = +25°C
ILX3
-5
SHDN = GND, VLX3 = GND or 5.5V,
VIN3 = 5.5V, TA = +25°C
5
-20
nA
+20
µA
High-side n-channel
100
200
Low-side n-channel
50
100
4.0
4.5
LX3 Idle-Mode Trip Level
ILX3MIN
I ZX3
3.5
VILIM3 = 3.3V
3.4
VILIM3 = 2V
2.8
VILIM3 = GND
2.2
m
A
Percentage of ILX3PK
25
%
Skip mode
20
mA
DMAX
84
87
t ONMIN
Idle Mode is a trademark of Maxim Integrated Products, Inc.
4
mV
+100
R ON(NL3)
ILX3PK
Minimum On-Time
-100
R ON(NH3)
LX3 Peak Current Limit
Maximum Duty Factor
6.5
0% to 100% duty cycle
I OUT3
VILIM3 = VCC
LX3 Zero-Crossing Trip Level
4.5
_______________________________________________________________________________________
%
150
ns
AMD 2-/3-Output Mobile Serial
VID Controller
(Circuit of Figure 2, VIN = 12V, VCC = VDD = VIN3 = VSHDN = VPGD_IN = 5V, VDDIO = 1.8V, VOPTION = VGNDS_ = VAGND = VPGND,
VFBDC_ = VFBAC_ = VOUT3 = VCSP_ = VCSN_ = 1.2V, all DAC codes set to the 1.2V code, TA = 0°C to +85°C, unless otherwise noted.
Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
PWM mode
250
300
350
mV
Skip mode and output
has not reached the
regulation voltage
1.80
1.85
1.90
FAULT DETECTION
Output Overvoltage Trip
Threshold
(SMPS1 and SMPS2 Only)
VOVP_
Measured at
FBDC_, rising
edge
V
Minimum OVP
threshold
Output Overvoltage Fault
Propagation Delay (SMPS1 and
SMPS2 only)
t OVP
FBDC_ forced 25mV above trip threshold
Output Undervoltage Protection
Trip Threshold
VUVP
Measured at FBDC_ or OUT3 with respect
to unloaded output voltage
Output Undervoltage Fault
Propagation Delay
tUVP
FBDC_ forced 25mV below trip threshold
Measured at
FBDC_ or OUT3
with respect to
unloaded output
voltage,15mV
hysteresis (typ)
PWRGD Threshold
PWRGD Propagation Delay
t PWRGD
PWRGD, Output Low Voltage
-450
-400
Upper threshold,
rising edge
(overvoltage)
+150
-300
+200
tBLANK
Measured from the time when FBDC_ and
OUT3 reach the target voltage
Measured at THRM, with respect to VCC,
falling edge, 115mV hysteresis (typ)
VRHOT Trip Threshold
t VRHOT
I SINK = 4mA
VRHOT Leakage Current
High state, VRHOT forced to 5V, TA = +25°C
THRM Input Leakage
TA = +25°C
T SHDN
Hysteresis = 15°C
DH_ Gate-Driver On-Resistance
R ON(DH _)
BST_ - LX_ forced
to 5V (Note 4)
DL_ Gate-Driver On-Resistance
R ON(DL_)
-250
+250
µs
0.4
V
1
µA
20
29.5
THRM forced 25mV below the VRHOT trip
threshold, falling edge
VRHOT, Output Low Voltage
mV
µs
10
I SINK = 4mA
PWRGD Startup Delay and
Transition Blanking Time
-350
mV
FBDC_ or OUT3 forced 25mV outside the
PWRGD trip thresholds
High state, PWRGD forced to 5.5V, TA =
+25°C
µs
10
-350
I PWRGD
Thermal-Shutdown Threshold
10
Lower threshold,
falling edge
(undervoltage)
PWRGD Leakage Current
VRHOT Delay
0.8
30
µs
30.5
10
-100
%
µS
0.4
V
1
µA
+100
nA
+160
°C
GATE DRIVERS
High state (pullup)
0.9
2.5
Low state (pulldown)
0.7
2.5
DL_, high state
0.7
2.0
DL_, low state
0.25
0.6
_______________________________________________________________________________________
5
MAX17080
ELECTRICAL CHARACTERISTICS (continued)
MAX17080
AMD 2-/3-Output Mobile Serial
VID Controller
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 2, VIN = 12V, VCC = VDD = VIN3 = VSHDN = VPGD_IN = 5V, VDDIO = 1.8V, VOPTION = VGNDS_ = VAGND = VPGND,
VFBDC_ = VFBAC_ = VOUT3 = VCSP_ = VCSN_ = 1.2V, all DAC codes set to the 1.2V code, TA = 0°C to +85°C, unless otherwise noted.
Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
IDH_
DH_ forced to 2.5V, BST_ - LX_ forced to 5V
2.2
A
IDL_
DL_ forced to 2.5V
2.7
A
8
A
DH_ Gate-Driver Source/Sink
Current
DL_ Gate-Driver Source Current
DL_ Gate-Driver Sink Current
MIN
IDL_ (SINK) DL_ forced to 2.5V
Dead Time
TYP
MAX
UNITS
tDH_DL
DH_ low to DL_ high
9
20
35
tDL_DH
DL_ low to DH_ high
9
20
35
10
20
10
20
-1
+1
µA
0.3 x
VDDIO
0.7 x
VDDIO
V
3.4
MHz
Internal BST1, BST2 Switch RON
Internal BST3 Switch R ON
BST1, BST2 to VDD, IBST1 = IBST2 = 10mA
BST3 to VDD, IBST3 = 10mA
ns
2-WIRE I2C BUS LOGIC INTERFACE
SVI Logic Input Current
SVC, SVD, TA = +25°C
SVI Logic Input Threshold
SVC, SVD, rising edge, hysteresis 0.14 x
VDDIO (V)
SVC Clock Frequency
f SVC
START Condition Hold Time
tHD;STA
160
ns
Repeated START Condition
Setup Time
t SU;STA
160
ns
STOP Condition Setup Time
t SU;STO
160
ns
A master device must internally provide a
hold time of at least 300ns for the SVD
signal (referred to the VIHMIN of SVC signal)
to bridge the undefined region of SVC’s
falling edge
Data Hold
tHD;DAT
Data Setup Time
t SU;DAT
10
ns
SVC Low Period
tLOW
160
ns
SVC High Period
tHIGH
Measured from 10% to 90% of VDDIO
60
ns
tR, tF
Input filters on SVD and SVC suppress
noise spike less than 50ns
SVC/SVD Rise and Fall Time
70
40
Pulse Width of Spike Suppression
20
ns
ns
ns
INPUTS AND OUTPUTS
Logic Input Current
Logic Input Levels
Four-Level Input Logic Levels
SHDN, PGD_IN, TA = +25°C
-1
+1
µA
ILIM3, OPTION, TA = +25°C
-200
+200
nA
0.8
2.0
V
V
SHDN, rising edge, hysteresis = 225mV
OPTION, ILIM3
High
VCC 0.4
3.3V
2.75
3.85
2V
1.65
2.35
0.3 x
VDDIO
0.7 x
VDDIO
Low
PGD_IN Logic Input Threshold
6
PGD_IN, rising edge, hysteresis = 65mV
0.4
_______________________________________________________________________________________
V
AMD 2-/3-Output Mobile Serial
VID Controller
(Circuit of Figure 2, VIN = 12V, VCC = VDD = VIN3 = VSHDN = VPGD_IN = 5V, VDDIO = 1.8V, VOPTION = VGNDS_ = VAGND = VPGND,
VFBDC_ = VFBAC_ = VOUT3 = VCSP_ = VCSN_ = 1.2V, all DAC codes set to the 1.2V code, TA = -40°C to +105°C, unless otherwise
noted. Typical values are at TA = +25°C.) (Note 5)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
INPUT SUPPLIES
VIN
26
4.5
5.5
2.7
5.5
VDDIO
1.0
2.7
VCC rising, 50mV typical hysteresis,
latched, UV fault
4.10
4.45
V
VDDIO Undervoltage-Lockout
Threshold
VDDIO rising, 100mV typical hysteresis,
latched, UV fault
0.7
0.9
V
VIN3 Undervoltage-Lockout
Threshold
VIN3 rising, 100mV typical hysteresis
2.5
2.7
V
10
mA
25
µA
200
µA
%
VCC Undervoltage-Lockout
Threshold
Quiescent Supply Current (VCC)
Quiescent Supply Current
Quiescent Supply Current (IN3)
VUVLO
ICC
VCC, VDD
4
VIN3
Input Voltage Range
VBIAS
Drain of external high-side MOSFET
Skip mode, FBDC_ and OUT3 forced
above their regulation points
IDDIO
I IN3
Skip mode, OUT3 forced above its
regulation point
V
INTERNAL DACs, SLEW RATE, PHASE SHIFT
DC Output Voltage Accuracy
VOUT
Slew-Rate Accuracy
Measured at FBDC_
for the core SMPSs;
measured at OUT3
for the NB SMPS;
30% duty cycle,
no load, ILIM3 =
VCC, VOUT3 = VDAC3
+ 12.5mV (Note 3)
During transition
DAC codes from
0.8375V to 1.5500V
-0.7
+0.7
DAC codes from
0.5000V to 0.8250V
-7.5
+7.5
mV
DAC codes from
12.5mV to 0.4875V
-15
+15
RTIME = 143k,
SR = 6.25mV/µs
-10
+10
RTIME = 35.7k to
357k, SR =
25mV/µs to 2.5mV/µs
R OSC = 143k (fOSC1 = f OSC2 = 300kHz
nominal, f OSC3 = 600kHz nominal)
Switching Frequency Accuracy
f OSC1,
f OSC2,
f OSC3
R OSC = 71.4k (f OSC1 = f OSC2 = 600kHz
nominal, f OSC3 = 1.2MHz nominal) to
432k (f OSC1 = f OSC2 = 99kHz nominal,
f OSC3 = 199kHz nominal)
%
-15
+15
-7.5
+7.5
%
-10
+10
_______________________________________________________________________________________
7
MAX17080
ELECTRICAL CHARACTERISTICS
MAX17080
AMD 2-/3-Output Mobile Serial
VID Controller
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 2, VIN = 12V, VCC = VDD = VIN3 = VSHDN = VPGD_IN = 5V, VDDIO = 1.8V, VOPTION = VGNDS_ = VAGND = VPGND,
VFBDC_ = VFBAC_ = VOUT3 = VCSP_ = VCSN_ = 1.2V, all DAC codes set to the 1.2V code, TA = -40°C to +105°C, unless otherwise
noted. Typical values are at TA = +25°C.) (Note 5)
PARAMETER
SYMBOL
CONDITIONS
R OSC = 143k (fOSC1 = f OSC2 = 300kHz
nominal, f OSC3 = 600kHz nominal)
Switching Frequency Accuracy
f OSC1,
f OSC2,
f OSC3
MIN
TYP
-7.5
MAX
UNITS
+7.5
R OSC = 71.4k (f OSC1 = f OSC2 = 600kHz
nominal, f OSC3 = 1.2MHz nominal) to
432k (f OSC1 = f OSC2 = 99kHz nominal,
f OSC3 = 199kHz nominal)
-10
+10
%
SMPS1 AND SMPS2 CONTROLLERS
GNDS_ Input Range
VGNDS_
Separate mode
-200
+200
mV
GNDS_ Gain
A GNDS_
Separate: VOUT_/VGNDS_, -200mV VGNDS_ +200mV; combined;
VOUT/ VGNDS_, -200mV VGNDS_ +200mV
0.95
1.05
V/V
GNDS1, GNDS2, detection after REFOK,
latched, cleared by cycling SHDN
0.7
0.9
V
Combined-Mode Detection
Threshold
Maximum Duty Factor
Minimum On-Time
DMAX
90
t ONMIN
%
150
ns
SMPS1 AND SMPS2 CURRENT LIMIT
Current-Limit Threshold
Tolerance
VLIMIT
VCSP_ - VCSN _ = 0.052 x (VREF - VILIM),
(VREF - VILM) = 0.2V to 1.0V
-3
+3
mV
Idle-Mode Threshold Tolerance
VIMIN
VCSP_ - VCSN _, skip mode, 0.15 x VLIMIT
-2
+2
mV
CSP_ and CSN_
0
2
V
IFBAC_/(VCS_), VFBAC _ = VCSN _ = 1.2V,
VCSP_ - VCSN _ = 0mV to +40mV
1.94
2.06
mS
AC Droop and Current Balance
Amplifier Offset
IFBAC_/Gm(FBAC_)
-1.5
+2.0
mV
Transient Detection Threshold
Measured at FBDC_ with respect to
steady-state FBDC_ regulation voltage,
5mV hysteresis (typ)
-47
-28
mV
8.5
mV/A
CS_ Common-Mode Input Range
SMPS1 AND SMPS2 DROOP, CURRENT BALANCE, AND TRANSIENT RESPONSE
AC Droop and Current Balance
Amplifier Transconductance
Gm(FBAC_)
SMPS3 INTERNAL 3A STEP-DOWN CONVERTER
OUT3 Load Regulation
Internal MOSFET On-Resistance
RDROOP3
High-side n-channel
200
R ON(NL3)
Low-side n-channel
100
LX3 Peak Current Limit
ILX3PK
Maximum Duty Factor
DMAX
Minimum On-Time
8
4.5
R ON(NH3)
ILIM3 = VCC, skip mode
3.5
4.5
84
t ONMIN
_______________________________________________________________________________________
m
A
%
150
ns
AMD 2-/3-Output Mobile Serial
VID Controller
(Circuit of Figure 2, VIN = 12V, VCC = VDD = VIN3 = VSHDN = VPGD_IN = 5V, VDDIO = 1.8V, VOPTION = VGNDS_ = VAGND = VPGND,
VFBDC_ = VFBAC_ = VOUT3 = VCSP_ = VCSN_ = 1.2V, all DAC codes set to the 1.2V code, TA = -40°C to +105°C, unless otherwise
noted. Typical values are at TA = +25°C.) (Note 5)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
FAULT DETECTION
PWM mode
250
350
mV
Skip mode and
output have not
reached the
regulation voltage
1.80
1.90
V
-450
-350
mV
Lower threshold,
falling edge
(undervoltage)
-350
-250
Upper threshold,
rising edge
(overvoltage)
+150
Output Overvoltage Trip
Threshold
(SMPS1 and SMPS2 Only)
VOVP_
Measured at
FBDC_, rising edge
Output Undervoltage Protection
Trip Threshold
VUVP
Measured at FBDC_ or OUT3 with respect
to unloaded output voltage
Measured at FBDC_
or OUT3 with respect
to unloaded output
voltage, 15mV
hysteresis (typ)
PWRGD Threshold
PWRGD, Output Low Voltage
I SINK = 4mA
VRHOT Trip Threshold
Measured at THRM, with respect to VCC,
falling edge, 115mV hysteresis (typ)
VRHOT, Output Low Voltage
I SINK = 4mA
mV
29.5
+250
0.4
V
30.5
%
0.4
V
GATE DRIVERS
DH_ Gate-Driver On-Resistance
R ON(DH _)
DL_ Gate-Driver On-Resistance
R ON(DL_)
Dead Time
BST_ - LX_ forced to
5V (Note 4)
High state (pullup)
2.5
Low state (pulldown)
2.5
DL_, high state
2.0
DL_, low state
0.6
tDH_DL
DH_ low to DL_ high
9
35
tDL_DH
DL_ low to DH_ high
9
35
ns
Internal BST1, BST2 Switch RON
BST1, BST2 to VDD, IBST1 = IBST2 = 10mA
20
Internal BST3 Switch R ON
2-WIRE I2C BUS LOGIC INTERFACE
BST3 to VDD, IBST3 = 10mA
20
0.7 x
VDDIO
V
3.4
MHz
SVC, SVD, rising edge, hysteresis = 0.14 x
VDDIO(V)
SVI Logic Input Threshold
SVC Clock Frequency
0.3 x
VDDIO
f SVC
START Condition Hold Time
t SU;STA
160
ns
Repeated START Condition
Setup Time
t SU;STA
160
ns
STOP Condition Setup Time
t SU;STO
160
ns
Data Hold
tHD;DAT
A master device must internally provide a
hold time of at least 300ns for the SVD signal
(referred to the VIHMIN of SVC signal) to bridge
the undefined region of SVC’s falling edge
70
ns
_______________________________________________________________________________________
9
MAX17080
ELECTRICAL CHARACTERISTICS (continued)
MAX17080
AMD 2-/3-Output Mobile Serial
VID Controller
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 2, VIN = 12V, VCC = VDD = VIN3 = VSHDN = VPGD_IN = 5V, VDDIO = 1.8V, VOPTION = VGNDS_ = VAGND = VPGND,
VFBDC_ = VFBAC_ = VOUT3 = VCSP_ = VCSN_ = 1.2V, all DAC codes set to the 1.2V code, TA = -40°C to +105°C, unless otherwise
noted. Typical values are at TA = +25°C.) (Note 5)
PARAMETER
SYMBOL
Data Setup Time
CONDITIONS
MIN
t SU;DAT
SVC Low Period
tLOW
SVC High Period
tHIGH
Measured from 10% to 90% of VDDIO
SVC/SVD Rise and Fall Time
tR, tF
Input filters on SVD and SVC suppress
noise spike less than 50ns
TYP
MAX
UNITS
10
ns
160
ns
60
ns
40
ns
2.0
V
V
INPUTS AND OUTPUTS
SHDN, rising edge, hysteresis = 225mV
Logic Input Levels
Four-Level Input Logic Levels
OPTION, ILIM3
0.8
High
VCC 0.4
3.3V
2.75
3.85
2V
1.65
2.35
Low
PGD_IN Logic Input Threshold
PGD_IN, rising edge, hysteresis = 65mV
0.4
0.3 x
VDDIO
0.7 x
VDDIO
V
Note 3: When the inductor is in continuous conduction, the output voltage has a DC regulation level lower than the error-comparator
threshold by 50% of the ripple. In discontinuous conduction, the output voltage has a DC regulation level higher than the
error-comparator threshold by 50% of the ripple. The core SMPSs have an integrator that corrects for this error. The NB
SMPS has an offset determined by the ILIM3 pin, and a -6.5mV/A load line.
Note 4: Production testing limitations due to package handling require relaxed maximum on-resistance specifications for the TQFN
package.
Note 5: Specifications to TA = -40°C to +105°C are guaranteed by design, not production tested.
tR
tHD;STA
tHIGH
tLOW
SVC
tF
SVD
tHD;DAT
tSU;DAT
tSU;STO
VIH
VIL
Figure 1. Timing Definitions Used in the Electrical Characteristics
10
______________________________________________________________________________________
tBUF
AMD 2-/3-Output Mobile Serial
VID Controller
7V
PWM MODE
12V
80
20V
70
20V
80
12V
70
VIN = 12V
OUTPUT VOLTAGE (V)
90
EFFICIENCY (%)
90
1.205
MAX17080 toc02
100
MAX17080 toc01
100
EFFICIENCY (%)
CORE SMPS OUTPUT VOLTAGE
vs. LOAD CURRENT (VOUT = 1.2V)
CORE SMPS 2-PHASE EFFICIENCY
vs. LOAD CURRENT (VOUT = 1.2V)
MAX17080 toc03
CORE SMPS 1-PHASE EFFICIENCY
vs. LOAD CURRENT (VOUT = 1.2V)
1.200
SKIP MODE AND PWM MODE
1.195
7V
SKIP MODE
PWM MODE
60
1
100
10
1
0
100
10
5
10
LOAD CURRENT (A)
LOAD CURRENT (A)
CORE SMPS 1-PHASE EFFICIENCY
vs. LOAD CURRENT (VOUT = 0.8V)
CORE SMPS OUTPUT VOLTAGE
vs. LOAD CURRENT (VOUT = 0.8V)
NB SMPS EFFICIENCY
vs. LOAD CURRENT (VOUT = 1V)
OUTPUT VOLTAGE (V)
90
80
20V
100
0.800
90
SKIP MODE AND PWM MODE
0.795
70
MAX17080 toc06
VIN = 12V
EFFICIENCY (%)
12V
MAX17080 toc05
0.805
MAX17080 toc04
7V
3.3V
80
5V
70
60
SKIP MODE
PWM MODE
SKIP MODE
PWM MODE
60
0.790
0.1
1
100
10
5
10
15
20
0.1
10
1
CORE SMPS 1-PHASE SWITCHING
FREQUENCY vs. LOAD CURRENT
NB SMPS SWITCHING FREQUENCY
vs. LOAD CURRENT
ILIM3 = VCC
0.97
VOUT = 1.2V
300
VIN = 20V SKIP
VIN = 20V PWM
250
200
VIN = 12V SKIP
VIN = 12V PWM
150
VIN = 7V SKIP
VIN = 7V PWM
SKIP MODE
PWM MODE
1
2
LOAD CURRENT (A)
3
VOUT = 1V
700
650
600
VIN = 5V SKIP
VIN = 5V PWM
550
500
VIN = 3.3V SKIP
VIN = 3.3V PWM
450
400
100
0.95
750
SWITCHING FREQUENCY (kHz)
VIN = 3.3V
SWITCHING FREQUENCY (kHz)
MAX17080 toc07
1.01
350
MAX17080 toc09
NB SMPS OUTPUT VOLTAGE
vs. LOAD CURRENT (VOUT = 1.0V)
MAX17080 toc08
LOAD CURRENT (A)
VIN = 5V
0
0.01
LOAD CURRENT (A)
1.03
0.99
50
0
LOAD CURRENT (A)
1.05
OUTPUT VOLTAGE (V)
20
15
LOAD CURRENT (A)
100
EFFICIENCY (%)
1.190
60
0.1
0.1
1
10
LOAD CURRENT (A)
100
0
0.5
1.0
1.5
2.0
2.5
3.0
LOAD CURRENT (A)
______________________________________________________________________________________
11
MAX17080
Typical Operating Characteristics
(Circuit of Figure 2, VIN = 12V, VDD = VCC = 5V, VDDIO = 2.5V, TA = +25°C, unless otherwise noted.)
Typical Operating Characteristics (continued)
(Circuit of Figure 2, VIN = 12V, VDD = VCC = 5V, VDDIO = 2.5V, TA = +25°C, unless otherwise noted.)
ICC + IDD
1
IIN
0.1
0.01
6
9
INPUT VOLTAGE (V)
12
15
18
21
24
INPUT VOLTAGE (V)
MAX17080 toc12
1.205
0
3
20.0
1.204
17.5
1.203
15.0
1.202
12.5
1.201
10.0
1.200
7.5
20
1.195
5.0
30
1.199
21
40
10
SKIP MODE
PWM MODE
VOUT = 1.2V
50
1.198
23
SAMPLE SIZE = 100
+85°C
+25°C
60
1.197
DC CURRENT
25
10
70
1.196
PEAK CURRENT
IIN
ICC + IDD
SUPPLY CURRENT (mA)
27
CORE SMPS OUTPUT VOLTAGE DISTRIBUTION
VID = 1.2V
SAMPLE PERCENTAGE (%)
VOUT = 1.2V
29
INDUCTOR CURRENT (A)
100
MAX17080 toc10
31
NO-LOAD SUPPLY CURRENT
vs. INPUT VOLTAGE
MAX17080 toc11
MAXIMUM INDUCTOR CURRENT
vs. INPUT VOLTAGE
OUTPUT VOLTAGE (V)
10
SAMPLE SIZE = 100
ILIM3 = VCC
30
25
20
15
10
TRANSCONDUCTANCE (µS)
PEAK CURRENT LIMIT (A)
______________________________________________________________________________________
4.25
4.20
4.15
4.10
4.05
4.00
3.95
3.90
3.85
3.80
3.75
2015
2012
2009
2006
2003
0
MAX17080 toc15
+85°C
+25°C
35
5
2000
1.205
1.204
1.203
1.202
1.201
1.200
1.199
1.198
1.197
0
1.196
0
40
SAMPLE PERCENTAGE (%)
15
5
1.195
MAX17080 toc14
20
10
OUTPUT VOLTAGE (V)
12
25
1997
20
SAMPLE SIZE = 100
1994
30
+85°C
+25°C
1991
40
30
1988
50
SAMPLE SIZE = 100
1985
+85°C
+25°C
NB SMPS PEAK
CURRENT-LIMIT DISTRIBUTION
Gm(FBAC) TRANSCONDUCTANCE
DISTRIBUTION
SAMPLE PERCENTAGE (%)
60
MAX17080 toc13
NB SMPS OUTPUT VOLTAGE DISTRIBUTION
VID = 1.2V
SAMPLE PERCENTAGE (%)
MAX17080
AMD 2-/3-Output Mobile Serial
VID Controller
AMD 2-/3-Output Mobile Serial
VID Controller
STARTUP SEQUENCE
STARTUP WAVEFORMS
MAX17080 toc17
MAX17080 toc16
SHDN, 5V/div
VOUT1, 0.5V/div
VOUT2, 0.5V/div
VOUT3, 0.5V/div
0
0
0
0
SHDN, 5V/div
VOUT1, 0.5V/div
VOUT2, 0.5V/div
0
VOUT3, 0.5V/div
0
PWRGD, 5V/div
0
5A
ILX, 5A/div
0
1A
ILX3, 1A/div
0
0
PWRGD, 5V/div
0
0
0
PGD_IN, 2.5V/div
SVC, 2.5V/div
0
SVD, 2.5V/div
0
400µs/div
200µs/div
VIN = 12V
VBOOT = 1V
VIN = 12V
VBOOT = 1V
VSVID = 1.2V
ILOAD1 = 3A
ILOAD2 = 3A
ILOAD3 = 0.5A
CORE SMPS 1-PH LOAD-TRANSIENT
RESPONSE
SHUTDOWN WAVEFORMS
MAX17080 toc18
MAX17080 toc19
3.3V
SHDN, 5V/div
1.2V
1.2V
VOUT1, 50mV/div
1.2V
1.2V
5V
5V
VOUT1, 0.5V/div
VOUT2, 0.5V/div
13.5A
VOUT3, 0.5V/div
DL1, 10V/div
1.5A
DL2, 10V/div
5V
5V
ILX1, 10A/div
12V
LX3, 10V/div
PWRGD, 10V/div
LX1, 10V/div
0
100µs/div
VIN = 12V
VSVID = 1.2V
ILOAD1 = 3A
ILOAD2 = 3A
ILOAD3 = 0.5A
20µs/div
VIN = 12V
VOUT1 = 1.2V
ILOAD1 = 1.5A TO 13.5A TO 1.5A
PWM MODE
______________________________________________________________________________________
13
MAX17080
Typical Operating Characteristics (continued)
(Circuit of Figure 2, VIN = 12V, VDD = VCC = 5V, VDDIO = 2.5V, TA = +25°C, unless otherwise noted.)
MAX17080
AMD 2-/3-Output Mobile Serial
VID Controller
Typical Operating Characteristics (continued)
(Circuit of Figure 2, VIN = 12V, VDD = VCC = 5V, VDDIO = 2.5V, TA = +25°C, unless otherwise noted.)
CORE SMPS 2-PH LOAD-TRANSIENT
RESPONSE
CORE SMPS 1-PH TRANSIENT
PHASE REPEAT
MAX17080 toc21
MAX17080 toc20
VOUT, 50mV/div
1.2V
VOUT1, 50mV/div
1.2V
13.5A
13.5A
ILX1, 10A/div
1.5A
ILX1, 10A/div
1.5A
13.5V
12V
LX1, 10V/div
1.5A
ILX2, 10A/div
0
20µs/div
2µs/div
VIN = 12V
VOUT1 = 1.2V
VIN = 12V
VOUT1 = 1.2V
ILOAD1 = 1.5A TO 13.5A TO 1.5A
PWM MODE
ILOAD = 3A TO 27A TO 3A
PWM MODE
NB SMPS LOAD-TRANSIENT
RESPONSE
CORE SMPS 2-PH TRANSIENT
PHASE REPEAT
MAX17080 toc23
MAX17080 toc22
1.2V
VOUT, 50mV/div
1V
VOUT3, 20mV/div
13.5A
ILX1, 10A/div
2.5A
1.5A
ILX3, 2A/div
0.5A
13.5A
ILX2, 10A/div
1.5A
5V
LX3, 5A/div
0
20µs/div
2µs/div
VIN = 12V
VOUT1 = 1.2V
14
ILOAD = 3A TO 27A TO 3A
PWM MODE
VIN3 = 5V
VOUT3 = 1V
ILOAD3 = 0.5A TO 2.5A TO 0.5A
PWM MODE
______________________________________________________________________________________
AMD 2-/3-Output Mobile Serial
VID Controller
CORE SMPS OUTPUT OVERLOAD
WAVEFORM (SEPARATE MODE)
CORE SMPS OUTPUT OVERVOLTAGE
WAVEFORM (SEPARATE MODE)
MAX17080 toc24
MAX17080 toc25
5V
5V
SHDN, 5V/div
1.2V
SHDN, 5V/div
1.2V
VOUT1, 1V/div
5V
0
1.2V
VOUT1, 1V/div
5V
0
1.2V
VOUT2, 1V/div
DL2, 10V/div
5V
0
1.2V
VOUT2, 1V/div
DL2, 10V/div
5V
0
VOUT3, 1V/div
LX3, 10V/div
5V
0
VOUT3, 1V/div
LX3, 10V/div
DL1, 10V/div
DL1, 10V/div
0
1.2V
100µs/div
VIN = 12V
VSVID = 1.2V
100µs/div
ILOAD1 = 3A TO 40A
ILOAD2 = 3A
ILOAD3 = 0.5A
VIN = 12V
VSVID = 1.2V
ILOAD1 = NO LOAD
ILOAD2 = 3A
ILOAD3 = 0.5A
PGD_IN TRANSITION
(LIGHT LOAD)
DYNAMIC OUTPUT-VOLTAGE
TRANSITIONS (LIGHT LOAD)
MAX17080 toc27
MAX17080 toc26
VOUT1, 0.5V/div
1.3V
VOUT1, 200mV/div
1.1V
VOUT3, 200mV/div
0.8V
0.9V
0.6V
1.3V
VOUT2, 0.5V/div
0.6V
1.3V
VOUT3, 0.5V/div
0.6V
2.5V
SVC, 2.5V/div
0
5V
2.5V
SVD, 2.5V/div
5V
LX1, 20V/div
0
LX3, 5V/div
0
1.2V
1.1V
VOUT2, 200mV/div
LX2, 20V/div
PWRGD, 5V/div
PGD_IN, 5V/div
10µs/div
100µs/div
VIN = 12V
VSVID = 1.3V TO 0.6V TO 1.3V
VIN = 12V
VBOOT = 1V
VOUT1 = 0.8V
VOUT2 = 1.2V
VOUT3 = 0.9V
______________________________________________________________________________________
15
MAX17080
Typical Operating Characteristics (continued)
(Circuit of Figure 2, VIN = 12V, VDD = VCC = 5V, VDDIO = 2.5V, TA = +25°C, unless otherwise noted.)
MAX17080
AMD 2-/3-Output Mobile Serial
VID Controller
Pin Description
PIN
1
NAME
ILIM12
FUNCTION
SMPS1 and SMPS2 Current-Limit Adjust Input. The positive current-limit threshold voltage is
precisely 0.052 times the voltage between TIME and ILIM over a 0.2V to 1.0V range of V(TIME,
ILIM). The IMIN12 minimum current-limit threshold voltage in skip mode is precisely 15% of the
corresponding positive current-limit threshold voltage.
SMPS3 Current-Limit Adjust Input. Four-level current-limit setting for SMPS3. Also sets the offset
voltage for SMPS3.
The ILX3MIN minimum current-limit threshold in skip mode is precisely 25% of the corresponding
positive current-limit threshold.
2
ILIM3
ILIM3
ILX3PK (A)
SMPS3 OFFSET (mV)
VCC
4
+12.5
3.3V
3.4
+12.5
2V
2.8
+6.25
GND
2.2
+6.25
3, 4
IN3
Internal High-Side MOSFET Drain Connection for SMPS3. Bypass to PGND with a 10µF or greater
ceramic capacitor close to the IC.
5, 6
LX3
Inductor Connection for SMPS3. Connect LX3 to the switched side of the inductor.
7
BST3
Boost Flying Capacitor Connection for SMPS3. An internal switch between VDD and BST3 charges
the flying capacitor during the time the low-side FET is on.
Shutdown Control Input. This input cannot withstand the battery voltage. Connect to VCC for normal
operation. Connect to ground to put the IC into its 1µA max shutdown state. During startup, the
output voltage is ramped up to the voltage set by the SVC and SVD inputs at a slew rate of 1mV/µs.
In shutdown, the outputs are discharged using a 20 switch through the CSN_ pins for the core
SMPSs and through the OUT3 pin for the northbridge SMPS.
The MAX17080 powers up to the voltage set by the 2 SVI bits.
8
SHDN
SVC
SVD
BOOT VOLTAGE
VOUT (V)
0
0
1.1
0
1
1.0
1
0
0.9
1
1
0.8
The MAX17080 stores the boot VID when PWRGD first goes high. The stored boot VID is cleared
by a rising SHDN signal.
16
Feedback Input for SMPS3. A 20 discharge FET is enabled from OUT3 to PGND when SMPS3 is
shut down.
9
OUT3
10
AGND
Analog Ground
11
SVD
Serial VID Data
12
SVC
Serial VID Clock
13
VDDIO
CPU I/O Voltage (1.8V or 1.5V). Logic thresholds for SVD and SVC are relative to the voltage at VDDIO.
______________________________________________________________________________________
AMD 2-/3-Output Mobile Serial
VID Controller
PIN
14
NAME
GNDS2
FUNCTION
SMPS2 Remote Ground-Sense Input. Normally connected to GND directly at the load. GNDS2
internally connects to a transconductance amplifier that fine tunes the output voltage—
compensating for voltage drops from the SMPS ground to the load ground.
Connect GNDS1 or GNDS2 above 0.9V combined-mode operation (unified core). When GNDS2 is
pulled above 0.9V, GNDS1 is used as the remote ground-sense input.
Output of the Voltage-Positioning Transconductance Amplifier for SMPS2. The R and C network
between this pin and the positive side of the remote-sensed output voltage sets the transient AC
droop:
RFBAC2 × RFBDC2
RDROOP_AC2 =
× RSENSE2 × Gm(FBAC2)
RFBAC2 + RFBDC2 + RFB22 ZCFB2
15
FBAC2
where RDROOP_AC2 is the transient (AC) voltage-positioning slope that provides an acceptable
trade-off between stability and load-transient response, Gm(FBAC2) = 2mS (typ), RSENSE2 is the
value of the current-sense element that is used to provide the (CSP2, CSN2) current-sense voltage,
ZCFB2 is the impedance of CFB2.
FBAC2 is high impedance in shutdown.
Feedback-Sense Input for SMPS2. Connect a resistor RFBDC2 between FBDC2 and the positive side
of the feedback remote sense, and a capacitor from FBAC2 to couple the AC ripple from FBAC2 to
FBDC2. An integrator on FBDC2 corrects for output ripple and ground-sense offset.
16
FBDC2
To enable a DC load-line less than the AC load-line, add a resistor from FBAC2 to FBDC2.
To enable a DC load-line equal to the AC load-line, short FBAC2 to FBDC2. See the Core SteadyState Voltage Positioning (DC Droop) section.
FBDC2 is high impedance in shutdown.
17
CSN2
Negative Current-Sense Input for SMPS2. Connect to the negative side of the output current-sensing
resistor or the filtering capacitor if the DC resistance of the output inductor is utilized for current
sensing.
A 20 discharge FET is enabled from CSN2 to PGND when the SMPS2 is shut down.
18
CSP2
Positive Current-Sense Input for SMPS2. Connect to the positive side of the output current-sensing
resistor or the filtering capacitor if the DC resistance of the output inductor is utilized for current
sensing.
System Power-Good Input.
PGD_IN is low when SHDN first goes high. The MAX17080 decodes the 2 SVI bits to determine the
boot voltage. The SVI bits can be changed dynamically during this time while PGD_IN remains low
and PWRGD is still low.
19
PGD_IN
PGD_IN goes high after the MAX17080 reaches the boot voltage. This indicates that the SVI block
is active, and the MAX17080 starts to respond to the SVI commands. The MAX17080 stores the
boot VID when PWRGD first goes high. The stored boot VID is cleared by rising SHDN.
After PGD_IN has gone high, if at any time PGD_IN goes low, the MAX17080 regulates to the
previously stored boot VID. PWRGD is forced low until the internal DAC reaches the stored boot VID
plus an additional 20µs. The slew rate during this transition is set by the resistor between the TIME
and GND pins.
The subsequent rising edge of PGD_IN does not change the stored VID.
PWRGD is independent of PGD_IN.
______________________________________________________________________________________
17
MAX17080
Pin Description (continued)
AMD 2-/3-Output Mobile Serial
VID Controller
MAX17080
Pin Description (continued)
PIN
NAME
FUNCTION
Open-Drain Power-Good Output. PWRGD is the wired-OR open-drain output of all three SMPS
outputs.
PWRGD is forced high impedance whenever the slew-rate controller is active (output voltage
transitions).
20
PWRGD
During startup, PWRGD is held low for an additional 20µs after the MAX17080 reaches the startup
boot voltage set by the SVC and SVD pins. The MAX17080 stores the boot VID when PWRGD first
goes high. The stored boot VID is cleared by rising SHDN.
PWRGD is forced low in shutdown.
When SMPS is in pulse-skipping mode, the upper PWRGD threshold comparator for the respective
SMPS is blanked during a downward VID transition. The upper PWRGD threshold comparator is reenabled once the output is in regulation (Figure 5).
If PGD_IN goes low anytime after the boot sequence, PWRGD is forced low during the time when
any one of the three internal DACs is slewing from the current VID to the stored boot VID plus an
additional 20µs.
18
21
DH2
SMPS2 High-Side Gate-Driver Output. DH2 swings from LX2 to BST2. Low in shutdown.
22
LX2
SMPS2 Inductor Connection. LX2 is the internal lower supply rail for the DH2 high-side gate driver.
Also used as an input to SMPS2’s zero-crossing comparator.
23
BST2
Boost Flying Capacitor Connection for the DH2 High-Side Gate Driver. An internal switch between
VDD and BST2 charges the flying capacitor during the time the low-side FET is on.
24
DL2
SMPS2 Low-Side Gate-Driver Output. DL2 swings from GND2 to VDD. DL2 is forced low in shutdown.
DL2 is also forced high when an output overvoltage fault is detected. DL2 is forced low in skip
mode after an inductor current zero crossing (GND2 - LX2) is detected.
25
VDD
Supply Voltage Input for the DL_ Drivers. VDD is also the supply voltage used to internally recharge
the BST_ flying capacitors during the off-time. Connect VDD to the 4.5V to 5.5V system supply
voltage. Bypass VDD to GND with a 2.2µF or greater ceramic capacitor.
26
DL1
SMPS1 Low-Side Gate-Driver Output. DL1 swings from GND1 to VDD. DL1 is forced low in shutdown.
DL1 is also forced high when an output overvoltage fault is detected. DL1 is forced low in skip
mode after an inductor current zero crossing (GND1 - LX1) is detected.
27
BST1
Boost Flying Capacitor Connection for the DH1 High-Side Gate Driver. An internal switch between
VDD and BST1 charges the flying capacitor during the time the low-side FET is on.
28
LX1
SMPS1 Inductor Connection. LX1 is the internal lower supply rail for the DH1 high-side gate driver.
Also used as an input to SMPS1’s zero-crossing comparator.
29
DH1
SMPS1 High-Side Gate-Driver Output. DH1 swings from LX1 to BST1. Low in shutdown.
30
VRHOT
Open-Drain Output of Internal Comparator. VRHOT is pulled low when the voltage at THRM goes
below 1.5V (30% of VCC). VRHOT is high impedance in shutdown.
31
THRM
Input of Internal Comparator. Connect the output of a resistor- and thermistor-divider (between VCC
and GND) to THRM. Select the components so the voltage at THRM falls below 1.5V (30% of VCC)
at the desired high temperature.
32
VCC
Controller Supply Voltage. Connect to a 4.5V to 5.5V source. Bypass to GND with 1µF minimum. A
VCC UVLO event that occurs while the IC is functioning is latched, and can only be cleared by
cycling VCC power or by toggling SHDN.
______________________________________________________________________________________
AMD 2-/3-Output Mobile Serial
VID Controller
PIN
NAME
33
CSP1
34
CSN1
FUNCTION
Positive Current-Sense Input for SMPS1. Connect to the positive side of the output current-sensing
resistor or the filtering capacitor if the DC resistance of the output inductor is utilized for current
sensing.
Negative Current-Sense Input for SMPS1. Connect to the negative side of the output current-sensing
resistor or the filtering capacitor if the DC resistance of the output inductor is utilized for current
sensing.
A 20 discharge FET is enabled from CSN1 to PGND when the SMPS1 is shut down.
Feedback Sense Input for SMPS1. Connect a resistor RFBDC1 between FBDC1 and the positive side
of the feedback remote sense, and a capacitor from FBAC1 to couple the AC ripple from FBAC1 to
FBDC1. An integrator on FBDC1 corrects for output ripple and ground-sense offset.
35
FBDC1
To enable a DC load-line less than the AC load-line, add a resistor from FBAC1 to FBDC1.
To enable a DC load-line equal to the AC load-line, short FBAC1 to FBDC1. See the Core SteadyState Voltage Positioning (DC Droop) section.
FBDC1 is high impedance in shutdown.
Output of the AC Voltage-Positioning Transconductance Amplifier for SMPS1. The R and C network
between this pin and the positive side of the remote-sensed output voltage sets the transient AC
droop:
RDROOP_AC1 =
36
RFBDC1 × RFBAC1
x RSENSE1 x Gm(FBAC1)
RFBDC1 + RFBAC1 + RFB11 ZCFB1
FBAC1
where RDROOP_AC1 is the transient (AC) voltage-positioning slope that provides an acceptable
trade-off between stability and load-transient response, Gm(FBAC1) = 2mS (typ), RSENSE1 is the
value of the current-sense element that is used to provide the (CSP1, CSN1) current-sense voltage,
and ZCFB1 is the impedance of CFB1.
FBAC1 is high impedance in shutdown.
37
GNDS1
SMPS1 Remote Ground-Sense Input. Normally connected to GND directly at the load. GNDS1
internally connects to a transconductance amplifier that fine tunes the output voltage—
compensating for voltage drops from the SMPS ground to the load ground.
Connect GNDS1 or GNDS2 above 0.9V combined-mode operation (unified core). When GNDS1 is
pulled above 0.9V, GNDS2 is used as the remote ground-sense input.
______________________________________________________________________________________
19
MAX17080
Pin Description (continued)
AMD 2-/3-Output Mobile Serial
VID Controller
MAX17080
Pin Description (continued)
PIN
NAME
FUNCTION
Four-Level Input to Enable Offset and Change Core SMPS Address.
OPTION
38
OPTION
OFFSET
ENABLED
SMPS1
ADDRESS
SMPS2
ADDRESS
VCC
0
BIT 1 (VDD0)
BIT 2 (VDD1)
3.3V
0
BIT 2 (VDD1)
BIT 1 (VDD0)
2V
1
BIT 1 (VDD0)
BIT 2 (VDD1)
GND
1
BIT 2 (VDD1)
BIT 1 (VDD0)
When OFFSET is enabled, the MAX17080 enables a fixed +12.5mV offset on SMPS1 and SMPS2
VID codes after PGD_IN goes high. This configuration is intended for applications that implement a
load line. An external resistor at FBDC_ sets the load-line. The offset can be disabled by setting
the PSI_L bit to 0 through the serial interface.
Additionally, the OPTION level also allows core SMPS1 and SMPS2 to take on either the VDD0 or
VDD1 addresses. VDD0 refers to CORE0, and VDD1 refers to CORE1 for the AMD CPU.
The NB SMPS is not affected by the OPTION setting.
Oscillator Adjustment Input. Connect a resistor (ROSC) between OSC and GND to set the switching
frequency (per phase):
f OSC = 300kHz x 143k/R OSC
39
OSC
A 71.4k to 432k corresponds to switching frequencies of 600kHz to 100kHz, respectively, for
SMPS1 and SMPS2. SMPS3 runs at twice the programmed switching frequency. Switching frequency
selection is limited by the minimum on-time. See the Core Switching Frequency description in the
SMPS Design Procedure section.
Slew-Rate Adjustment Pin. The total resistance RTIME from TIME to GND sets the internal slew rate:
PWM slew rate = (6.25mV/µs) x (143k/RTIME)
where RTIME is between 35.7k and 357k.
40
TIME
This slew rate applies to both upward and downward VID transitions, and to the transition from boot
mode to VID mode. Downward VID transition slew rate in skip mode can appear slower because the
output transition is not forced by the SMPS.
The slew rate for startup is fixed at 1mV/µs.
—
20
EP
Exposed Pad. Power ground connection, and source connection of the internal low-side MOSFET.
______________________________________________________________________________________
AMD 2-/3-Output Mobile Serial
VID Controller
COMPONENT
VIN = 7V TO 24V,
V OUT1 = VOUT2 = 1.0V TO
1.3V, 18A PER PHASE
VIN3 = 5V,
V OUT3 = 1.0V TO 1.3V,
3A
VIN = 4.5V TO 14V,
V OUT1 = VOUT2 = 1.0V TO
1.3V, 18A PER PHASE
VIN3 = 3.3V,
V OUT3 = 1.0V TO 1.3V,
3A
Mode
Separate, 2-phase mobile
(GNDS1 = GNDS2 = low)
—
Separate, 2-phase mobile
(GNDS1 = GNDS2 = low)
—
Switching
Frequency
300kHz
600kHz
500kHz
1MHz
CIN_ Input
Capacitor
(2) 10µF, 25V
Taiyo Yuden
TMK432BJ106KM
(1) 10µF, 6.3V
TDK C2012X5R0J106M
Taiyo Yuden
JMK212BJ106M
(2) 10µF, 16V
Taiyo Yuden
TMK432BJ106KM
(1) 10µF, 6.3V
TDK C2012X5R0J106M
Taiyo Yuden
JMK212BJ106M
C OUT_ Output
Capacitor
(2) 330µF, 2V, 6m,
low-ESR capacitor
Panasonic EEFSX0D331XE
SANYO 2TPE330M6
(1) 220µF, 2V, 6m,
low-ESR capacitor
Panasonic EEFSD0D221R
SANYO 2TPE220M6
(2) 220µF, 2V, 6m,
low-ESR capacitor
Panasonic EEFSD0D221R
SANYO 2TPE220M6
(1) 100µF, 4V
Taiyo Yuden
AMK316 BJ107M
NH_ High-Side
MOSFET
(1) Vishay/Siliconix
SI7634DP
None
(1) International Rectifier
IRF7811W
None
NL_ Low-Side
MOSFET
(2) Vishay/Siliconix
SI7336ADP
None
(2) Vishay/Siliconix
SI7336ADP
None
DL_ Schottky
Rectifier
(if needed)
3A, 40V Schottky diode
Central Semiconductor
CMSH3-40
None
3A, 40V Schottky diode
Central Semiconductor
CMSH3-40
None
0.45µH, 21A, 1.1m
power inductor
Panasonic
ETQP4LR45WFC
1.5µH, 3.55A, 22m
power inductor
Sumida CDR6D23MN
0.36µH, 21A, 1.1m
power inductor
Panasonic
ETQP4LR36WFC
1µH, 4A, 20m
power inductor
Sumida CDR6D23MN
L_ Inductor
Note: Mobile applications should be designed for separate mode operation. Component selection is dependent on AMD CPU AC
and DC specifications.
Table 2. Component Suppliers
MANUFACTURER
WEBSITE
AVX Corporation
www.avxcorp.com
BI Technologies
www.bitechnologies.com
www.centralsemi.com
Central Semiconductor Corp.
Fairchild Semiconductor
International Rectifier
KEMET Corp.
NEC TOKIN America, Inc.
Panasonic Corp.
www.fairchildsemi.com
www.irf.com
www.kemet.com
www.nec-tokinamerica.com
www.panasonic.com
Standard Application Circuit
The MAX17080 standard application circuit (Figure 2)
generates two independent 18A outputs and one 3A
MANUFACTURER
Pulse Engineering
Renesas Technology Corp.
SANYO Electric Co., Ltd.
Siliconix (Vishay)
Sumida Corp.
Taiyo Yuden
TDK Corp.
TOKO America, Inc.
WEBSITE
www.pulseeng.com
www.renesas.com
www.sanyodevice.com
www.vishay.com
www.sumida.com
www.t-yuden.com
www.component.tdk.com
www.tokoam.com
output for AMD mobile CPU applications. See Table 1
for component selections. Table 2 lists the component
manufacturers.
______________________________________________________________________________________
21
MAX17080
Table 1. Component Selection for Standard Applications
MAX17080
AMD 2-/3-Output Mobile Serial
VID Controller
RVCC
10Ω
CVCC
2.2µF
25
32
ROSC
39
40
VDD
VCC
BST1
OSC
DH1
1
13
1.5V OR 1.8V
12
SERIAL INPUT
11
19
SYSTEM POWER-GOOD
8
ON OFF
OPTION
OFFSET
SMPS1
ADDR
VCC
3.3V
2V
GND
0
0
1
1
BIT1 (VDD0)
BIT2 (VDD1)
BIT1 (VDD0)
BIT2 (VDD1)
ILIM12
LX1
VDDIO
DL1
BIT2 (VDD1)
BIT1 (VDD0)
BIT2 (VDD1)
BIT1 (VDD0)
29
NH1
38
26
NL1
SVD
CSP1
PGD_IN
CCS1
CSN1
AGND
RCSP2
18
CSP2
17
RCSN2
CSN2
CCSN2
31
AGND
PWRGD
BST2
DH2
THRM
2
3, 4
21
CBST2
0.22µF
24
NL2
IN3
36
35
RFBAC1
2kΩ
INTERNAL
3A NB
REGULATOR
GNDS1
9
BST3
OUT3
FBDC2
4700pF
AGND
15
16
GNDS2
AGND
14
PWR
CSN2
100Ω
100Ω
4700pF
AGND
CORE0 SENSE_L
RFBAC2
2kΩ
CFB2
2200pF
100Ω
CORE1 SENSE_H
100Ω
POWER GROUND
4700pF
AGND
ANALOG GROUND
CORE1 SENSE_L
4700pF
EP = PGND
PWR
PWR
CDCR2
CORE0 SENSE_H
RFBDC2
2kΩ
AGND
10
VOUT2/18ATDC
COUT2
2x 330µF
6mΩ
RDCR2
4700pF
FBAC2
0Ω
37
LX3
PWR
NB SENSE_H
RLX2
CSP2
CFB1
2200pF
PWR
7
DL2
CLX2
FBDC1
CBST3
0.1µF
CORE1
18A
REGULATOR
L2
0.45µH
22
RFBDC1
2kΩ
COUT3
220µF
6mΩ
VIN
4V TO 26V
NH2
ILIM3
CIN_NB
5, 6
CIN2
PWR
LX2
4-LEVEL V
CC
ILIM3
23
VRHOT
FBAC1
VOUT3/3A
CSN1
RCSN1
34
OPTION
DL2
L3
1.5µH
AGND
AGND
PWR
Figure 2. MAX17080 Standard Application Circuit
22
CORE0
18A
REGULATOR
CCSN1
RNTC
VIN_NB
2.7V TO 5.5V
PWR
CSP1
CSP1
SHDN
CSN2
RTHRM
+12.50
+12.50
+6.25
+6.25
RDCR1
PWR
RCSP1
33
CCS2
VCC
4.0
3.4
2.8
2.2
RLX1
CDCR1
CSP2
30
VCC
3.3V
2V
GND
DL1
VOUT1/18ATDC
COUT1
2x 330µF
6mΩ
CLX1
AGND
20
SMPS3
OFFSET (mV)
L1
0.45µH
28
2x 100kΩ
ILX3_PK (A)
VIN
4V TO 26V
MAX17080
+3.3V
ILIM3
CIN1
SVC
CSN1
SMPS2
ADDR
CBST1
0.22µF
PWR
RILIM2
AGND
PWR
27
TIME
RILIM1
+5V
CVDD
1µF
______________________________________________________________________________________
AMD 2-/3-Output Mobile Serial
VID Controller
MAX17080
VRHOT
0.3 x VCC
SHDN
FAULT1
FAULT2
FAULT3
MAX17080
THRM
VDDIO
VCC
VDD
x2
REF
(2.0V)
AGND
RUN
UVLO
BST_
PWM_
REFOK
BLANK1
SMPS1 TARGET
AND SLEW
RATE BLOCK
OFS_EN
7-BIT VID
SKIP1
ADDR
VDDIO
SVC
SVI INTERFACE
PGD_IN
DACOUT1
DAC1
SKIP_
TARGET1
DH_
SMPS1 AND
SMPS2 DRIVER
BLOCK
LX_
DL_
GNDS1
PGND
PWR
BLANK2
7-BIT VID
SKIP2
7-BIT VID
SKIP3
DACOUT2
DAC2
SMPS2 TARGET
AND SLEW
RATE BLOCK
GNDS2
PWM_
CSA_
DACOUT3
DAC3
x2
TARGET2
BLANK3
SMPS3 TARGET
AND SLEW
RATE BLOCK
SVD
TARGET3
TARGET_
IMIN_
TIME
SKIP_
GNDS2
FBAC_
IMAX_
SMPS1 AND
SMPS2 PWM
BLOCK
FBDC_
CSN_
CSP_
CLOCK_
GNDS MUX
ISLOPE_
GNDS1
COMBINE
COMBINE
DETECT
x2
ILIM12
CURRENT
LIMIT
COMBINE
IMAX_
OUT3
IMIN_
BST3
CSA_
FBDC1
REF
TARGET1
SKIP_
BLANK1
FAULT1
SMPS1 FAULT
BLOCK
OSC
4-LEVEL
DECODE
OSCILLATOR
OFS_EN
ADDR
CLOCK1
CLOCK2
CLOCK3
ISLOPE1
ISLOPE2
ISLOPE3
TARGET2
BLANK2
IN3
CSN3
LX3
SKIP3
FBDC2
OPTION
PGD1
CSP3
TARGET3
PGD2
SMPS2 FAULT
BLOCK
FAULT2
SMPS3 DRIVER
BLOCK
PGND
PWR
OUT3
TARGET3
BLANK3
PGD3
SMPS3 FAULT
BLOCK
ILIM3
PWRGD
FAULT3
Figure 3. MAX17080 Functional Diagram
______________________________________________________________________________________
23
MAX17080
AMD 2-/3-Output Mobile Serial
VID Controller
Detailed Description
The MAX17080 consists of a dual fixed-frequency PWM
controller with external switches that generate the supply voltage for two independent CPU cores, and one
low-input-voltage internal switch SMPS for the separate
NB SMPS. The CPU core SMPSs can be configured as
independent outputs, or as a combined output by connecting the GNDS1 or GNDS2 pin-strap high (GNDS1
or GNDS2 pulled to 1.5V to 1.8V, which are the respective voltages for DDR3 and DDR2).
All three SMPSs can be programmed independently to
any voltage in the VID table (see Table 4) using the serial
VID interface (SVI). The CPU is the SVI bus master, while
the MAX17080 is the SVI slave. Voltage transitions are
commanded by the CPU as a single step command from
one VID code to another. The MAX17080 slews the
SMPS outputs at the slew rate programmed by the external RTIME resistor during VID transitions and the transition from boot mode to VID mode.
During startup, the MAX17080 SMPSs are always in
pulse-skipping mode. After exiting the boot mode, the
individual PSI_L bit sets the respective SMPS into
pulse-skipping mode or forced-PWM mode, depending
on the system power state, and adds the +12.5mV offset for core supplies if enabled by the OPTION pin. In
combined mode, the PSI_L bit adds the +12.5mV offset
if enabled by the OPTION pin, and switches from
1-phase pulse-skipping mode to 2-phase PWM mode.
Figure 3 is the MAX17080 functional diagram.
+5V Bias Supply (VCC, VDD)
The MAX17080 requires an external 5V bias supply in
addition to the battery. Typically, this 5V bias supply is
the notebook’s main 95%-efficient 5V system supply.
Keeping the bias supply external to the IC improves
efficiency and eliminates the cost associated with the
5V linear SMPS that would otherwise be needed to supply the PWM circuit and gate drivers.
The 5V bias supply powers both the PWM controller
and internal gate-drive power, so the maximum current
drawn is:
IBIAS = ICC + fSW_COREQG_CORE +
fSW_NBQG_NB = 50mA to 70mA (typ)
where ICC is provided in the Electrical Characteristics
table, fSW_CORE and fSW_NB are the respective core
and NB SMPS switching frequencies, QG_CORE is the
24
gate charge of the external MOSFETs as defined in the
MOSFET data sheets, and Q G_NB is approximately
2nC. If the +5V bias supply is powered up prior to the
battery supply, the enable signal (SHDN going from low
to high) must be delayed until the battery voltage is
present to ensure startup.
Switching Frequency (OSC)
Connect a resistor (ROSC) between OSC and GND to
set the switching frequency (per phase):
fSW = 300kHz × 143kΩ/ROSC
A 71.4kΩ to 432kΩ resistor corresponds to switching frequencies of 600kHz to 100kHz, respectively, for the core
SMPSs, and 1.2MHz to 200kHz for the NB SMPS. Highfrequency (600kHz) operation for the core SMPS optimizes the application for the smallest component size,
trading off efficiency due to higher switching losses. This
might be acceptable in ultra-portable devices where the
load currents are lower and the controller is powered
from a lower voltage supply. Low-frequency (100kHz)
operation offers the best overall efficiency at the
expense of component size and board space.
The NB SMPS runs at twice the switching frequency of
the core SMPSs. The low power of the NB rail allows for
higher switching frequencies with little impact on the
overall efficiency.
Minimum on-time (tON(MIN)) must be taken into consideration when selecting a switching frequency. See the
Core Switching Frequency description in the SMPS
Design Procedure section.
Interleaved Multiphase Operation
The MAX17080 interleaves both core SMPSs’ phases—
resulting in 180° out-of-phase operation that minimizes
the input and output filtering requirements, reduces
electromagnetic interference (EMI), and improves efficiency. The high-side MOSFETs do not turn on simultaneously during normal operation. The instantaneous
input current is effectively reduced by the number of
active phases, resulting in reduced input-voltage ripple,
effective series resistance (ESR) power loss, and RMS
ripple current (see the Core Input Capacitor Selection
section). Therefore, the controller achieves high performance while minimizing the component count—which
reduces cost, saves board space, and lowers component power requirements—making the MAX17080 ideal
for high-power, cost-sensitive applications.
______________________________________________________________________________________
AMD 2-/3-Output Mobile Serial
VID Controller
Core SMPS Feedback
Adjustment Amplifiers
The MAX17080 provides an FBAC and FBDC pin for
each SMPS to allow for flexible AC and DC droop settings. FBAC is the output of an internal transconductance amplifier that outputs a current proportional to the
current-sense signal. FBDC is the feedback input that is
compared against the internal target. Place resistors
and capacitors at the FBAC and FBDC pins as shown
in Figure 4. With this configuration, the DC droop is
always less than or equal to the AC droop.
MAX17080
CSP
Gm(FBAC)
RFBAC
FBAC
CSN
CFB
ERROR
AMP
FBDC
RFB
RFBDC
100Ω
CORE SENSE_H
4700pF
TARGET
AGND
Figure 4. MAX17080 Core SMPS Feedback Connection
Core Steady-State Voltage Positioning (DC Droop)
FBDC is the feedback input to the error amplifier.
Based on the configuration in Figure 4, the core SMPS
output voltage is given by:
VOUT = VTARGET −
RFBDC × RFBAC
× IFBAC
RFBAC + RFBDC + RFB
where the target voltage (VTARGET) is defined in the
Nominal Output-Voltage Selection section, and the
FBAC amplifier’s output current (IFBAC) is determined
by each phase’s current-sense voltage:
I FBAC = Gm (FBAC)VCS
where VCS = VCSP - VCSN is the differential current-sense
voltage, and Gm(FBAC) is typically 2mS as defined in the
Electrical Characteristics table. DC droop is typically used
together with the +12.5mV offset feature to keep within the
DC tolerance window of the application. See the Offset
and Address Change for Core SMPSs (OPTION) section.
The ripple voltage on FBDC must be less than the -28mV
(max) transient phase repeat threshold:
RFBAC
∆I R
Gm(FBAC)RFBDC + ∆I LRESR
RFBAC + RFBDC + RFB L SENSE
≤ 28mV
2
RFBDC ≤
( 56mV - ∆I LRESR ) (RFBAC + RFB )
RFBAC ∆I LRSENSEGm(FBAC) - 56mV
where ∆IL is the inductor ripple current, RESR is the
effective output ESR at the remote sense point, RSENSE
is the current-sense element, and Gm(FBAC) is 2.06mS
(max) as defined in the Electrical Characteristics table.
The worst-case inductor ripple occurs at the maximum
input-voltage and maximum output-voltage conditions:
VOUT(MAX) VIN(MAX) − VOUT(MAX)
∆I L(MAX) =
VIN(MAX) fSW L
(
)
To make the DC and AC load-lines the same, directly
short FBAC to FBDC.
To disable DC voltage positioning, remove RFB, which
connects FBAC to FBDC.
Core Transient Voltage-Positioning Amplifier
(AC Droop)
Each of the MAX17080 core supply SMPSs includes one
transconductance amplifier for voltage positioning. The
amplifiers’ inputs are generated by summing their respective current-sense inputs, which differentially sense the
voltage across either current-sense resistor or the inductor’s DCR.
The voltage-positioning amplifier’s output (FBAC) connects to the remote-sense point of the output through
an R and C network that sets each phase’s AC voltagepositioning gain:
VOUT = VTARGET -
RFBDC × RFBAC
I FBAC
RFBAC + RFBDC + RFB ZCFB
where the target voltage (VTARGET) is defined in the
Nominal Output-Voltage Selection section, ZCFB is the
effective impedance of CFB, and the FBAC amplifier’s
output current (IFBAC) is determined by each phase’s
current-sense voltage:
I FBAC = Gm(FBAC)VCS
______________________________________________________________________________________
25
MAX17080
Transient Phase Repeat
When a transient occurs, the output voltage deviation
depends on the controller’s ability to quickly detect the
transient and slew the inductor current. A fixed-frequency
controller typically responds only when a clock edge
occurs, resulting in a delayed transient response. To
minimize this delay time, the MAX17080 includes
enhanced transient detection and transient phase
repeat capabilities. If the controller detects that the output voltage has dropped by 38mV, the transient detection comparator immediately retriggers the phase that
completed its on-time last. The controller triggers the
subsequent phases as normal, on the appropriate
oscillator edges. This effectively triggers a phase a full
cycle early, increasing the total inductor-current slew
rate and providing an immediate transient response.
MAX17080
AMD 2-/3-Output Mobile Serial
VID Controller
where VCS = VCSP - VCSN is the differential currentsense voltage, and Gm (FBAC) is 2.06mS (max) as
defined in the Electrical Characteristics table.
AC droop is required for stable operation of the
MAX17080. A minimum of 1.5mV/A is recommended.
AC droop must not be disabled.
Core Differential Remote Sense
The MAX17080 controller includes independent differential, remote-sense inputs for each CPU core to eliminate
the effects of voltage drops along the PCB traces and
through the processor’s power pins. The feedback-sense
(FBDC_) input connects to the remote-sensed output
through the resistance at FBDC_ (RFBDC_). The groundsense (GNDS_) input connects to an amplifier that adds
an offset directly to the target voltage, effectively
adjusting the output voltage to counteract the voltage
drop in the ground path. Connect the feedback-sense
(FBDC_) RFBDC_ resistor and ground-sense (GNDS_)
input directly to the respective CPU core’s remotesense outputs as shown in Figure 2.
GNDS1 and GNDS2 are dual-function pins. At power-on,
the voltage levels on GNDS1 and GNDS2 configure the
MAX17080 as two independent switching SMPSs, or one
higher current 2-phase SMPS. Keep both GNDS1 and
GNDS2 low during power-up to configure the MAX17080
in separate mode. Connect GNDS1 or GNDS2 to a voltage above 0.8V (typ) for combined-mode operation. In
the AMD mobile system, this is automatically done by the
CPU that is plugged into the socket that pulls GNDS1 or
GNDS2 the VDDIO voltage level.
When GNDS1 is pulled high to indicate combinedmode operation, the remote ground sense is automatically switched to GNDS2. When GNDS2 is pulled high
to indicate combined-mode operation, the remote
ground sense is automatically switched to GNDS1.
GNDS1 and GNDS2 do not dynamically switch in the
real application. It is only switched when one CPU is
removed (e.g., split-core CPU), and another is plugged
in (e.g., combined-core CPU). This should not be done
when the socket is “hot” (i.e., powered).
The MAX17080 checks the GNDS1 and GNDS2 levels
at the time when the internal REFOK signal goes high,
and latches the operating mode information (separate
or combined mode). This latch is cleared by cycling the
SHDN pin.
26
Core Integrator Amplifier
An internal integrator amplifier forces the DC average of
the FBDC_ voltage to equal the target voltage. This
transconductance amplifier integrates the feedback
voltage and provides a fine adjustment to the regulation
voltage (Figure 3), allowing accurate DC output-voltage
regulation regardless of the output ripple voltage.
The MAX17080 disables the integrator during downward VID transitions done in pulse-skipping mode. The
integrator remains disabled until the transition is completed (the internal target settles) and the output is in
regulation (edge detected on the error comparator).
The integrator amplifier has the ability to shift the output
voltage by ±80mV (min). The maximum difference
between transient AC droop and DC droop should not
exceed ±80mV at the maximum allowed load current to
guarantee proper DC output-voltage accuracy over the
full load conditions.
NB SMPS Feedback Adjustment Amplifiers
NB Steady-State Voltage Positioning (DC Droop)
The NB SMPS has a built-in load-line that is -6.5mV/A.
The output peak voltage (VOUT3_PK+) is set to:
∆I
VOUT3_PK = VTARGET3 − 6.5mV/A × (I LOAD3 + L 3 )
2
( V − VOUT3 ) × VOUT3
∆I L3 = IN3
L3 × VIN3 × fSW 3
where the target voltage (VTARGET3) is defined in the
Nominal Output-Voltage Selection section, fSW3 is the
NB switching frequency, and ILOAD3 is the output load
current of the NB SMPS.
2-Wire Serial Interface (SVC, SVD)
The MAX17080 supports the 2-wire, write-only, serialinterface bus as defined by the AMD serial VID interface specification. The serial interface is similar to the
high-speed 3.4MHz I2C bus, but without the master
mode sequence. The bus consists of a clock line (SVC)
and a data line (SVD). The CPU is the bus master, and
the MAX17080 is the slave. The MAX17080 serial interface works from 100kHz to 3.4MHz. In the AMD mobile
application, the bus runs at 3.4MHz.
The serial interface is active only after PGD_IN goes
high in the startup sequence. The CPU sets the VID
voltage of the three internal DACs and the PSI_L bit
through the serial interface.
During the startup sequence, the SVC and SVD inputs
serve an alternate function to set the 2-bit boot VID for
all three DACs while PWRGD is low.
______________________________________________________________________________________
AMD 2-/3-Output Mobile Serial
VID Controller
Core SMPS Output Voltage
The nominal no-load output voltage (V TARGET_ ) for
each SMPS is defined by the selected voltage reference (VID DAC) plus the remote ground-sense adjustment (V GNDS ) and the offset voltage (V OFFSET ) as
defined in the following equation:
VTARGET = VFBDC = VDAC + VGNDS + VOFFSET
where VDAC is the selected VID voltage of the core
SMPS DAC, VGNDS is the ground-sense correction voltage for core supplies, and VOFFSET is the +12.5mV offset enabled by the OPTION pin when the PSI_L is set
high for core supplies.
NB SMPS Output Voltage
The nominal output voltage (VTARGET) for the NB is
defined by the selected voltage reference (VID DAC)
plus the offset voltage (VOFFSET_NB) as defined in the
following equation:
VTARGET3 = VOUT3 = VDAC + VOFFSET _ NB
where VDAC is the selected VID voltage of the NB DAC,
and VOFFSET_NB is +12.5mV or +6.25mV as set by the
ILIM3 pin for NB.
7-Bit DAC
Inside the MAX17080 are three 7-bit digital-to-analog
converters (DACs). Each DAC can be individually programmed to different voltage levels by the serial-interface bus. The DAC sets the target for the output voltage
for the core and NB SMPSs. The available DAC codes
and resulting output voltages are compatible with the
AMD SVI (Table 4) specifications.
Boot Voltage
On startup, the MAX17080 slews the target for all three
DACs from ground to the boot voltage set by the SVC
and SVD pin-voltage levels. While the output is still below
regulation, the SVC and SVD levels can be changed,
and the MAX17080 sets the DACs to the new boot voltage. Once the programmed boot voltage is reached and
PWRGD goes high, the MAX17080 stores the boot VID.
Changes in the SVC and SVD settings do not change the
output voltage once the boot VID is stored. When
PGD_IN goes high, the MAX17080 exits boot mode, and
the three DACs can be independently set to any voltage
in the VID table by the serial interface.
If PGD_IN goes from high to low any time after the boot
VID is stored, the MAX17080 sets all three DACs back
to the voltage of the stored boot VID.
Table 3 is the boot voltage code table.
Table 3. Boot Voltage Code Table
SVC
SVD
BOOT VOLTAGE
VOUT (V)
0
0
1.1
0
1
1.0
1
0
0.9
1
1
0.8
Core SMPS Offset
A +12.5mV offset can be added to both core SMPS
DAC voltages for applications that include DC droop.
The offset is applied only after the MAX17080 exits boot
mode (PGD_IN going from low to high), and the
MAX17080 enters the serial-interface mode. The offset
is disabled when the PSI_L bit is set, saving more
power when the load is light.
The OPTION pin setting enables or disables the
+12.5mV offset. Connect OPTION to OSC (2V) or GND
to enable the offset. Keep OPTION connected to 3.3V
or V CC to disable the offset. See the Offset and
Address Change for Core SMPSs (OPTION) section.
NB SMPS Offset
The NB SMPS output has a -6.5mV/A load-line. An offset is required to keep the output within regulation over
the full load. The offset is set by the ILIM3 pin setting
(see Table 7). Connect ILIM3 to OSC (2V) or GND to
set a +6.25mV offset. Pull the ILIM3 pin up to 3.3V or
VCC to set +12.5mV offset. See the Offset and CurrentLimit Setting for NB SMPS (ILIM3) section.
Output-Voltage Transition Timing
SMPS Output-Voltage Transition
The MAX17080 performs positive voltage transitions in
a controlled manner, automatically minimizing input
surge currents. This feature allows the circuit designer
to achieve nearly ideal transitions, guaranteeing just-intime arrival at the new output-voltage level with the lowest possible peak currents for a given output
capacitance. The slew rate (set by resistor RTIME) must
be set fast enough to ensure that the transition is completed within the maximum allotted time for proper CPU
operation. RTIME is between 35.7kΩ and 357kΩ for corresponding slew rates between 25mV/µs to 2.5mV/µs,
respectively, for the SMPSs.
At the beginning of an output-voltage transition, the
MAX17080 blanks both PWRGD comparator thresholds,
preventing the PWRGD open-drain output from changing states during the transition. At the end of an upward
VID transition, the controller enables both PWRGD
thresholds approximately 20µs after the slew-rate
______________________________________________________________________________________
27
MAX17080
Nominal Output-Voltage Selection
MAX17080
AMD 2-/3-Output Mobile Serial
VID Controller
controller reaches the target output voltage. At the end
of a downward VID transition, the upper PWRGD threshold is enabled only after the output reaches the lower
VID code setting. Figure 5 shows VID transition timing.
The MAX17080 automatically controls the current to the
minimum level required to complete the transition in the
calculated time. The slew-rate controller uses an internal capacitor and current source programmed by
RTIME to transition the output voltage. The total transition time depends on RTIME, the voltage difference, and
the accuracy of the slew-rate controller (C SLEW
accuracy). The slew rate is not dependent on the total
output capacitance, as long as the surge current is less
than the current limit set by ILIM12 for the core SMPSs
and ILIM3 for the NB SMPS. For all dynamic positive
VID transitions or negative VID transitions in forcedPWM mode (PSI_L set to 1), the transition time (tTRAN)
is given by:
− VOLD ⎤⎦
⎡V
t TRAN = ⎣ NEW
( dVTARGET /dt )
The output voltage tracks the slewed target voltage,
making the transitions relatively smooth. The average
inductor current per phase required to make an output
voltage transition is:
)
where dVTARGET/dt is the required slew rate and COUT
is the total output capacitance of each phase.
If the SMPS is in a pulse-skipping mode (PSI_L set to
0), the discharge rate of the output voltage during
downward transitions is then dependent on the load
current and total output capacitance for loads less than
a minimum current, and dependent on the RTIME programmed slew rate for heavier loads. The critical load
current (ILOAD(CRIT)) where the transition time is dependent on the load is:
ILOAD(CRIT) ≅ COUT × ( dVTARGET /dt )
For load currents less than ILOAD(CRIT), the transition
time is:
C
× dVTARGET
t TRAN ≅ OUT
ILOAD
For soft-start, the controller uses a fixed slew rate of
1mV/µs. In shutdown, the outputs are discharged using
28
Forced-PWM Operation
After exiting the boot mode and if the PSI_L bit is set to
1, the MAX17080 operates with the low-noise, forcedPWM control scheme. Forced-PWM operation disables
the zero-crossing comparator, forcing the low-side
gate-drive waveforms to constantly be the complement
of the high-side gate-drive waveforms. This keeps the
switching frequency constant and allows the inductor
current to reverse under light loads, providing fast,
accurate negative output-voltage transitions by quickly
discharging the output capacitors.
Forced-PWM operation comes at a cost: the no-load +5V
bias supply current remains between 50mA to 70mA,
depending on the external MOSFETs and switching frequency. To maintain high efficiency under light load
conditions, the processor could switch the controller to a
low-power pulse-skipping control scheme.
Pulse-Skipping Operation
where dVTARGET/dt = 6.25mV/µs × 143kΩ/RTIME is the
slew rate, VOLD is the original output voltage, and VNEW
is the new target voltage. See the Slew-Rate Accuracy
in the Electrical Characteristics table for slew-rate limits.
IL ≅ COUT × ( dVTARGET /dt
a 20Ω switch through the CSN_ pins for the core
SMPSs and through the OUT3 pin for the NB SMPS.
During soft-start and in power-saving mode—when the
PSI_L bit is set to 0—the MAX17080 operates in pulseskipping mode. Pulse-skipping mode enables the driver’s
zero-crossing comparator, so the driver pulls its DL low
when “zero” inductor current is detected (VGND - VLX =
0). This keeps the inductor from discharging the output
capacitors and forces the controller to skip pulses under
light load conditions to avoid overcharging the output.
In pulse-skipping operation, the controller terminates
the on-time when the output voltage exceeds the feedback threshold and when the current-sense voltage
exceeds the idle-mode current-sense threshold (VIDLE
= 0.15 x VLIMIT for the core SMPS and ILX3MIN = 0.25 x
ILX3PK setting for the NB SMPS). Under heavy load
conditions, the continuous inductor current remains
above the idle-mode current-sense threshold, so the
on-time depends only on the feedback voltage threshold. Under light load conditions, the controller remains
above the feedback voltage threshold, so the on-time
duration depends solely on the idle-mode currentsense threshold, which is approximately 15% of the fullload peak current-limit threshold set by ILIM12 for the
core SMPSs and 25% of the full-load peak current-limit
threshold set by ILIM3 for the NB SMPS.
During downward VID transitions, the controller temporarily sets the OVP threshold of the SMPSs to 1.85V
(typ), preventing false OVP faults. Once the error amplifier detects that the output voltage is in regulation, the
OVP threshold tracks the selected VID DAC code.
______________________________________________________________________________________
AMD 2-/3-Output Mobile Serial
VID Controller
BUS IDLE
SMPS LOAD
BUS IDLE
BUS IDLE
LIGHT LOAD
PWRGD UPPER THRESHOLD
MAX17080
SVC/SVD
HEAVY LOAD
UPPER THRESHOLD BLANKED
SMPS TARGET
SMPS VOLTAGE
(SMPS TARGET)
PWRGD LOWER
THRESHOLD
PWRGD
BLANK
HIGH-Z
20µs
BLANK
HIGH-Z
20µs
BLANK
HIGH-Z
20µs
Figure 5. VID Transition Timing
Each SMPS can be individually set to operate in pulseskipping mode when its PSI_L bit is set to 0, or set to
operate in forced-PWM mode when its PSI_L bit is set
to 1.
When the core SMPSs are configured for combinedmode operation, core supplies operate in 1-phase
pulse-skipping mode when PSI_L = 0, and core supplies are in 2-phase forced-PWM mode when PSI_L = 1.
the driver forces DL low. This mechanism causes the
threshold between pulse-skipping PFM and nonskipping PWM operation to coincide with the boundary
between continuous and discontinuous inductor-current
operation (also known as the critical conduction point).
The load-current level at which the PFM/PWM crossover
occurs, ILOAD(SKIP), is given by:
V
(V − V )
I LOAD(SKIP) = OUT IN OUT
2VINfSWL
Idle-Mode Current-Sense Threshold
The idle-mode current-sense threshold forces a lightly
loaded SMPS to source a minimum amount of power
with each on-time since the controller cannot terminate
the on-time until the current-sense voltage exceeds the
idle-mode current-sense threshold (V IDLE = 0.15 x
VLIMIT for the core SMPS and ILX3MIN = 0.25 x ILX3PK
setting for the NB SMPS). Since the zero-crossing comparator prevents the switching SMPS from sinking
current, the controller must skip pulses to avoid overcharging the output. When the clock edge occurs, if the
output voltage still exceeds the feedback threshold, the
controller does not initiate another on-time. This forces
the controller to actually regulate the valley of the output voltage ripple under light load conditions.
The switching waveforms can appear noisy and asynchronous when light loading causes pulse-skipping
operation, but this is a normal operating condition that
results in high light-load efficiency. Trade-off in PFM
noise vs. light-load efficiency is made by varying the
inductor value. Generally, low inductor values produce a
broader efficiency vs. load curve, while higher values
result in higher full-load efficiency (assuming that the coil
resistance remains fixed) and less output voltage ripple.
Penalties for using higher inductor values include larger
physical size and degraded load-transient response
(especially at low input-voltage levels).
Automatic Pulse-Skipping Crossover
In skip mode, the MAX17080 zero-crossing comparators are active. Therefore, an inherent automatic
switchover to PFM takes place at light loads, resulting
in a highly efficient operating mode. This switchover is
affected by a comparator that truncates the low-side
switch on-time at the inductor current’s zero crossing.
The driver’s zero-crossing comparator senses the
inductor current across the low-side MOSFET. Once
VGND - VLX drops below the zero-crossing threshold,
Core SMPS Current Sense
The output current of each phase is sensed differentially.
A low offset voltage and high-gain differential current
amplifier at each phase allows low-resistance currentsense resistors to be used to minimize power dissipation. Sensing the current at the output of each phase
offers advantages, including less noise sensitivity, more
accurate current sharing between phases, and the flexibility of using either a current-sense resistor or the DC
resistance of the output inductor.
Current Sense
______________________________________________________________________________________
29
MAX17080
AMD 2-/3-Output Mobile Serial
VID Controller
Table 4. Output-Voltage VID DAC Codes
SVID[6:0]
OUTPUT
VOLTAGE
(V)
SVID[6:0]
OUTPUT
VOLTAGE
(V)
SVID[6:0]
OUTPUT
VOLTAGE
(V)
SVID[6:0]
OUTPUT
VOLTAGE
(V)
000_0000
1.5500
010_0000
1.1500
100_0000
0.7500
110_0000
0.3500
000_0001
1.5375
010_0001
1.1375
100_0001
0.7375
110_0001
0.3375
000_0010
1.5250
010_0010
1.1250
100_0010
0.7250
110_0010
0.3250
000_0011
1.5125
010_0011
1.1125
100_0011
0.7125
110_0011
0.3125
000_0100
1.5000
010_0100
1.1000
100_0100
0.7000
110_0100
0.3000
000_0101
1.4875
010_0101
1.0875
100_0101
0.6875
110_0101
0.2875
000_0110
1.4750
010_0110
1.0750
100_0110
0.6750
110_0110
0.2750
000_0111
1.4625
010_0111
1.0625
100_0111
0.6625
110_0111
0.2625
000_1000
1.4500
010_1000
1.0500
100_1000
0.6500
110_1000
0.2500
000_1001
1.4375
010_1001
1.0375
100_1001
0.6375
110_1001
0.2375
000_1010
1.4250
010_1010
1.0250
100_1010
0.6250
110_1010
0.2250
000_1011
1.4125
010_1011
1.0125
100_1011
0.6125
110_1011
0.2125
000_1100
1.4000
010_1100
1.0000
100_1100
0.6000
110_1100
0.2000
000_1101
1.3875
010_1101
0.9875
100_1101
0.5875
110_1101
0.1875
000_1110
1.3750
010_1110
0.9750
100_1110
0.5750
110_1110
0.1750
000_1111
1.3625
010_1111
0.9625
100_1111
0.5625
110_1111
0.1625
001_0000
1.3500
011_0000
0.9500
101_0000
0.5500
111_0000
0.1500
001_0001
1.3375
011_0001
0.9375
101_0001
0.5375
111_0001
0.1375
001_0010
1.3250
011_0010
0.9250
101_0010
0.5250
111_0010
0.1250
001_0011
1.3125
011_0011
0.9125
101_0011
0.5125
111_0011
0.1125
001_0100
1.3000
011_0100
0.9000
101_0100
0.5000
111_0100
0.1000
001_0101
1.2875
011_0101
0.8875
101_0101
0.4875
111_0101
0.0875
001_0110
1.2750
011_0110
0.8750
101_0110
0.4750
111_0110
0.0750
001_0111
1.2625
011_0111
0.8625
101_0111
0.4625
111_0111
0.0625
001_1000
1.2500
011_1000
0.8500
101_1000
0.4500
111_1000
0.0500
001_1001
1.2375
011_1001
0.8375
101_1001
0.4375
111_1001
0.0375
001_1010
1.2250
011_1010
0.8250
101_1010
0.4250
111_1010
0.0250
001_1011
1.2125
011_1011
0.8125
101_1011
0.4125
111_1011
0.0125
001_1100
1.2000
011_1100
0.8000
101_1100
0.4000
111_1100
OFF
001_1101
1.1875
011_1101
0.7875
101_1101
0.3875
111_1101
OFF
001_1110
1.1750
011_1110
0.7750
101_1110
0.3750
111_1110
OFF
001_1111
1.1625
011_1111
0.7625
101_1111
0.3625
111_1111
OFF
Note: The NB SMPS output voltage has an offset of +12.5mV or +6.25mV depending on the ILIM3 pin setting.
When using a current-sense resistor for accurate output-voltage positioning, the circuit requires a differential
RC filter to eliminate the AC voltage step caused by the
equivalent series inductance (L ESL ) of the currentsense resistor (see Figure 6). The ESL-induced voltage
step does not affect the average current-sense voltage,
30
but results in a significant peak current-sense voltage
error that results in unwanted offsets in the regulation
voltage and early current-limit detection. Similar to the
inductor DCR sensing method above, the RC filter’s
time constant should match the L/R time constant
______________________________________________________________________________________
AMD 2-/3-Output Mobile Serial
VID Controller
MAX17080
INPUT (VIN)
CIN
DH_
SENSE RESISTOR
NH
L
LESL
RSENSE
LX_
CEQREQ =
COUT
DL_
NL
DL
LESL
RSENSE
CEQ
REQ
MAX17080
CSP_
CSN_
A) OUTPUT SERIES RESISTOR SENSING
INPUT (VIN)
CIN
DH_
INDUCTOR
NH
L
RCS =
RDCR
R2
× RDCR
R1 + R2
LX_
COUT
DL_
NL
DL
R1
RLX
CLX
MAX17080
CSP_
CSN_
R2
RDCR =
L
1
1
×
+
CEQ
R1 R2
CEQ
FOR THERMAL COMPENSATION:
R2 SHOULD CONSIST OF AN NTC RESISTOR
IN SERIES WITH A STANDARD THIN-FILM
RESISTOR.
B) LOSSLESS INDUCTOR DCR SENSING
Figure 6. Current-Sense Configurations
formed by the current-sense resistor’s parasitic inductance:
LESL
= REQCSENSE
RSENSE
where LESL is the equivalent series inductance of the
current-sense resistor, RSENSE is current-sense resistance value, and CSENSE and REQ are the time-constant matching components.
Using the DC resistance (RDCR) of the output inductor
allows higher efficiency. In this configuration, the initial
tolerance and temperature coefficient of the inductor’s
DCR must be accounted for in the output-voltage
droop-error budget and power monitor. This currentsense method uses an RC filtering network to extract
the current information from the output inductor (see
Figure 6). The time constant of the RC network should
match the inductor’s time constant (L/RDCR):
L
= REQCSENSE
RDCR
where CSENSE and REQ are the time-constant matching
components. To minimize the current-sense error due to
the current-sense inputs’ bias current (ICSP and ICSN),
choose REQ less than 2kΩ and use the above equation
to determine the sense capacitance (CSENSE). Choose
capacitors with 5% tolerance and resistors with 1% tolerance specifications. Temperature compensation is
recommended for this current-sense method. See the
Core Voltage Positioning and Loop Compensation section for detailed information.
Additional RLX and CLX are always added between the
LX_ and CSP_ pins if DCR sensing is used, and they
provide additional overdrive to the current-sense signal
to improve the noise immunity; otherwise, there might
be too much jitter or the system could be unstable.
______________________________________________________________________________________
31
MAX17080
AMD 2-/3-Output Mobile Serial
VID Controller
1
2
3
4
5
6
DC_IN
VDDIO
SVC/SVD
2-BIT BOOT VID
BUS IDLE
SERIAL MODE
SHDN
GNDS1 OR GNDS2
(VDD_PLANE_STRAP)
7
SMPS VOUT
PWRGD
BLANK
HIGH-Z
20µs
10µs
20µs
PGD_IN
RESET_L
8
Figure 7. Startup Sequence
NB SMPS Current Sense
The NB current sense is achieved by sensing the voltage across the high-side internal MOSFET during the
on-time. The current information is computed by dividing
the sensed voltage by the MOSFET’s on-resistance,
RON(NH3).
Combined-Mode Current Balance
When the core SMPSs are configured in combined
mode (GNDS1 or GNDS2 pulled to V DDIO ), the
MAX17080 current-mode architecture automatically
forces the individual phases to remain current balanced. SMPS1 is the main voltage-control loop, and
SMPS2 maintains the current balance between the
phases. This control scheme regulates the peak inductor current of each phase, forcing them to remain properly balanced. Therefore, the average inductor current
variation depends mainly on the variation in the currentsense element and inductance value.
Peak Current Limit
The MAX17080 current-limit circuit employs a fast peak
inductor current-sensing algorithm. Once the currentsense signal of the SMPS exceeds the peak current-limit
threshold, the PWM controller terminates the on-time.
32
See the Core Peak Inductor Current Limit (ILIM12) section in the Core SMPS Design Procedure section.
Power-Up Sequence (POR, UVLO, PGD_IN)
Power-on reset (POR) occurs when VCC rises above
approximately 3V, resetting the fault latch and preparing the controller for operation. The VCC undervoltagelockout (UVLO) circuitry inhibits switching until VCC
rises above 4.25V (typ). The controller powers up the
reference once the system enables the controller VCC
above 4.25V and SHDN is driven high. With the reference in regulation, the controller ramps the SMPS and
NB voltages to the boot voltage set by the SVC and
SVD inputs:
tSTART =
VBOOT
(1mV/µs )
The soft-start circuitry does not use a variable current
limit, so full output current is available immediately.
PWRGD becomes high impedance approximately 20µs
after the SMPS outputs reach regulation. The boot VID
is stored the first time PWRGD goes high. The
MAX17080 is in pulse-skipping mode during soft-start.
Figure 7 shows the MAX17080 startup sequence.
______________________________________________________________________________________
AMD 2-/3-Output Mobile Serial
VID Controller
Notes for Figure 7:
1) The relationship between DC_IN and VDDIO is not
guaranteed. It is possible to have VDDIO powered
when DC_IN is not powered, and it is possible to
have DC_IN power up before VDDIO powers up.
2) As the VDDIO power rail comes within specification,
VDD_Plane_Strap becomes valid and SVC and SVD
are driven to the boot VID value by the processor.
The system guarantees that VDDIO is in specification and SVC and SVD are driven to the boot VID
value for at least 10µs prior to SHDN being asserted
to the MAX17080.
3) After SHDN is asserted, the MAX17080 samples and
latches the VDD_Plane_Strap level at its GNDS1 and
GNDS2 pins when REF reaches the REFOK threshold, and ramps up the voltage plane outputs to the
level indicated by the 2-bit boot VID. The boot VID is
stored in the MAX17080 for use when PGD_IN
deasserts. The MAX17080 soft-starts the output rails
to limit inrush current from the DC_IN rail. The
MAX17080 operates in pulse-skipping mode in the
boot mode regardless of PSI_L settings.
4) The MAX17080 asserts PWRGD. After PWRGD is
asserted and all system-wide voltage planes and
free-running clocks are within specification, then the
system asserts PGD_IN.
5) The processor holds the 2-bit boot VID for at least
10µs after PGD_IN is asserted.
6) The processor issues the set VID command through SVI.
7) The MAX17080 transitions the voltage planes to the
set VID. The set VID can be greater than or less
than the boot VID voltage. The MAX17080 operates
in pulse-skipping mode or forced-PWM mode
according to the PSI_L setting.
8) The chipset enforces a 1ms delay between PGD_IN
assertion and RESET_L deassertion.
PWRGD
The MAX17080 features internal power-good fault comparators for each SMPS. The outputs of these individual
power-good fault comparators are logically ORed to drive
the gate of the open-drain PWRGD output transistor.
Each SMPS’s power-good fault comparator has an
upper threshold of +200mV (typ) and a lower threshold
of -300mV (typ). PWRGD goes low if the output of either
SMPS exceeds its respective threshold.
PWRGD is forced low during the startup sequence up to
20µs after the output is in regulation. The 2-bit boot VID
is stored when PWRGD goes high during the startup
sequence. PWRGD is immediately forced low when
SHDN goes low.
PWRGD is blanked high impedance while any of the
internal SMPS DACs are slewing during a VID transition,
plus an additional 20µs after the DAC transition is completed. For downward VID transitions, the upper threshold
of the particular power-good fault comparators remains
blanked until the output reaches regulation again.
PWRGD is blanked high impedance for each SMPS
whose internal DAC is in off mode, and is pulled low if
all three SMPS DACs are in off mode.
PWRGD is forced low for a minimum of 20µs when
PGD_IN goes low during normal operation, and
remains low until all SMPS output voltages are within
their respective power-good windows.
PGD_IN
After the SMPS outputs reach the boot voltage, the
MAX17080 switches to the serial-interface mode when
PGD_IN goes high. Anytime during normal operation, a
high-to-low transition on PGD_IN causes the MAX17080
to slew all three internal DACs back to the stored boot
VIDs. PWRGD goes low immediately when PGD_IN goes
low, and stays low until 20µs after the SMPS outputs are
within their respective PWRGD thresholds. The SVC and
SVD inputs are disabled during the time that PGD_IN is
low. The serial interface is reenabled when PGD_IN
goes high again. Figure 8 shows PGD_IN timing.
Shutdown
When SHDN goes low, the MAX17080 enters shutdown
mode. PWRGD is pulled low immediately and forces all
DH and DL low, and all three outputs are discharged
through the 20Ω internal discharge FETs through CSN pin
for core SMPSs and through the OUT3 pin for NB SMPSs.
______________________________________________________________________________________
33
MAX17080
For automatic startup, the battery voltage should be
present before VCC. If the controller attempts to bring
the output into regulation without the battery voltage
present, the fault latch trips. The controller remains shut
down until the fault latch is cleared by toggling SHDN
or cycling the VCC power supply below 0.5V.
If the VCC voltage drops below 4.25V, the controller
assumes that there is not enough supply voltage to
make valid decisions and could also result in the stored
boot VIDs being corrupted. As such, the MAX17080
immediately stops switching (DH_ and DL_ pulled low),
latches off, and discharges the outputs using the internal 20Ω switches from CSN_ to GND.
MAX17080
AMD 2-/3-Output Mobile Serial
VID Controller
PULSE-SKIPPING MODE
PSI_L
SVC/SVD
BUS IDLE
SMPS VOUT
(HIGH DAC TARGET)
TARGET
BUS IDLE
2-BIT BOOT VID, SVC/SVD INPUTS DISABLED
VOUT
(LOW DAC TARGET)
SMPS VOUT
PGD_IN
PWRGD
BLANK
HIGH-Z
20µs
20µs
Figure 8. PGD_IN Timing
RPTC1
VCC
RTHRM
PLACE RNTC NEXT TO THE
HOTTEST POWER COMPONENT.
VCC
RPTC2
MAX17080
THRM
RNTC
PLACE RPTC1, RPTC2, AND RPTC3
NEXT TO THE RESPECTIVE SMPS'S
POWER COMPONENT.
GND
MAX17080
RPTC3
THRM
RTHRM
GND
Figure 9. THRM Configuration
VRHOT Temperature Comparator
The MAX17080 features an independent comparator
with an accurate threshold (VHOT) that tracks the analog supply voltage (VHOT = 0.3VCC). Use a resistorand thermistor-divider between VCC and GND to generate a voltage-SMPS overtemperature monitor. Place the
thermistor as close as possible to the MOSFETs and
inductors.
Place three individual thermistors near to each SMPS to
monitor the temperature of the respective SMPS. When
core SMPSs are in combined-mode operation, the current-balance circuit balances the currents between
core SMPS phases. As such, the power loss and heat
in each phase should be identical, apart from the
effects of placement and airflow over each phase.
Single thermistors can be placed near either of the
phases and still be effective for core SMPS temperature
34
monitoring, and one thermistor can be saved. See
Figure 9.
Fault Protection (Latched)
Output Overvoltage Protection (OVP)
The overvoltage protection (OVP) circuit is designed to
protect the CPU against a shorted high-side MOSFET
by drawing high current and blowing the battery fuse.
The MAX17080 continuously monitors the output for an
overvoltage fault. The controller detects an OVP fault if
the output voltage exceeds the set VID DAC voltage by
more than 300mV. The OVP threshold tracks the VID
DAC voltage except during a downward VID transition.
During a downward VID transition, the OVP threshold is
set at 1.85V (typ) until the output reaches regulation,
when the OVP threshold is reset back to 300mV above
the VID setting.
______________________________________________________________________________________
AMD 2-/3-Output Mobile Serial
VID Controller
When the core SMPSs are configured in combined mode,
the synchronous-rectifier MOSFETs of both phases are
turned on with 100% duty in response to an overvoltage
fault. Passive shutdown is initiated for the NB SMPS.
The NB SMPS has no OVP.
Output Undervoltage Protection (UVP)
If any of the MAX17080 output voltages are 400mV
below the target voltage, the controller sets the fault
latch, shuts down all the SMPSs, and activates the
internal passive discharge MOSFET. Toggle SHDN or
cycle the VCC power supply below 0.5V to clear the
fault latch and reactivate the controller.
VCC Undervoltage-Lockout (UVLO) Protection
If the VCC voltage drops below 4.2V (typ), the controller
assumes that there is not enough supply voltage to
make valid decisions and sets a fault latch. During a
UVLO fault, the controller shuts down all the SMPSs
immediately, and forces DL and DH low, and pulls
CSN1, CSN2, and OUT3 low through internal 20Ω discharge FETs. If the VCC falls below the POR threshold
(1.8V, typ), DL is forced low even if it was previously
high due to a latched overvoltage fault.
Toggle SHDN or cycle the VCC power supply below
0.5V to clear the fault latch and reactivate the controller.
VDDIO Undervoltage-Lockout (UVLO) Protection
If the VDDIO voltage drops below 0.7V (typ), the controller assumes that there is not enough supply voltage
to make valid decisions and sets a UV fault latch.
During VDDIO UVLO, as with UVP, the controller shuts
down all the SMPSs immediately, forces DL and DH
low, and pulls CSN1, CSN2, and OUT3 low through
internal 20Ω discharge FETs. If the VCC falls below the
POR threshold (1.8V, typ), DL is forced low even if it
was previously high due to a latched overvoltage fault.
Toggle SHDN or cycle the VCC power supply below
0.5V to clear the fault latch and reactivate the controller.
Thermal Fault Protection
The MAX17080 features a thermal fault protection
circuit. When the junction temperature rises above
+160°C, a thermal sensor sets the fault latch and shuts
down immediately, forcing DH and DL low and turning
on the 20Ω discharge FETs for all SMPSs. Toggle
SHDN or cycle the VCC power supply below 0.5V to
clear the fault latch and reactivate the controller after
the junction temperature cools by 15°C.
Other Fault Protection (Nonlatched)
VIN3 Undervoltage-Lockout (UVLO) Protection
If the VIN3 voltage drops below 2.5V (typ), the controller
assumes that there is not enough input voltage for NB
SMPSs. If VIN3 UVLO happens before or just after softstart, the NB SMPS is disabled and the internal target
voltage stays off. When the VIN3 subsequently rises past
its UVLO rising threshold 2.6V (typ), NB goes through the
soft-start sequence with a 1mV/µs slew rate.
If VIN3 UVLO happens while the MAX17080 is running,
the NB SMPS is stopped, the NB target is reset to 0
immediately, and PWRGD is forced low. When VIN3
subsequently rises above the UVLO rising threshold
2.6V (typ), the NB SMPS restarts with 1mV/µs slew rate
to the previous DAC target.
Core SMPS MOSFET Gate Drivers
The DH and DL drivers are optimized for driving moderate-sized high-side and larger low-side power
MOSFETs. This is consistent with the low duty factor
seen in notebook applications where a large VIN - VOUT
differential exists. The high-side gate drivers (DH)
source and sink 2.2A, and the low-side gate drivers
(DL) source 2.7A and sink 8A. This ensures robust gate
drive for high-current applications. The DH floating
high-side MOSFET drivers are powered by internal
boost switch charge pumps at BST, while the DL synchronous-rectifier drivers are powered directly by the
5V bias supply (VDD).
Adaptive dead-time circuits monitor the DL and DH drivers and prevent either FET from turning on until the
other is fully off. The adaptive driver dead time allows
operation without shoot-through with a wide range of
MOSFETs, minimizing delays and maintaining efficiency.
There must be a low-resistance, low-inductance path
from the DL and DH drivers to the MOSFET gates
for the adaptive dead-time circuits to work properly;
otherwise, the sense circuitry in the MAX17080 interprets the MOSFET gates as “off” while charge actually
remains. Use very short, wide traces (50 mils to 100
mils wide if the MOSFET is 1in from the driver).
______________________________________________________________________________________
35
MAX17080
When the OVP circuit detects an overvoltage fault in
core SMPSs, it immediately sets the fault latch and
forces the external low-side driver high on the faulted
SMPS. The nonfaulted SMPSs are also shut down by
turning on the internal passive discharge MOSFET. The
synchronous-rectifier MOSFETs of the faulted side are
turned on with 100% duty, which rapidly discharges the
output filter capacitor and forces the output low. If the
condition that caused the overvoltage (such as a shorted high-side MOSFET) persists, the battery fuse blows.
Toggle SHDN or cycle the VCC power supply below
0.5V to clear the fault latch and reactivate the controller.
MAX17080
AMD 2-/3-Output Mobile Serial
VID Controller
MAX17080
BST
(RBST)*
INPUT (VIN)
CBST
DH
NH
L
LX
VDD
CBYP
Alternatively, shoot-through currents can be caused by
a combination of fast high-side MOSFETs and slow lowside MOSFETs. If the turn-off delay time of the low-side
MOSFET is too long, the high-side MOSFETs can turn
on before the low-side MOSFETs have actually turned
off. Adding a resistor less than 5Ω in series with BST
slows down the high-side MOSFET turn-on time, eliminating the shoot-through currents without degrading the
turn-off time (R BST in Figure 10). Slowing down the
high-side MOSFET also reduces the LX node rise time,
thereby reducing EMI and high-frequency coupling
responsible for switching noise.
Offset and Address Change
for Core SMPSs (OPTION)
DL
NL
(CNL)*
PGND
(RBST)* OPTIONAL—THE RESISTOR LOWERS EMI BY DECREASING
THE SWITCHING NODE RISE TIME.
(CNL)* OPTIONAL—THE CAPACITOR REDUCES LX-TO-DL CAPACITIVE
COUPLING THAT CAN CAUSE SHOOT-THROUGH CURRENTS.
Figure 10. Gate-Drive Circuit
The internal pulldown transistor that drives DL low is
robust, with a 0.25Ω (typ) on-resistance. This helps prevent DL from being pulled up due to capacitive coupling
from the drain to the gate of the low-side MOSFETs
when the inductor node (LX) quickly switches from
ground to VIN. Applications with high input voltages and
long inductive driver traces could require rising LX
edges that do not pull up the low-side MOSFET’s gate,
causing shoot-through currents. The capacitive coupling
between LX and DL created by the MOSFET’s gate-todrain capacitance (CRSS), gate-to-source capacitance
(CISS - CRSS), and additional board parasitics should not
exceed the following minimum threshold:
⎛C
⎞
VGS(TH) > VIN ⎜ RSS ⎟
⎝ CISS ⎠
Typically, adding a 4700pF capacitor between DL and
power ground (CNL in Figure 10), close to the low-side
MOSFETs, greatly reduces coupling. Do not exceed
22nF of total gate capacitance to prevent excessive
turn-off delays.
36
The +12.5mV offset and the address change features
of the MAX17080 can be selectively enabled and disabled by the OPTION pin setting. When the offset is
enabled, setting the PSI_L bit to 0 disables the offset,
reducing power consumption in the low-power state.
See the Core SMPS Offset section for a detailed
description of this feature.
In addition, the address of the core SMPSs can be
exchanged, allowing for flexible layout of the
MAX17080 with respect to the CPU placement on the
same or opposite sides of the PCB. Table 6 shows the
OPTION pin voltage levels and the features that are
enabled.
Table 6. OPTION Pin Settings
OPTION
OFFSET
ENABLES
SMPS1
ADDRESS
SMPS2
ADDRESS
VCC
0
BIT 1 (VDD0)
BIT 2 (VDD1)
3.3V
0
BIT 2 (VDD1)
BIT 1 (VDD0)
2V
1
BIT 1 (VDD0)
BIT 2 (VDD1)
GND
1
BIT 2 (VDD1)
BIT 1 (VDD0)
Note: VDD0 refers to CORE0 and VDD1 refers to CORE1 for
the AMD CPU.
Offset and Current-Limit Setting
for NB SMPS (ILIM3)
The offset and current-limit settings of the NB SMPS
can be set by the ILIM3 pin setting. Table 7 shows the
ILIM3 pin voltage levels and the corresponding settings
for the offset and current limit of the NB SMPS. The NB
offset is always present regardless of PSI_L setting.
The I LX3MIN minimum current-limit threshold in skip
mode is precisely 25% of the corresponding positive
current-limit threshold.
______________________________________________________________________________________
AMD 2-/3-Output Mobile Serial
VID Controller
MAX17080
Table 7. ILIM3 Setting
ILIM3
PEAK CURRENT
LIMIT (A)
SKIP CURRENT
LIMIT (A)
MAX DC
CURRENT (A)
FULL-LOAD
DROOP (mV)
OFFSET
(mV)
VCC
4.0
1.0
3.5
-21
12.5
3.3V
3.4
0.85
3.0
-17.5
12.5
2V
2.8
0.7
2.5
-14
6.25
GND
2.2
0.55
1.9
-10.4
6.25
SMPS Design Procedure
Firmly establish the input voltage range and maximum
load current before choosing a switching frequency
and inductor operating point (ripple-current ratio). The
primary design trade-off lies in choosing a good switching frequency and inductor operating point, and the following four factors dictate the rest of the design:
• Input Voltage Range: The maximum value (VIN(MAX))
must accommodate the worst-case high AC adapter
voltage. The minimum value (VIN(MIN)) must account for
the lowest input voltage after drops due to connectors,
fuses, and battery selector switches. If there is a choice
at all, lower input voltages result in better efficiency.
• Maximum Load Current: There are two values to
consider. The peak load current (ILOAD(MAX)) determines the instantaneous component stresses and filtering requirements, and thus drives output capacitor
selection, inductor saturation rating, and the design
of the current-limit circuit. The continuous load current (ILOAD) determines the thermal stresses and thus
drives the selection of input capacitors, MOSFETs,
and other critical heat-contributing components.
Modern notebook CPUs generally exhibit ILOAD =
ILOAD(MAX) x 80%.
For multiphase systems, each phase supports a fraction of the load, depending on the current balancing.
When properly balanced, the load current is evenly
distributed among each phase:
I
ILOAD(PHASE) = LOAD
ηPH
where ηPH is the total number of active phases.
• Core Switching Frequency: This choice determines
the basic trade-off between size and efficiency. The
optimal frequency is largely a function of maximum
input voltage, due to MOSFET switching losses that
are proportional to frequency and VIN2. The optimum
frequency is also a moving target, due to rapid
improvements in MOSFET technology that are making
higher frequencies more practical.
When selecting a switching frequency, the minimum
on-time at the highest input voltage and lowest output
voltage must be greater than the 150ns (max) minimum on-time specification in the Electrical
Characteristics table:
VOUT(MIN)/VIN(MAX) x tSW > tON(MIN)
A good rule is to choose a minimum on-time of at
least 200ns.
When in pulse-skipping operation (PSI_L = 0), the
minimum on-time must take into consideration the
time needed for proper skip-mode operation. The ontime for a skip pulse must be greater than the 170ns
(max) minimum on-time specification in the Electrical
Characteristics table:
tON(MIN) ≤
LVIDLE
RSENSE VIN(MAX) − VOUT(MIN)
(
)
• Inductor Operating Point: This choice provides
trade-offs between size vs. efficiency and transient
response vs. output noise. Low inductor values provide better transient response and smaller physical
size, but also result in lower efficiency and higher output noise due to increased ripple current. The minimum practical inductor value is one that causes the
circuit to operate at the edge of critical conduction
(where the inductor current just touches zero with
every cycle at maximum load). Inductor values lower
than this grant no further size-reduction benefit. The
optimum operating point is usually found between
20% and 50% ripple current.
Core SMPS Design Procedure
Core Inductor Selection
By design, the AMD mobile serial VID application
should regard each of the MAX17080 SMPSs as independent, single-phase SMPSs. The switching frequency and operating point (% ripple current or LIR)
determine the inductor value as follows:
______________________________________________________________________________________
37
MAX17080
AMD 2-/3-Output Mobile Serial
VID Controller
⎛
⎞⎛ V
⎞
VIN − VOUT
⎟ ⎜ OUT ⎟
L = ⎜⎜
⎟
⎝ fSWI LOAD(MAX)LIR ⎠ ⎝ VIN ⎠
where ILOAD(MAX) is the maximum current per phase,
and fSW is the switching frequency per phase.
Find a low-loss inductor with the lowest possible DC
resistance that fits in the allotted dimensions. If using a
swinging inductor (where the inductance decreases linearly with increasing current), evaluate the LIR with
properly scaled inductance values. For the selected
inductance value, the actual peak-to-peak inductor
ripple current (∆IINDUCTOR) is defined by:
V
(V − V )
∆IINDUCTOR = OUT IN OUT
VINfSWL
Ferrite cores are often the best choice, although powdered iron is inexpensive and can work well at 200kHz.
The core must be large enough not to saturate at the
peak inductor current (IPEAK):
⎛ I LOAD(MAX) ⎞ ⎛ ∆I
⎞
IPEAK = ⎜
⎟ + ⎜ INDUCTOR ⎟
η
2
⎝
⎠
⎝
⎠
PH
Core Peak Inductor Current Limit (ILIM12)
The MAX17080 overcurrent protection employs a peak
current-sensing algorithm that uses either currentsense resistors or the inductor’s DCR as the currentsense element (see the Current Sense section). Since
the controller limits the peak inductor current, the maximum average load current is less than the peak current-limit threshold by an amount equal to half the
inductor ripple current. Therefore, the maximum load
capability is a function of the current-sense resistance,
inductor value, switching frequency, and input-to-output voltage difference. When combined with the output
undervoltage-protection circuit, the system is effectively
protected against excessive overload conditions.
The peak current-limit threshold is set by the voltage
difference between ILIM and REF using an external
resistor-divider:
VCS(PK) = VCSP_ - VCSN_ = 0.052 x (VREF - VILIM12)
ILIMIT(PK) = VCS(PK)/RSENSE
where RSENSE is the resistance value of the currentsense element (inductors’ DCR or current-sense resistor), and ILIMIT(PK) is the desired peak current limit (per
phase). The peak current-limit threshold voltage adjustment range is from 10mV to 50mV.
Core Output Capacitor Selection
The output filter capacitor must have low enough ESR
to meet output ripple and load-transient requirements.
38
In CPU VCORE converters and other applications where
the output is subject to large load transients, the output
capacitor’s size typically depends on how much ESR is
needed to prevent the output from dipping too low
under a load transient. Ignoring the sag due to finite
capacitance:
VSTEP
(RESR + RPCB ) ≤
∆I LOAD(MAX)
In non-CPU applications, the output capacitor’s size
often depends on how much ESR is needed to maintain
an acceptable level of output ripple voltage. The output
ripple voltage of a step-down controller equals the total
inductor ripple current multiplied by the output capacitor’s ESR. When operating multiphase systems out-ofphase, the peak inductor currents of each phase are
staggered, resulting in lower output ripple voltage
(VRIPPLE) by reducing the total inductor ripple current.
For nonoverlapping, multiphase operation (VIN ≥ VOUT),
the maximum ESR to meet the output-ripple-voltage
requirement is:
⎡
⎤
VIN fSW L
⎥ VRIPPLE
RESR ≤ ⎢
⎢⎣ ( VIN − VOUT ) VOUT ⎥⎦
where fSW is the switching frequency per phase. The
actual capacitance value required relates to the physical size needed to achieve low ESR, as well as to the
chemistry of the capacitor technology. Thus, the capacitor selection is usually limited by ESR and voltage rating rather than by capacitance value (this is true of
polymer types).
The capacitance value required is determined primarily
by the output transient-response requirements. Low
inductor values allow the inductor current to slew faster,
replenishing charge removed from or added to the output filter capacitors by a sudden load step. Therefore,
the amount of output soar when the load is removed is
a function of the output voltage and inductor value. The
minimum output capacitance required to prevent overshoot (VSOAR) due to stored inductor energy can be
calculated as:
(∆I LOAD(MAX) )
2
COUT ≥
L
2VOUT VSOAR
When using low-capacity ceramic filter capacitors,
capacitor size is usually determined by the capacity
needed to prevent VSOAR from causing problems during
load transients. Generally, once enough capacitance is
added to meet the overshoot requirement, undershoot at
the rising load edge is no longer a problem.
______________________________________________________________________________________
AMD 2-/3-Output Mobile Serial
VID Controller
I RMS =
⎛ VOUT1 ⎞
⎛ VOUT2 ⎞
⎜⎝ V
⎟⎠ IOUT1 (IOUT1 − I IN ) + ⎜⎝ V
⎟⎠ I OUT2(IOUT2 − I IN )
IN
IN
where IIN is the average input current:
⎛V
⎞
⎛V
⎞
I IN = ⎜ OUT1 ⎟ IOUT1 + ⎜ OUT2 ⎟ IOUT2
⎝ VIN ⎠
⎝ VIN ⎠
In combined mode (GNDS1 = V DDIO or GNDS2 =
VDDIO) with both phases active, the input RMS current
simplifies to:
⎛V
⎞⎛ 1 V
⎞
IRMS = IOUT ⎜ OUT ⎟ ⎜ − OUT ⎟
VIN ⎠
⎝ VIN ⎠ ⎝ 2
For most applications, nontantalum chemistries (ceramic, aluminum, or OS-CON) are preferred due
to their resistance to inrush surge currents typical of
systems with a mechanical switch or connector in
series with the input. If the MAX17080 is operated as
the second stage of a two-stage power-conversion system, tantalum input capacitors are acceptable. In either
configuration, choose an input capacitor that exhibits
less than +10°C temperature rise at the RMS input current for optimal circuit longevity.
Core Voltage Positioning and Loop Compensation
Voltage positioning dynamically lowers the output voltage in response to the load current, reducing the output
capacitance and processor’s power-dissipation requirements. The controller uses a transconductance amplifier
to set the transient AC and DC output-voltage droop
(Figure 4). The FBAC and FBDC configuration adjusts
the steady-state regulation voltage as a function of the
load. This adjustability allows flexibility in the selected
current-sense resistor value or inductor DCR, and allows
smaller current-sense resistance to be used, reducing
the overall power dissipated.
Core Transient Droop and Stability
The inductor current ripple sensed across the currentsense inputs (CSP_ - CSN_) generates a proportionate
current out of the FBAC pin. This AC current flowing
across the effective impedance at FBAC generates an
AC ripple voltage. Actual stability, however, depends
on the AC voltage at the FBDC pin, and not on the
FBAC pin. Based on the configuration shown in Figure
4, the ripple voltage at the FBDC pin can only be less
than, or equal to, the ripple at the FBAC pin.
With the requirement that R FBDC = R FBAC , and
(ZCFB//RFB) < 10% of RFBAC, then:
RFBAC = RFBDC ≥
1
COUT fSWRSENSEGm(FBAC)
where Gm(FBAC_) is typically 2mS as defined in the
Electrical Characteristics table, RSENSE_ is the effective
value of the current-sense element that is used to provide the (CSP_, CSN_) current-sense voltage, and fSW
is the selected switching frequency.
Based on the above requirement for RFBAC and RFBDC,
and with the other requirement for RFBDC defined in the
Core Steady-State Voltage Positioning (DC Droop) section, RFBAC and RFBDC can be chosen. The resultant
AC droop is:
R
R
R
RDROOP _ AC ≈ FBDC FBAC SENSE Gm(FBAC)
RFBAC + RFBDC
Capacitor CFB is required when the RDROOP_DC is less
than RDROOP_AC. Choose CFB according to the following
equation:
CFB × ⎡⎣ RFB / /(RFBAC + RFBDC ) ⎤⎦ = 3 × tSW
Core Steady-State Voltage Positioning
With R DROOP_AC defined, the steady-state voltagepositioning slope, RDROOP_DC, can only be less than,
or at most equal to, RDROOP_AC:
RDROOP _ DC =
RFBDCRFBACRSENSE
Gm(FBAC)
RFBAC + RFBDC + RFB
Choose the RFBDC and RFBAC already previously chosen, then select RFB to give the desired droop.
DC droop is typically used together with the +12.5mV
offset feature to keep within the DC tolerance window of
the application. See the Offset and Address Change for
Core SMPSs (OPTION) section.
Core Power-MOSFET Selection
Most of the following MOSFET guidelines focus on the
challenge of obtaining high-load-current capability
when using high-voltage (> 20V) AC adapters. Lowcurrent applications usually require less attention.
The high-side MOSFET (NH) must be able to dissipate
the resistive losses plus the switching losses at both
VIN(MIN) and VIN(MAX). Calculate both of these sums.
______________________________________________________________________________________
39
MAX17080
Core Input Capacitor Selection
The input capacitor must meet the ripple-current
requirement (IRMS) imposed by the switching currents.
For a dual 180° interleaved controller, the out-of-phase
operation reduces the RMS input ripple current, effectively lowering the input capacitance requirements.
When both outputs operate with a duty cycle less than
50% (VIN > 2VOUT), the RMS input ripple current is
defined by the following equation:
MAX17080
AMD 2-/3-Output Mobile Serial
VID Controller
Ideally, the losses at VIN(MIN) should be roughly equal to
losses at VIN(MAX), with lower losses in between. If the
losses at VIN(MIN) are significantly higher than the losses
at VIN(MAX), consider increasing the size of NH (reducing
RDS(ON) but with higher CGATE). Conversely, if the losses at VIN(MAX) are significantly higher than the losses at
VIN(MIN), consider reducing the size of NH (increasing
RDS(ON) to lower CGATE). If VIN does not vary over a
wide range, the minimum power dissipation occurs
where the resistive losses equal the switching losses.
Choose a low-side MOSFET that has the lowest possible
on-resistance (RDS(ON)), comes in a moderate-sized
package (i.e., one or two 8-pin SOs, DPAK, or D2PAK),
and is reasonably priced. Make sure that the DL gate driver can supply sufficient current to support the gate
charge and the current injected into the parasitic gate-todrain capacitor caused by the high-side MOSFET turning
on; otherwise, cross-conduction problems might occur
(see the Core SMPS MOSFET Gate Drivers section).
Core MOSFET Power Dissipation
Worst-case conduction losses occur at the duty factor
extremes. For the high-side MOSFET (NH), the worstcase power dissipation due to resistance occurs at the
minimum input voltage:
⎛V
⎞
PD (NH Resistive) = ⎜ OUT ⎟ ILOAD2RDS(ON)
⎝ VIN ⎠
where ILOAD is the per-phase current.
Generally, a small high-side MOSFET is desired to
reduce switching losses at high input voltages.
However, the RDS(ON) required to stay within package
power dissipation often limits how small the MOSFET
can be. Again, the optimum occurs when the switching
losses equal the conduction (RDS(ON)) losses. Highside switching losses do not usually become an issue
until the input is greater than approximately 15V.
Calculating the power dissipation in the high-side
MOSFET (NH) due to switching losses is difficult since it
must allow for difficult quantifying factors that influence
the turn-on and turn-off times. These factors include the
internal gate resistance, gate charge, threshold voltage,
source inductance, and PCB layout characteristics. The
following switching-loss calculation provides only a very
rough estimate and is no substitute for breadboard
evaluation, preferably including verification using a
thermocouple mounted on NH:
:
(
PD (NH Switching) = VIN(MAX)
⎛
⎞
fSW
)2 ⎜⎝ CIRSS
⎟ I LOAD
GATE ⎠
where CRSS is the reverse transfer capacitance of NH,
IGATE is the peak gate-drive source/sink current (1A,
typ), and ILOAD is the per-phase current.
40
Switching losses in the high-side MOSFET can become
an insidious heat problem when maximum AC adapter
voltages are applied, due to the squared term in the C
x VIN2 x fSW switching-loss equation. If the high-side
MOSFET chosen for adequate RDS(ON) at low battery
voltages becomes extraordinarily hot when biased from
V IN(MAX) , consider choosing another MOSFET with
lower parasitic capacitance.
For the low-side MOSFET (NL), the worst-case power
dissipation always occurs at maximum input voltage:
⎡ ⎛ V
⎞⎤ ⎛ I
⎞2
PD (NL Resistive) = ⎢1− ⎜⎜ OUT ⎟⎟⎥ ⎜ LOAD ⎟ RDS(ON)
⎣⎢ ⎝ VIN(MAX) ⎠⎥⎦ ⎝ ηTOTAL ⎠
The worst case for MOSFET power dissipation occurs
under heavy overloads that are greater than
ILOAD(MAX), but are not quite high enough to exceed
the current limit and cause the fault latch to trip. To protect against this possibility, the circuit can be “overdesigned” to tolerate:
I LOAD(MAX)= I PEAK(MAX)−
⎛ I LOAD(MAX)LIR ⎞
∆I INDUCTOR
⎟⎟
= I PEAK(MAX)− ⎜⎜
2
2
⎝
⎠
where I PEAK(MAX) is the maximum valley current
allowed by the current-limit circuit, including threshold
tolerance and on-resistance variation. The MOSFETs
must have a good-sized heatsink to handle the overload power dissipation.
Choose a Schottky diode (DL) with a forward voltage
low enough to prevent the low-side MOSFET body
diode from turning on during the dead time. As a general rule, select a diode with a DC current rating equal
to 1/3 the load current per phase. This diode is optional
and can be removed if efficiency is not critical.
Core Boost Capacitors
The boost capacitors (CBST) must be selected large
enough to handle the gate-charging requirements of
the high-side MOSFETs. Typically, 0.1µF ceramic
capacitors work well for low-power applications driving
medium-sized MOSFETs. However, high-current applications driving large, high-side MOSFETs require boost
capacitors larger than 0.1µF. For these applications,
select the boost capacitors to avoid discharging the
capacitor more than 200mV while charging the highside MOSFETs’ gates:
CBST =
N × QGATE
200mV
where N is the number of high-side MOSFETs used for
one SMPS, and QGATE is the gate charge specified in the
MOSFET’s data sheet. For example, assume two
IRF7811W n-channel MOSFETs are used on the high
______________________________________________________________________________________
AMD 2-/3-Output Mobile Serial
VID Controller
Selecting the closest standard value, this example
requires a 0.22µF ceramic capacitor.
NB SMPS Design Procedure
NB Inductor Selection
The switching frequency and operating point (% ripple
current or LIR) determine the inductor value as follows:
⎛
⎞⎛ V
⎞
VIN3 − VOUT3
⎟ ⎜ OUT3 ⎟
:
L3 = ⎜⎜
⎟
⎝ fSW 3I LOAD3(MAX)LIR ⎠ ⎝ VIN3 ⎠
where ILOAD3(MAX) is the maximum current and fSW3 is
the switching frequency of the NB regulator.
Find a low-loss inductor having the lowest possible DC
resistance that fits in the allotted dimensions. If using
a swinging inductor (where the inductance decreases
linearly with increasing current), evaluate the LIR with
properly scaled inductance values. For the selected
inductance value, the actual peak-to-peak inductor ripple current (∆IINDUCTOR) is defined by:
:
V
(V − VOUT3 )
∆IINDUCTOR = OUT3 IN3
VIN3 fSW 3L3
Ferrite cores are often the best choice, although powdered iron is inexpensive and can work well at 200kHz.
The core must be large enough not to saturate at the
peak inductor current (IPEAK3):
⎛ ∆I
⎞
I PEAK3 = I LOAD3(MAX)+ ⎜ INDUCTOR ⎟
2
⎝
⎠
NB Peak Inductor Current Limit (ILIM3)
The MAX17080 NB regulator overcurrent protection
employs a peak current-sensing algorithm that uses the
high-side MOSFET RON(NH3) as the current-sense element. Since the controller limits the peak inductor current, the maximum average load current is less than the
peak current-limit threshold by an amount equal to half
the inductor ripple current. Therefore, the maximum
load capability is a function of the current-limit setting,
inductor value, switching frequency, and input-to-output voltage difference. When combined with the output
undervoltage-protection circuit, the system is effectively
protected against excessive overload conditions.
The peak current-limit threshold is set by the ILIM3 pin
setting (see the Offset and Current-Limit Setting for NB
SMPS (ILIM3) section).
NB Output Capacitor Selection
The output filter capacitor must have low enough ESR
to meet output ripple and load-transient requirements.
In CPU VCORE converters and other applications where
the output is subject to large load transients, the output
capacitor’s size typically depends on how much ESR is
needed to prevent the output from dipping too low
under a load transient. Ignoring the sag due to finite
capacitance:
VSTEP
(RESR + RPCB ) ≤
:
∆I LOAD(MAX)
The output capacitor’s size often depends on how
much ESR is needed to maintain an acceptable level of
output ripple voltage. The output ripple voltage of a
step-down controller equals the total inductor ripple
current multiplied by the output capacitor’s ESR. For
single-phase operation, the maximum ESR to meet the
output-ripple-voltage requirement is:
⎡
⎤
VIN3 fSW 3L3
⎥ VRIPPLE3
RESR ≤ ⎢
:
⎢⎣ ( VIN3 − VOUT3 ) VOUT3 ⎥⎦
where fSW3 is the switching frequency. The actual capacitance value required relates to the physical size needed
to achieve low ESR, as well as to the chemistry of the
capacitor technology. Thus, capacitor selection is usually limited by ESR and voltage rating rather than by
capacitance value (this is true of polymer types).
The capacitance value required is determined primarily
by the stability requirements. However, the soar and
sag calculations are still provided here for reference.
Low inductor values allow the inductor current to slew
faster, replenishing charge removed from or added to
the output filter capacitors by a sudden load step.
Therefore, the amount of output soar and sag when the
load is applied or removed is a function of the output
voltage and inductor value. The soar and sag voltages
are calculated as:
VSOAR3
2
∆I LOAD3(MAX) ) L3
(
=
2VOUT3COUT3
( ∆ILOAD3(MAX) )
2
: VSAG3 = 2C
(
L3
OUT 3 VIN3 × DMAX − VOUT 3
)
+
∆I LOAD3(MAX)( tSW 3 − ∆t )
COUT3
where D MAX is the maximum duty cycle of the NB
SMPS as listed in the Electrical Characteristics table,
tSW3 is the NB switching period programmed by the
OSC pin, and ∆t equals VOUT/VIN x tSW when in forcedPWM mode, or L x ILX3MIN/(VIN - VOUT) when in pulseskipping mode.
______________________________________________________________________________________
41
MAX17080
side. According to the manufacturer’s data sheet, a single
IRF7811W has a maximum gate charge of 24nC (VGS =
5V). Using the above equation, the required boost
capacitance would be:
2 × 24nC
:
CBST =
= 0.24µF
200mV
MAX17080
AMD 2-/3-Output Mobile Serial
VID Controller
When using low-capacity ceramic filter capacitors,
capacitor size is usually determined by the capacity
needed to prevent VSOAR from causing problems during
load transients. Generally, once enough capacitance is
added to meet the overshoot requirement, undershoot at
the rising load edge is no longer a problem.
NB Input Capacitor Selection
The input capacitor must meet the ripple-current requirement (IRMS) imposed by the switching currents. The IRMS
requirements can be determined by the following equation:
⎛I
⎞
:
IRMS = ⎜ LOAD3 ⎟ VOUT3 ( VIN3 − VOUT3 )
⎝ VIN3 ⎠
The worst-case RMS current requirement occurs when
operating with VIN3 = 2VOUT3. At this point, the above
equation simplifies to IRMS = 0.5 x ILOAD3.
For most applications, nontantalum chemistries
(ceramic, aluminum, or OS-CON) are preferred due to
their resistance to inrush surge currents typical of systems with a mechanical switch or connector in series
with the input. The MAX17080 NB regulator is operated
as the second stage of a two-stage power-conversion
system. Tantalum input capacitors are acceptable.
Choose an input capacitor that exhibits less than 10°C
temperature rise at the RMS input current for optimal
circuit longevity.
NB Steady-State Voltage Positioning
Voltage positioning dynamically lowers the output voltage in response to the load current, reducing the output capacitance and processor’s power-dissipation
requirements. For NB, the load line is generated by
sensing the inductor current through the high-side
MOSFET on-resistance (RON(NH3)), and is internally
preset to -6.5mV/A (typ). This guarantees the output
voltage to stay in the static regulation window over the
maximum load conditions per AMD specifications. See
Table 7 for full-load voltage droop according to different ILIM3 settings.
NB Transient Droop and Stability
The voltage-positioned load-line of the NB SMPS also
provides the AC ripple voltage required for stability. To
maintain stability, the output capacitive ripple must be
kept smaller than the internal AC ripple voltage. Hence,
a minimum NB output capacitance is required as calculated below:
1
⎛ VOUT3 ⎞
COUT3 >
:
⎜⎝ 1 + V
⎟⎠
2×f
×R
SW 3
DROOP3(MIN)
where R DROOP3(MIN) is 4.5mV/A as defined in the
Electrical Characteristics table, and f SW3 is the NB
switching frequency programmed by the OSC pin.
SVI Applications Information
I2C Bus-Compatible Interface
The MAX17080 is a receive-only device. The 2-wire serial bus (pins SVC and SVD) is designed to attach on a
low-voltage I2C-like bus. In the AMD mobile application,
the CPU directly drives the bus at a speed of 3.4MHz.
The CPU has a push-pull output driving to the VDDIO
voltage level. External pullup resistors are not required.
When not used in the specific AMD application, the serial interface can be driven to as high as 2.5V, and can
operate at the lower speeds (100kHz, 400kHz, or
1.7MHz). At lower clock speeds, external pullup resistors can be used for open-drain outputs. Connect both
SVC and SVD lines to VDDIO through individual pullup
resistors. Calculate the required value of the pullup
resistors using:
t
:
RPULLUP ≤ R
CBUS
where tR is the rise time, and should be less than 10% of
the clock period. CBUS is the total capacitance on the bus.
The MAX17080 is compatible with the standard SVI interface protocol as defined in the following subsections.
Figure 11 shows the SVI bus START, STOP, and data
change conditions.
SVD
SVC
S
START
CONDITION
P
DATA LINE
STABLE
DATA VALID
CHANGE
OF DATA
ALLOWED
STOP
CONDITION
Figure 11. SVI Bus START, STOP, and Data Change Conditions
42
IN3
______________________________________________________________________________________
AMD 2-/3-Output Mobile Serial
VID Controller
D7
D6
MAX17080
DATA OUTPUT
BY MASTER
D0
NOT ACKNOWLEDGE
DATA OUTPUT
BY MAX17080
ACKNOWLEDGE
SVC FROM
MASTER
1
CLK1
2
CLK2
8
CLK8
9
CLK9
S
START
CONDITION
ACKNOWLEDGE
CLOCK PULSE
Figure 12. SVI Bus Acknowledge
START
STOP
ACK
BIT0
P
BIT1
BIT2
BIT3
BIT4
BIT5
BIT6
PSI_L
ACK
WR (WRITE) = 0
SET DAC AND PSI_L
NB
VDD0 (CORE0)
VDD1 (CORE1)
X
1
1
0
SLAVE ADDRESS
S
FIXED VALUES
Figure 13. SVI Bus Data Transfer Summary
Bus Not Busy
The SVI bus is not busy when both data and clock lines
remain high. Data transfers can be initiated only when
the bus is not busy. Figure 12 shows the SVI bus
acknowledge.
Start Data Transfer (S)
Starting from an idle bus state (both SVC and SVD are
high), a high-to-low transition of the data (SVD) line while
the clock (SVC) is high determines a START condition.
All commands must be preceded by a START condition.
Stop Data Transfer (P)
A low-to-high transition of the SDA line while the clock
(SVC) is high determines a STOP condition. All operations must be ended with a STOP condition.
Slave Address
After generating a START condition, the bus master
transmits the slave address consisting of a 7-bit device
code (110xxxx) for the MAX17080. Since the
MAX17080 is a write-only device, the eighth bit of the
slave address is 0. The MAX17080 monitors the bus for
its corresponding slave address continuously. It generates an acknowledge bit if the slave address was true
and it is not in a programming mode.
SVD Data Valid
The state of the data line represents valid data when,
after a START condition, the data line is stable for the
duration of the high period of the clock signal. The data
on the line must be changed during the low period of
the clock signal. There is one clock pulse per bit of data.
______________________________________________________________________________________
43
MAX17080
AMD 2-/3-Output Mobile Serial
VID Controller
Table 8. SVI Send Byte Address Description
BIT
DESCRIPTION
Table 9. Serial VID 8-Bit Field Encoding
BIT
6:4
Always 110b.
PSI_L: Power-Save Indicator
3
X—don’t care.
2
VDD1, if set then the following data byte contains
the VID for VDD1. Bit 2 is ignored in combined
mode (GNDS1 or GNDS2 = VDDIO). VDD1 refers
to CORE1 of the AMD CPU.
1
VDD0, if set then the following data byte contains
the VID for VDD0 in separate mode, and the
unified VDD in combined mode. VDD0 refers to
CORE0 of the AMD CPU.
0 means the processor is at an optimal load and
the SMPS(s) can enter power-saving mode. The
SMPS operates in pulse-skipping mode after
exiting the boot mode. Offset is disabled if
previously enabled by the OPTION pin. The
MAX17080 enters 1-phase operation if in
combined mode (GNDS1 or GNDS2 = H).
0
VDDNB, if set then the following data byte
contains the VID for VDDNB.
7
1 means the processor is in a high currentconsumption state. The SMPS operates in forcedPWM mode after exiting the boot mode. Offset is
enabled if previously enabled by the OPTION
pin. The MAX17080 returns to 2-phase operation
if in combined mode (GNDS1 or GNDS2 = H).
6:0
Acknowledge
Each receiving device, when addressed, is obliged to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse that is associated with this acknowledge bit. The
device that acknowledges has to pull down the SVD
line during the acknowledge clock pulse so that the
SVD line is stable low during the high period of the
acknowledge-related clock pulse. Of course, setup and
hold times must be taken into account. See Figure 12.
Command Byte
A complete command consists of a START condition
(S) followed by the MAX17080’s slave address and a
data phase, followed by a STOP condition (P). For the
slave address, bits 6:4 are always 110 and bit 3 is X
(don’t care). The WR bit should always be 1 since read
functions are not supported. Figure 13 is the SVI bus
data-transfer summary. Table 8 is a description of the
SVI send byte address and Table 9 describes serial
VID 8-bit field encoding.
SMPS Applications Information
Duty-Cycle Limits
Minimum Input Voltage
The minimum input operating voltage (drop-out voltage)
is restricted by stability requirements, not the minimum
off-time (tOFF(MIN)). The MAX17080 does not include
slope compensation, so the controller becomes unstable with duty cycles greater than 50% per phase:
VIN(MIN) ≥ 2VOUT(MAX)
However, the controller can briefly operate with duty
cycles over 50% during heavy load transients.
44
DESCRIPTION
SVID[6:0] as defined in Table 7.
Maximum Input Voltage
The MAX17080 controller has a minimum on-time,
which determines the maximum input operating voltage
that maintains the selected switching frequency. With
higher input voltages, each pulse delivers more energy
than the output is sourcing to the load. At the beginning
of each cycle, if the output voltage is still above
the feedback threshold voltage, the controller does not
trigger an on-time pulse, resulting in pulse-skipping
operation regardless of the operating mode selected by
PSI_L. This allows the controller to maintain regulation
above the maximum input voltage, but forces the controller to effectively operate with a lower switching frequency. This results in an input threshold voltage at
which the controller begins to skip pulses (VIN(SKIP)):
⎛
⎞
1
:
⎟
VIN(SKIP) = VOUT ⎜⎜
⎟
⎝ fSW tON(MIN) ⎠
where fSW is the per-phase switching frequency set by
the OSC resistor, and tON(MIN) is 150ns (max) minus the
driver’s turn-on delay (DL low to DH high). For the best
high-voltage performance, use the slowest switching
frequency setting (100kHz per phase, ROSC = 432kΩ).
PCB Layout Guidelines
Careful PCB layout is critical to achieve low switching
losses and clean, stable operation. The switching
power stage requires particular attention (Figure 14). If
possible, mount all the power components on the top
side of the board with their ground terminals flush
against one another, and mount the controller and analog components on the bottom layer so the internal
ground layers shield the analog components from any
______________________________________________________________________________________
AMD 2-/3-Output Mobile Serial
VID Controller
• Keep the high-current paths short, especially at the
ground terminals. This is essential for stable, jitterfree operation.
• Connect all analog grounds to a separate solid copper plane; then connect the analog ground to the
GND pins of the controller. The following sensitive
components connect to analog ground: V CC and
VDDIO bypass capacitors, remote sense and GNDS
bypass capacitors, and the resistive connections
(ILIM12, OSC, TIME).
• Keep the power traces and load connections short.
This is essential for high efficiency. The use of thick
copper PCBx (2oz vs. 1oz) can enhance full-load
efficiency by 1% or more. Correctly routing PCB
traces is a difficult task that must be approached in
terms of fractions of centimeters, where a single mΩ
of excess trace resistance causes a measurable efficiency penalty.
• Connections for current limiting (CSP, CSN) and voltage positioning (FBS, GNDS) must be made using
Kelvin-sense connections to guarantee the currentsense accuracy. Place current-sense filter capacitors
and voltage-positioning filter capacitors as close as
possible to the IC.
• Route high-speed switching nodes and driver traces
away from sensitive analog areas (REF, VCC, FBAC,
FBDC, OUT3, etc.). Make all pin-strap control input
connections (SHDN, PGD_IN, OPTION) to analog
ground or VCC rather than power ground or VDD.
• Route the high-speed serial-interface signals (SVC,
SVD) in parallel, keeping the trace lengths identical.
Keep the SVC and SVD away from the high-current
switching paths.
• Keep the drivers close to the MOSFET, with the gatedrive traces (DL, DH, LX, and BST) short and wide to
minimize trace resistance and inductance. This is
essential for high-power MOSFETs that require lowimpedance gate drivers to avoid shoot-through currents.
• When trade-offs in trace lengths must be made, it is
preferable to allow the inductor charging path to be
made longer than the discharge path. For example, it
is better to allow some extra distance between the
input capacitors and the high-side MOSFET rather than
to allow distance between the inductor and the lowside MOSFET or between the inductor and the output
filter capacitor.
Layout Procedure
1) Place the power components first, with ground terminals adjacent (low-side MOSFET source, C IN,
COUT, and DL anode). If possible, make all these
connections on the top layer with wide, copperfilled areas. For the NB SMPS, place CIN3 and L3
as near as possible to the MAX17080, using multiple vias to reduce inductance when connecting the
different layers.
2) Use multiple vias to connect the exposed backside to
the power ground plane (PGND) to allow for a lowimpedance path for the SMPS3 internal low-side
MOSFET.
3) Mount the MAX17080 close to the low-side
MOSFETs. The DL gate traces must be short and
wide (50 mils to 100 mils wide if the MOSFET is 1in
from the driver IC).
4) Group the gate-drive components (BST capacitors,
V DD bypass capacitor) together near the
MAX17080.
5) Make the DC-DC controller ground connections as
shown in the standard application circuit (Figure 2).
This diagram can be viewed as having three separate ground planes: input/output ground, where all
the high-power components go; the power ground
plane, where the PGND, V DD bypass capacitor,
and driver IC ground connection go; and the controller’s analog ground plane, where sensitive analog components, the MAX17080’s AGND pin, and
VCC bypass capacitor go. The controller’s analog
ground plane (AGND) must meet the power ground
plane (PGND) only at a single point directly beneath
the IC. The power ground plane should connect to
the high-power output ground with a short, thick
metal trace from PGND to the source of the low-side
MOSFETs (the middle of the star ground).
6) Connect the output power planes (VCORE, VOUT3,
and system ground planes) directly to the output
filter capacitor positive and negative terminals with
multiple vias. Place the entire DC-DC converter
circuit as close to the CPU as is practical.
______________________________________________________________________________________
45
MAX17080
noise generated by the power components. Follow
these guidelines for good PCB layout:
MAX17080
AMD 2-/3-Output Mobile Serial
VID Controller
SPLIT CORE
CPU SOCKET
VDDNB
VCORE0
VCORE1
COUT
COUT
COUT
COUT
INDUCTOR
KELVIN-SENSE VIAS UNDER THE INDUCTOR
(REFER TO EVALUATION KIT)
INDUCTOR
RNTC
R2
R1
CSP
CSN
KELVIN-SENSE VIAS TO
INDUCTOR PAD
CIN
CIN
INDUCTOR DCR SENSING
POWER
GROUND
CIN
CVDD
CIN
CSP
CSN
CVCC
CEQ
CONNECT THE EXPOSED
PAD TO POWER GND
USING MULTIPLE VIAS
CIN3
+
L3
COUT3
AGND PIN
Figure 14. PCB Layout Example
46
______________________________________________________________________________________
AMD 2-/3-Output Mobile Serial
VID Controller
Chip Information
DH2
LX2
BST2
DL2
DL1
VDD
LX1
BST1
DH1
TOP VIEW
VRHOT
PROCESS: BiCMOS
30 29 28 27 26 25 24 23 22 21
THRM 31
20 PWRGD
VCC 32
19 PGD_IN
CSP1 33
18 CSP2
CSN1 34
17 CSN2
FBDC1 35
16 FBDC2
MAX17080
FBAC1 36
15 FBAC2
Package Information
For the latest package outline information, go to
www.maxim-ic.com/packages.
PACKAGE TYPE
PACKAGE CODE
DOCUMENT NO.
40 TQFN
T4055-2
21-0140
14 GNDS2
GNDS1 37
OPTION 38
13 VDDIO
+
12 SVC
OSC 39
11 SVD
7
8
9
10
OUT3
AGND
6
BST3
IN3
5
SHDN
ILIM3
4
LX3
3
LX3
2
IN3
1
ILIM12
TIME 40
THIN QFN
(5mm × 5mm)
______________________________________________________________________________________
47
MAX17080
Pin Configuration
MAX17080
AMD 2-/3-Output Mobile Serial
VID Controller
Revision History
REVISION
NUMBER
REVISION
DATE
0
6/08
1
5/09
DESCRIPTION
Initial release.
PAGES
CHANGED
—
EC table updates, Pin Description errors, mistakes in Detailed Description
2–9, 17, 18,
19,25, 26, 47
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implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
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