TYSEMI KRF9952

Transistors
IC
IC
IC
IC
SMD
SMD Type
Type
Product specification
KRF9952
Features
Generation V Technology
Ultra Low On-Resistance
Dual N and P Channel MOSFET
Surface Mount
Very Low Gate Charge and Switching Losses
Fully Avalanche Rated
1 : Source1
5 : Drain2
2 : Gate1
6 : Drain2
3 : Source2
7 : Drain1
4 : Gate2
8 : Drain1
Absolute Maximum Ratings Ta = 25
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-to-Source Voltage
VGS
N-Channel
P-Channel
30
V
20
V
Continuous Drain Current, VGS @ 10V @ Ta = 25
ID
3.5
-2.3
Continuous Drain Current, VGS @ 10V @ Ta = 70
ID
2.8
-1.8
Pulsed Drain Current *1
IDM
16
-10
IS
1.7
Continuous Source Current (Diode Conduction)
Power Dissipation
@Ta= 25
Power Dissipation
@Ta= 70
Single Pulse Avalanche Energy
44
Avalanche Current
IAR
2.0
Repetitive Avalanche Energy
EAR
Peak Diode Recovery dv/dt *2
dv/dt
R
57
-1.3
0.25
A
mJ
A
mJ
5.0
-5
V/ns
-55 to + 150
TJ, TSTG
Maximum Junction-to-Ambient *3
A
W
1.3
EAS
Junction and Storage Temperature Range
-1.3
2
PD
Unit
62.5
JA
/W
*1 Repetitive rating; pulse width limited by max. junction temperature.
*2 N-Channel ISD
2.0A, di/dt
P-Channel ISD
-1.3A, di/dt
100A/
84A/
*3 Surface mounted on FR-4 board, t
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s, VDD
s, VDD
V(BR)DSS, TJ
V(BR)DSS, TJ
150
150
10sec.
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IC
Transistors
IC
IC
IC
SMD
SMD Type
Type
Product specification
KRF9952
Electrical Characteristics Ta = 25
Parameter
Testconditons
Symbol
Drain-to-Source Breakdown Voltage
30
VGS = 0V, ID = -250 A
P-Ch
-30
V(BR)DSS/
ID = 1mA,Reference to 25
N-Ch
0.015
TJ
ID = -1mA,Reference to 25
P-Ch
0.015
Static Drain-to-Source On-Resistance
RDS(on)
Static Drain-to-Source On-Resistance
RDS(on)
Gate Threshold Voltage
VGS(th)
gfs
Forward Transconductance
Drain-to-Source Leakage Current
IDSS
VGS =10V, ID = 2.2A*1
VGS = 4.5V, ID = 1.0A*1
VGS = -10V, ID = -1.0A*1
VGS = -4.5V, ID = -0.5A*1
IGSS
Total Gate Charge
Qg
Gate-to-Source Charge
Qgs
Gate-to-Drain ("Miller") Charge
Qgd
Turn-On Delay Time
td(on)
Rise Time
tr
Turn-Off Delay Time
td(off)
Fall Time
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Continuous Source Current
Pulsed Source Current
Body Diode)
Body Diode) *2
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V/
0.08
0.10
0.12
0.15
0.165 0.250
P-Ch
0.290 0.400
N-Ch
1.0
P-Ch
-1.0
VDS = 15V, ID = 3.5A*1
N-Ch
12
VDS = -15V, ID = -2.3A*1
P-Ch
2.4
VDS = 24V, VGS = 0V
N-Ch
2.0
VDS = -24V, VGS = 0V
P-Ch
-2.0
VDS = 24V, VGS = 0V, TJ = 125
N-Ch
25
P-Ch
-25
VGS =
20V
V
N-Ch
S
100
P-Ch
N-Channel
N-Ch
6.9
ID = 1.8A,VDS = 10V,VGS =10V
P-Ch
6.1
12
N-Ch
1.0
2.0
P-Channel
P-Ch
1.7
3.4
ID = -2.3A,VDS = -10V,VGS = -10V
N-Ch
1.8
3.5
P-Ch
1.1
2.2
N-Ch
6.2
12
19
N-Channel
VDD = 10V,ID = 1.0A,RG = 6.0
P-Ch
9.7
RD=10
N-Ch
8.8
18
P-Channel
P-Ch
14
28
VDD = -10V,ID = -1.0A,RG = 6.0
N-Ch
13
26
P-Ch
20
40
N-Ch
3.0
6.0
P-Ch
6.9
14
N-Channel
N-Ch
190
VGS = 0V,VDS = 15V,f = 1.0MHz
P-Ch
190
RD=10
N-Ch
120
P-Channel
P-Ch
110
VGS = 0V,VDS = -15V,f = 1.0MHz
N-Ch
61
P-Ch
54
IS
ISM
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Unit
V
VDS = VGS, ID = -250 A
tf
Input Capacitance
N-Ch
Max
VDS = VGS, ID = 250 A
VDS = -24V, VGS = 0V, TJ = 125
Gate-to-Source Forward Leakage
Typ
N-Ch
V(BR)DSS
Breakdown Voltage Temp. Coefficient
Min
VGS = 0V, ID = 250 A
nA
nC
ns
pF
N-Ch
1.7
P-Ch
-1.3
N-Ch
16
P-Ch
16
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IC
Transistors
IC
IC
IC
SMD
SMD Type
Type
Product specification
KRF9952
Electrical Characteristics Ta = 25
Parameter
Diode Forward Voltage
VSD
Reverse Recovery Time
trr
Reverse RecoveryCharge
Qrr
*1 Pulse width
300 s; duty cycle
Testconditons
Symbol
Typ
Max
TJ = 25 , IS = 1.25A, VGS = 0V*3
N-Ch
Min
0.82
1.2
TJ = 25 , IS = -1.25A, VGS = 0V*3
P-Ch
-0.82
-1.2
N-Channel
TJ = 25 , IF =1.25A,di/dt = 100A/
N-Ch
27
53
s*1 P-Ch
27
54
N-Ch
28
57
P-Ch
31
62
P-Channel
TJ=25 , IF=-1.25A,di/dt=-100A/
s*1
Unit
V
ns
nC
2%.
*2 Repetitive rating; pulse width limited by max. junction temperature.
*3 N-Channel Starting TJ = 25 , L = 22mH RG = 25 , IAS = 2.0A.
P-Channel Starting TJ = 25 , L = 67mH RG = 25 , IAS = -1.3A.
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