SHENZHENFREESCALE AON2801

AON2801
Dual P-Channel Enhancement Mode Field
Effect Transistor
General Description
The AON2801/L uses advanced trench technology to provide excellent RDS(ON) , low gate charge and
operation with gate voltages as low as 1.8V. This device is suitable for use as a load switch or in PWM
applications. AON2801 and AON2801L are electrically identical.
-RoHS Compliant
-Halogen Free*
Features
VDS (V) = -20V
ID = -3A
(VGS = -4.5V)
RDS(ON) < 120mΩ (VGS = -4.5V)
RDS(ON) < 160mΩ (VGS = -2.5V)
RDS(ON) < 200mΩ (VGS = -1.8V)
DFN 2x2 Package
S1
G1
D2
G2
G1
D1
Top
G2
S2
S1
Symbol
VDS
Gate-Source Voltage
VGS
TA=25°C
Continuous Drain
CurrentA
C
TA=25°C
A
Units
V
±8
V
ID
-2.3
IDM
-15
Junction and Storage Temperature Range
W
0.95
TJ, TSTG
-55 to 150
Symbol
t ≤ 10s
Steady-State
t ≤ 10s
Steady-State
A
1.5
PDSM
TA=70°C
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient B
Maximum Junction-to-Ambient B
Maximum
-20
-3
TA=70°C
Pulsed Drain Current
1/5
S2
Bottom
Parameter
Drain-Source Voltage
Power Dissipation
D2
D1
RθJA
RθJA
Typ
35
65
120
175
°C
Max
45
85
155
235
Units
°C/W
°C/W
°C/W
°C/W
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AON2801
Dual P-Channel Enhancement Mode Field
Effect Transistor
Electrical Characteristics (TJ=25°C unless otherwise noted)
Parameter
Symbol
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
Conditions
Min
ID=-250µA, VGS=0V
-20
-1
Zero Gate Voltage Drain Current
IGSS
Gate-Body leakage current
VDS=0V, VGS=±8V
VGS(th)
Gate Threshold Voltage
VDS=VGS ID=-250µA
-0.3
ID(ON)
On state drain current
VGS=-4.5V, VDS=-5V
-15
TJ=55°C
VGS=-4.5V, ID=-3A
VGS=-1.8V, ID=-1.5A
160
200
mΩ
Diode Forward Voltage
IS=-1A,VGS=0V
DYNAMIC PARAMETERS
Ciss
Input Capacitance
VGS=0V, VDS=0V, f=1MHz
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
Qrr
VGS=-4.5V, VDS=-10V, RL=1.5Ω,
RGEN=3Ω
IF=-3A, dI/dt=100A/µs
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge IF=-3A, dI/dt=100A/µs
S
-0.76
V
-1
A
700
pF
90
pF
63
pF
9.5
Ω
5
VGS=-4.5V, VDS=-10V, ID=-3A
mΩ
6
540
VGS=0V, VDS=-10V, f=1MHz
SWITCHING PARAMETERS
Qg
Total Gate Charge
Gate Drain Charge
A
mΩ
Maximum Body-Diode Continuous Current
Gate Source Charge
V
160
IS
Qgs
-1
128
VSD
Qgd
nA
VGS=-2.5V, ID=-2.6A
VDS=-5V, ID=-3A
Gate resistance
±100
120
Forward Transconductance
Rg
-0.55
µA
170
gFS
Reverse Transfer Capacitance
-5
100
Static Drain-Source On-Resistance
Output Capacitance
Units
135
TJ=125°C
RDS(ON)
Crss
Max
V
VDS=-20V, VGS=0V
IDSS
Coss
Typ
6.5
nC
1.2
nC
1
nC
5
ns
40
ns
28.5
ns
46
ns
21
9.1
28
ns
nC
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The
-15value in any given application depends
Power dissipation P DSM is based on R θJA and the maximum allowed junction temperature of 150°C. The
on the user's specific board design, and the maximum temperature of 150°C may be used if the PCB allows it to.
B. The value of R θJA is measured with the device mounted on a minimum pad board with 2oz. Copper, in a still air environment with T A =25°C.
The Power dissipation P DSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any given application
depends on the user's specific board design, and the maximum temperature of 150°C may be used if the PCB allows it to.
C. The R θJA is the sum of the thermal impedence from junction to case R θJC and case to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA
curve provides a single pulse rating.
*This device is guaranteed green after data code 7111 (Oct 15 2007).
Rev 2: Sep 2008
2/5
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AON2801
Dual P-Channel Enhancement Mode Field
Effect Transistor
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
15
15
-3.0V
-4.5V
VDS=-5V
12
12
-2.5V
25°C
-ID(A)
-ID (A)
9
-2.0V
6
9
125°C
6
VGS=-1.5V
3
3
0
0
0
1
2
3
4
0
1
-VDS (Volts)
Figure 1: On-Region Characteristics
3
4
1.5
Normalized On-Resistance
280
240
RDS(ON) (mΩ )
2
-VGS(Volts)
Figure 2: Transfer Characteristics
VGS=-1.8V
200
VGS=-2.5V
160
120
VGS=-4.5V
80
VGS=-1.8V
ID=-1.5A
VGS=-2.5V
ID=-2.6A
1.3
VGS=-4.5V
ID=-3A
1.1
0.9
0.7
0
2
4
6
8
10
-50
-ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
-15
320
-25
0
25
50
75
100
125
150
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature (Note E)
1E+01
ID=-3A
280
1E+00
240
1E-01
-IS (A)
RDS(ON) (mΩ )
12
200
125°C
160
120
1E-02
25°C
1E-03
1E-04
25°C
80
1E-05
0
2
4
6
8
-VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
3/5
125°C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-VSD (Volts)
Figure 6: Body-Diode Characteristics
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AON2801
Dual P-Channel Enhancement Mode Field
Effect Transistor
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
5
800
VDS=-10V
ID=-3A
700
3
2
Ciss
600
Capacitance (pF)
-VGS (Volts)
4
500
400
300
Crss
Coss
200
1
100
0
0
0
1
2
3
4
5
6
0
Qg (nC)
Figure 7: Gate-Charge Characteristics
5
10
15
-VDS (Volts)
Figure 8: Capacitance Characteristics
10000
100.00
TJ(Max)=150°C
TA=25°C
TJ(Max)=150°C
TA=25°C
10µs
10.00
1000
100µ
1.00
Power (W)
-ID (Amps)
20
1ms
RDS(ON)
limited
0.10
10ms
0.1s
10s
DC
100
10
0.01
0.1
1
10
100
1
0.000001
-VDS (Volts)
Zθ JA Normalized Transient
Thermal Resistance
10
1
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=85°C/W
0.0001
0.01
1
100
10000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-to-15
Ambient (Note E)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
12
0.1
PD
0.01
Ton
Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
T
10
100
1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)
4/5
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AON2801
Dual P-Channel Enhancement Mode Field
Effect Transistor
Gate Charge Test Circuit & Waveform
Vgs
Qg
-10V
-
-
VDC
Qgd
+
+
DUT
Qgs
Vds
VDC
Vgs
Ig
Charge
Resistive Switching Test Circuit & W aveform s
RL
Vds
t off
t on
td(on)
Vgs
-
D UT
Vgs
t d(off)
tr
90%
Vdd
VDC
tf
+
Rg
Vgs
10%
Vds
Diode Recovery Test Circuit & W aveform s
Q rr = - Idt
Vds +
D UT
Vds -
Isd
Vgs
Ig
5/5
Vgs
L
-Isd
+ Vdd
t rr
dI/dt
-I R M
Vdd
VD C
-
-I F
-Vds
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