SHENZHENFREESCALE AO8807

AO8807
Dual P-Channel Enhancement Mode Field
Effect Transistor
General Description
The AO8807 uses advanced trench technology to provide excellent RDS(ON) , low gate charge and
operation with gate voltages as low as 1.8V. This device is suitable for use as a load switch. AO8807
and AO8807L are electrically identical.
- RoHS Compliant
-Halogen Free
Features
VDS (V) = -12V
ID = -6.5 A (VGS = -4.5V)
RDS(ON) < 20mΩ (VGS = -4.5V)
RDS(ON) < 24mΩ (VGS = -2.5V)
RDS(ON) < 30mΩ (VGS = -1.8V)
D1
D2
TSSOP-8
Top View
D1
S1
S1
G1
8
7
6
5
1
2
3
4
D2
S2
S2
G2
Rg
Rg
G1
G2
S1
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
TA=25°C
Continuous Drain
Current
Pulsed Drain Current
TA=70°C
ID
IDM
C
Junction and Storage Temperature Range
1/5
Units
V
±8
V
-60
1.4
W
0.9
TJ, TSTG
°C
-55 to 150
Symbol
t ≤ 10s
Steady-State
Steady-State
A
-5
PD
TA=70°C
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient AD
Maximum Junction-to-Lead
Maximum
-12
-6.5
TA=25°C
Power Dissipation B
S2
RθJA
RθJL
Typ
73
96
63
Max
90
125
75
Units
°C/W
°C/W
°C/W
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AO8807
Dual P-Channel Enhancement Mode Field
Effect Transistor
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
Conditions
Min
ID=-250µA, VGS=0V
-12
-1
TJ=55°C
-5
IGSS
Gate-Body leakage current
VDS=0V, VGS=±8V
Gate Threshold Voltage
VDS=VGS ID=-250µA
-0.35
ID(ON)
On state drain current
VGS=-4.5V, VDS=-5V
-60
±10
VGS=-4.5V, ID=-6.5A
TJ=125°C
Static Drain-Source On-Resistance
VGS=-2.5V, ID=-6A
Reverse Transfer Capacitance
Gate resistance
SWITCHING PARAMETERS
Qg
Total Gate Charge
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
tD(on)
Turn-On Delay Time
tr
Turn-On Rise Time
A
16
20
23
28
19
24
mΩ
mΩ
23
30
36
mΩ
VDS=-5V, ID=-6.5A
45
-0.56
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Rg
-0.85
28
Diode Forward Voltage
IS=-1A,VGS=0V
Maximum Body-Diode Continuous Current
Crss
µA
VGS=-1.8V, ID=-5.5A
VSD
Output Capacitance
-0.53
µA
VGS=-1.5V, ID=-5A
Forward Transconductance
Coss
Units
mΩ
gFS
IS
Max
V
VDS=-12V, VGS=0V
VGS(th)
RDS(ON)
Typ
1740
VGS=0V, VDS=-6V, f=1MHz
S
-1
V
-1.4
A
2100
pF
334
pF
VGS=0V, VDS=0V, f=1MHz
200
1.3
1.7
pF
kΩ
19
23
nC
VGS=-4.5V, VDS=-6V, ID=-6.5A
4.5
nC
5.3
nC
240
ns
580
7
ns
µs
4.2
µs
VGS=-4.5V, VDS=-6V, RL=0.9Ω,
RGEN=3Ω
tD(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
trr
Body Diode Reverse Recovery Time
IF=-6.5A, dI/dt=100A/µs
22
Qrr
Body Diode Reverse Recovery Charge IF=-6.5A, dI/dt=100A/µs
17
27
ns
nC
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The value
in any given application depends on the user's specific board design.
B. The power dissipation PD is based on T J(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature T J(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialTJ=25°C.
D. The RθJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in 2 FR-4 board with
2oz. Copper, assuming a maximum junction temperature of T J(MAX)=150°C. The SOA curve provides a single pulse rating.
2/5
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AO8807
Dual P-Channel Enhancement Mode Field
Effect Transistor
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
60
60
-4.5V
50
VDS=-5V
-2.5V
50
-3V
40
-2V
-ID(A)
-ID (A)
40
30
30
20
20
VGS=-1.5V
10
125°C
10
0
25°C
0
0
1
2
3
4
5
0
45
1
1.5
2
2.5
3
1.6
Normalized On-Resistance
40
VGS=-1.5V
35
RDS(ON) (mΩ)
0.5
-VGS(Volts)
Figure 2: Transfer Characteristics(Note E)
-VDS (Volts)
Figure 1: On-Region Characteristics(Note E)
VGS=-2.5V
30
VGS=-1.8V
25
20
15
ID=-6A, VGS=-2.5V
1.4
ID=-6.5A, VGS=-4.5V
1.2
ID=-5A, VGS=-1.5V
ID=-5.5A, VGS=-1.8V
1.0
VGS=-4.5V
10
0.8
0
2
4
6
8
10
12
14
16
18
20
0
25
-ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage(Note E)
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature(Note E)
50
1E+01
ID=-6.5A
45
1E+00
125°C
40
1E-01
35
30
-IS (A)
RDS(ON) (mΩ)
50
125°C
25
25°C
1E-02
1E-03
20
1E-04
15
25°C
1E-05
10
0
2
4
6
-VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source
Voltage(Note E)
3/5
8
0.0
0.2
0.4
0.6
0.8
1.0
-VSD (Volts)
Figure 6: Body-Diode Characteristics(Note E)
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AO8807
Dual P-Channel Enhancement Mode Field
Effect Transistor
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
2800
4.5
VDS=-6V
ID=-6.5A
4
2400
Capacitance (pF)
3.5
-VGS (Volts)
3
2.5
2
1.5
1
1600
1200
800
0.5
400
0
0
0
4
8
12
16
Ciss
2000
20
Coss
Crss
0
-Qg (nC)
Figure 7: Gate-Charge Characteristics
2
4
6
100
12
TJ(Max)=150°C
TA=25°C
60
RDS(ON)
limited
100µs
1ms
1
10s
0.1s
Power (W)
ID (Amps)
10
80
10µs
10
8
-VDS (Volts)
Figure 8: Capacitance Characteristics
20
1s
0
DC
TJ(Max)=150°C
TA=25°C
0
0.01
40
0
0.0001
0.1
1
10
100
VDS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note F)
0.001
0.01
0.1
1
10
100
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note F)
ZθJA Normalized Transient
Thermal Resistance
10
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=125°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
PD
0.1
Ton
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
T
10
100
1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance(Note F)
4/5
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AO8807
Dual P-Channel Enhancement Mode Field
Effect Transistor
Gate Charge Test Circuit & Waveform
Vgs
Qg
-
+
VDC
Qgs
Vds
Qgd
+
DUT
-
VDC
-10V
Vgs
Ig
Charge
Resistive Switching Test Circuit & Waveforms
RL
Vds
Vds
Vgs
VDC
90%
-
DUT
Vdd
+
Rg
Vgs
10%
Vgs
td(on)
tr
t d(off)
ton
tf
t off
Diode Recovery Test Circuit & Waveforms
Q rr = - Idt
Vds +
DUT
Vds -
Isd
Vgs
Ig
5/5
Vgs
L
-Isd
+ Vdd
VDC
-
-I F
t rr
dI/dt
-I RM
Vdd
-Vds
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