AON3601 Complementary Enhancement Mode Field Effect Transistor General Description Features The AON3601 uses advanced trench technology MOSFETs to provide excellent RDS(ON) and low gate charge. The complementary MOSFETs may be used in power inverters, and other applications.Standard Product AON3601 is Pb- n-channel VDS (V) = 30V ID = 6.6A (VGS=10V) RDS(ON) < 29mΩ (VGS=10V) < 42mΩ (VGS=4.5V) free (meets ROHS & Sony 259 specifications). p-channel -30V -5A (VGS = -10V) RDS(ON) < 52mΩ (VGS = -10V) < 72mΩ (VGS = -4.5V) DFN 3x3 Top View D1 D2 Bottom View S2 G2 D2 D2 S1 D1 G2 D1 G1 G1 S1 S2 p-channel n-channel Absolute Maximum Ratings TA=25°C unless otherwise noted Parameter Max n-channel Symbol VDS Drain-Source Voltage 30 VGS Gate-Source Voltage Pulsed Drain Current TA=70°C B TA=25°C Power Dissipation ±20 ±20 6.6 -5 ID 5.6 -4.2 IDM 30 -20 2 2 1.44 1.44 -55 to 150 -55 to 150 TA=25°C Continuous Drain Current A TA=70°C Junction and Storage Temperature Range PD TJ, TSTG Thermal Characteristics: n-channel and p-channel Parameter t ≤ 10s Maximum Junction-to-Ambient A A Steady-State Maximum Junction-to-Ambient C Steady-State Maximum Junction-to-Lead A t ≤ 10s Maximum Junction-to-Ambient A Steady-State Maximum Junction-to-Ambient Steady-State Maximum Junction-to-Lead C Alpha & Omega Semiconductor, Ltd. Max p-channel -30 Symbol RθJA RθJL RθJA RθJL Device n-ch n-ch n-ch Typ 50 90 43 p-ch p-ch p-ch 45 80 40 Units V V A W °C Max Units 62.5 °C/W 110 °C/W 53 °C/W 62.5 110 50 °C/W °C/W °C/W www.aosmd.com AON3601 N-CHANNEL: Electrical Characteristics (T J=25°C unless otherwise noted) Symbol Parameter STATIC PARAMETERS BVDSS Drain-Source Breakdown Voltage Conditions Min ID=250µA, VGS=0V Zero Gate Voltage Drain Current IGSS Gate-Body leakage current VDS=0V, VGS=±20V VGS(th) Gate Threshold Voltage VDS=VGS ID=250µA 1 ID(ON) On state drain current VGS=4.5V, V DS=5V 20 VGS=4.5V, I D=5.5A gFS Forward Transconductance VSD Diode Forward Voltage IS=1A Maximum Body-Diode Continuous Current VDS=5V, ID=6.6A DYNAMIC PARAMETERS Ciss Input Capacitance Output Capacitance Crss Reverse Transfer Capacitance Rg Gate resistance SWITCHING PARAMETERS Qg(10V) Total Gate Charge Qg(4.5V) Total Gate Charge Qgs Gate Source Charge Qgd Gate Drain Charge tD(on) Turn-On DelayTime tr Turn-On Rise Time 1 V 10 nA 1.8 3 V 24.3 29 34 41 34.5 42 A 15.4 VGS=10V, VDS=15V, I D=6.6A VGS=10V, VDS=15V, RL=2.3Ω, RGEN=3Ω mΩ 1 V 3 A 820 pF 102 pF 77 VGS=0V, VDS=0V, f=1MHz mΩ S 0.78 680 VGS=0V, VDS=15V, f=1MHz µA 100 pF 3.6 Ω 13.84 17 nC 6.74 8.1 nC 3 1.82 nC 3.2 nC 4.6 ns 4.1 ns 20.6 ns 5.2 ns tD(off) Turn-Off DelayTime tf Turn-Off Fall Time trr Body Diode Reverse Recovery Time IF=6.6A, dI/dt=100A/µs 16.5 Body Diode Reverse Recovery Charge IF=6.6A, dI/dt=100A/µs 7.8 Qrr Units 5 TJ=125°C Static Drain-Source On-Resistance Coss 0.004 TJ=55°C VGS=10V, I D=6.6A IS Max 30 VDS=24V, VGS=0V IDSS RDS(ON) Typ 20 ns nC A: The value of R θJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The value in any given application depends on the user's specific board design. The current rating is based on the t≤ 10s thermal resistance rating. B: Repetitive rating, pulse width limited by junction temperature. C. The R θJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient. D. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max. E. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The SOA curve provides a single pulse rating. Rev 1: Feb 2008 THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE Alpha & Omega Semiconductor, Ltd. www.aosmd.com AON3601 N-CHANNEL: TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 20 30 10V 25 6V 5V 4.5V VDS=5V 16 4V 12 15 ID(A) ID (A) 20 3.5V 8 10 125°C VGS=3V 5 4 25°C 0 0 1 2 3 4 0 5 0 VDS (Volts) Fig 1: On-Region Characteristics 1.5 2 2.5 3 3.5 4 4.5 1.6 Normalized On-Resistance 50 RDS(ON) (mΩ) 1 VGS (Volts) Figure 2: Transfer Characteristics 60 VGS=4.5V 40 30 20 VGS=10V 1.5 VGS=10V ID=6.6A 1.4 VGS=4.5V ID=5.5A 1.3 1.2 1.1 1 0.9 0.8 10 0 5 10 15 0 20 50 100 150 200 Temperature ( °C) Figure 4: On-Resistance vs. Junction Temperature ID (Amps) Figure 3: On-Resistance vs. Drain Current and Gate Voltage 70 1.0E+01 1.0E+00 IS Amps ID=5A 60 RDS(ON) (mΩ) 0.5 50 125°C 40 1.0E-01 1.0E-02 125°C 1.0E-03 30 25°C 1.0E-04 20 1.0E-05 25°C 0.0 10 2 4 6 8 10 0.2 0.4 0.6 0.8 1.0 VSD (Volts) Figure 6: Body diode characteristics VGS (Volts) Figure 5: On-Resistance vs. Gate-Source Voltage Alpha & Omega Semiconductor, Ltd. www.aosmd.com AON3601 N-CHANNEL: TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 1000 10 VDS=15V ID=6.6A 800 Capacitance (pF) VGS (Volts) 8 f=1MHz VGS=0V 900 6 4 2 700 Ciss 600 500 400 300 200 Coss 100 0 0 2 4 6 8 10 12 Crss 0 14 0 5 Qg (nC) Figure 7: Gate-Charge characteristics 100 30 TJ(Max)=150°C TA=25°C 10µs Power W ID (Amps) 25 40 10ms 0.1s 1 20 30 100µs 1ms 10 15 VDS (Volts) Figure 8: Capacitance Characteristics TJ(Max)=150°C TA=25°C RDS(ON) limited 10 1s 20 10 10s DC 0 0.001 0.1 0.1 1 10 100 VDS (Volts) ZθJA Normalized Transient Thermal Resistance D=Ton/T TJ,PK=TA+PDM.ZθJA.RθJA RθJA=62.5°C/W 0.1 1 10 100 1000 Pulse Width (s) Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E) Figure 9: Maximum Forward Biased Safe Operating Area (Note E) 10 0.01 In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 1 0.1 PD Ton Single Pulse 0.01 0.00001 0.0001 0.001 0.01 0.1 1 T 10 100 1000 Pulse Width (s) Figure 11: Normalized Maximum Transient Thermal Impedance Alpha & Omega Semiconductor, Ltd. www.aosmd.com AON3601 P-CHANNEL: Electrical Characteristics (TJ=25°C unless otherwise noted) Symbol Parameter STATIC PARAMETERS BVDSS Drain-Source Breakdown Voltage IDSS Zero Gate Voltage Drain Current IGSS Gate-Body leakage current Gate Threshold Voltage On state drain current VGS(th) ID(ON) Conditions Min ID=-250µA, VGS=0V VDS=-24V, VGS=0V -30 Typ -1 VGS=-4.5V, VDS=-5V VGS=-10V, ID=-5A RDS(ON) Static Drain-Source On-Resistance V µA -2 ±100 -3 nA V 39 54 60 52 70 72 gFS VSD IS VGS=-4.5V, ID=-4.2A Forward Transconductance VDS=-5V, ID=-5A Diode Forward Voltage IS=-1A,VGS=0V Maximum Body-Diode Continuous Current mΩ -20 TJ=125°C 6 Units -1 -5 TJ=55°C VDS=0V, VGS=±20V VDS=VGS ID=-250µA Max A 8.6 -0.79 mΩ -1 S V -2.8 A 900 pF DYNAMIC PARAMETERS Ciss Input Capacitance Coss Output Capacitance VGS=0V, VDS=-15V, f=1MHz Crss Rg 120 75 VGS=0V, VDS=0V, f=1MHz 10 15 Ω 14.7 19 nC VGS=-10V, VDS=-15V, ID=-5A 7.6 2 10 nC nC VGS=-10V, VDS=-15V, RL=3Ω, RGEN=3Ω 3.8 8.3 5 29 14 23.5 Reverse Transfer Capacitance Gate resistance SWITCHING PARAMETERS Qg (10V) Total Gate Charge (10V) Qg (4.5V) Total Gate Charge (4.5V) Qgs Qgd Gate Source Charge Gate Drain Charge tD(on) tr tD(off) tf trr Turn-On DelayTime Turn-On Rise Time Turn-Off DelayTime Qrr 700 Turn-Off Fall Time IF=-5A, dI/dt=100A/µs Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge IF=-5A, dI/dt=100A/µs pF pF nC ns ns ns ns 30 13.4 ns nC A: The value of R θJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The value in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance rating. B: Repetitive rating, pulse width limited by junction temperature. C. The R θJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient. D. The static characteristics in Figures 1 to 6,12,14 are obtained using <300 µs pulses, duty cycle 0.5% max. E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The SOA curve provides a single pulse rating. Rev 1: Feb 2008 THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE Alpha & Omega Semiconductor, Ltd. www.aosmd.com AON3601 P-CHANNEL: TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 10 20 -10V -6V -5V -4.5V VDS=-5V 8 15 6 10 -ID(A) -ID (A) -4V -3.5V VGS=-3V 5 4 125°C 2 0 0.00 2.00 3.00 4.00 5.00 0 1 2 3 4 -VGS(Volts) Figure 2: Transfer Characteristics 100 Normalized On-Resistance 1.60E+00 80 RDS(ON) (mΩ) 72 0 1.00 -VDS (Volts) Figure 1: On-Region Characteristics VGS=-4.5V 60 VGS=-10V 40 20 VGS=-4.5V ID=-4.2A VGS=-10V ID=-5A 1.40E+00 1.20E+00 1.00E+00 8.00E-01 1 3 5 7 9 0 -ID (A) Figure 3: On-Resistance vs. Drain Current and Gate Voltage 25 50 75 100 125 150 175 Temperature (°C) Figure 4: On-Resistance vs. Junction Temperature 1E+01 160 140 1E+00 ID=-5A 120 1E-01 100 1E-02 -IS (A) RDS(ON) (mΩ) 25°C 60 -2.5V 125°C 80 125°C 1E-03 25°C 1E-04 60 25°C 40 1E-05 1E-06 20 2 4 6 8 10 -VGS (Volts) Figure 5: On-Resistance vs. Gate-Source Voltage Alpha & Omega Semiconductor, Ltd. 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -VSD (Volts) Figure 6: Body-Diode Characteristics www.aosmd.com AON3601 P-CHANNEL: TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 1200 10 VDS=-15V ID=-5A 1000 Capacitance (pF) -VGS (Volts) 8 6 4 2 Ciss 800 600 400 Coss 200 0 0 0 2 4 6 8 10 12 14 16 0 -Qg (nC) Figure 7: Gate-Charge Characteristics TJ(Max)=150°C TA=25°C 10 15 40 25 30 30 100µs 1ms 0.1s 20 TJ(Max)=150°C TA=25°C 10µs RDS(ON) limited 10 5 72 -VDS (Volts) Figure 8: Capacitance Characteristics Power (W) -ID (Amps) 100 60 Crss 10ms 1 20 10 1s 10s DC 0 0.001 0.1 0.1 1 10 100 -VDS (Volts) ZθJA Normalized Transient Thermal Resistance D=Ton/T TJ,PK=TA+PDM.ZθJA.RθJA RθJA=62.5°C/W 0.1 1 10 100 1000 Pulse Width (s) Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E) Figure 9: Maximum Forward Biased Safe Operating Area (Note E) 10 0.01 In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 1 PD 0.1 Ton T Single Pulse 0.01 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 Pulse Width (s) Figure 11: Normalized Maximum Transient Thermal Impedance Alpha & Omega Semiconductor, Ltd. www.aosmd.com