SSK-QFN-7000 - Ironwood Electronics

Features
Top View
Directly mounts to target PCB (needs tooling
holes) with hardware
Minimum real estate required
A
Compression plate distributes forces evenly
30.23mm
[1.190"]
Clamshell lid
A
Materials:
9
25.48mm [1.003"]
Side View
(Section AA)
Recommended Torque 1-2 in-oz.
1
Clam Shell Lid: Black anodized Aluminum.
Height = 16.5 mm.
2
Socket Base: Black anodized Aluminum.
Height = 6 mm.
3
4
4
5
37.81mm
[1.489"]
+ IC thickness
6
Pogo Pin Guides: Torlon or Peek
7
Socket Base Screw: Socket Head Cap Screw,
alloy steel with black oxide finish, 0-80 Thread,
3/4" long.
8
Pogo Pin Guide Screw: Pan head phillips, 18-8
SS, 0-80 thread, 3/16" long.
9
Latch: Black anodized Aluminum.
10
IC guide: Ultem 1000
11
Insulation Plate : FR4 0.0625'' (1.59 mm)
12
Backing Plate : Black anodized Aluminum
1
3
2
6
10
5
11
Customer's PCB
Compression Plate: Black anodized Aluminum.
Thickness = 8.5 mm.
Compression Screw: Clear anodized Aluminum.
Height = 25 mm, Fluted Knob
Pogo Pin:
Plungers - Hardened Steel/ Gold plated
Barrel - Copper Alloy/ Gold plated
Spring - Stainless Steel/ Gold wire
12
8
7
SSK-QFN-7000 Drawing
© 2010 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Scale: 1.25:1
Rev: A
Drawing: M.A. Fedde
Date: 11/10/10
File: SSK-QFN-7000 Dwg
Modified:
All Tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 4
Ironwood Package code: QFN12H
Recommended PCB Layout
Top View
Orientation Mark
3.303mm
Ø 1.61mm±0.05mm(x4)
1.213mm±0.125mm (x4)
Non plated mounting hole
0.50mm typ.
1.218mm±0.125mm (x4)
2.00mm
3.61mm
Ø 0.850mm±0.025mm (x2)
12.225mm±0.125mm
Socket Body Size
Non plated alignment hole
0.50mm
3.00mm
3.00mm
0.30 x 0.32mm pad (x 24)
0.50mm
3.42mm
9.725mm (x4)
12.475mm±0.125mm
Socket Body Size
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
14.725mm
Backing plate size
Recommended PCB Layout Tolerances:
±0.025mm [±0.001”] unless stated otherwise.
Target PCB Recommendations
SSK-QFN-7000 Drawing
Total thickness: 1.6mm
© 2010min.
IRONWOOD ELECTRONICS, INC.
Plating: Gold or11351
Solder
finish
Rupp
Drive, Suite 400, Burnsville, MN 55337
Tele: (952)
PCB Pad height: Same or higher
than229-8200
solder mask
www.ironwoodelectronics.com
Status: Released
Scale: 4:1
Rev: A
Drawing: M.A. Fedde
Date: 11/10/10
File: SSK-QFN-7000 Dwg
Modified:
All dimensions are in mm.
PAGE 2 of 4
Compatible QFN (MLF) Spec
Ironwood Package code: QFN12H
D
A
b
A1
L
E
e
Bottom View
Top View
Side View
DIM
MIN
MAX
A
0.80
A1
0.05
b
0.30
L
0.43
D
4.00 BSC
E
3.00 BSC
e
0.5 BSC
12 Leads
Dimensions are in millimeters.
Interpret dimensions and toleraces per ASME Y14.5M-1994.
Target PCB SSK-QFN-7000
Recommendations Drawing
Total thickness: 1.6mm
min.
© 2010 IRONWOOD ELECTRONICS, INC.
Plating: Gold or
Solder
11351
Ruppfinish
Drive, Suite 400, Burnsville, MN 55337
PCB Pad height: Same or Tele:
higher
than
solder mask
(952)
229-8200
www.ironwoodelectronics.com
Status: Released
Scale:
Rev: A
Drawing: M.A. Fedde
Date: 11/10/10
File: SSK-QFN-7000 Dwg
Modified:
PAGE 3 of 4
14.73mm
2.50mm
2.50mm
1.27mm (x4)
1.50mm
Top View
14.73mm
9.725mm±0.025mm (x4)
3.50mm
Ø 1.61mm±0.05mm (x4)
3.00mm sqr.
5.94mm
Note: Backing plate holes are tapped to accept 0-80 screws.
1.59mm
Insulation Plate
Side View
Backing Plate
6.35mm
Description: Insulation Plate and Backing Plate
Target PCB SSK-QFN-7000
Recommendations Drawing
Total thickness: 1.6mm
min.
© 2010 IRONWOOD
ELECTRONICS, INC.
Plating: Gold 11351
or Solder
Rupp finish
Drive, Suite 400, Burnsville, MN 55337
(952)
229-8200
PCB Pad height: Same orTele:
higher
than
solder mask
www.ironwoodelectronics.com
Status: Released
Scale:
Rev: A
Drawing: M.A. Fedde
Date: 9/8/10
File: SSK-QFN-7000 Dwg
Modified:
All dimensions are in mm.
All tolerences are +/- 0.125mm.
(Unless stated otherwise)
PAGE 4 of 4