MUR6040PT, MUR6060PT A C A Dimensions TO-247AD A C A C(TAB) A=Anode, C=Cathode, TAB=Cathode VRSM V 400 600 MUR6040PT MUR6060PT Symbol IFRMS IFAVM IFRM IFSM Test Conditions Inches Min. Max. A B 19.81 20.32 20.80 21.46 0.780 0.819 0.800 0.845 C D 15.75 16.26 3.55 3.65 0.610 0.140 0.640 0.144 E F 4.32 5.4 5.49 6.2 0.170 0.212 0.216 0.244 G H 1.65 - 2.13 4.5 0.065 - 0.084 0.177 J K 1.0 10.8 1.4 11.0 0.040 0.426 0.055 0.433 L M 4.7 0.4 5.3 0.8 0.185 0.016 0.209 0.031 N 1.5 2.49 0.087 0.102 Unit TVJ=TVJM o TC=85 C; rectangular, d=0.5 tp<10us; rep. rating, pulse width limited by TVJM 50 60 375 A TVJ=45oC t=10ms (50Hz), sine t=8.3ms (60Hz), sine t=10ms(50Hz), sine t=8.3ms(60Hz), sine 300 320 260 280 A t=10ms (50Hz), sine t=8.3ms (60Hz), sine t=10ms(50Hz), sine t=8.3ms(60Hz), sine 450 420 340 320 As o TVJ=150 C o 2 o TVJ=150 C -40...+150 150 -40...+150 TVJ TVJM Tstg o Ptot TC=25 C Md Mounting torque Weight 2014-8-6 Millimeter Min. Max. Maximum Ratings TVJ=45 C It VRRM V 400 600 Dim. 1 2 o C 125 W 0.8...1.2 Nm 6 g www.kersemi.com MUR6040PT, MUR6060PT Symbol Characteristic Values typ. max. Test Conditions o IR TVJ=25 C; VR=VRRM o TVJ=25 C; VR=0.8.VRRM o TVJ=125 C; VR=0.8.VRRM o Unit 100 50 7 uA uA mA VF IF=37A; TVJ=150 C o TVJ=25 C 1.4 1.6 V VTO For power-loss calculations only 1.01 V TVJ=TVJM 7.1 rT RthJC RthCK RthJA trr IRM m 1 K/W 0.25 70 o IF=1A; -di/dt=100A/us; VR=30V; TVJ=25 C o _ VR=350V; IF=30A; -diF/dt=240A/us; L<0.05uH; TVJ=100 C 35 50 ns 10 11 A FEATURES APPLICATIONS ADVANTAGES * International standard package JEDEC TO-247AD * Planar passivated chips * Very short recovery time * Extremely low switching losses * Low IRM-values * Soft recovery behaviour * Rectifiers in switch mode power supplies (SMPS) * Uninterruptible power supplies (UPS) * Ultrasonic cleaners and welders * High reliability circuit operation * Low voltage peaks for reduced protection circuits * Low noise switching * Low losses * Operating at lower temperature or space saving by reduced cooling 2014-8-6 2 www.kersemi.com MUR6040PT, MUR6060PT Fig. 1 Forward current versus voltage drop. Fig. 2 Recovery charge versus -diF/dt. Fig. 3 Peak reverse current versus -diF/dt. Fig. 4 Dynamic parameters versus junction temperature. Fig. 5 Recovery time versus -diF/dt. Fig. 6 Peak forward voltage versus diF/dt. Fig. 7 Transient thermal impedance junction to case. 2014-8-6 3 www.kersemi.com