, One.. U TELEPHONE: (973) 376-2922 (212)227-6005 FAX: (973) 376-8960 20 STERN AVE. SPRINGFIELD, NEW JERSEY 07081 U.S.A. 2N5564/5565/5566 Matched N-Channel JFET Pairs Product Summary Part Number VGS(olD 00 V(BR)css Min (V) grs Min (mS) IG T>1> (pA) |VGsi - VGS2| Max (mV) -0.5 to -3 -40 -40 7.5 7.5 -0.5 to -3 -40 7.5 2N5564 -0.5 to -3 2N5565 2N5566 Features Two-Chip Design High Slew Rate Low Offset/Drift Voltage Low Gate Leakage: 3 pA Low Noise: 12 nV/Vffe~@ 10 Hz GoodCMRR: 76 dB Minimum Parasitics -3 -3 -3 Benefits 5 10 20 Applications Tight Differential Match vs. Current Improved Op Amp Speed, Settling Time Accuracy Minimum Input Error/Trimming Requirement Insignificant Signal Loss/Error Voltage High System Sensitivity Minimum Error with Large Input Signals Maximum High Frequency Performance Wideband Differential Amps High-Speed, Temp-Compensated, Single-Ended Input Amps High-Speed Comparators Impedance Converters Matched Switches TO-71 Description The 2N5564/5565/5566 are matched pairs of JKETs mounted in a TO-71 package. This two-chip design reduces parasitics for good performance at high frequency while ensuring extremely tight matching. This series features high breakdown voltage (V(BR)DSS typically > 55 V), high gain (typically > 9 mS), and <5-mV offset between the two die. Top View Absolute Maximum Ratings Gate-Drain, Gate-Source Voltage Gate-Gate Voltage Gate Current Lead Temperature (Vi6" from case for 10 sec.) Storage Temperature Quality Semi-Conductors -40 V ± 80 V 50 mA 300 °C -65 to 200°C Operating Junction Temperature Power Dissipation : Per Side3. Total* Notes a. Derate 2.6 mW/°C above 25°C b. Derate 5.2 mW/°C above 25°C -55 to 150°C 325 mW 650 mW Specifications' Limits 2N5564 Parameter 2N5565 Typb Min Max Min Symbol Test Conditions V(BR)GSS IG = -luA,V D S = OV -55 -40 Vas(off) VDS = 15 V, ID = 1 nA -2 -0.5 5 2N5566 Max Min Max Unit Static Gate-Source Breakdown Voltage Gate-Source Cutoff Voltage Saturation Drain Current0 Gate Reverse Current Gate Operating Current Drain-Source On-Resistance Gate-Source Voltage Gate-Source Forward Voltage -40 -40 V IDSS IGSS IG -3 -0.5 30 5 -3 -0.5 30 5 -3 VDS = 15V,VOS = OV 20 30 mA V G S =-20V,V D S = OV -5 -100 -100 -100 | TA = 150°C -10 -200 -200 -200 PA nA VDG = 15 V ID = 2mA | TA » 125°C -3 PA nA -1 TDS(on) VGS = 0 V, ID = 1 mA 50 VGS VDG = 15 V, ID = 2 mA -1.2 VGS(F) lG = 2mA,V D S = OV 0.7 100 100 100 1 1 1 Q V Dynamic Common-Source Forward Transconductance gfs Common-Source Output Conductance gos Common-Source Forward Transconductance gfs Common-Source nput Capacitance QM Common-Source Reverse Transfer Capacitance Cr* Equivalent Input 'ioise Voltage 6n *Ioise Figure NF VDS - 15 V, ID = 2 mA f = 1 kHz 9 7.5 35 vDs = 15 y iD = 2 mA f = 100 MHz VDS - 15 V, ID - 2 mA f = 1 MHz VDS = 15 V, ID = 2 mA f=10Hz 8.5 12.5 7.5 45 12.5 45 7 7 7.5 12.5 mS 45 US mS 7 10 12 12 12 2.5 3 3 3 12 50 50 50 nV/ VHI 1 1 1 dB pF 1 RG = 10 MQ Matching Differential Gate-Source Voltage |vosl-vGS2| VDG = 15 V, ID = 2mA 5 10 20 mV Gate-Source Voltage 3ifferential Change with Temperature AlVos.-V^I VDG = 15 V, ID = 2 mA TA = -55 to 125°C 10 25 50 uv/°c : Saturation Drain Current Ratio AT 'DSSI 'DSS: ransconductance Ratio Common Mode {ejection Ratio VTA*. ~ 1 ^ v v^o n v 0.98 0.95 1 0.95 1 0.95 1 Bfsi 8fs2 VDS = 15 V, ID = 2 mA f = 1 kHz 0.98 0.95 1 0.90 1 0.90 1 CMRR VDG = 10 to 20V ID = 2 mA 76 dB Notes a. TA = 25°C unless otherwise noted. b. Topical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. c. Pulse test: PW a 300 us duty cycle S3%. TO-71 Dim Millimeters Min M«ut Inches Min Max A AI 0b 0D 0D] e «1 J k L 4.32 5.33 0.76 0.41 0.48 5.31 5.84 4.S2 4.95 2.54 BSC 1.27BSC 0.92 1.17 0.72 1.22 12.70 - 0.170 0.210 0.030 0.016 0.019 0.209 0.230 0.178 0.195 0.100 BSC 0.050 BSC 0.036 0.046 0.028 rb.048 0.5DO -