RENESAS R2J20751NP

Preliminary Datasheet
R2J20751NP
Peak Current Mode Synchronous Buck Controller
with Power MOS FETs
R07DS0240EJ0100
Rev.1.00
Jan 26, 2011
Description
This all-in-one SiP for POL (point-of-load) applications is a multi-chip module incorporating a high-side MOS FET,
low-side MOS FET, and PWM controller in a single QFN package. The on and off timing of the power MOS FET is
optimized by the built-in driver circuit, making this device suitable for large-current high-efficiency buck converters.
In a simple peak-current mode topology, stable operation is obtained in a closed power loop, and a fast converter is
easily realized with the addition of simple components. Furthermore, the same topology can be applied to realize
converters for parallel synchronized operation with current sharing, and multi-phase operation. The package also
incorporates a high-side bootstrap switch (Boot switch), eliminating the need for an external SBD for this purpose.
Features
















Three chip in one package for high efficiency and space saving
Large average output current (25 A)
Wide input voltage range: 3.3 V to 27 V
0.6 V reference voltage accurate to within 2%
Wide programmable switching frequency: 200 kHz to 1 MHz
Peak current mode topology with Active Current Sensing
Slope compensation function
Current sensing error: 1.5 A maximum @15 A load current
Built-in Boot switch for boot strapping
ON/OFF control
Hiccup operation under over load condition
Tracking function
Thin and small package: QFN40 pins (6 mm  6 mm)
Power Good function
Over voltage protection
Pre-OVP function
Applications
 Mother board
 Servers
Typical Characteristic Curve
96
VIN = 5V
VOUT = 1.5V
Frequency = 500kHz
Efficiency (%)
94
92
90
88
86
84
82
80
0
5
10
15
20
25
Output Current Iout (A)
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
Page 1 of 25
R2J20751NP
Preliminary
Application Circuit Example
VCIN (4.5V to 5.5V)
PGOOD
VIN
BOOT
VCIN
IN
OUT
ON/OFF
IREF
VCIN
CT
VIN (3.3V to 27V)
VOUT (1.5V)
TRK-SS
SW
FB
Controller Chip
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
PGND
CS
SGND
CSLP
REFIN
Share
EO/CO
Page 2 of 25
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
VOUT
FB
TRK-SS
REFIN/
POS
EO/CO
CLK
CT
ON/OFF
Slave
125% REF
SGND
OUT
IN
Max.
Duty
S
R
Q
Q
ON/OFF
UVLO
OCL
OVP
Error Amp.
CO
Share
Islope
RES
40k
10k
VCIN
50ns
RES
CSLP
Islope
35k
Current
Sense
Comp.
Max. Duty
OUT
Pulse Generator
Phase Ctrl Comp.
CLK
OVP Comp.
SYS.
ENBL
IN
SYS.ENBL RES
SYS.
ENBL
Share
Slave
1V
0.6V(2%)
1.8V
M/S Selector
70% VCIN
CLK
Supervisor
oscillator
OVP
CT
VCIN
ON/OFF
UVL
CO
CS
300μA
1.5V
UVLO
Iref
FB
OCP
PWM
SYS.ENBL
OCP
Hiccup
control
Q
Q
BOOT
VCIN
PreOVP
90% REF
OVP
Power Good Indicator
OVP
Gate Drive
Logic
Circuit
Boot Switch
Active
Current
Sensing
UVLO
OCP
Comp.
S
R
Idh
13700
50ns
Blanking
Internal Logic
Power
VCIN
4.5V to 5.5V
Idh
PGOOD
PGND
SW
VOUT
3.3V to 27V
VIN
R2J20751NP
Preliminary
Block Diagram
Page 3 of 25
R2J20751NP
Preliminary
OUT
11
IN
12
SGND
SGND
CT
CS
CSLP
VCIN
IREF
PGOOD
Share
EO/CO
REFIN/POS
Pin Arrangement
10
9
8
7
6
5
4
3
2
1
40
FB
39
TRK-SS
13
38
SGND
CLK
14
37
ON/OFF
BOOT
15
36
SW
SW
16
35
SW
VIN
17
34
SW
VIN
18
33
SW
VIN
19
32
SW
VIN
20
31
SW
SGND
SW
21
22
23
24
25
26
27
28
29
30
VIN
VIN
VIN
VIN
SW
PGND
PGND
PGND
PGND
PGND
VIN
Top view
Package: QFN40 pin (6 mm × 6 mm, 0.5-mm pin pitch)
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
Page 4 of 25
R2J20751NP
Preliminary
Pin Description
Pin Name
Pin No.
VIN
17 to 24
SW
16, 25, 31 to 36
PGND
26 to 30
SGND
10, 13, 38
VCIN
BOOT
Description
Remarks
Input voltage for buck converter.
Switching node. Connect a choke coil between the
SW pin and dc output node of the converter.
Ground of the power stage.
Should be connected to SGND
externally.
Ground of the IC chip.
Should be connected to PGND
externally.
6
Input voltage for control circuit.
Should be connected to 5 V power
supply.
15
Bootstrap voltage pin. A bootstrap capacitance
should be connected between BOOT pin and SW pin.
To be supplied +5 V through the
internal SBD.
TRK-SS
39
Start-up timing control input.
FB
40
Feedback voltage input for the closed loop.
EO/CO
2
Error amplifier output pin. (Master mode)
Comparator output pin. (Slave mode)
Share
3
Current share bus.
Should be connected to each Share
pin in multi phase operation.
IREF
5
Reference current generator for the IC.
Need a 18 k resistance between
IREF to GND plane.
CSLP
7
Additional current slope input pin.
Should be connected capacitor
between CSLP to GND.
CS
8
Current output pin of Active Current Sensing circuit.
Need a resistance appropriately
between CS to GND plane.
CT
9
Timing capacitor pin for the oscillator.
OUT
11
Switching trigger output.
Tie to IN pin of previous device in
multi phase operation.
IN
12
Switching trigger input.
Tie to OUT pin of next device in multi
phase operation.
CLK
14
I/O pin for synchronous operation.
Should be connect to each CLK pin in
multiphase operation.
ON/OFF
37
Signal disable pin.
Disabled when ON/OFF pin is low
state.
PGOOD
4
Power Good Indicator output. (Open drain)
Pulled low when No Good.
REFIN/POS
1
Reference voltage input. (Master mode)
Comparator positive pin. (Slave mode)
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
Page 5 of 25
R2J20751NP
Preliminary
Absolute Maximum Ratings
(Ta = 25°C)
Item
Symbol
Power dissipation
ON/OFF pin voltage
PGOOD voltage
Other pins voltage
TRK-SS dc current
IREF current
EO sink current
CO sink current
Pt(25)
Pt(100)
Iout
VIN(DC)
VIN(AC)
VCIN(DC)
Vsw(DC)
Vsw(AC)
Vboot(DC)
Vboot(AC)
Von/off
Vpgood
Vic
Itrk
Iref
Iieo
Iico
CO source current
Operating junction temperature
Storage temperature
Ioco
Tj-opr
Tstg
Average output current
Input voltage
Supply voltage
Switch node voltage
BOOT pin voltage
Notes: 1.
2.
3.
4.
5.
Rating
25
8
25
–0.3 to +27
30
–0.3 to +6
27
30
32
36
–0.3 to VIN
0 to VIN
–0.3 to (REG5 + 0.3)
0 to 1
–120 to 0
0 to 2
0 to 1
Unit
W
0 to 1
–40 to +150
–55 to +150
mA
°C
°C
A
V
V
V
V
V
V
V
mA
A
mA
mA
Note
1
2
2, 5
2
2
2, 5
2
2, 5
2
3
2
3
3
3
3, 4
3, 4
Pt(25) represents a PCB temperature of 25°C, and Pt(100) represents 100°C.
Rated voltages are relative to voltages on the SGND and PGND pins.
For rated current, (+) indicates inflow to the chip and (–) indicates outflow.
Rated currents are only for slave mode.
Ratings for which "ac" is indicated are limited to within 100 ns.
Safe Operating Area
Average Output Current Iout (A)
30
25
20
15
10
VIN = 5 V
VOUT = 1.5 V
Frequency = 300 kHz
5
0
0
20
40
60
80
100
120
140
160
PCB Temperature Tpcb (°C)
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
Page 6 of 25
R2J20751NP
Preliminary
Electrical Characteristics
(Ta = 25°C, VIN = VCIN = 5 V, unless otherwise specified)
Item
Supply
Remote
On/off
Symbol
Min
Typ
Max
Unit
VCIN start threshold
VH
4.1
4.3
4.5
V
VCIN shutdown threshold
VL
3.6
3.8
4.0
V
1
Test Conditions
UVLO hysteresis
dUVL
—
0.5 *
—
V
Input bias current
Iin
15
30
45
mA
Freq = 500 kHz,
Duty = 50%
Slave standby current
I-sin
2.1
3.5
4.9
mA
Von/off = 5 V, Vfb = 5 V
ON/OFF = 0 V
Input shutdown current
Isd
3.1
4.5
5.9
mA
Disable threshold
Voff
1.0
1.3
1.6
V
Enable threshold
Von
2.0
2.5
3.0
V
Input current
Ion/off
0.5
2.0
5.0
A
Von/off = 1 V
Reference
current
generator
IREF pin voltage
VIref
1.75
1.80
1.85
V
Riref = 18 k
Oscillator
CT oscillating frequency
Fct
—
500
—
kHz
CT = 180 pF
CT higher trip voltage
Vhct
—
1.8 *1
—
V
CT = 180 pF
CT lower trip voltage
Vlct
—
1 *1
—
V
CT = 180 pF
CT = 0.5 V
Error
amplifier
Phase
control
comparator
Current
sense
Power
good
indicator
Note:
CT source current
Ict-src
–176
–160
–144
A
CT sink current
Ict-snk
144
160
176
A
CT = 2.3 V
Feedback voltage
Vfb
588
600
612
mV
TRK-SS = 1 V
FB input bias current
Ifb
–0.1
0
+0.1
A
REFIN input bias current
Irefin
0.5
2
5
A
Output source current
Ieo-src
150
200
250
A
EO = 4 V, FB = 0 V
Output sink current
Ieo-snk
3.5
7.0
14.0
mA
EO = 1 V, FB = 0.7 V
Voltage gain
Av
—
80 *1
—
dB
Band width
BW
—
15 *1
—
MHz
Share pin resistance
Rshare
35
50
65
k
EO = 0 V. Ishare = 1 V
Output source current
Ico-src
–3.0
–2.0
–1.0
mA
Share = 0 V, POS = 1 V,
CO = 4.5 V
Output sink current
Ico-snk
2.0
3.0
4.0
mA
Share = 1 V, POS = 0 V,
CO = 0.5 V
Input bias current
Ipos
0.5
2
5.0
A
POS = 1.0 V
1
CS current accuracy
Idh/Ics
—
13700 *
—
—
Leading edge blanking time
TLD
—
60 *1
—
ns
CS comparator delay to output
Td-cs
—
65 *1
—
ns
OCP comparator threshold on
CS pin
Vocp
1.4
1.5
1.6
V
Hiccup interval
Tocp
1.85
2.05
2.26
ms
CT = 180 pF
RAMP offset voltage
Vramp-dc
70
100
130
mV
CT = 180 pF
CS offset current
Ics-dc
—
300
—
A
CS = 0 V
Rising threshold on FB
Vgood
0.855
0.9
0.945
V
REFIN = 1.0 V
—
mV
1.4
V
Power good hysteresis
dVgood
—
50 *
Power good output low voltage
Vpglow
0.6
1.0
1
Ipgood = 2 mA
1. Reference values for design. Not 100% tested in production.
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
Page 7 of 25
R2J20751NP
Preliminary
(Ta = 25°C, VIN = VCIN = 12 V, unless otherwise specified)
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Overvoltage
protection
OVP trip voltage
Vtovp
1.19
1.25
1.31
V
Pre-OVP trip voltage
Vpovp
—
1.67
—
V
Slope
generator
Slope current
ISLP
7
10
13
A
VSLP = 0 V
Clock
generator
Clock frequency
Fclk
450
500
550
kHz
CT = 180 pF
OUT high voltage
Vh-out
4.0
5.0
—
V
Rout = 51 k to GND
OUT low voltage
Vl-out
0
—
1.0
V
Rout = 51 k to VCIN
IN input bias current
Ibin
0.5
2.0
5.0
A
V-in = 1 V
IN input threshold
Vth-in
—
2.2
—
V
IN input hysteresis
Vth-hys
—
0.25
—
V
Note:
REFIN = 1.0 V
1. Reference values for design. Not 100% tested in production.
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
Page 8 of 25
R2J20751NP
Preliminary
Description of Operation
Peak Current Control
The control IC operates as current programmed control mode, in which output of the converter is controlled by the
choice of the peak current from the high-side MOS FET. The current from this MOS FET is sensed by an active current
sensing circuit (ACS), the output current of which is 1/13700 (50 ppm) of the MOS FET current. The ACS current is
then converted to certain voltage by external resistor on the CS pin. The CS voltage is fed to the internal current sense
comparator via the slope compensation circuit, and then compared with current control signal which determined from
the error amplifier output voltage (EO) via an NPN transistor and resister network.
To start with, the RES pulse from pulse generator resets a latch, then the high-side MOS FET is turned on. The latch
output (Q bar) is toggled when CS voltage reaches the level of the current control signal on EO, the high-side MOS
FET is turned off, and the low-side MOS FET is turned off after a certain dead time interval. The IC remains in this
state until the arrival of the next RES pulse.
Applying current information for the control loop, the converter loop compensation design will be simple.
Maximum Duty-Cycle Limitation
If the current-sense comparator output is not toggled 60-ns prior to the arrival of the next RES pulse, an internal
maximum duty pulse is generated and forces toggling of SR latch. So, the duty cycle of the high-side MOS FET is
limited by the maximum duty period.
The maximum duty period of the high-side MOS FET depends on its switching frequency.
Max. duty = 1 – 60 ns  Fsw
OCP Hiccup Operation
Eight times the voltage of CS exceeds 1.5 V, OCP hiccup circuit disables switching operation of the IC and MOS FETs.
Internal circuitry also pulls the TRK-SS pin down to SGND. The IC is turned off for a period of 1024 RES pulses; after
this has elapsed, switching operation of the IC is restarted from the soft-start state.
UVLO and ON/OFF Control
When VCIN is under the start-up voltage, it is in the UVLO condition, functioning of the IC is disabled. The oscillator
is turned off, both high and low-side MOS FETs are turned off, and the TRK-SS pin is pulled down. Furthermore, if the
ON/OFF pin is the low state or left open, functioning of the IC is disabled and both MOS FETs are turned off.
Oscillator and Pulse Generator
The frequency of the oscillator (Fct) is set by the value of the external capacitor connected to the CT pin. The switching
frequency (Fsw) is not the same as Fct, which also depends on the phase number N. The following equations determine
these frequencies.
Oscillator frequency: Fct = 160 A / (2  CT(F)  0.8 V)  N
Switching frequency: Fsw = Fct / N
(Hz)
(Hz)
In multi-phase operation, connect the CT pins for all devices.
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
Page 9 of 25
R2J20751NP
Preliminary
Soft Start
TRK-SS pin is provided for start-up setup. Both simple soft start and sequential start up can be realized with this pin
setup. The error amp has two reference inputs and one input for soft start. One of lower voltage inputs of the two
positive inputs is dominant for the amplifier. Therefore simply having CR charging circuit on TRK-SS pin is easier for
soft start design.
The soft start period is determined with the equation as follows when TRK-SS pin has CR charging circuit.
Tss = –C · R · Ln (1 – REF / VCIN)
(s)
REF is REFIN voltage or 0.6 V in internal reference voltage.
Power Good Indicator
The power good indicator is useful for controlling timing when multiple converter systems are started up or shut down.
Voltage on the FB pin is internally monitored by a power good comparator. The power good comparator compares the
voltage on the pin with 90% of the reference voltage. When the comparator detects the FB voltage reaching the
reference voltage, the Power Good pin becomes high impedance. If the voltage on FB goes over 125% or falls below
80% of the reference voltage, the pin is pulled down to SGND. PGOOD has an n-channel MOS FET operating as an
open drain output and capable of sinking up to 2 mA of current.
Overvoltage Protection
When the output voltage (FB voltage) reaches or exceeds 125% of the reference voltage, switching stops immediately,
the gate of the low-side MOS FET is latched in the high level, which causes shorting of the SW pin to GND. Resetting
to leave the OVP mode is by resupplying VCIN or switching the circuit OFF and ON.
Pre-Overvoltage Protection
When the IC is starting up, an internal circuit monitors the voltage at the switch node and detects the output of
excessive voltages. When a voltage exceeding 1.67 V is detected on the SW pin after release from the UVL state, the
gate of the low-side MOS FET is latched in the high level, which causes shorting of the SW pin to GND. The low-side
MOS FET remains in this state until VCIN is resupplied.
Multi Phase Operation
The R2J20751NP is a scalable solution. Pulling the FB pin of a device up to VCIN causes the device to operate as a
slave. Clock timing is synchronized by connecting the CLK and CT pins of all devices. Current sharing is available by
connecting the Share pins. The timing of switching of the signal on the SW pin is generated from the switching trigger
signal on the IN pin. A device that has received the switching trigger signal outputs the same signal on its OUT pin for
the next device one clock cycle later. The phase number is controllable by the internal phase control comparators of
slave devices.
Slope Compensation
If peak current control leads to the duty cycle being over 50%, sub-harmonic oscillation is generated and the output
voltage becomes unstable regardless of the negative feedback for constant voltage control. The duty cycle, D, is
obtained from the following equation.
D = Vout / VIN  100 (%)
To prevent such oscillation, add a constant slope to the slope of the voltage on the CS pin. This added slope is
determined by 10 uA constant current output through the CSLP pin and the value of the connected external capacitor.
Insufficient added slope leads to sub-harmonic oscillation. Too much added slope leads to voltage-mode operation and
poorer response characteristics. An optimal slope (determined by the value of the external capacitor) needs to be set.
The capacitance (Cslp) is determined by the following equation.
Cslp = 70 A  13700  Toff / (2  Ipp  Rcs  M)
In the above equation, Toff is the off portion of the duty cycle (as time), Ipp is the ripple current of the output inductor,
Rcs is the value of the external resistor connected to the CS pin, and M is the rate of the added slope. A capacitor value
that leads to a greater setting of M in the range from 0.5 to 1.0 will lead to a greater added slope.
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
Page 10 of 25
R2J20751NP
Preliminary
Output Voltage Setting
The error amplifier of the device has an accurate 0.6 V reference voltage and REFIN pin which can input reference
voltage from external voltage. When reference voltage is 0.6 V, feedback loop leads to the FB pin a voltage of 0.6 V in
case of stable condition on the converter. Therefore the output voltage is;
Vout = 0.6 V  (R1 + R2) / R2
REFIN pin should be pulled up to VCIN, when reference voltage refer to internal 0.6 V.
R
VCIN
Vout
REFIN
CT
R1
FB
R2
Loop Compensation
Peak-current control makes design in terms of phase margins easier than is the case with voltage control. This is
because of differences between the characteristics of the PWM modulator and power stage in the two methods.
Figure 1 and 2 shows the behavior of the PWM modulator and power stage in the case of voltage control and peak
current control, respectively.
−40 dB/dec
Gain
(dB)
−20 dB/dec
Gain
(dB)
freq. (Hz)
freq. (Hz)
0
0
Phase
(deg) −90
Phase
(deg)
−180
−180
freq. (Hz)
Figure 1 Bode Plot (Voltage Mode)
freq. (Hz)
Figure 2 Bode Plot (Peak Curent Mode)
Feed-forward current to the modulator in the case of peak-current control means that the system is single pole, so we
see a –20 dB/decade cutoff and phase margin of 90° in the Bode plot. In voltage control, the system configures a twopole system. That is why rather complicated loop compensation of the error amplifier is required. Such as type-III
compensation. The design of effective compensation is thus much simpler in the case of peak-current control (refer to
figure 3).
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
Page 11 of 25
R2J20751NP
Preliminary
Rf
Vout
Cf
EO
R1
FB
R2
REF
10k
Amp-out to current-sense comparator
40k
Figure 3 Error Amplifier Compensation
Design example;
Specification: L = 470 nH, Co = 600 F, Fsw = 500 kHz, Vin = 5 V, Vout = 1.5 V, R1 = 1 k, R2 = 1 kΩ,
RCS = 820 Ω
1. Flat band gain of error amplifier
The flat band gain is; Af = Rf / (R1 // R2)  4 / 5  {R2 / (R1 + R2)}
Hence,
Rf = 5 / 4  Af  (R1 // R2) / {R2 / (R1 + R2)} ......(1)
In the Bode plot, the total gain should be lower than 1 (0 dB) at the switching frequency.
The total gain at Fsw (= Asw) depends on the flat-band gain, so Af should be expressed as follows;
Af = Asw  2   Fsw  Co  RCS / Nt ……(2)
Here, Nt = Idh / Ics = 13700
In the typical way, the value chosen for Asw is in the range from 0.1 to 0.5, since this produces a stable control loop.
The transient response will be faster if a large Asw is adopted, but the system might be unstable.
We choose 0.2 for Asw in the example below.
Af = 0.2  2   500 kHz  600 F  820  / 13700 = 22.564
Rf = 5 / 4  22.564  0.6 k / (2 / 3) = 25.385 k
Therefore, we select a value of 24 k for Rf.
2. Selecting the Cf value to determine the frequency of the zero.
The frequency of the zero established by Cf and Rf is about ten times the frequency of the pole for the power stage
and modulator.
We must start with the dc gain of the power stage and modulator.
Nt/RCS × L × Vin × Fsw
A0 =
……(3)
2
SQRT {Vin − 8 × L × Vin × Fsw × (VCS0 × Nt / RCS) }
Here VCS0 is the peak ac voltage on CS pin when the load current is zero, thus
VCS0 = 0.5  RCS  (Vin – Vout)  Vout / (L  Vin  Fsw) / 13700 ……(4)
= 0.5  820   (5 V – 1.5 V)  1.5 V / (470 nH  5 V  500 kHz) / 13700
= 0.134 V
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
Page 12 of 25
R2J20751NP
Preliminary
equation (3),
A0 =
=
=
Nt/RCS × L × Vin × Fsw
SQRT {Vin2 − 8 × L × Vin × Fsw × (VCS0 × Nt / RCS) }
……(3)
13700 / 820 Ω × 470 nH × 5 V × 500 kHz
SQRT {5
V2
− 8 × 470 nH × 5 V × 500 kHz × (0.134 V × 13700 / 820 Ω) }
19.63
SQRT {3.955}
= 9.871
The frequency of the pole established by the power stage and modulator is
F0 = Nt / (2   Co  RCS  A0) ......(5)
Thus,
F0 = 13700 / (2   600 F  820   9.871) = 448.967 Hz
Thus,
Fzero = 10  F0 = 4.489 kHz
Cf = (2   Fzero  Rf)–1 = (2   4.489 kHz  24 k)–1 = 1477 pF
Therefore, we select 1500 pF for Cf.
Basically, the transient response is faster when Cf is smaller, but too small a value will make the system-loop
unstable.
Converter open loop
Gain (dB)
−20 dB/dec
−40 dB/dec
Compensated error amp.
BW/Af
A0
Error amp. unity gain
frequency
Af
−20 dB/dec
F0
Freq. (Hz)
Asw
Fzero
BW
Fsw
Power and modulator
Figure 4
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
Page 13 of 25
R2J20751NP
Preliminary
Study of Vout Accuracy
The nominal output voltage is calculated as
Vout = VFB  (R1 + R2) / R2 ......(6)
Here, the typical FB voltage is 0.6 V.
VCIN
R
Vout
REFIN
CT
R1
FB
R2
The accuracy of Vout is strongly dependent on the variation of VFB, R1 and R2. VFB has variation of 1% and
resistance intrinsically has a certain variation. When we take the variation in resistance into account, equation (6) is
extended to produce equation (7).
Vout =
=
R1 × K1 + R2 × K2
R2 × K2
R1 × K1 / K2 + R2
R2
× FB
× FB ……(7)
Here, K1 and K2 are coefficients, Both are 1.00 in the ideal case.
By equation (6), R1 is chosen as;
R1 =
Vout (typical)
VFB (typical)
− 1 × R2 ……(8)
Substituting the expression for R1 into equation (7) yields the following
Vout (typical)
Vout = VFB ×
VFB (typical)
−1 ×
K1
+1
K2
……(9)
Therefore, variation in Vout is expressed as
Vout
Vout (typical)
=
VFB
Vout (typical)
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
×
Vout (typical)
VFB (typical)
−1 ×
K1
+1
K2
− 1 × 100 (%) ……(10)
Page 14 of 25
R2J20751NP
Preliminary
The accuracy of Vout can be estimated by using equation (10).
For Example, if Vout (typical) = 1.5 V, resistance variation is 1% (i.e K1, K2 = 1.01 and 0.99), and VFB = 588 mV to
612 mV.
Vout
Vout (typical)
=
VFB
Vout (typical)
612 mV
=
×
×
1.5 V
Vout (typical)
VFB (typical)
1.5 V
600 mV
−1 ×
K1
+1
K2
−1 ×
1.01
+1
0.99
− 1 × 100 (%)
−1 ×
0.99
+1
1.01
− 1 × 100 (%)
− 1 × 100 (%) ……(10)
= 3.23%
or
588 mV
=
×
1.5 V
1.5 V
600 mV
= −3.16%
Therefore, the output accuracy will be 3.2% under the above conditions.
Figure 5 shows the relationship between the accuracy of the resistance and the accuracy of the output voltage. The
resistor value must have an accuracy of 0.5% if the variation in output voltage from the system is to be kept within three
percent across the voltage range from 0.6 V to 3.3 V.
4
Vout accuracy (%)
3
2
1
R = ±0.5%
0
R = ±1%
−1
−2
−3
−4
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Vout (typical)
Figure 5 Vout Accuracy vs. Vout Set Voltage
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
Page 15 of 25
R2J20751NP
Preliminary
Timing Chart
Peak Current Control
Max. Duty
(Internal signal)
RES
(Internal signal)
60 ns (typ.)
TLD
50 ns (typ.)
EO
(EO-Vbe) 4/5
(Internal signal)
CS
0V
VIN
SW
0V
The high-side MOS FET is turned
off by the max. duty signal.
Note: Propagation delay is ignored.
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
Page 16 of 25
R2J20751NP
Preliminary
Oscillator and Pulse Generator
1. Standalone operation or working as Master Chip in parallel configuration with other chips.
1.8 V
CT
1.0 V
5V
CLK
(IN)
0V
Max. Duty
(Internal signal)
60 ns (typ.)
RES
(Internal signal)
Note: Propagation delay is ignored.
Switching frequency for CT
Fsw =
160 μA
2 × (CT(F) + 20 pF) × 0.8 V × N
(Hz)
Frequency set range: 200 kHz to 1 MHz
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
Page 17 of 25
R2J20751NP
Preliminary
Hiccup Operation when the Over-Current Limit (OCL) is Reached
TRK-SS
Detected OCL
1.5 V
CS
Skipped 1024 pulses
0V
Skipped 1024 pulses
Normal operation
Note: Propagation delay is ignored.
Detected OVP
125%
FB
90%
Top
MOSFET
signal
Bottom
MOSFET
signal
PGOOD *2
ON/OFF
(UVL)
Output current signal
Note: 2. Connected 51 kΩ resistor between PGOOD and VCIN.
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
Page 18 of 25
R2J20751NP
Preliminary
Applications
Multi Phase Operation
Tie each CT, CLK and Share pin.
Connect OUT pin to IN pin of next switching device.
REFIN/POS
VOUT
IN
EO/CO
FB
CLK
Device 1
(Master)
SW
Share
CT
OUT
VCIN
REFIN/POS
IN
EO/CO
FB
CLK
Device 2
(Slave1)
SW
VOUT
Share
CT
OUT
LOAD
REFIN/POS
IN
EO/CO
FB
CLK
Device 3
(Slave2)
SW
Share
CT
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
OUT
Page 19 of 25
R2J20751NP
Preliminary
Multi Phase Operation Waveforms (3 Phase)
Fclk
CLK
Phase1 switching
Device 1
(Master)
OUT1
(IN2)
Device 2
(Slave1)
OUT2
(IN3)
Device 3
(Slave2)
OUT3
(IN1)
The trigger signal is fed back
with the same timing as CLK.
For the three-phase system, only the master device operates while the voltages on the POS pins of slave devices 1 and 2 are higher
than the voltage on the Share pins. In single-phase operation, although the switching trigger signal is input on the IN pin of both slaves,
both slaves 1 and 2 are disabled so they output the signal on the OUT pin with the same timing as the clock signal (CLK), feeding it back
to the IN1 pin of the master.
2Fclk
CLK
Phase1 switching
Device 1
(Master)
OUT1
(IN2)
Device 2
(Slave1)
OUT2
(IN3)
Device 3
(Slave2)
OUT3
(IN1)
Phase2 switching
Trigger signal is output
after 1 cycle of CLK.
When only slave 1 is enabled, that is, the voltage on the POS pin is higher than the voltage on the Share pins only for slave 2, operation
becomes two phase. The frequency is double that in single-phase mode because slave 1 supplies current at the frequency of CLK that is
applied to the CT pin with the same timing as the master. Slave 1 outputs a switching trigger signal one clock cycle after it has received a
switching trigger signal. Accordingly, the phase of the timing for turning slave 1 on lags 90? behind that for the master.
CLK
Phase1 switching Phase2 switching Phase3 switching
Device 1
(Master)
OUT1
(IN2)
Device 2
(Slave1)
OUT2
(IN3)
Device 3
(Slave2)
OUT3
(IN1)
When slaves 1 and 2 are both enabled, the frequency is triple that in single-phase mode because slaves 1 and 2 supply current at the
frequency of CLK that is applied to the CT pin with the same timing as the master. Switching operation is with the timing of the CLK signal,
so the phase angle becomes 120? in three-phase operation and the phase shift is automatic.
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
Page 20 of 25
R2J20751NP
Preliminary
Phase Control
The device incorporates a comparator for control of the phase number. Pulling the voltage on the FB pin up to that on
VCIN exchanges the phase control comparator for the error amplifier, and the device operates as a slave. In this case,
the output of the comparator (CO) is exchanged for the output of the error amplifier (EO), and the positive input
(REFIN) of the error amplifier is exchanged for the positive input (POS) for the comparator. Furthermore, the inverse
input for the comparator is internally connected to the Share pin. The level where the phase number is switched is set by
an external resistor.
Design example;
Specification: L = 470 nH, Fsw = 500 kHz, Vin = 5 V, Vout = 1.5 V, RCS = 820 ,
Phase switching level is Iout = 10 A, hysteresis = 3.48 A
1. Deriving the voltage on the Share pins to return to single-phase operation with Iout = 6.52 A (3.48 A of hysteresis)
from two-phase operation with Iout = 10 A.
The peak of the output ripple current is:
Ipp (10 A) = (VIN – Vout) / L  Vout / VIN / Fsw / 2 + Iout (10 A) = 12.23 A
When Iout = 6.52 A in two-phase mode, current from each device is 3.26 A. Thus,
Ipp (3.26 A) = (VIN – Vout) / L  Vout / VIN / Fsw / 2 + Iout (3.26 A) = 5.49 A
The ratio between currents for the sense MOS FET and main MOS FET is 1:13700, so a bias current of 300 A
flows through the CS pin.
Thus, voltages on the CS pin are:
Vcs (10 A) = (Ipp (10 A) / 13700 + 300 A)  Rcs = 978 mV and
Vcs (3.26 A) = (Ipp (3.26 A) / 13700 + 300 A)  Rcs = 575 mV.
The non-inverted input terminal of the internal current sense comparator has an offset voltage of 0.2 V, and 40-k
and 10-k resistors are connected to the inverted input terminal.
Therefore, the Share voltages are:
Vshare (10 A) = (Vcs (10 A) + 0.2 V)  5 / 4 = 1.473 V and ......(11)
Vshare (3.26 A) = (Vcs (3.26 A) + 0.2 V)  5 / 4 = 0.969 V. ......(12)
VCIN
EO/CO
R5
Current Sense
comparator
EO/CO
R3
Sense
current
10k
R4
REFIN/POS
Phase control
comparator
0.2V
40k
Share
35k
Share
Slave chip
Master chip
RCS
Figure 6 Phase Switching Control
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
Page 21 of 25
R2J20751NP
VTHR
Preliminary
Vpos
VTHF
Vshare
2. Selecting the external resistors
When the output of phase control comparator becomes low, switching operation of the slave device starts and
operation becomes two phase. According to the results of (11) and (12), VTHR and VTHF are 1.473 V and 0.969 V.
These become the voltages on the POS pins (comparator non-inverted input pin). VTHR is the start-up level for the
slave device and VTHF is the shut-down level for the slave device.
We set the output current of CO at around 100 A when the voltage on Share is 1.379 V. In this case, R5 is:
R5 = (VCIN – 1.379) / 100 A = 35.27 k
The formulae that express R3 and R4 are:
R3 = R4  R5 / (R4 + R5)  (VCIN – VTHF) / VTHF = 18.34 k and
R4 = R5  (VTHR – VTHF) / (VCIN – VTHR) = 5.04 k.
With E24-series resistors, R3 = 18 k, R4 = 5.1 k, and R5 = 36 k.
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
Page 22 of 25
R2J20751NP
Preliminary
Main Characteristics
VL vs. Temperature
4.2
4.6
4.1
4.5
4.0
4.4
3.9
VL (V)
VH (V)
VH vs. Temperature
4.7
4.3
3.8
4.2
3.7
4.1
3.6
4.0
3.5
3.9
–50 –25
0
25
50
3.4
–50 –25
75 100 125 150
0
25
50
75 100 125 150
Temperature (°C)
Temperature (°C)
Viref vs. Temperature
Vfb vs. Temperature
1.90
620
1.88
615
1.86
610
1.82
Vfb (mV)
Viref (V)
1.84
1.80
1.78
605
600
595
1.76
590
1.74
585
1.72
1.70
–50 –25
0
25
50
75 100 125 150
Temperature (°C)
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
580
–50 –25
0
25
50
75 100 125 150
Temperature (°C)
Page 23 of 25
R2J20751NP
Preliminary
Fsync vs. Temperature
Von vs. Temperature
440
2.70
430
2.65
420
2.60
Von (V)
Fct (kHz)
410
400
390
2.50
2.45
380
2.40
370
2.35
360
350
–50 –25
2.55
0
25
50
2.30
–50 –25
75 100 125 150
Temperature (°C)
0
25
50
75 100 125 150
Temperature (°C)
Fsw vs. CT
Voff vs. Temperature
10000
1.45
1.40
1.30
Fsw (kHz)
Voff (V)
1.35
1.25
1.20
1000
1.15
1.10
1.05
–50 –25
0
25
50
75 100 125 150
Temperature (°C)
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
100
10
100
1000
CT (pF)
Page 24 of 25
R2J20751NP
Preliminary
Package Dimensions
JEITA Package Code
—
RENESAS Code
PVQN0040KD-A
Previous Code
—
MASS[Typ.]
0.07
HD
D
D /2
2.250
)
HE/2
1.95
HE
E
1.95
1 pin indication
2.250
Reference Dimension in Millimeters
Symbol
0.375
0.750
X4
f S AB
Eject pin
20°
2.250
ZD
e
t S AB
(C0.3)
A
ZE
1.95
X4
40
40
1.95
E /2
Eject pin
B
1pin
2.250
39
1pin
2.250
y1 S
0.950
.1
4-C0.50
0.500
(0
B
2.100
4-
HD/2
b
x
20°
S AB
Lp
A1
A
A2
0.69
S
c2
L1
y S
Min Nom Max
D
— 6.00 —
— 6.00 —
E
—
A2
—
—
f
—
— 0.20
A
—
— 0.95
A1 0.005 —
—
b
0.17 0.22 0.27
e
— 0.50 —
Lp 0.40 0.50 0.60
x
—
— 0.05
y
—
— 0.05
y1
—
— 0.20
—
— 0.20
t
HD 6.15 6.20 6.25
HE 6.15 6.20 6.25
ZD
— 0.75 —
— 0.75 —
ZE
— 0.10 —
L1
Ordering Information
Part Name
R2J20751NP#G0
R07DS0240EJ0100 Rev.1.00
Jan 26, 2011
Quantity
2500 pcs
Shipping Container
Taping Reel
Page 25 of 25
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