Product Specification

Product Specification
Series: SMB7H 75Ω True 75TM SMB Jacks & Plugs
SMB7H-TH – Jack, Straight Orientation, PCB Terminated
SMB7H-CA– Plug, Straight Orientation, Cable Terminated
Other configurations available for:
Vertical and right angle cable-to-board applications
Through-hole, edge mount
Termination to various cable types
See www.samtec.com for more information.
Revision: A
Date: May 23, 2014
Page 1
© 2012 Samtec, Inc.
Product Specification
Series: SMB7H 75Ω True 75TM SMB Jacks & Plugs
1.0 SCOPE
1.1 This specification covers performance, testing and quality requirements for Samtec SMB7H Series. These
connectors are available in through-hole, surface mount, mixed technology and edge mount. All information
contained in this specification is for a right angle jack through-hole connector to a straight plug cable connector
unless otherwise noted.
2.0 DETAILED INFORMATION
2.1 Product prints, footprints, catalog pages, test reports and other specific, detailed information can be found at
http://www.samtec.com/rf/75-ohm/smb.aspx.
3.0 TESTING
3.1
ITEM
Terminal Orientation
Withstanding voltage
RG179
ST
RA
1000 DCV
3.2 Electrical:
ITEM
TEST CONDITION
REQUIREMENT
STATUS
Withstanding Voltage
EIA-364-20 (No Flashover,
Sparkover, or Breakdown)
See Section 3.1
Pass
Insulation Resistance
EIA-364-21 (5000 MΩ
minimum)
15,000 MΩ
Pass
Contact Resistance
(LLCR)
EIA-364-23
Δ 15 mΩ maximum
(Samtec defined)/ No damage
Pass
REQUIREMENT
STATUS
3.3 Mechanical:
ITEM
TEST CONDITION
Durability
EIA-364-09C
100 cycles (w/Env.) 1000 cycles
(w/o Env)
Pass
Random Vibration
EIA-364-28 Condition V, Letter B
7.56 G 'RMS', 50 to 2000 Hz, 2
hours per axis, 3 axis total , PSD
0.04
Visual Inspection: No Damage
LLCR: Δ 15 mΩ maximum
Event Detection: No interruption >
1.0 microsecond
Pass
Mechanical Shock
EIA-364-27 100 G, 6 milliseconds,
half sine, 12.3 ft/s, 3
shocks/direction, 3 axis (18 total
shocks)
Visual Inspection: No Damage
LLCR: Δ 15 mΩ maximum
Event Detection: No interruption >
1.0 microsecond
Pass
Normal Force
EIA-364-04
30 grams minimum for gold
interface
Pass
Revision: A
Date: May 23, 2014
Page 2
© 2012 Samtec, Inc.
Product Specification
Series: SMB7H 75Ω True 75TM SMB Jacks & Plugs
3.4 Environmental:
ITEM
REQUIREMENT
STATUS
Thermal Shock
EIA-364-32
Thermal Cycles: 100 (30 minute dwell)
Hot Temp: +85°C
Cold Temp: -55°C
Hot/Cold Transition: Immediate
Visual Inspection: No Damage
LLCR: Δ 15 mΩ
DWV: 825 VAC
IR: >15,000 MΩ
Pass
Thermal Aging
(Temp Life)
EIA-364-17
Test Condition 4 @ 105°C Condition B
for 250 hours
Visual Inspection: No Damage
LLCR: Δ 15 mΩ
DWV: 825 VAC
IR: >15,000 MΩ
Pass
Cyclic Humidity
EIA-364-31
Test Temp: +25°C to +65°C
Relative Humidity: 90 to 95%
Test Duration: 240 hours
Visual Inspection: No Damage
LLCR: Δ 15 mΩ
DWV: 825 VAC
IR: >15,000 MΩ
Pass
Gas Tight
EIA-364-36
Gas Exposure: Nitric Acid Vapor
Duration: 60 min.
Drying Temp.: 50°C +/- 3°C
Measurements: Within 1 hour of
Exposure
LLCR: Δ 15 mΩ
Pass
Revision: A
TEST CONDITION
Date: May 23, 2014
Page 3
© 2012 Samtec, Inc.
Product Specification
Series: SMB7H 75Ω True 75TM SMB Jacks & Plugs
4.0 MATED SYSTEM
4.1 Orientations
5.0 HIGH SPEED PERFORMANCE
5.1 Frequency Range:
Cable Type
SMB7H Orientation
Frequency Range
RG179
RA
ST
DC-4 GHz
DC-4 GHz
5.2 Impedance: 75 ohm
5.3 Rating: DC to 4 GHz
Revision: A
Date: May 23, 2014
Page 4
© 2012 Samtec, Inc.
Product Specification
Series: SMB7H 75Ω True 75TM SMB Jacks & Plugs
6.0 PROCESSING RECOMMENDATIONS
6.1 Maximum Reflow Passes: Versions of these connectors with surface mount features can withstand three reflow
passes at a maximum oven temperature of 260°C.
6.2 Stencil Thickness: The recommended stencil thickness is .006” (0,15 mm).
6.3 Placement: Manual placement of the parts is recommended.
6.4 Thermal Profile: Due to the large number of processing variables (printed wiring board design, reflow oven type,
component quantity, solder paste type, etc.), Samtec does not provide specific reflow profiles for any
connector. We recommend that the solder paste manufacturer’s guidelines be followed for optimum soldering
results.
6.5 Reflow Environment: Samtec recommends the use of a low level oxygen environment (typically achieved through
Nitrogen gas infusion) in the reflow process to improve solderability.
6.6 Cleaning: Samtec, Inc. has verified that our connectors may be cleaned in accordance with the solvents and
conditions designated in the EIA-364-11A standard.
7.0 APPLICATION INFORMATION
7.1 Min Cable Bend Radius: RG179 = .40” [10.2mm]
7.2 Assembly Mating: Snap-on coupling
7.3 Engagement force: 14 Lbs maximum
7.4 Disengagement force: 2 Lbs minimum
7.5 Mating Angle Requirements: Jacks/Plugs to be mated and unmated axially only. Zipper angles may
damage Jacks/Plugs.
7.5.1
7.5.2
7.6 Cable Management: Samtec recommends some form of cable management to prevent non-axial forces
being applied to the connector.
Revision: A
Date: May 23, 2014
Page 5
© 2012 Samtec, Inc.
Product Specification
Series: SMB7H 75Ω True 75TM SMB Jacks & Plugs
8.0 ADDITIONAL RESOURCES
8.1 For additional mechanical testing or product information, contact our Customer Engineering Support Group at
[email protected]
8.2 For additional information on high speed performance testing, contact our Signal Integrity Group at
[email protected]
8.3 For additional processing information, contact our Interconnect Processing Group at [email protected]
8.4 For RoHS, REACH or other environmental compliance information, contact our Product Environmental
Compliance Group at [email protected]
Revision: A
Date: May 23, 2014
Page 6
© 2012 Samtec, Inc.