SDF04N06 Green Product S a mHop Microelectronics C orp. Ver 1.2 N-Channel Enhancement Mode Field Effect Transistor FEATURES Super high dense cell design for low R DS(ON). PRODUCT SUMMARY V DSS ID 600V 4A R DS(ON) ( Ω) Max Rugged and reliable. 2.5 @ VGS=10V TO-220F Package. D G G D S STF SERIES TO-220F S ABSOLUTE MAXIMUM RATINGS ( T C=25 °C unless otherwise noted ) Symbol Parameter VDS VGS Drain-Source Voltage Gate-Source Voltage ID Drain Current-Continuous IDM EAS -Pulsed Avalanche Energy T C =25 °C T C =70 °C a b d a PD Maximum Power Dissipation TJ, TSTG Operating Junction and Storage Temperature Range TC=25°C TC=70°C THERMAL CHARACTERISTICS R JC Thermal Resistance, Junction-to-Case a R JA Thermal Resistance, Junction-to-Ambient a Details are subject to change without notice. Limit 600 ±30 Units 4 A 2.2 16 A A 90 mJ V V 21 W 13.3 W -55 to 150 °C 6 65 °C/W °C/W Apr,20,2010 1 www.samhop.com.tw SDF04N06 Ver 1.2 ELECTRICAL CHARACTERISTICS ( T A=25 °C unless otherwise noted ) 4 Symbol Parameter OFF CHARACTERISTICS Drain-Source Breakdown Voltage BVDSS Zero Gate Voltage Drain Current IDSS Gate-Body Leakage Current IGSS ON CHARACTERISTICS VGS(th) Gate Threshold Voltage RDS(ON) gFS Min VGS=0V , ID=250uA 600 Typ VGS= ±20V , VDS=0V Drain-Source On-State Resistance Forward Transconductance VDS=10V , ID=1.8A 2 Max Units 1 ±100 uA V VDS=480V , VGS=0V VDS=VGS , ID=250uA VGS=10V , ID=1.8A DYNAMIC CHARACTERISTICS CISS COSS CRSS Conditions 3 2 2.5 4 2.5 nA V ohm S c Input Capacitance Output Capacitance Reverse Transfer Capacitance SWITCHING CHARACTERISTICS VDS=25V,VGS=0V f=1.0MHz 650 67 11 pF pF pF 26.5 ns 15.5 ns 28 ns 13 ns c tD(ON) Turn-On Delay Time tr Rise Time tD(OFF) Turn-Off Delay Time tf Fall Time Qg Total Gate Charge VDS=300V,ID=1A,VGS=10V 12.5 nC Qgs Gate-Source Charge 2.6 nC Qgd Gate-Drain Charge VDS=300V,ID=1A, VGS=10V 5 nC VDD=300V ID=1A VGS=10V RGEN=6 ohm DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS IS Maximum Continuous Drain-Source Diode Forward Current VSD Diode Forward Voltage VGS=0V,IS=1A 0.765 1 A 1.4 V Notes _ 10sec. a.Surface Mounted on FR4 Board,t < _ 2%. _ 300us, Duty Cycle < b.Pulse Test:Pulse Width < c.Guaranteed by design, not subject to production testing. d.Starting TJ=25°C,L=5mH,VDD = 50V.(See Figure13) Apr,20,2010 2 www.samhop.com.tw SDF04N06 Ver 1.2 3.5 I D , Drain C urrent (A) ID , Drain C urrent(A) 6.0 VG S = 10V 4.8 3.6 VG S = 6V 2.4 VG S = 5V 1.2 1.4 8 6 4 2 0 12 10 1.2 2.4 3.6 4.8 7.2 6.0 V DS , Drain-to-S ource Voltage (V ) V G S , G ate-to-S ource Voltage (V ) F igure 1. Output C haracteris tics F igure 2. Trans fer C haracteris tics 3.0 R DS (ON) , On-R es is tance 6 5 4 3 V G S =10V 2 1 0 0.1 1.2 2.4 3.6 4.8 2.6 1.8 1.4 1.0 0 6.0 V G S =10V I D =1.8A 2.2 0 B V DS S , Normalized Drain-S ource B reakdown V oltage V DS =V G S I D =250uA 1.2 1.0 0.8 0.6 0.4 -25 0 25 50 75 100 125 150 F igure 4. On-R es is tance Variation with Drain C urrent and Temperature 1.6 0.2 -50 50 T j, J unction T emperature ( C ) F igure 3. On-R es is tance vs . Drain C urrent and G ate V oltage 1.4 25 T j( C ) I D , Drain C urrent (A) V th, Normalized G ate-S ource T hres hold V oltage 25 C -55 C 0 0 Ω) T j=125 C 2.1 0.7 0 R DS (on) ( 2.8 75 100 125 150 1.15 I D =250uA 1.10 1.05 1.00 0.95 0.90 0.85 -50 -25 0 25 50 75 100 125 150 T j, J unction T emperature ( C ) T j, J unction T emperature ( C ) F igure 5. G ate T hres hold V ariation with T emperature F igure 6. B reakdown V oltage V ariation with T emperature Apr,20,2010 3 www.samhop.com.tw SDF04N06 Ver 1.2 20.0 6 I D = 1.8A 4 Is , S ource-drain current (A) R DS (on) ( Ω ) 5 125 C 3 75 C 2 25 C 1 0 0 2 4 6 8 125 C 10.0 5.0 75 C 1.0 10 25 C 0 V G S , G ate- S ource Voltage (V ) 0.9 1.2 1.5 F igure 8. B ody Diode F orward V oltage V ariation with S ource C urrent 1200 V G S , G ate to S ource V oltage (V ) 10 1000 C , C apacitance (pF ) 0.6 V S D , B ody Diode F orward V oltage (V ) F igure 7. On-R es is tance vs . G ate-S ource V oltage 800 C is s 600 400 200 C os s C rs s 0 0 V DS =300V I D = 1A 8 6 4 2 0 10 20 40 30 50 0 V DS , Drain-to S ource Voltage (V ) 100 10 I D , Drain C urrent (A) 100 TD(on) Tr Tf 10 VDS=300V,ID=1A VGS=10V 10 1 RD 8 6 10 12 14 16 100 R g, G ate R es is tance ( Ω ) S (O L N) im 10 0u 1m s 10 s m DC s it 0.1 0.01 0.001 0.1 1 1 4 F igure 10. G ate C harge 300 TD(off ) 2 Qg, T otal G ate C harge (nC ) F igure 9. C apacitance S witching T ime (ns ) 0.3 VGS=10V Single Pulse TA=25 C 1 10 100 1000 V DS , Drain-S ource V oltage (V ) F igure 12. Maximum S afe O perating Area F igure 11.s witching characteris tics Apr,20,2010 4 www.samhop.com.tw SDF04N06 Ver 1.2 V ( BR )D S S 15V tp D R IVE R L VDS D .U .T RG + - VD D IA S A 20V tp 0.0 1 IAS Unclamped Inductive Test Circuit Unclamped Inductive Waveforms F igure 13a. F igure 13b. r(t),Normalized E ffective T ransient T hermal Impedance 2 1 D=0.5 0.2 0.1 0.05 0.1 P DM 0.02 t1 0.01 t2 S ingle P uls e 0.01 0.00001 0.0001 1. 2. 3. 4. 0.001 0.01 0.1 R J C (t)=r (t) * R J C R J C =S ee Datas heet T J M-T C = P * R J C (t ) Duty C ycle, D=t1/t2 1 10 S quare Wave P uls e Duration (ms ec) F igure 14. Normalized T hermal T rans ient Impedance C urve Apr,20,2010 5 www.samhop.com.tw SDF04N06 Ver 1.2 # ' F . % . . O H I # . D D E G J A A1 b b1 c c2 E L1 L2 L4 L5 O e f g h 4.80 2.85 1.05 1.50 0.80 3.10 10.30 3.80 7.50 16.40 14.50 3.20 2.55 1.30 1.90 3.40 3.80 2.70 2.10 4.20 1.95 0.56 0.90 0.55 2.50 9.70 3.20 6.90 15.60 13.50 Apr,20,2010 6 www.samhop.com.tw SDF04N06 Ver 1.2 F Tube Apr,20,2010 7 www.samhop.com.tw