MIC45116-1/2

MIC45116-1/2
20V/6A DC/DC Power Module
General Description
Features
Micrel’s MIC45116 is a synchronous step-down regulator
module, featuring a unique adaptive ON-time control
architecture. The module incorporates a DC/DC controller,
power MOSFETs, bootstrap diode, bootstrap capacitor,
and an inductor in a single package; simplifying the design
and layout process for the end user.
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This highly integrated solution expedites system design
and improves product time-to-market. The internal
MOSFETs and inductor are optimized to achieve high
efficiency at a low output voltage. The fully optimized
design can deliver up to 6A current under a wide input
voltage range of 4.75V to 20V without requiring additional
cooling.
The MIC45116-1 uses Micrel’s HyperLight Load® (HLL)
which maintains high efficiency under light load conditions
by transitioning to variable frequency, discontinuous-mode
operation. The MIC45116-2 uses Micrel’s Hyper Speed
Control® architecture which enables ultra-fast load
transient response, allowing for a reduction of output
capacitance. The MIC45116 offers 1% output accuracy
that can be adjusted from 0.8V to 85% of the input (PVIN)
with two external resistors. Additional features include
thermal-shutdown protection, adjustable current limit, and
short-circuit protection. The MIC45116 allows for safe
start-up into a pre-biased output.
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Up to 6A output current
>93% peak efficiency
Output voltage: 0.8V to 85% of input with ±1% accuracy
Fixed 600kHz switching frequency
Enable input and open-drain power good output
Hyper Speed Control (MIC45116-2) architecture
enables fast transient response
HyperLight Load (MIC45116-1) improves light load
efficiency
Supports safe start-up into pre-biased output
–40°C to +125°C junction temperature range
Thermal-shutdown protection
Short-circuit protection with hiccup mode
Adjustable current limit
Available in 52-pin 8mm × 8mm × 3mm QFN package
Applications
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High power density point-of-load conversion
Servers, routers, Networking, and base stations
FPGAs, DSP, and low-voltage ASIC power supplies
Industrial and medical equipment
Datasheets and support documentation are available on
Micrel’s web site at: www.micrel.com.
Typical Application
Efficiency vs. Output Current
(VIN = 12V) MIC45116-1
100
5.0V
3.3V
2.5V
1.8V
1.5V
1.2V
1.0V
0.8V
90
EFFICIENCY (%)
80
70
60
50
40
30
20
Fsw = 600kHz
10
0
1
2
3
4
5
6
7
8
OUTPUT CURRENT (A)
Hyper Speed Control and HyperLight Load are registered trademarks of Micrel, Inc.
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
June 10, 2015
Revision 1.0
Micrel, Inc.
MIC45116
Ordering Information
Switching
Frequency
Features
Junction Temperature
Range
Package
Lead
Finish
MIC45116-1YMP
600kHz
HyperLight Load
–40°C to +125°C
52-pin
8mm × 8mm × 3mm
QFN
Pb-Free
MIC45116-2YMP
600kHz
Hyper Speed Control
–40°C to +125°C
52-pin
8mm × 8mm × 3mm
QFN
Pb-Free
Part Number
Pin Configuration
52-Pin 8mm × 8mm × 3mm QFN
(Top View)
June 10, 2015
2
Revision 1.0
Micrel, Inc.
MIC45116
Pin Description
Pin Number
Pin Name
1, 2, 52
PVIN
Power Input Voltage. Connection to the drain of the internal high side power MOSFET. Connect
an input capacitor from PVIN to PGND.
4, 44
PVDD
Supply input for the internal power MOSFET drivers. Connect PVDD pins together. Do not leave
floating.
5, 6
BST
Connection to the internal bootstrap circuitry and high-side power MOSFET drive circuitry.
Connect the two BST pins together.
8-10, 48-51
SW
The SW pin connects directly to the switch node. Due to the high-speed switching on this pin, the
SW pin should be routed away from sensitive nodes. The SW pin also senses the current by
monitoring the voltage across the low-side MOSFET during OFF time.
12 - 21
VOUT
23-25, 27- 30,
32-34, 40, 41
NC
26, 31, 35, 42,
45
PGND
36
FB
Feedback. Input to the transconductance amplifier of the control loop. The FB pin is referenced to
0.8V. A resistor divider connecting the feedback to the output is used to set the desired output
voltage. Connect the bottom resistor from FB to system ground. External ripple injection (series R
and C) can be connected between FB and SW.
37
PG
Power Good. Open-Drain Output. If used, connect to an external pull-up resistor of at least 10kΩ
between PG and the external bias voltage.
38
EN
Enable. A logic signal to enable or disable the step-down regulator module operation. The EN pin
is TTL/CMOS compatible. Logic-high = enable, logic-low = disable or shutdown. EN pin has an
internal 1MΩ (typical) pull-down resistor to GND. Do not leave floating.
39
VIN
Input for the internal linear regulator. Allows for split supplies to be used when there is an external
bus voltage available. Connect to PVIN for single supply operation. Bypass with a 0.1µF capacitor
from VIN to PGND.
43
5VDD
47
ILIM
3, 7, 11, 22, 46
KEEPOUT
–
VOUT ePAD
–
SW ePAD
SW Exposed Pad. Internally connected to SW pins. Please see PCB Layout Recommendations
section.
–
PGND ePAD
PGND Exposed Pads. Please see PCB Layout Recommendations section for the connection to
the system Ground.
June 10, 2015
Pin Function
Output Voltage. Connected to the internal inductor, the output capacitor should be connected
from this pin to PGND as close to the module as possible.
Not internally connected.
Power Ground. PGND is the return path for the step-down power module power stage. The
PGND pin connects to the source of internal low-side power MOSFET, the negative terminals of
input capacitors, and the negative terminals of output capacitors. Signal Ground and Power
Ground of MIC45116 are internally connected.
Internal +5V Linear Regulator Output. Powered by VIN, 5VDD is the internal supply bus for the
device. In the applications with VIN<+5.5V, 5VDD should be tied to VIN to by-pass the linear
regulator.
Current Limit. Connect a resistor between ILIM and SW to program the current limit.
Depopulated pin positions.
VOUT Exposed Pad. Internally connected to VOUT pins. Please see PCB Layout
Recommendations section.
3
Revision 1.0
Micrel, Inc.
MIC45116
Operating Ratings(2)
Supply Voltage (VPVIN, VVIN) ............................ 4.75V to 20V
Output Current ................................................................. 6A
Enable Input (VEN) .................................................. 0V to VIN
Power Good (VPG) ............................................. 0V to 5VDD
Junction Temperature (TJ) ........................ –40°C to +125°C
Junction Thermal Resistance(3)
8mm × 8mm × 3mm QFN-52 (θJA) .......................... 22°C/W
8mm × 8mm × 3mm QFN-52 (θJC) ......................... 5.0°C/W
Absolute Maximum Ratings(1)
VPVIN, VVIN to PGND ....................................... –0.3V to +30V
VPVDD, V5VDD to PGND ..................................... –0.3V to +6V
VSW, VILIM, VEN to PGND ....................... –0.3V to (VIN +0.3V)
VBST to VSW ........................................................ –0.3V to 6V
VBST to PGND .................................................. –0.3V to 36V
VPG to PGND .................................. –0.3V to (5VDD + 0.3V)
VFB to PGND................................... –0.3V to (5VDD + 0.3V)
PGND to GND .............................................. –0.3V to +0.3V
Junction Temperature .............................................. +150°C
Storage Temperature (TS) ......................... –65°C to +150°C
Lead Temperature (soldering, 10s) ............................ 260°C
ESD Rating(4) ................................................. ESD Sensitive
Electrical Characteristics(5)
VIN = VEN = 12V, VOUT = 3.3V, VBST − VSW = 5V, TJ = +25ºC. Bold values indicate −40ºC < TJ < +125ºC, unless otherwise noted.
Parameter
Condition
Min.
Typ.
Max.
Units
20
V
0.75
mA
Power Supply Input
Input Voltage Range
(VPVIN, VIN)
4.75
Quiescent Supply
Current (MIC45116-1)
VFB = 1.5V
0.35
Quiescent Supply
Current (MIC45116-2)
VFB = 1.5V
1.03
mA
Operating Current
VPVIN = VIN = 12V, VOUT = 1.8V, IOUT = 0A
(MIC45116-2)
29.4
mA
Shutdown Supply
Current
VEN = 0V
5.3
10
µA
5VDD Output
5VDD Output Voltage
VIN = 7V to 20V, I5VDD = 10mA
4.8
5.2
5.4
V
5VDD UVLO Threshold
V5VDD rising
3.8
4.2
4.6
V
5VDD UVLO Hysteresis
V5VDD falling
5VDD Load Regulation
I5VDD = 0 to 40mA
400
mV
0.6
2
3.6
%
Reference
Feedback Reference
Voltage
TJ = 25°C
0.792
0.8
0.808
−40°C ≤ TJ ≤ 125°C
0.784
0.8
0.816
FB Bias Current
VFB = 0.8V
5
500
V
nA
Notes:
1. Exceeding the absolute maximum rating may damage the device.
2. The device is not guaranteed to function outside operating range.
3. θJA and θJC were measured using the MIC45116 evaluation board.
4. Devices are ESD sensitive. Handling precautions recommended.
5. Specification for packaged product only.
June 10, 2015
4
Revision 1.0
Micrel, Inc.
MIC45116
Electrical Characteristics(5) (Continued)
VIN = VEN = 12V, VOUT = 3.3V, VBST − VSW = 5V, TJ = +25ºC. Bold values indicate −40ºC < TJ < +125ºC, unless otherwise noted.
Parameter
Condition
Min.
Typ.
Max.
Units
Enable Control
1.8
EN Logic Level High
V
0.6
EN Logic Level Low
EN Hysteresis
EN Bias Current
200
VEN = 12V
V
mV
5
10
µA
600
750
kHz
Oscillator
Switching Frequency
400
IOUT = 2A
Maximum Duty Cycle
Minimum Duty Cycle
VFB = 1V
Minimum Off-Time
140
85
%
0
%
250
350
ns
Soft-Start
Soft-Start Time
FB from 0V to 0.8V
3.3
ms
Short-Circuit Protection
Current-Limit Threshold
VFB = 0.79V
−30
−14
0
mV
Short-Circuit Threshold
VFB = 0V
−23
−7
9
mV
Current-Limit Source Current
VFB = 0.79V
60
80
100
µA
Short-Circuit Source Current
VFB = 0V
25
35
45
µA
PG Threshold Voltage
Sweep VFB from Low-to-High
85
88
95
% VFB
PG Hysteresis
Sweep VFB from High-to-Low
6
% VFB
PG Delay Time
Sweep VFB from Low-to-High
80
µs
PG Low Voltage
VFB < 90% × VNOM, IPG = 1mA
60
TJ Rising
160
°C
15
°C
Power Good (PG)
200
mV
Thermal Protection
Overtemperature Shutdown
Overtemperature Shutdown Hysteresis
June 10, 2015
5
Revision 1.0
Micrel, Inc.
MIC45116
Typical Characteristics
10.0
30
0.48
0.36
0.24
0.12
VIN = 12V
VOUT = 1.8V
IOUT = 0A
0.00
VIN =12V
VEN = 0V
IOUT = 0A
25
20
15
10
-25
0
25
50
75
100
125
6.0
4.0
-25
0
25
50
75
100
-50
125
0.80
VIN = 12V
VOUT = 1.8V
IOUT = 0A
0.76
0
25
50
75
100
630
600
570
-25
VDD UVLO Threshold
vs. Temperature
0
25
50
75
100
Falling
3.0
2.0
Hyst
0.0
-25
0
25
50
75
TEMPERATURE (°C)
June 10, 2015
4
VIN =12V
VOUT = 1.8V
RLIM = 1.37kΩ
0
125
-50
-25
100
125
25
50
75
100
125
EN Bias Current
vs. Temperature
10.0
1.60
Rising
1.20
Falling
0.80
0.40
0
TEMPERATURE (°C)
EN BIAS CURRENT (µA)
ENABLE THRESHOLD (V)
4.0
-50
6
2
2.00
1.0
8
Enable Threshold
vs. Temperature
Rising
125
10
TEMPERATURE (°C)
TEMPERATURE (°C)
5.0
100
12
VIN = 12V
VOUT = 1.8V
IOUT = 2A
540
-50
125
75
14
660
510
0.74
50
16
CURRENT LIMIT (A)
SWITCHING FREQUENCY (kHz)
0.82
25
Output Current Limit
vs. Temperature
690
0.84
0
TEMPERATURE (°C)
Switching Frequency
vs. Temperature
0.86
-25
-25
TEMPERATURE (°C)
Feedback Voltage
vs. Temperature
-50
VIN = 12V
IOUT = 0A
0.0
-50
TEMPERATURE (°C)
0.78
8.0
2.0
5
0
-50
FEEBACK VOLTAGE (V)
VDD VOLTAGE (V)
SHUTDOWN CURRENT (µA)
SUPPLY CURRENT (mA)
0.60
VDD THRESHOLD (V)
VDD Voltage
vs. Temperature
VIN Shutdown Current
vs. Temperature
VIN Operating Supply Current
vs. Temperature (MIC45116-1)
VIN = 12V
VOUT = 1.8V
8.0
6.0
4.0
VIN = 12V
2.0
VOUT = 1.8V
IOUT = 0A
0.0
0.00
-50
-25
0
25
50
75
TEMPERATURE (°C)
6
100
125
-50
-25
0
25
50
75
100
125
TEMPERATURE (°C)
Revision 1.0
Micrel, Inc.
MIC45116
Typical Characteristics (Continued)
Load Regulation vs.
Temperature (MIC45116-1)
Output Voltage vs.
Temperature (MIC45116-1)
1.84
1.82
1.80
1.78
VIN = 12V
VOUT = 1.8V
IOUT = 0A
1.76
3.0%
2.0%
2.5%
1.5%
2.0%
1.5%
1.0%
VIN = 12V
VOUT = 1.8V
IOUT = 0A to 6A
0.5%
1.74
-25
0
25
50
75
100
125
-25
0
50
100
75
125
-50
50
40
Room Temperature
No Air Flow
70
40
10
4
5
6
7
Room Temperature
No Air Flow
30
20
2
3
4
5
6
7
40
Room Temperature
No Air Flow
70
3
4
5
6
OUTPUT CURRENT (A)
June 10, 2015
7
8
3
4
5
6
7
8
5.0VOUT
3.3VOUT
2.5VOUT
1.8VOUT
1.5VOUT
1.2VOUT
1.0VOUT
0.8VOUT
90
80
50
40
Room Temperature
No Air Flow
70
60
50
40
Room Temperature
No Air Flow
30
20
10
10
10
2
Efficiency (VIN = 18V)
vs. Output Current (MIC45116-2)
60
30
20
2
1
OUTPUT CURRENT (A)
20
1
Room Temperature
No Air Flow
0
EFFICIENCY (%)
50
0
40
100
80
60
30
50
8
5.0VOUT
3.3VOUT
2.5VOUT
1.8VOUT
1.5VOUT
1.2VOUT
1.0VOUT
0.8VOUT
90
EFFICIENCY (%)
70
60
30
100
80
70
Efficiency (VIN = 12V)
vs. Output Current (MIC45116-2)
3.3V
3.3VOUT
out
2.5V
2.5VOUT
out
1.8V
1.8VOUT
out
1.5V
1.5VOUT
out
1.2V
1.2VOUT
out
1.0V
1.0VOUT
out
0.8V
0.8VOUT
out
90
5.0VOUT
3.3VOUT
2.5VOUT
1.8VOUT
1.5VOUT
1.2VOUT
1.0VOUT
0.8VOUT
OUTPUT CURRENT (A)
100
125
10
1
OUTPUT CURRENT (A)
Efficiency (VIN =5V)
vs. Output Current (MIC4516-2)
100
20
0
8
75
80
50
10
50
90
60
20
25
100
5.0VOUT
3.3VOUT
2.5VOUT
1.8VOUT
1.5VOUT
1.2VOUT
1.0VOUT
0.8VOUT
80
60
0
Efficiency (VIN = 18V)
vs. Output Current
EFFICIENCY (%)
70
3
-25
TEMPERATURE (°C)
90
EFFICIENCY (%)
80
EFFICIENCY (%)
25
100
3.3VOUT
3.3V
2.5VOUT
2.5V
1.8VOUT
1.8V
1.5VOUT
1.5V
1.2VOUT
1.2V
1.0VOUT
1.0V
0.8VOUT
0.8V
90
2
VIN = 5V to 20V
VOUT = 1.8V
IOUT = 2A
Efficiency (VIN = 12V)
vs. Output Current (MIC45116-1)
100
1
0.0%
TEMPERATURE (°C)
Efficiency (VIN = 5V)
vs. Output Current (MIC45116-1)
0
0.5%
-1.0%
-50
TEMPERATURE (°C)
30
1.0%
-0.5%
0.0%
-50
EFFICIENCY (%)
LINE REGULATION (%)
LOAD REGULATION (%)
OUTPUT VOLTAGE (V)
1.86
Line Regulation vs.
Temperature (MIC45116-1)
0
1
2
3
4
5
6
OUTPUT CURRENT (A)
7
7
8
0
1
2
3
4
5
6
7
8
OUTPUT CURRENT (A)
Revision 1.0
Micrel, Inc.
MIC45116
Typical Characteristics (Continued)
Power Dissipation (VIN =12V)
vs. Output Current (MIC45116-1)
Power Dissipation (VIN =5V)
vs. Output Current (MIC45116-1)
3.0
3.3VOUT
2.5VOUT
1.8VOUT
1.5VOUT
1.2VOUT
1.0VOUT
0.8VOUT
1.6
1.4
2.4
1.2
1
0.8
Room Temperature
No Air Flow
0.6
0.4
2.1
1.8
1.2
0.9
0.3
0
0.0
1
2
3
4
5
6
7
Room Temperature
No Air Flow
0.6
2
3
4
5
6
0
1
0.8
Room Temperature
No Air Flow
2.1
1.8
0.9
0.3
0.0
3
4
5
6
7
Room Temperature
No Air Flow
1
2
3
4
5
6
7
OUTPUT VOLTAGE (V)
0.2%
0.0%
-0.2%
-0.4%
VIN = 5V to 20V
VOUT = 1.8V
2
3
4
5
OUTPUT CURRENT (A)
1.5
1.2
Room Temperature
No Air Flow
0.9
0
1
2
1.84
1.82
1.80
1.78
1.76
6
3
4
5
6
7
8
Switching Frequency
vs. Output Current (MIC45116-1)
VIN = 12V
VOUT = 1.8V
1.72
1
1.8
700
1.74
-1.0%
0
2.1
OUTPUT CURRENT (A)
1.86
-0.8%
2.4
8
1.88
-0.6%
2.7
Output Voltage vs.
Output Current (MIC45116-1)
0.4%
8
0.0
Line Regulation vs.
Output Current (MIC45116-1)
0.6%
7
5.0VOUT
3.3VOUT
2.5VOUT
1.8VOUT
1.5VOUT
1.2VOUT
1.0VOUT
0.8VOUT
OUTPUT CURRENT (A)
0.8%
6
0.3
OUTPUT CURRENT (A)
1.0%
5
0.6
0
8
4
3.0
1.2
0
3
3.3
1.5
0.2
2
2
3.6
5.0VOUT
3.3VOUT
2.5VOUT
1.8VOUT
1.5VOUT
1.2VOUT
1.0VOUT
0.8VOUT
0.6
0.4
1
1
Power Dissipation (VIN =18V)
vs. Output Current (MIC45116-2)
POWER LOSS (W)
1.2
0
Room Temperature
No Air Flow
0.9
OUTPUT CURRENT (A)
2.4
1.4
0.6
1.2
8
7
2.7
POWER LOSS (W)
POWER LOSS (W)
1.6
1.5
0.0
1
3.0
1.8
1.8
Power Dissipation (VIN =12V)
vs. Output Current (MIC45116-2)
3.3VOUT
2.5VOUT
1.8VOUT
1.5VOUT
1.2VOUT
1.0VOUT
0.8VOUT
2
2.1
OUTPUT CURRENT (A)
Power Dissipation (VIN = 5V)
vs. Output Current (MIC45116-2)
2.2
2.4
0.3
OUTPUT CURRENT (A)
2.4
2.7
0.6
0
8
5.0VOUT
3.3VOUT
2.5VOUT
1.8VOUT
1.5VOUT
1.2VOUT
1.0VOUT
0.8VOUT
3.0
1.5
0.2
0
3.3
SWITCHING FREQUENCY (kHz)
POWER LOSS (W)
1.8
3.6
5.0VOUT
3.3VOUT
2.5VOUT
1.8VOUT
1.5VOUT
1.2VOUT
1.0VOUT
0.8VOUT
2.7
POWER LOSS (W)
2
POWER LOSS (W)
2.2
LINE REGULATION (%)
Power Dissipation (VIN =18V)
vs. Output Current (MIC45116-1)
0
1
2
3
4
OUTPUT CURRENT (A)
5
6
600
500
400
300
200
VIN = 12V
VOUT = 1.8V
100
0
0
1
2
3
4
5
6
OUTPUT CURRENT (A)
Typical Characteristics (Continued)
June 10, 2015
8
Revision 1.0
Micrel, Inc.
MIC45116
Line Regulation
vs. Output Current (MIC45116-2)
1.0%
Output Voltage
vs. Output Current (MIC45116-2)
0.8%
720
0.4%
0.2%
0.0%
-0.2%
-0.4%
-0.6%
VIN = 5V to 20V
VOUT = 1.8V
-0.8%
1.84
1.82
1.80
1.78
1.76
1
2
3
4
5
OUTPUT CURRENT (A)
VIN = 12V
VOUT = 1.8V
1.74
-1.0%
0
SWITCHING FREQUENCY (kHz)
1.86
0.6%
OUTPUT VOLTAGE (V)
LINE REGULATION (%)
Switching Frequency
vs. Output Current (MIC45116-2)
1.88
1.72
6
0
1
2
3
4
5
0.82
0.80
0.78
VOUT = 1.8V
IOUT = 0A
0.74
1.6%
1.4%
1.2%
1.0%
0.8%
0.6%
0.4%
0.2%
0.0%
VOUT = 1.8V
IOUT = 0A to 6A
2
3
4
5
6
Switching Frequency
vs. Input Voltage (MIC45116-1)
5
8
Feedback Voltage
vs. Input Voltage (MIC45116-2)
11
14
INPUT VOLTAGE (V)
17
700
650
600
550
VOUT = 1.8V
IOUT = 2A
500
450
400
-0.4%
20
INPUT VOLTAGE (V)
5
20
8
11
14
17
20
INPUT VOLTAGE (V)
Switching Frequency
vs. Input Voltage (MIC45116-2)
Output Regulation
vs. Input Voltage (MIC45116-2)
0.86
0.82
0.80
0.78
VOUT = 1.8V
IOUT = 0A
0.76
0.74
SWITCHING FREQUENCY (kHz)
690
0.84
TOTAL REGULATION (%)
FEEDBACK VOLTAGE (V)
1
750
-0.2%
17
VIN = 12V
VOUT = 1.8V
540
OUTPUT CURRENT (A)
SWITCHING FREQUENCY (kHz)
TOTAL REGULATION (%)
FEEDBACK VOLTAGE (V)
0.84
14
570
0
1.8%
11
600
510
6
2.0%
8
630
Output Regulation
vs. Input Voltage (MIC45116-1)
0.86
5
660
OUTPUT CURRENT (A)
Feedback Voltage
vs. Input Voltage (MIC45116-1)
0.76
690
VOUT = 1.8V
IOUT = 0A to 6A
1.6%
1.1%
0.6%
0.1%
-0.4%
5
8
11
14
INPUT VOLTAGE (V)
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17
20
5
8
11
14
INPUT VOLTAGE (V)
9
17
20
660
VOUT = 1.8V
IOUT = 0A
630
600
570
540
510
480
5
8
11
14
17
20
INPUT VOLTAGE (V)
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MIC45116
Typical Characteristics (Continued)
Enable Threshold
vs. Input Voltage
20.0
2.0
16.0
1.6
ENABLE THRESHOLD (V)
ENABLE INPUT CURRENT (µA)
Enable Input Current
vs. Input Voltage
12.0
8.0
4.0
VEN= VIN
IOUT = 0A
Rising
1.2
Falling
0.8
0.4
VOUT = 1.8V
0.0
0.0
5
8
11
14
INPUT VOLTAGE (V)
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17
20
5
8
11
14
17
20
INPUT VOLTAGE (V)
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MIC45116
Functional Characteristics
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MIC45116
Functional Characteristics (Continued)
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MIC45116
Functional Characteristics (Continued)
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MIC45116
Functional Characteristics (Continued)
Control Loop Frequency Response
30
200
15
VIN=12V
VOUT = 1.8V
IOUT = 6A
BW=76 kHz
PM=79º
10
Magnitude
150
MAGNITUDE (db)
25
20
Phase
5
0
100
PHASE (º)
250
-5
-10
50
-15
-20
0
1
10
100
FREQUENCY (kHz)
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MIC45116
Functional Diagram
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MIC45116
OFF-time period determined by the feedback voltage is
less than the minimum OFF-time tOFF(MIN), which is about
250ns, the MIC45116 control logic will apply the tOFF(MIN)
instead. tOFF(MIN) is required to maintain enough energy in
the internal boost capacitor (CBST) to drive the high-side
MOSFET.
Functional Description
The MIC45116 is an adaptive on-time synchronous buck
regulator module built for high-input voltage to low-output
voltage conversion applications. The MIC45116 is
designed to operate over a wide input voltage range,
from 4.75V to 20V, and the output is adjustable with an
external resistor divider. An adaptive ON-time control
scheme is employed to obtain a constant switching
frequency in steady state and to simplify the control
compensation. Hiccup mode over-current protection is
implemented by sensing low-side MOSFET’s RDS(ON). The
device features internal soft-start, enable, UVLO, and
thermal shutdown. The module has integrated switching
FETs, inductor, bootstrap diode, and bypass capacitors.
The maximum duty cycle is obtained from the 250ns
tOFF(MIN):
DMAX =
t S − t OFF(MIN)
tS
= 1−
250ns
tS
Eq. 2
Where:
tS = 1/fSW. It is not recommended to use MIC45116 with
an OFF-time close to tOFF(MIN) during steady-state
operation.
Theory of Operation
Figure 1, in association with Equation 1, shows the output
voltage is sensed by the MIC45116 feedback pin (FB) via
the voltage divider RFB1 and RFB2 and compared to a 0.8V
reference voltage (VREF) at the error comparator through
a low-gain transconductance (gm) amplifier. If the
feedback voltage decreases, and the amplifier output falls
below 0.8V, then the error comparator will trigger the
control logic and generate an ON-time period. The ONtime period length is predetermined by the “Fixed tON
Estimator” circuitry:
The adaptive ON-time control scheme results in a
constant switching frequency in the MIC45116 during
steady state operation. The actual ON-time and resulting
switching frequency will vary with the different rising and
falling times of the MOSFETs. Also, the minimum tON
results in a lower switching frequency in high VIN to VOUT
applications. During load transients, the switching
frequency is changed due to the varying OFF-time.
To illustrate the control loop operation, we will analyze
both the steady-state and load transient scenarios. For
easy analysis, the gain of the gm amplifier is assumed to
be 1. With this assumption, the inverting input of the error
comparator is the same as the feedback voltage.
Figure 2 shows the MIC45116 control loop timing during
steady-state operation. During steady-state, the gm
amplifier senses the feedback voltage ripple, which is
proportional to the output voltage ripple plus injected
voltage ripple, to trigger the ON-time period. The ON-time
is predetermined by the tON estimator. The termination of
the OFF-time is controlled by the feedback voltage. At the
valley of the feedback voltage ripple, which occurs when
VFB falls below VREF, the OFF period ends and the next
ON-time period is triggered through the control logic
circuitry.
Figure 1. Output Voltage Sense via FB Pin
t ON(ESTIMATED) =
VOUT
VIN × fSW
Eq. 1
Where VOUT is the output voltage, VIN is the power stage
input voltage, and fSW is the switching frequency.
At the end of the ON-time period, the internal high-side
driver turns off the high-side MOSFET and the low-side
driver turns on the low-side MOSFET. The OFF-time
period length depends upon the feedback voltage in most
cases. When the feedback voltage decreases and the
output of the gm amplifier falls below 0.8V, the ON-time
period is triggered and the OFF-time period ends. If the
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MIC45116
Unlike true current-mode control, the MIC45116 uses the
output voltage ripple to trigger an ON-time period. The
output voltage ripple is proportional to the inductor
current ripple if the ESR of the output capacitor is large
enough.
In order to meet the stability requirements, the MIC45116
feedback voltage ripple should be in phase with the
inductor current ripple and is large enough to be sensed
by the gm amplifier and the error comparator. The
recommended feedback voltage ripple is 20mV~100mV
over full input voltage range. If a low ESR output
capacitor is selected, then the feedback voltage ripple
may be too small to be sensed by the gm amplifier and
the error comparator. Also, the output voltage ripple and
the feedback voltage ripple are not necessarily in phase
with the inductor current ripple if the ESR of the output
capacitor is very low. In these cases, ripple injection is
required to ensure proper operation. Please refer to
“Ripple Injection” subsection in the Application
Information section for more details about the ripple
injection technique.
Figure 2. MIC45116 Control Loop Timing
Figure 3 shows the operation of the MIC45116 during a
load transient. The output voltage drops due to the
sudden load increase, which causes the VFB to be less
than VREF. This will cause the error comparator to trigger
an ON-time period. At the end of the ON-time period, a
minimum OFF-time tOFF(MIN) is generated to charge the
bootstrap capacitor (CBST) since the feedback voltage is
still below VREF. Then, the next ON-time period is
triggered due to the low feedback voltage. Therefore, the
switching frequency changes during the load transient,
but returns to the nominal fixed frequency once the
output has stabilized at the new load current level. With
the varying duty cycle and switching frequency, the
output recovery time is fast and the output voltage
deviation is small. Note that the instantaneous switching
frequency during load transient remains bounded and
cannot increase arbitrarily. The minimum period is limited
by tON + tOFF(MIN) .Since the variation in VOUT is relatively
limited during load transient, tON stays virtually close to its
steady-state value.
Discontinuous Mode (MIC45116-1 only)
In continuous mode, the inductor current is always
greater than zero; however, at light loads, the MIC451161 is able to force the inductor current to operate in
discontinuous mode. Discontinuous mode is where the
inductor current falls to zero, as indicated by trace (IL)
shown in Figure 4. During this period, the efficiency is
optimized by shutting down all the non-essential circuits
and minimizing the supply current as the switching
frequency is reduced. The MIC45116-1 wakes up and
turns on the high-side MOSFET when the feedback
voltage VFB drops below 0.8V.
The MIC45116-1 has a zero crossing comparator (ZC)
that monitors the inductor current by sensing the voltage
drop across the low-side MOSFET during its ON-time. If
the VFB > 0.8V and the inductor current goes slightly
negative, then the MIC45116-1 automatically powers
down most of the IC circuitry and goes into a low-power
mode.
Once the MIC45116-1 goes into discontinuous mode,
both DL and DH are low, which turns off the high-side
and low-side MOSFETs. The load current is supplied by
the output capacitors and VOUT drops. If the drop of VOUT
causes VFB to go below VREF, then all the circuits will
wake up into normal continuous mode. First, the bias
currents of most circuits reduced during the
discontinuous mode are restored, and then a tON pulse is
triggered before the drivers are turned on to avoid any
possible glitches. Finally, the high-side driver is turned
on. Figure 4 shows the control loop timing in
discontinuous mode.
Figure 3. MIC45116 Load Transient Response
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MIC45116
created by R26 and C16 should be much less than the
minimum off time.
Figure 5. MIC45116 Current-Limiting Circuit
Figure 4. MIC45116-1 Control Loop Timing
(Discontinuous Mode)
The VCL drop allows short-limit programming based on
the value of the resistor (R26). If the absolute value of the
voltage drop on the bottom FET becomes greater than
VCL, and the VILIM falls below PGND, an overcurrent is
triggered causing the IC to enter hiccup mode. The
hiccup sequence including the soft-start reduces the
stress on the switching FETs and protects the load and
supply for severe short conditions.
During discontinuous mode, the bias current of most
circuits is substantially reduced. As a result, the total
power supply current during discontinuous mode is only
about 350µA, allowing the MIC45116-1 to achieve high
efficiency in light load applications.
Soft-Start
Soft-start reduces the input power supply surge current at
startup by controlling the output voltage rise time. The
input surge appears while the output capacitor is charged
up.
The short-circuit current limit can be programmed by
using Equation 3.
R26 =
The MIC45116 implements an internal digital soft-start by
making the 0.8V reference voltage VREF ramp from 0 to
100% in about 3ms with 9.7mV steps. Therefore, the
output voltage is controlled to increase slowly by a staircase VFB ramp. Once the soft-start cycle ends, the related
circuitry is disabled to reduce current consumption.
PVDD must be powered up at the same time or after VIN
to make the soft-start function correctly.
Eq. 3
ICL
Where:
ICLIM = Desired current limit
RDS(ON) = On-resistance of low-side power MOSFET,
16mΩ typically.
VCL = Current-limit threshold (typical absolute value is
14mV per the Electrical Characteristics table).
Current Limit
The MIC45116 uses the RDS(ON) of the low-side MOSFET
and external resistor connected from ILIM pin to SW
node to set the current limit.
ICL = Current-limit source current (typical value is 80µA,
per the Electrical Characteristics table).
ΔIL(PP) = Inductor current peak-to-peak, since the inductor
is integrated use Equation 4 to calculate the inductor
ripple current.
In each switching cycle of the MIC45116, the inductor
current is sensed by monitoring the low-side MOSFET in
the OFF period. The sensed voltage VILIM is compared
with the power ground (PGND) after a blanking time of
150ns. In this way the drop voltage over the resistor R26
(VCL) is compared with the drop over the bottom FET
generating the short current limit. The small capacitor
(C16) connected from ILIM pin to PGND filters the
switching node ringing during the off-time allowing a
better short-limit measurement. The time constant
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(ICLIM + ΔIL (PP ) × 0.5 - 0.1) × RDS(ON) + VCL
The peak-to-peak inductor current ripple is:
∆IL(PP) =
18
VOUT × (VIN(max) − VOUT )
VIN(max) × fsw × L
Eq. 4
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Micrel, Inc.
MIC45116
The MIC45116 has a 1.0µH inductor integrated into the
module. In case of a hard short, the short limit is folded
down to allow an indefinite hard short on the output
without any destructive effect. It is mandatory to make
sure that the inductor current used to charge the output
capacitance during soft-start is under the folded short
limit; otherwise the supply will go in hiccup mode and
may not finish the soft-start successfully.
With R26 = 1.62kΩ and C16 = 15pF, the typical output
current limit is 8A.
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MIC45116
subsection in the Application Information section for more
details.
Application Information
Output Capacitor Selection
The type of the output capacitor is usually determined by
the application and its equivalent series resistance
(ESR). Voltage and RMS current capability are two other
important factors for selecting the output capacitor.
Recommended capacitor types are MLCC, OS-CON and
POSCAP. The output capacitor’s ESR is usually the main
cause of the output ripple. The MIC45116 requires ripple
injection and the output capacitor ESR affects the control
loop from a stability point of view.
The output capacitor RMS current is calculated in
Equation 7:
ICOUT (RMS) =
Eq. 5
ΔVOUT(PP) = Peak-to-peak output voltage ripple
ΔIL(PP) = Peak-to-peak inductor current ripple
The input capacitor must be rated for the input current
ripple. The RMS value of input capacitor current is
determined at the maximum output current. Assuming the
peak-to-peak inductor current ripple is low:
The total output ripple is a combination of the ESR and
output capacitance. The total ripple is calculated in
Equation 6:
2
ΔVOUT(PP)
(
Eq. 8
Input Capacitor Selection
The input capacitor for the power stage input PVIN
should be selected for ripple current rating and voltage
rating.
Where:
ΔIL(PP)


 + ΔIL(PP) × ESR C
= 
OUT

 C OUT × fSW × 8 
Eq. 7
2
PDISS(COUT ) = ICOUT (RMS) × ESR COUT
ΔVOUT(PP)
ΔIL(PP)
12
The power dissipated in the output capacitor is:
Equation 5 shows how the maximum value of ESR is
calculated.
ESR COUT ≤
ΔIL(PP)
ICIN(RMS) ≈ IOUT(MAX) × D × (1 − D)
)
2
Eq. 9
The power dissipated in the input capacitor is:
Eq. 6
PDISS(CIN) = ICIN(RMS) 2 × ESR CIN
Where:
Eq. 10
D = Duty cycle
COUT = Output capacitance value
The general rule is to pick the capacitor with a ripple
current rating equal to or greater than the calculated
worst-case RMS capacitor current.
fsw = Switching frequency
Equation 11 should be used to calculate the input
capacitor. Also it is recommended to keep some margin
on the calculated value:
As described in the “Theory of Operation” subsection in
the Functional Description, the MIC45116 requires at
least 20mV peak-to-peak ripple at the FB pin to make the
gm amplifier and the error comparator behave properly.
Also, the output voltage ripple should be in phase with
the inductor current. Therefore, the output voltage ripple
caused by the output capacitors value should be much
smaller than the ripple caused by the output capacitor
ESR. If low-ESR capacitors, such as ceramic capacitors,
are selected as the output capacitors, a ripple injection
method should be applied to provide enough feedback
voltage ripple. Please refer to “Ripple Injection”
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CIN ≈
IOUT(MAX) × (1 − D)
fSW × dV
Eq. 11
Where:
dV = The input ripple
fSW = Switching frequency
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MIC45116
Output Voltage Setting Components
The MIC45116 requires two resistors to set the output
voltage as shown in Figure 6.
Table 1. VOUT Programming Resistor Look-Up
VOUT
OPEN
0.8V
40.2kΩ
1.0V
20kΩ
1.2V
11.5kΩ
1.5V
8.06kΩ
1.8V
4.75kΩ
2.5V
3.24kΩ
3.3V
1.91kΩ
5.0V
Ripple Injection
The VFB ripple required for proper operation of the
MIC45116 gm amplifier and error comparator is 20mV to
100mV. However, the output voltage ripple is generally
too small to provide enough ripple amplitude at the FB
pin and this issue is more visible in lower output voltage
applications. If the feedback voltage ripple is so small that
the gm amplifier and error comparator cannot sense it,
then the MIC45116 will lose control and the output
voltage is not regulated. In order to have some amount of
VFB ripple, a ripple injection method is applied for low
output voltage ripple applications.
Figure 6. Voltage-Divider Configuration
The output voltage is determined by Equation 12:


R
VOUT = VFB ×  1 + FB1 
R FB2 

RFB2
The applications are divided into three situations
according to the amount of the feedback voltage ripple:
Eq. 12
1. Enough ripple at the feedback voltage due to the
large ESR of the output capacitors:
Where:
As shown in Figure 7, the converter is stable without
any ripple injection.
VFB = 0.8V
A typical value of RFB1 used on the standard evaluation
board is 10kΩ. If RFB1 is too large, it may allow noise to
be introduced into the voltage feedback loop. If RFB1 is
too small in value, it will decrease the efficiency of the
power supply, especially at light loads. Once RFB1 is
selected, RFB2 can be calculated using Equation 13:
R FB2 =
VFB × R FB1
VOUT − VFB
Eq. 13
For fixed RFB1 = 10kΩ, output voltage can be selected by
RFB2. Table 1 provides RFB2 values for some common
output voltages.
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Figure 7. Enough Ripple at FB from ESR
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MIC45116
The feedback voltage ripple is:
ΔVFB(PP) =
R FB2
× ESR C OUT × ΔIL(PP) Eq. 14
R FB1 + R FB2
K div =
R FB1//R FB2
R INJ + R FB1//R FB2
Where:
Where:
ΔIL(PP) = The peak-to-peak value of the inductor current
ripple
VIN = Power stage input voltage
Eq. 17
D = Duty cycle
fSW = Switching frequency
2. Inadequate ripple at the feedback voltage due to the
small ESR of the output capacitors.
τ = (RFB1//RFB2//RINJ) × CFF
The output voltage ripple is fed into the FB pin
through a feedforward capacitor (CFF) in this situation,
as shown in Figure 8. The typical CFF value is
between 1nF and 100nF. With the feedforward
capacitor, the feedback voltage ripple is very close to
the output voltage ripple:
ΔVFB(PP) = ESR COUT × ΔIL(PP)
RINJ= 20kΩ
CINJ = 0.1µF
In Equations 17 and 18, it is assumed that the time
constant associated with CFF must be much greater than
the switching period:
Eq. 15
1
T
= << 1
fSW × τ τ
Eq. 18
If the voltage divider resistors RFB1 and RFB2 are in the kΩ
range, then a CFF of 1nF to 100nF can easily satisfy the
large time constant requirements.
Figure 8. Inadequate Ripple at FB pin
3. Virtually no ripple at the FB pin voltage due to the
very-low ESR of the output capacitors, such is the
case with ceramic output capacitor.
In this case, the VFB ripple waveform needs to be
generated by injecting suitable signal. A series RC
network between SW pin and FB pin, RINJ and CINJ as
shown in Figure 9 injects a square-wave current
waveform into FB pin, which by means of integration
across the capacitor (CFF) generates an appropriate
sawtooth FB ripple waveform.
Figure 9. External Ripple Injection Circuit at FB Pin
The injected ripple is:
ΔVFB(PP) = VIN × K div × D × (1 - D) ×
1
fSW × τ
Eq. 16
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MIC45116
Thermal Measurements and Safe Operating Area
(SOA)
Measuring the IC’s case temperature is recommended to
ensure it is within its operating limits. Although this might
seem like a very elementary task, it is easy to get
erroneous results. The most common mistake is to use
the standard thermal couple that comes with a thermal
meter. This thermal couple wire gauge is large, typically
22 gauge, and behaves like a heatsink, resulting in a
lower case measurement.
Two methods of temperature measurement are using a
smaller thermal couple wire or an infrared thermometer. If
a thermal couple wire is used, it must be constructed of
36-gauge wire or higher (smaller wire size) to minimize
the wire heat-sinking effect. In addition, the thermal
couple tip must be covered in either thermal grease or
thermal glue to make sure that the thermal couple
junction is making good contact with the case of the IC.
Omega brand thermal couple (5SC-TT-K-36-36) is
adequate for most applications.
Figure 10. MIC45116 Power Derating vs. Output Voltage
with 12V input with no Airflow
Wherever possible, an infrared thermometer is
recommended. The measurement spot size of most
infrared thermometers is too large for an accurate
reading on a small form factor ICs. However, an IR
thermometer from Optris has a 1mm spot size, which
makes it a good choice for measuring the hottest point on
the case. An optional stand makes it easy to hold the
beam on the IC for long periods of time.
The safe operating area (SOA) of the MIC45116 is shown
in Figure 10 and Figure 11. These thermal
measurements were taken on MIC45116 evaluation
board with no air flow. Since the MIC45116 is an entire
system comprised of switching regulator controller,
MOSFETs and inductor, the part needs to be considered
as a system. The SOA curves will give guidance to
reasonable use of the MIC45116.
SOA curves should only be used as a point of reference.
SOA data was acquired using the MIC45116 evaluation
board. Thermal performance depends on the PCB layout,
board size, copper thickness, number of thermal vias,
and actual airflow.
June 10, 2015
Figure 11. MIC45116 Power Derating vs. Input Voltage with
1.0V output with no Airflow
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MIC45116
•
PCB Layout Guidelines
Warning: To minimize EMI and output noise, follow
these layout recommendations.
PCB layout is critical to achieve reliable, stable and
efficient performance. A ground plane is required to
control EMI and minimize the inductance in power, signal
and return paths.
Follow the instructions in Package Information and
Recommended Landing Pattern to connect the
Ground exposed pads to system ground planes.
Input Capacitor
Figure 12 is optimized from a small form factor point of
view shows top and bottom layer of a four layer PCB. It is
recommended to use mid layer 1 as a continuous ground
plane.
•
Place the input capacitors on the same side of the
board and as close to the module as possible.
•
Place several vias to the ground plane close to the
input capacitor ground terminal.
•
Use either X7R or X5R dielectric input capacitors. Do
not use Y5V or Z5U type capacitors.
•
Do not replace the ceramic input capacitor with any
other type of capacitor. Any type of capacitor can be
placed in parallel with the ceramic input capacitor.
•
If a non-ceramic input capacitor is placed in parallel
with the input capacitor, it must be recommended for
switching regulator applications and the operating
voltage.
•
In “Hot-Plug” applications, an electrolytic bypass
capacitor must be used to limit the over-voltage spike
seen on the input supply with power is suddenly
applied. If hot-plugging is the normal operation of the
system, using an appropriate hot-swap IC is
recommended.
RC Snubber (Optional)
•
Depending on the operating conditions, a RC
snubber can be used. Place the RC and as close to
the SW pin as possible if needed. Placement of
Snunbber on the same side as Module is preferred.
SW Node
• Do not route any digital lines underneath or close to
the SW node.
• Keep the switch node (SW) away from the feedback
(FB) pin.
Output Capacitor
•
Use a wide trace to connect the output capacitor
ground terminal to the input capacitor ground
terminal.
•
Phase margin will change as the output capacitor
value and ESR changes.
•
The feedback trace should be separate from the
power trace and connected as close as possible to
the output capacitor. Sensing a long high-current load
trace can degrade the DC load regulation.
Figure 12. Top and Bottom Layer of a Four-Layer Board
The following guidelines should be followed to ensure
proper operation of the MIC45116 module:
Module
•
Place the module close to the point-of-load (POL).
•
Use wide polygons to route the input and output
power lines.
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MIC45116
PCB Layout Recommendations
Top − Copper Layer 1
Copper Layer 2
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MIC45116
PCB Layout Recommendations (Continued)
Copper Layer 3
Bottom − Copper Layer 4
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MIC45116
Simplified PCB Design Recommendations
Periphery I/O Pad Layout and Large Pad for Exposed
Heatsink
The board design should begin with copper/metal pads
that sit beneath the periphery leads of a mounted QFN.
The board pads should extend outside the QFN package
edge a distance of approximately 0.20mm per side:
After completion of the periphery pad design, the larger
exposed pads will be designed to create the mounting
surface of the QFN exposed heatsink. The primary transfer
of heat out of the QFN will be directly through the bottom
surface of the exposed heatsink. To aid in the transfer of
generated heat into the PCB, the use of an array of plated
through-hole vias beneath the mounted part is
recommended. The typical via hole diameter is 0.30mm to
0.35mm, with center-to-center pitch of 0.80mm to 1.20mm.
Total pad length = 8.00mm + (0.20mm per side × 2 sides)
= 8.40mm
Note:
Exposed metal trace is “mirror image” of package bottom view.
Package Bottom View vs. PCB Recommended Exposed Metal Trace
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MIC45116
Solder Paste Stencil Design (Recommend Stencil
Thickness = 112.5 ±12.5µm)
The solder stencil aperture openings should be smaller
than the periphery or large PCB exposed pads to reduce
any chance of build-up of excess solder at the large
exposed pad area which can result to solder bridging.
The suggested reduction of the stencil aperture opening is
typically 0.20mm smaller than exposed metal trace.
Note: A critical requirement is to not duplicate land pattern
of the exposed metal trace as solder stencil opening as the
design and dimension values are different.
Note:
Cyan-colored shaded pad indicate exposed trace keep out area.
Solder Stencil Opening
Stack-Up of Pad Layout and Solder Paste Stencil
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Micrel, Inc.
MIC45116
Evaluation Board Schematic
Bill of Materials
Item
C4
Part Number
B41125A5337M
Manufacturer
(6)
TDK
C2, C3, C8, C9,
C7, C17
Description
Qty.
330µF/25V, ALE Capacitor (optional)
1
Open
6
10uF/25V, 1206, X5R, 20%, MLCC
1
0.1µF/50V, X7R, 0603, 10%, MLCC
5
100µF/6.3V, X5R, 1206, 20%, MLCC
1
C1
C3216X5R1E106M085AC
TDK
C13, C14, C15,
C5, C10
GRM188R71H104KA93D
Murata
C6
C3216X5R0J107M160AB
TDK
C12
C1608C0G1H102J080AA
TDK
1.0nF/50V, NP0, 0603, 5%, MLCC
1
C16
GRM1885C1H150JA01D
Murata
15pF/50V, NP0, 0603, 5%, MLCC
1
CON1, CON2,
CON3, CON4
8191
15A, 4-Prong Through-Hole Screw Terminal
4
(7)
Keystone(8)
Notes:
6. TDK: www.TDK.com.
7. Murata: www.murata.com.
8. Keystone: www.keyelco.com.
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Revision 1.0
Micrel, Inc.
MIC45116
Bill of Materials (Continued)
Item
Part Number
Manufacturer
(9)
J1
M50-3500742
Harwin
J2, J3, TP3 −
TP5
90120-0122
Molex
R4
CRCW0603100K0FKEA
(10)
Vishay Dale(11)
R21, R1
Description
Qty.
Header 2x7
1
Header 2
5
100kΩ, 1%, 1/10W, 0603, Thick Film
1
Open
2
R55
CRCW060340K2FKEA
Vishay Dale
40.2kΩ, 1%, 1/10W, 0603, Thick Film
1
R31, R50
CRCW060320K0FKEA
Vishay Dale
20kΩ, 1%, 1/10W, 0603, Thick Film
2
R32
CRCW060311K5FKEA
Vishay Dale
11.5kΩ, 1%, 1/10W, 0603, Thick Film
1
R49
CRCW06038K06FKEA
Vishay Dale
8.06kΩ, 1%, 1/10W, 0603, Thick Film
1
R52
CRCW06034K75FKEA
Vishay Dale
4.75kΩ, 1%, 1/10W, 0603, Thick Film
1
R53
CRCW06033K24FKEA
Vishay Dale
3.24kΩ, 1%, 1/10W, 0603, Thick Film
1
R54
CRCW06031K91FKEA
Vishay Dale
1.91kΩ, 1%, 1/10W, 0603, Thick Film
1
R2
CRCW060349K9FKEA
Vishay Dale
49.9kΩ, 1%, 1/10W, 0603, Thick Film
1
R51
CRCW060310K0FKEA
Vishay Dale
10kΩ, 1%, 1/10W, 0603, Thick Film
1
R26
CRCW06031K62FKEA
Vishay Dale
1.62kΩ, 1%, 1/10W, 0603, Thick Film
1
R3, R12
RCG06030000Z0EA
Vishay Dale
0Ω Resistor, 1%, 1/10W, 0603, Thick Film
2
TP6 − TP9, A, B
1502-2
Single-End, Through-Hole Terminal
6
20V/6A DC/DC Power Module
1
U1
MIC45116-1YMP
MIC45116-2YMP
Keystone
Micrel, Inc.(12)
Notes:
9. Harwin: http://www.harwin.com.
10. Molex: www.molex.com.
11. Vishay-Dale: www.vishay.com.
12. Micrel, Inc: www.micrel.com.
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30
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Micrel, Inc.
MIC45116
Package Information and Recommended Landing Pattern(13)
52-Pin 8mm × 8mm QFN (MP)
Note:
13. Package information is correct as of the publication date. For updates and most current information, go to www.micrel.com.
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31
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Micrel, Inc.
MIC45116
Package Information and Recommended Landing Pattern(13) (Continued)
June 10, 2015
32
Revision 1.0
Micrel, Inc.
MIC45116
Package Information and Recommended Landing Pattern(13) (Continued)
June 10, 2015
33
Revision 1.0
Micrel, Inc.
MIC45116
Thermally-Enhanced Landing Pattern
June 10, 2015
34
Revision 1.0
Micrel, Inc.
MIC45116
Thermally Enhanced Landing Pattern (Continued)
June 10, 2015
35
Revision 1.0
Micrel, Inc.
MIC45116
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com
Micrel, Inc. is a leading global manufacturer of IC solutions for the worldwide high performance linear and power, LAN, and timing & communications
markets. The Company’s products include advanced mixed-signal, analog & power semiconductors; high-performance communication, clock
management, MEMs-based clock oscillators & crystal-less clock generators, Ethernet switches, and physical layer transceiver ICs. Company
customers include leading manufacturers of enterprise, consumer, industrial, mobile, telecommunications, automotive, and computer products.
Corporation headquarters and state-of-the-art wafer fabrication facilities are located in San Jose, CA, with regional sales and support offices and
advanced technology design centers situated throughout the Americas, Europe, and Asia. Additionally, the Company maintains an extensive network
of distributors and reps worldwide.
Micrel makes no representations or warranties with respect to the accuracy or completeness of the information furnished in this datasheet. This
information is not intended as a warranty and Micrel does not assume responsibility for its use. Micrel reserves the right to change circuitry,
specifications and descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual
property rights is granted by this document. Except as provided in Micrel’s terms and conditions of sale for such products, Micrel assumes no liability
whatsoever, and Micrel disclaims any express or implied warranty relating to the sale and/or use of Micrel products including liability or warranties
relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product
can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical
implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A
Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully
indemnify Micrel for any damages resulting from such use or sale.
© 2015 Micrel, Incorporated.
June 10, 2015
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