Schottky Barrier Diode RB162M-40 Applications General rectification Dimensions(Unit : mm) Land size figure(Unit : mm) 0.85 1.2 3.05 Features 1)Small power mold type.(PMDU) 2)Low IR 3)High reliability PMDU Construction Silicon epitaxial planer Structure Taping specifications(Unit : mm) Absolute maximum ratings (Ta=25C) Parameter Reverse voltage (repetitive) Reverse voltage (DC) Average rectified forward current (*1) Forward current surge peak (60Hz / 1cyc) Junction temperature Storage temperature φ1.0±0.1 Limits Symbol VRM VR Io IFSM Tj Tstg 3.71±0.1 8.0±0.2 φ1.55±0.05 4.0±0.1 1.81±0.1 0.25±0.05 1.75±0.1 2.0±0.05 3.5±0.05 4.0±0.1 1.5MAX Unit V V A A 40 40 1 30 150 -40to+150 C C (*1)Mounting on epoxi board. (Tc=100°C MAX ) Electrical characteristics(Ta=25C) Parameter Min. Typ. Max. Unit Forward voltage Symbol VF - - 0.55 V Reverse current IR - - 100 μA www.rohm.com ©2010 ROHM Co., Ltd. All rights reserved. 1/3 Conditions IF=1A VR=40V 2010.02 - Rev.A RB162M-40 Data Sheet Electrical characteristics curves Ta=150C 10000 1000 REVERSE CURRENT : IR(A) Ta=125C 100 Ta=-25C Ta=25C 10 Ta=75C Ta=125C Ta=75C 100 10 Ta=25C 1 Ta=-25C 0.1 0.01 0.001 1 0 0 100 200 300 400 500 FORWARD VOLTAGE : V F(mV) VF-IF CHARACTERISTICS 20 40 520 AVE : 517.1mV AVE:349.9mV Ta=25C VR=40V n=30pcs 8 7 6 5 4 AVE : 2.0A 3 2 1 0 0 Ifsm RESERVE RECOVERY TIME : trr(ns) 200 1cyc 150 8.3ms 100 AVE : 68.8A 20 15 10 5 AVE : 7.8ns AVE : 10.2ns 25C 0 1 10 TIME : t(ms) IFSM-t CHARACTERISTICS www.rohm.com ©2010 ROHM Co., Ltd. All rights reserved. 100 35 180 AVE : 181.3pF 170 160 1000 Ifsm 8.3ms 8.3ms 1cyc 100 10 1 10 NUMBER OF CYCLES IFSM-CYCLE CHARACTERISTICS 1 IF=0.5A D=1/2 0.9 Rth(j-a) 100 100 On glass-epoxy board 1ms DC 0.8 tim FORWARD POWER DISSIPATION : Pf(W) 50 TRANSIENT THAERMAL IMPEDANCE : Rth (C/W) PEAK SURGE FORWARD CURRENT : IFSM(A) 100 30 190 80C IM=10mA t 25 Ct DISPERSION MAP Ta=25,80C IF=0.5A IR=1A Irr=0.25*IR n=20pcs 25 1000 Ifsm 20 Ta=25C f=1MHz n=20pcs trr DISPERSION MAP 150 15 30 IFSM DISPERSION MAP 200 10 200 0 0 5 210 IR DISPERSION MAP VF DISPERSION MAP 50 CAPACITANCE BETWEEN TERMINALS : Ct(pF) 530 510 1 220 9 REVERSE CURRENT : IR(A) 540 10 REVERSE VOLTAGE : VR(V) VR-Ct CHARACTERISTICS 10 Ta=25℃ Ta=25C IF=1A IF=1.0A n=30pcs n=30pcs 500 PEAK SURGE FORWARD CURRENT : IFSM(A) 30 100 REVERSE VOLTAGE : VR(V) VR-IR CHARACTERISTICS 550 FORWARD VOLTAGE : VF(mV) 10 f=1MHz 600 PEAK SURGE FORWARD CURRENT : IFSM(A) FORWARD CURRENT : IF(mA) Ta=150C 1000 CAPACITANCE BETWEEN TERMINALS : Ct(pF) 1000 300s Rth(j-c) 10 1 0.7 0.6 Sin(=180) 0.5 0.4 0.3 0.2 0.1 0.1 0.001 0 0.01 0.1 1 10 100 TIME : t(s) Rth-t CHARACTERISTICS 2/3 1000 0 0.5 1 1.5 2 AVERAGE RECTIFIED FORWARD CURRENT : Io(A) Io-Pf CHARACTERISTICS 2010.02 - Rev.A Data Sheet Io 0A 0.2 0V 2 AVERAGE RECTIFIED FORWARD CURRENT : Io(A) REVERSE POWER DISSIPATION : PR (W) 0.15 0.1 D=1/2 DC 0.05 Sin(=180) T D=t/T VR=20V Tj=150C 1.5 D=1/2 1 Sin(=180) 0.5 2 VR t DC AVERAGE RECTIFIED FORWARD CURRENT : Io(A) RB162M-40 0A Io 0V VR t DC T D=t/T VR=20V Tj=150C 1.5 D=1/2 1 Sin(=180) 0.5 On glass-epoxy board On glass-epoxy board 0 0 0 0 10 20 30 REVERSE VOLTAGE : V R(V) VR-PR CHARACTERISTICS 40 0 25 50 75 100 125 AMBIENT TEMPERATURE : Ta(C) Derating Curve"(Io-Ta) 150 0 25 50 75 100 125 150 CASE TEMPARATURE : Tc(C) Derating Curve"(Io-Tc) 30 ELECTROSTATIC DISCHARGE TEST ESD(KV) No break at 30kV 25 20 15 10 5 AVE : 6.2kV 0 C=200pF R=0 C=100pF R=1.5k ESD DISPERSION MAP www.rohm.com ©2010 ROHM Co., Ltd. All rights reserved. 3/3 2010.02 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. 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