PL502-00 Multiplier VCXO IC Die for 12 to 25MHz Parallel Resonant Crystals FEATURES DIE CONFIGURATION • • • • • 23 il m 2 XOUT 6 BLOCK DIAGRAM XIN VCXO Selectable PLL VCON CLK 19 18 13 CLK 10 GND 29 C502B DESCRIPTION The PL502-00 is a monolithic low jitter and low phase noise (-125dBc @10kHz offset and 155.52MHz output), high performance CMOS VCXO IC Die, that uses a low cost crystal (12-25MHz). The same die can be used as a VCXO with output frequencies ranging from F XIN x 1 to F XIN x 8 using selector pad bonding options (see Multiplier Selection Table on this page). This makes the PL502-00 ideal for a wide range of applications from 12MHz to 190MHz (including 27MHz, 35.328MHz, 77.76MHz and 155.52MHz, etc.). 20 21 (1550,1475) Die ID: 3737-37 27 XIN S2V 25 D D V S1V • D D V ^ E O S0V 65 mil Integrated voltage-controlled crystal oscillator circuitry (VCXO) (pull range 500ppm minimum). Low phase noise (-125dBc @ 10kHz offset and 155.52MHz output) Selectable frequency multipliers (x1, x2, x4, x8). 3.3V supply voltage. Uses inexpensive fundamental-mode parallel resonant crystals (from 12 to 25MHz). Selectable High Drive (30mA) or Standard Drive (10mA) output. Available in DIE (65 mil x 62 mil). • VCON 31 7 Y D N G (0,0) X Note: ^ denotes internal pull up V denotes internal pull down MULTIPLIER SELECTION SELECTION S2 S1 S0 0 0 0 0 0 1 0 1 0 0 1 1 1 1 1 0 0 1 1 1 0 1 0 1 F XIN CLK (MHz) F XIN x 2 F XIN x 4 F XIN x 1 12MHz – 25MHz F XIN x 2* F XIN x 8 F XIN x 1* F XIN x 4* F XIN x 8* Note: - Selector pads default to ‘0’, wire bond to VDD to set to ‘1’ - (*) High-drive output PAD DESCRIPTION DIE SPECIFICATIONS Name Value Size 65 x 62 mil Reverse side Pad dimensions Thickness GND 80 micron x 80 micron 8 mil Name Number Description XIN 27 Crystal input connection. XOUT 29 Crystal output connection. VCON 31 Voltage Control Input. GND 7,10 CLK 13 S[0:2] 18,19,20 VDD 21,23 OE 25 Ground. Clock Output. Frequency selection pads 3.3V Power Supply. Output Enable: ‘0’ to disable (tri-state output), ‘1’ (default value when not connected) to enabled the output. 2880 Zanker Road, San Jose, CA 95134 Tel (408) 571-1668 Fax (408) 571-1688 www.phaselink.com Rev 4/27/11 Page 1 PL502-00 Multiplier VCXO IC Die for 12 to 25MHz Parallel Resonant Crystals ELECTRICAL SPECIFICATIONS 1. Absolute Maximum Ratings PARAMETERS SYMBOL Supply Voltage Input Voltage, dc Output Voltage, dc V DD VI VO Storage Temperature Ambient Operating Temperature* Junction Temperature Lead Temperature (soldering, 10s) ESD Protection, Human Body Model TS TA TJ MIN. MAX. UNITS -0.5 -0.5 4.6 V DD +0.5 V DD +0.5 V V V 150 85 125 260 2 °C °C °C °C kV -65 -40 Exposure of the device under conditions beyond the limits specified by Maximum Ratings for extended periods may cause permanent damage to the device and affect product reliability. These conditions represent a stress rating only, and functional operations of the device at these or any other conditions above the operational limits noted in this specification is not implied. * Note: Operating Temperature is guaranteed by design for all parts (COMMERCIAL and INDUSTRIAL), but tested for COMMERCIAL grade only. 2. DC Electrical Specifications PARAMETERS Supply Current, Dynamic, with Loaded Outputs Operating Voltage Output drive current (High Drive) Output drive current (Standard Drive) VCXO Control Voltage SYMBOL I DD V DD I OH I OL I OH I OL VCON CONDITIONS MIN. TYP. F XIN = 12 - 25MHz Output load of 10pF V OH = V DD -0.4V, V DD =3.3V V OL = 0.4V, V DD = 3.3V V OH = V DD -0.4V, V DD =3.3V V OL = 0.4V, V DD = 3.3V 2.97 30 30 10 10 0 MAX. UNITS 35 mA 3.63 V mA mA mA 3.3 mA V MAX. UNITS 25 MHz 3. AC Electrical Specifications PARAMETERS Input Crystal Frequency Output Clock Rise/Fall Time (Standard Drive) Output Clock Rise/Fall Time (High Drive) Output Clock Duty Cycle SYMBOL CONDITIONS MIN. TYP. 12 0.3V ~ 3.0V with 15 pF load 3.0 0.3V ~ 3.0V with 15 pF load 1.2 ns Measured @ 50% V DD 45 50 55 2880 Zanker Road, San Jose, CA 95134 Tel (408) 571-1668 Fax (408) 571-1688 www.phaselink.com Rev 11/29/11 Page 2 % PL502-00 Multiplier VCXO IC Die for 12 to 25MHz Parallel Resonant Crystals 4. Voltage Control Crystal Oscillator PARAMETERS VCXO Stabilization Time * SYMBOL T VCXOSTB VCXO Tuning Range CLK output pullability VCXO Tuning Characteristic Pull range linearity VCON pin input impedance VCON modulation BW CONDITIONS From power valid F XIN = 12 – 25MHz; XTAL C 0 /C 1 < 250 0V ≤ VCON ≤ 3.3V VCON=1.65V, ±1.65V MIN. TYP. MAX. UNITS 10 ms 500 ppm 150 ppm ppm/V % ±200 10 0V ≤ VCON ≤ 3.3V, -3dB 2000 10 kΩ kHz Note: Parameters denoted with an asterisk (*) represent nominal characterization data and are not production tested to any specific limits. 5. Crystal Specifications PARAMETERS Crystal Resonator Frequency Crystal Loading Rating Crystal Pullability Recommended ESR SYMBOL CONDITIONS MIN. F XIN C L (xtal) Parallel Fundamental Mode At VCON = 1.65V 12 C 0 /C 1 (xtal) RE TYP. MAX. UNITS 25 MHz pF 250 30 - 9.5 AT cut AT cut Ω Note: Crystal Loading rating: 9.5pF is the loading the crystal sees from the VCXO chip at VCON = 1.65V. It is assumed that the crystal will be at nominal frequency at this load. If the crystal requires more load to be at nominal frequency, the additional load must be added externally. This however may reduce the pull range. 6. Jitter and Phase Noise specification* PARAMETERS RMS Period Jitter (1 sigma – 1000 samples) Phase Noise relative to carrier Carrier Frequency 44MHz Phase Noise relative to carrier Carrier Frequency 155.52MHz CONDITIONS at 155MHz, with capacitive decoupling between VDD and GND. @100Hz offset @1kHz offset @10kHz offset @100kHz offset @1MHz offset @100Hz offset @1kHz offset @10kHz offset @100kHz offset @1MHz offset @10MHz offset @40MHz offset MIN. TYP. MAX. UNITS 20 ps -113 -130 -135 -128 -128 -100 -115 -125 -116 -114 -132 -142 dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz * General condition: Control Voltage is 0V. 2880 Zanker Road, San Jose, CA 95134 Tel (408) 571-1668 Fax (408) 571-1688 www.phaselink.com Rev 11/29/11 Page 3 PL502-00 Multiplier VCXO IC Die for 12 to 25MHz Parallel Resonant Crystals PAD ASSIGNMENT Pad # Name X (µ µ m) Y (µ µ m) Description 7 10 13 GND GND CLK 1042 1400 1400 109 259 716 Ground. Ground. CMOS Clock Output. 18 S2 1232 1365 Used to select multiplication factor and Standard or High-Drive output. Internal pull down. 19 S1 1042 1365 Used to select multiplication factor and Standard or High-Drive output. Internal pull down. 20 S0 854 1365 Used to select multiplication factor and Standard or High-Drive output. Internal pull down. 21 23 25 27 29 VDD VDD OE XIN XOUT 659 459 194 109 109 1365 1365 1365 1017 646 3.3V Power Supply. 3.3V Power Supply. Used to Enable/Disable the output. Internal pull up. See Crystal input. See Crystal Specifications on page 3. Crystal output. See Crystal Specifications on page 3. 31 VCON 109 181 Voltage Control Input. 0V to 3.3V. ORDERING INFORMATION For part ordering, please contact our Sales Department: 2880 Zanker Road, San Jose, CA 95134 Tel (408) 571-1668 Fax (408) 571-1688 PART NUMBER The order number for this device is a combination of the following: Device number, Package type and Operating temperature range PL502-00 D C TEMPERATURE C=COMMERCIAL I=INDUSTRAL PART NUMBER PACKAGE TYPE D=DIE W=SAW WAFER IN BLUE TAPE Order Number Marking Package Option PL502-00DC N/A Die (Waffle Pack) PhaseLink Corporation, reserves the right to make changes in its products or specifications, or both at any time without notice. The information furnished by Phaselink is believed to be accurate and reliable. However, PhaseLink makes no guarantee or warranty concerning the accuracy of said information and shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon this product. LIFE SUPPORT POLICY: PhaseLink’s products are not authorized for use as critical components in life support devices or systems without the express written approval of the President of PhaseLink Corporation. 2880 Zanker Road, San Jose, CA 95134 Tel (408) 571-1668 Fax (408) 571-1688 www.phaselink.com Rev 11/29/11 Page 4