FMBT3906DW1

Formosa MS
Dual PNP Epitaxial Planar Transistor
FMBT3906DW1
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2,3
Switching time equivalent test circuits................................................ 4
Rating and characteristic curves........................................................ 4, 5, 6
Pinning information........................................................................... 7
Marking........................................................................................... 7
Suggested solder pad layout............................................................. 7
Packing information.......................................................................... 8
Reel packing.................................................................................... 9
Suggested thermal profiles for soldering processes............................. 9
High reliability test capabilities.......................................................... 10
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TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 1
DS-231113
Issued Date
Revised Date
2008/02/10
2010/03/10
Revision
Page.
B
10
Formosa MS
Dual PNP Epitaxial Planar Transistor
FMBT3906DW1
200mA Silicon PNP Epitaxial Planar
Transistor
Package outline
SOT-363
Features
.087(2.20)
.079(2.00)
• High collector-emitterbreakdien voltage.
(BV CEO = -40V@I C=-1.0mA)
.018(0.46)
.010(0.26)
•
•
•
•
stauration voltage, is designed for general purpose
amflifier and switching applications at collector current.
Offer PNP+ PNP in one package
recommended
Capable of 150mW power dissipation.
Lead-free parts for green partner, exceeds environmental
standards of MIL-STD-19500 /228
Suffix "-H" indicates Halogen-free part, ex.FMBT3906DW1-H
.087(2.20)
.079(2.00)
• Small load switch transistor with high gain and low
.053(1.35)
.045(1.15)
.026(0.65)Typ. .010(0.25)
.003(0.08)
.014(0.35)
.006(0.15)
.004(0.10)
Max.
.043(1.10)
.035(0.90)
Mechanical data
.016(0.40)
.012(0.30)
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, SOT-363
• Terminals : Solder plated, solderable per
Dimensions in inches and (millimeters)
MIL-STD-750, Method 2026
3
• Polarity : See Diagram
• Mounting Position : Any
• Weight : Approximated 0.006 gram
2
Q
1
Q
4
5
6
Maximum ratings (AT T =25 C unless otherwise noted)
o
A
PARAMETER
CONDITIONS
Symbol
MIN.
TYP.
MAX. UNIT
Collector-Base voltage
V CBO
-40
V
Collector-Emitter voltage
V CEO
-40
V
Emitter-Base voltage
V EBO
-5.0
V
Collector current
IC
-200
mA
Total device dissipation FR-5 board T A = 25 OC
(1)
PD
150
mW
Thermal resistance
R θJA
833
Junction to ambient
Operating temperature
Storage temperature
TJ
-55
+150
T STG
-65
+150
O
C/W
o
C
1.FR-5 = 1.0 X 0.75 X0.062 in.
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Document ID
Page 2
DS-231113
Issued Date
Revised Date
2008/02/10
2010/03/10
Revision
Page.
B
10
Formosa MS
Dual PNP Epitaxial Planar Transistor
FMBT3906DW1
Characteristics (AT T =25 C unless otherwise noted)
o
A
Off characteristics
PARAMETER
Symbol
MIN.
Collector-Base breakdown voltage
I c = -10uA, I E = 0
CONDITIONS
V (BR)CBO
-40
TYP.
MAX. UNIT
V
Collector-Emitter breakdown voltage(3)
I c = -1mA, I B = 0
V (BR)CEO
-40
V
Emitter-Base breakdown voltage
I c = -10uA, I C = 0
V (BR)EBO
-5.0
V
Base cutoff current
V CE = -30Vdc, V EB = -3.0Vdc
I BL
-50
Collector cutoff current
V CE = -30Vdc, V EB = -3.0Vdc
I CEX
-50
nA
On characteristics(3)
PARAMETER
CONDITIONS
Symbol
h FE
I c = -10mA, V CE = -1.0V
Collector-Emitter saturation voltage(3)
TYP.
100
I c = -50mA, V CE = -1.0V
60
I c = -100mA, V CE = -1.0V
30
I c = -10mA, I B = -1.0mA
300
-0.25
V CE(sat)
-
Vdc
-0.40
I c = -50mA, I B = -5.0mA
Base-Emitter saturation voltage(3)
MAX. UNIT
80
I c = -1.0mA, V CE = -1.0V
DC current gain
MIN.
60
I c = -0.1mA, V CE = -1.0V
I c = -10mA, I B = -1.0mA
V BE(sat)
-0.65
-0.85
Vdc
-0.95
I c = -50mA, I B = -5.0mA
3.Pulse test : pukse width < 300uS, duty cycle < 2.0%.
Small-signal characteristics
PARAMETER
CONDITIONS
Current-gain-bandwidth product(4) I C = -10mA, V CE = -20V, f = 100MHz
Symbol
MIN.
fT
250
TYP.
MAX. UNIT
MHz
C obo
4.5
Vdc
pF
V EB = -0.5V, I C = 0, f = 1.0MHz
C ibo
1.0
pF
Input impedance
V CE = -10A, I C = -1.0mA, f = 1.0KHz
h ie
2.0
12
Vdc
kohms
Voltage feeback radio
V CE = -10V, I C = -1.0mA, f = 1.0KHz
h re
0.1
10.0
X 10 -4
Small-signal current gain
V CE = -10V, I C = -1.0mA, f = 1.0KHz
h fe
100
400
-
3.0
60
umhos
Output capacitance
V CB = -5.0V, I E = 0, f = 1.0MHz
Input capacitance
Output admittance
V CE = -10V, I C = -1.0mA, f = 1.0KHz
h oe
Noise figure
V CE = -5.0V, I C = -100uA, RS = 1.0K ohms, f = 1.0KHZ
NF
4.0
dB
4.f T is defined as the frequency at which h fe extrapolates to unity.
Switching characteristics
PARAMETER
CONDITIONS
Delay time
Rise time
V CC = -3.0V, V BE = 0.5V, I C = -10mA, I B1 = -1.0mA
Storage time
Fall time
V CC = -3.0V, I C =-10mA, I B1 = I B2 = -1.0mA
Symbol
MIN.
TYP.
MAX. UNIT
35
td
tr
35
ts
225
tf
75
ns
5. Pulse Test: Pulse Width <=300µs, Duty cycle«=2.0%
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Document ID
Page 3
DS-231113
Issued Date
Revised Date
2008/02/10
2010/03/10
Revision
Page.
B
10
Rating and characteristic curves (FMBT3906DW1)
3V
3V
+9.1V
<1ns
275
275
<1ns
10k
+0.5V
10k
0
CS<4 pF
10.6V
300 ns
10<t 1 <500 s
DUTY CYCLE=2%
CS<4 pF
1N916
t1
10.9V
DUTY CYCLE=2%
*Total shunt capacitance of test jig and connectors
Figure 1. Delay and Rise Time
Equivalent Test Circuit
Figure . Storage and Fall Time
Equivalent Test Circuit
TYPICAL TRANSIENT CHARACTERISTICS
T J=125 C
10
5000
7.0
3000
VCC=40V
I C/I B =10
2000
5.0
Cobo
Q CHARGE (pC)
CAPACITANCE (pF)
T J=25 C
Cibo
3.0
1000
700
500
300
200
2.0
QT
QA
100
70
50
1.0
0.1
0.2 0.3
0.5 0.7 1.0
2.0 3.0
5.0 7.0 10
20 30 40
1.0
2.0 3.0
20
30
50 70 100
200
Figure 4. Charge Data
Figure 3. Capacitance
500
500
VCC=40V
I B 1=I B 2
300
I C/I B =10
300
200
t f FALL TIME (ns)
200
100
TIME (ns)
5.0 7.0 10
I C COLLECTOR CURRENT (mA)
REVERSEM BIAS (VOLTS)
70
t r @VCC=3.0V
50
15V
30
20
40V
2.0V
10
7
5
2.0 3.0
5.0 7.0 10
20 30
50 70 100
I C COLLECTOP CURRENT (mA)
30
20
I C/I B =10
7
5
1.0
200
2.0 3.0
5.0 7.0 10
20
30
50 70 100
200
I C COLLECTYOR CURRENT (mA)
Figure 5. Turn-On Time
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70
50
10
t d @VOB=0V
1.0
I C/I B =20
100
Figure 6.Fall Time
Document ID
Page 4
DS-231113
Issued Date
Revised Date
2008/02/10
2010/03/10
Revision
Page.
B
10
Rating and characteristic curves (FMBT3906DW1)
(VCE= -5.0 Vdc, T A= 25 °C, Bandwidth= 1.0Hz)
5.0
12
4.0
SOURCE RESISTANCE=2001/2
I C=0.5 mA
3.0
SOURCE RESISTANCE=2.0 k
I C=50 uA
2.0
10
SOURCE RESISTANCE=2.0 k
I C=100uA
1.0
I C=100uA
6
4
I C=50 uA
0
0.1
0.2
0.4
1.0
2.0
4.0
10
20
40
100
0.1
0.2
0.4
1.0
2.0
4.0
10
20
40
f FREQUENCY (kHZ)
Rg SOURCE RESISTANCE (k OHMS)
Figure 7.
Figure 8.
100
(VCE= -10 Vdc, f= 1.0 kHz, T A= 25 °C)
h PARAMETERS
100
hoe OUTPUT ADMITTANCE (
mhos)
300
hfe DC CURRENT GAIN
8
2
0
200
100
70
50
30
70
50
30
20
10
7
5
0.1
0.2
0.3
0.5
0.7
1.0
2.0
3.0
5.0
7.0 1.0
0.1
0.2
I C COLLECTOR CURRENT (mA)
0.3
0.5
0.7
1.0
2.0
3.0
5.0
7.0
1.0
I C COLLECTOR CURRENT(mA)
Figure 10. Input Impedance
Figure 9. Current Gain
10
hfe VOLTAGE FEEBACK RATIO (X 10 x4)
20
hfe INPUT IMPEDANCE (k OHMS)
I C=0.5mA
I C=1.0mA
f=1.0 kHz
NF NOISE FIGURE (dB)
NF NOISE FIGURE (dB)
SOURCE RESISTANCE=2001/2
I C=1.0 mA
10
7.0
5.0
3.0
2.0
1.0
0.7
0.5
0.3
0.2
7.0
5.0
3.0
2.0
1.0
0.7
0.5
0.1
0.2 0.3
0.5 0.7
1.0
2.0
3.0
0.1
5.0 7.0 10
0.3
0.5
0.7
1.0
2.0
3.0
5.0 7.0
10
Figure 12. Votage Feeback Ratio
Figure .11 Input Impedance
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0.2
I C COLLECTOR CURRENT (mA)
I C COLLECTOR CURRENT (MA)
Document ID
Page 5
DS-231113
Issued Date
Revised Date
2008/02/10
2010/03/10
Revision
Page.
B
10
hFE DC CURRENT GAIN (NORMALIZED)
Rating and characteristic curves (FMBT3906DW1)
TYPICAL STATIC CHARACTERISTICS
2.0
TJ=+125 °C
VCE=10V
+25 °C
1.0
0.7
-55 °C
0.5
0.3
0.2
0.1
0.1
0.2
0.3
0.5
0.7
1.0
2.0
3.0
5.0
7.0
10
20
30
50
70
100
200
I C COLLECTOR CURRENT (mA)
V CE COLLECTOR EMITTER VOLTAGE (VOLTS)
Figurer 13. DC Current Gain
1.0
TJ=25 °C
0.8
I C=1.0mA
30mA
10mA
100mA
0.6
0.4
0.2
0
0.01
0.02
0.03
0.05
0.07
0.1
0.2
0.3
0.5
0.7
1.0
2.0
3.0
5.0
7.0
10
I B BASE CURRENT (mA)
1.0
VBE(sat) @ I C/I B =10
V VOLTAGE (VOLTS)
TJ=25 °C
0.8
VBE(sat) @VCE=1.0V
0.6
0.4
VCE(sat) @ I C/I B =10
0.2
0
10
20
50
10
20
50
100
200
θv TEMPERATURE COEFFICIENTS (mV/°C)
Figure 14. Collector Saturation Region
1.0
0.5
0
-55 °C TO +25 °C
-0.5
+25 °C TO +125 °C
-1.0
-55 °C TO +25 °C
-1.5
θ VB FOR VBE(sat)
-2.0
0
20
40
60
80
100
120
140
160
180
200
I C COLLECTOR CURRENT (mA)
I C COLLECTOR CURRENT (mA)
Figure 16.Temperature Coefficients
Figure 15. "ON" Voltages
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+25 °C TO +125 °C
θ VC FOR VCE(sat)
Document ID
Page 6
DS-231113
Issued Date
Revised Date
2008/02/10
2010/03/10
Revision
Page.
B
10
Formosa MS
Dual PNP Epitaxial Planar Transistor
FMBT3906DW1
Pinning information
Pin
Simplified outline
3
2
Symbol
1
3
2
1
•
FMBT3906DW1
Q
4
5
Q
4
6
5
6
Marking
Type number
Marking code
FMBT3906DW1
A2
Suggested solder pad layout
SOT-363
0.025(0.65)
0.025(0.65)
0.051(1.3)
0.075(1.9) 0.098(2.5)
0.024(0.60)
0.0165(0.42)
Dimensions in inches and (millimeters)
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TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 7
DS-231113
Issued Date
Revised Date
2008/02/10
2010/03/10
Revision
Page.
B
10
Formosa MS
Dual PNP Epitaxial Planar Transistor
FMBT3906DW1
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
SOT-363
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
2.36
2.40
1.20
1.50
178.00
62.00
13.00
1.75
3.50
4.00
4.00
2.00
0.23
8.00
11.40
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 8
DS-231113
Issued Date
Revised Date
2008/02/10
2010/03/10
Revision
Page.
B
10
Formosa MS
Dual PNP Epitaxial Planar Transistor
FMBT3906DW1
Reel packing
PACKAGE
REEL SIZE
SOT-363
7"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
BOX
(pcs)
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
3000
4.0
30,000
183*183*123
178
CARTON
SIZE
(m/m)
382*262*387
CARTON
(pcs)
APPROX.
GROSS WEIGHT
(kg)
240,000
9.5
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
150 oC
200 oC
60~120sec
Tsmax to T L
-Ramp-upRate
<3 oC/sec
Time maintained above:
-Temperature(T L )
-Time(t L )
217 oC
60~260sec
255 oC-0/+5 oC
Peak Temperature(T P )
Time within 5 oC of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 oC/sec
Time 25 oC to Peak Temperature
<6minutes
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TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 9
DS-231113
Issued Date
Revised Date
2008/02/10
2010/03/10
Revision
Page.
B
10
Formosa MS
Dual PNP Epitaxial Planar Transistor
FMBT3906DW1
High reliability test capabilities
Item Test
Conditions
1. Steady State Operating Life
TA=25°C P D=150mW Test Duration:1000hrs
2. High Temperature Reverse Bias
Tj= 150℃,V CE=80% related volage, Test Duration: 1000hrs
3. Temperature Cycle
4. Autoclave
-55℃( 15min) to 150℃( 15min)Air to Air Transition Time< 20sec Test Cycles:1000cycle
P=2atm Ta=121℃ RH=100% Test Duration:96hrs
5. High Temperature Storage Life
Ta=150℃ Test Duration:1000hrs
6. Solderability
245℃,Test Duration:5sec
7. High Temperature High Humidity Reverse
Bias
Ta=85℃, 85%RH, V CE= 80% related volage,Test Duration: 1000hrs
8. Resistance to Soldering Heat
260℃, Test Duration: 10sec
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TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 10
DS-231113
Issued Date
Revised Date
2008/02/10
2010/03/10
Revision
Page.
B
10