CYStech Electronics Corp. Spec. No. : C856I3 Issued Date : 2006.06.21 Revised Date : 2012.08.21 Page No. : 1/7 Silicon NPN Epitaxial Planar Transistor BTD1858I3 Description • High BVCEO • High current capability • Pb-free lead plating package Symbol Outline BTD1858I3 TO-251AB B：Base C：Collector E：Emitter TO-251S B C E B C E Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Collector Current (Pulse) Power Dissipation @TA=25℃ Power Dissipation @TC=25℃ Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Case Junction Temperature Storage Temperature Note : Single Pulse , Pw≦380μs,Duty≦2%. BTD1858I3 Symbol VCBO VCEO VEBO IC ICP PD PD RθJA RθJC Tj Tstg Limits Unit 180 160 5 1.5 3 (Note) 1 15 125 8.33 150 -55~+150 V V V A A W W °C/W °C/W °C °C CYStek Product Specification CYStech Electronics Corp. Spec. No. : C856I3 Issued Date : 2006.06.21 Revised Date : 2012.08.21 Page No. : 2/7 Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VCE(sat) *VBE(on) hFE1 hFE2 fT Cob Min. 180 160 5 180 30 - Typ. 0.15 140 27 Max. 1 1 0.3 0.4 0.8 560 - Unit V V V µA µA V V V MHz pF Test Conditions IC=50µA, IE=0 IC=1mA, IB=0 IE=50µA, IC=0 VCB=160V, IE=0 VEB=4V, IC=0 IC=1A, IB=100mA IC=1A, IB=50mA VCE=5V, IC=5mA VCE=5V, IC=200mA VCE=5V, IC=500mA VCE=5V, IC=150mA VCB=10V, IE=0, f=1MHz *Pulse Test: Pulse Width ≤380µs, Duty Cycle≤2% Classification of hFE 1 Rank Range Q 180~390 R 270~560 Ordering Information Device HFE rank BTD1858I3-Q-UB-S Q BTD1858I3-R-UB-S R BTD1858I3S-Q-UB-S Q BTD1858I3S-R-UB-S R BTD1858I3-Q-UB-G Q BTD1858I3-R-UB-G R BTD1858I3S-Q-UB-G Q BTD1858I3S-R-UB-G R BTD1858I3 Package TO-251AB (Pb-free lead plating) TO-251AB (Pb-free lead plating) TO-251S (Pb-free lead plating) TO-251S (Pb-free lead plating) TO-251AB (Pb-free lead plating and halogen-free package) TO-251AB (Pb-free lead plating and halogen-free package) TO-251S (Pb-free lead plating and halogen-free package) TO-251S (Pb-free lead plating and halogen-free package) Shipping 80 pcs / tube, 50 tubes / box 80 pcs / tube, 50 tubes / box 80 pcs / tube, 50 tubes / box 80 pcs / tube, 50 tubes / box 80 pcs / tube, 50 tubes / box 80 pcs / tube, 50 tubes / box 80 pcs / tube, 50 tubes / box 80 pcs / tube, 50 tubes / box CYStek Product Specification CYStech Electronics Corp. Spec. No. : C856I3 Issued Date : 2006.06.21 Revised Date : 2012.08.21 Page No. : 3/7 Characteristic Curves Output Characteristics Output Characteristics 0.7 IB=500uA 0.15 IB=400uA IB=300uA 0.1 IB=200uA 0.05 IB=100uA IB=2.5mA 0.6 Collector Current---IC(A) Collector Current---IC(A) 0.2 IB=2mA 0.5 IB=1.5mA 0.4 IB=1mA 0.3 IB=0.5mA 0.2 0.1 IB=0 IB=0 0 0 0 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) 6 0 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) Output Characteristics Output Characteristics 1.6 1.2 1 IB=8mA IB=6mA 0.8 IB=4mA 0.6 IB=25mA 1.4 Collector Current---IC(A) Collector Current---IC(A) IB=10mA IB=2mA 0.4 0.2 1.2 IB=20mA IB=15mA 1 IB=10mA IB=5mA 0.8 0.6 0.4 0.2 IB=0 IB=0 0 0 0 2 4 Collector-to-Emitter Voltage---VCE(V) 0 6 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) Current Gain vs Collector Current 6 Saturation Voltage vs Collector Current 100000 1000 100 Saturation Voltage---(mV) VCE=5V Current Gain---HFE 6 VCE=2V VCE=1V VCE(SAT) 10000 IC=30IB 1000 IC=50IB 100 IC=20IB IC=10IB 10 10 1 BTD1858I3 10 100 1000 Collector Current---IC(mA) 10000 1 10 100 1000 Collector Current---IC(mA) 10000 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C856I3 Issued Date : 2006.06.21 Revised Date : 2012.08.21 Page No. : 4/7 Characteristic Curves(Cont.) Saturation Voltage vs Collector Current On Voltage vs Collector Current 1000 VBE(SAT)@IC=10IB On Voltage---(mV) Saturation Voltage---(mV) 10000 1000 VBE(on)@VCE=5V 100 100 1 10 100 1000 Collector Current---IC(mA) 1 10000 Output Capacitance vs Reverse Biased Voltage 10 100 1000 Collector Current---IC(mA) 10000 Power Derating Curve 1.2 Power Dissipation---PD(W) Output capacitance---Cob(pF) 100 10 1 0.8 0.6 0.4 0.2 0 0.1 1 10 100 Reverse Biased Voltage---VCB(V) 0 50 100 150 Ambient Temperature---TA(℃) 200 Power Derating Curve 16 Power Dissipation---PD(W) 14 12 10 8 6 4 2 0 0 BTD1858I3 50 100 150 Case Temperature---TC(℃) 200 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C856I3 Issued Date : 2006.06.21 Revised Date : 2012.08.21 Page No. : 5/7 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. BTD1858I3 CYStek Product Specification Spec. No. : C856I3 Issued Date : 2006.06.21 Revised Date : 2012.08.21 Page No. : 6/7 CYStech Electronics Corp. TO-251AB Dimension Marking: Product Name HFE rank D1858 □ □□ Date Code: Year+Month Year : 1→ 2011, 2→ 2012,.., etc. Month : 1~9,A,B,C Style: Pin 1.Base 2.Collector 3.Emitter 3-Lead TO-251 Plastic Package CYStek Package Code: I3 Inches Min. Max. 0.250 0.262 0.205 0.213 0.571 0.587 0.028 0.035 0.020 0.028 0.091 TYP 0.091 TYP 0.017 0.023 DIM A B C D E F G H Millimeters Min. Max. 6.350 6.650 5.200 5.400 14.500 14.900 0.700 0.900 0.500 0.700 2.300 TYP 2.300 TYP 0.430 0.580 DIM I J K L M N S T Inches Min. Max. 0.087 0.094 0.213 0.224 0.295 0.311 0.042 0.054 0.017 0.023 0.118 REF 0.197 REF 0.150 REF Millimeters Min. Max. 2.200 2.400 5.400 5.700 7.500 7.900 1.050 1.350 0.430 0.580 3.000 REF 5.000 REF 3.800 REF Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. BTD1858I3 CYStek Product Specification Spec. No. : C856I3 Issued Date : 2006.06.21 Revised Date : 2012.08.21 Page No. : 7/7 CYStech Electronics Corp. TO-251S Dimension Marking : Device Name D1858 □ HFE rank □□ Date Code: Year+Month Year : 1→ 2011, 2→ 2012,.., etc. Month : 1~9,A,B,C 3-Lead TO-251AA Plastic Package CYStek Package Code: I3 Style : Pin 1. Base 2. Collector 3. Emitter *: Typical Inches Min. Max. 0.256 0.264 0.201 0.215 0.409 0.433 0.026 0.034 0.086 0.094 0.018 0.023 0.000 0.012 0.087 0.094 0.236 0.244 DIM A B C E F H h I J Millimeters Min. Max. 6.500 6.700 5.100 5.460 10.400 11.000 0.660 0.860 2.186 2.386 0.460 0.580 0.000 0.300 2.200 2.400 6.000 6.200 DIM K L L2 M S T U V Φ Inches Min. Max. 0.138 REF 0.036 0.046 0.063 REF 0.018 0.023 0.190 REF 0.211 REF 0.070 REF 0.030 REF 0.043 0.051 Millimeters Min. Max. 3.500 REF 0.910 1.110 1.600 REF 0.460 0.580 4.830 REF 5.350 REF 1.780 REF 0.760 REF 1.100 1.300 Notes: 1.Controlling dimension: inch. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTD1858I3 CYStek Product Specification