MBR10100FP

CYStech Electronics Corp.
10Amp. Schottky Barrier Rectifiers
MBR10100FP
IF(AV)
VRRM
Tj
VF
Spec. No. : C463FP
Issued Date : 2009.03.19
Revised Date :2014.04.08
Page No. : 1/1
2 × 5A
100V
175°C
0.66V
Features
• 175℃ operating junction temperature
• Low VF and low IR type
• Metal silicon junction, major carrier conduction
• 10A total (5A per diode leg)
• Guardring for stress protection
• Low power loss, high efficiency
• High surge capability
• Insulating package, insulating voltage=2000V DC, capacitance=45pF
• High temperature soldering guaranteed : 260℃/10s, 0.25”(6.35mm) from case
• For use in low voltage, high frequency inverters, free wheeling, and polarity protection application
• RoHS compliant package
Mechanical Data
• Case: JEDEC TO-220FP molded plastic
• Mounting Position: Any
• Weight: 2.2 grams, 0.078 ounce approximately
• Terminals: Pure tin plated, lead-free, solderable per MIL-STD-750 method 2026
• Epoxy: UL 94V-0 rate flame retardant
• Mounting Torque : 5 in-lbs max
Equivalent Circuit
MBR10100FP
Outline
TO-220FP
AKA
MBR10100FP
CYStek Product Specification
Spec. No. : C463FP
Issued Date : 2009.03.19
Revised Date :2014.04.08
Page No. : 2/2
CYStech Electronics Corp.
Maximum Ratings and Electrical Characteristics (Per Diode Leg)
(Rating at 25°C ambient temperature unless otherwise specified.
resistive or inductive load.
Single phase, half wave, 60Hz,
For capacitive load, derate current by 20%.)
Parameter
Maximum Recurrent peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
IF=5A, TC=25℃
Maximum instantaneous
IF=5A, TC=125℃
forward voltage at
IF=10 A, TC=25℃
Max.
100
70
100
Units
V
V
V
0.85
0.70
0.92
0.80
V
IF(AV)
5
10
A
IFSM
110
A
Peak repetitive reverse surge current, TJ<175℃ (Note 1 )
VR=100 V, TC=25℃
Maximum instantaneous
reverse current at
VR=100 V, TC=125℃
IRRM
Voltage rate of change, (rated VR)
dV/dt
2.5
5
5
10,000
A
μA
mA
V/μs
(Note 1)
IF=10A, TC=125℃
Per Diode
Per Device
Maximum Average forward
rectified current @ TC=168℃
Non-repetitive peak forward surge current @
8.3ms single half sine wave superimposed on
rated load (JEDEC method)
Typical junction capacitance @ f=1MHz and applied
5V reverse voltage
ESD susceptibility (Note 2)
Storage temperature range
Operating junction temperature range
Symbol
VRRM
VRMS
VDC
Min.
Typ.
0.66
VF
IR
CJ
Tstg
TJ
pF
110
-65
-65
8000
+175
+175
V
℃
℃
Value
3.5
260
Unit
°C/W
°C
Notes : 1. 2.0μs pulse width, f=1.0kHz
2. Human body model, 1.5kΩ in series with 100pF
Thermal Data
Parameter
Maximum Thermal Resistance, Junction-to-case
Lead Temperature for Soldering Purposes : 1/8” from Case for 5seconds
Symbol
Rth,j-c
TL
Ordering Information
Device
MBR10100FP-0-UB-S
Package
TO-220FP
(RoHS compliant package)
Shipping
50 pcs / Tube, 40 Tubes/Box
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, UB : 50 pcs / tube, 20 tubes/box
Product rank, zero for no rank products
Product name
MBR10100FP
CYStek Product Specification
Spec. No. : C463FP
Issued Date : 2009.03.19
Revised Date :2014.04.08
Page No. : 3/3
CYStech Electronics Corp.
Characteristic Curves
Forward Current Derating Curve
Forward Current vs Forward Voltage
100000
Instantaneous Forward Current---IF (mA)
Average Forward Current---Io(A)
6
5
4
resistive or inductive load
per leg
3
2
1
Per leg
10000
Tj=150℃
Tj=25℃
100
10
Pulse width=300μs,
1% Duty cycle
1
0
Case Temperature---TC(℃)
0.4
0.6
0.8
1
1.2
Forward Voltage---VF(V)
Reverse Leakage Current vs Reverse Voltage
Junction Capacitance vs Reverse Voltage
0
25
50
75
100
125
150
175
0
200
0.2
1.4
1000
Tj=125℃
Junction Capacitance---C J(pF)
100
Reverse Leakage Current---I R (μA)
1000
Per leg
10
Tj=75℃
1
0.1
Tj=25℃
100
Tj=25℃, f=1.0MHz
Per Leg
10
0.01
0
20
40
60
80
Reverse Voltage---VR (V)
MBR10100FP
100
120
0.1
1
10
Reverse Voltage---VR (V)
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C463FP
Issued Date : 2009.03.19
Revised Date :2014.04.08
Page No. : 4/4
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 °C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25 °C to peak
temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
10-30 seconds
20-40 seconds
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
MBR10100FP
CYStek Product Specification
Spec. No. : C463FP
Issued Date : 2009.03.19
Revised Date :2014.04.08
Page No. : 5/5
CYStech Electronics Corp.
TO-220FP Dimension (K Forming)
Marking:
Device
Name
1
2
3
Date Code
A K A
Style: Pin 1.Anode 2.Cathode 3.Anode
3-Lead TO-220FP Plastic Package
CYStek Package Code: FP
*: Typical
Inches
Min.
Max.
0.3740 0.4134
*0.2756
0.6063 0.6299
0.2480 0.2717
0.0984 0.1181
0.0138 0.0295
0.0276 0.0354
0.0394 0.0551
0.1693 0.1850
DIM
A
A1
B
b1
b2
C
D
D1
E1
Millimeters
Min.
Max.
9.50
10.50
*7.00
15.40
16.00
6.30
6.90
2.50
3.00
0.35
0.75
0.70
0.90
1.00
1.40
4.30
4.70
DIM
E2
N1
N2
P
L
L1
I
T
Inches
Min.
Max.
0.0984 0.1063
0.0961 0.1039
0.1921 0.2079
0.0984 0.1142
0.5276 0.5354
0.1378 0.1772
0.1181 0.1339
0.0059 0.0138
Millimeters
Min.
Max.
2.50
2.70
2.44
2.64
4.88
5.28
2.50
2.90
13.40
13.60
3.50
4.50
3.00
3.40
0.15
0.35
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: KFC ; tin plated
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
MBR10100FP
CYStek Product Specification
Spec. No. : C463FP
Issued Date : 2009.03.19
Revised Date :2014.04.08
Page No. : 6/6
CYStech Electronics Corp.
TO-220FP Dimension (C Forming)
Marking:
Device Name
Date Code
1
A
2
3
K A
3-Lead TO-220FP Plastic Package
CYStek Package Code: FP
Style: Pin 1.Anode 2.Cathode 3.Anode
*: Typical
Inches
Min.
Max.
0.169
0.185
0.051 REF
0.110
0.126
0.098
0.114
0.020
0.030
0.043
0.053
0.059
0.069
0.020
0.030
DIM
A
A1
A2
A3
b
b1
b2
c
Millimeters
Min.
Max.
4.300
4.700
1.300 REF
2.800
3.200
2.500
2.900
0.500
0.750
1.100
1.350
1.500
1.750
0.500
0.750
DIM
D
E
e
F
Φ
L
L1
L2
Inches
Min.
Max.
0.392
0.408
0.583
0.598
0.100*
0.106 REF
0.138 REF
1.102
1.118
0.067
0.075
0.075
0.083
Millimeters
Min.
Max.
9.960
10.360
14.800 15.200
2.540*
2.700 REF
3.500 REF
28.000 28.400
1.700
1.900
1.900
2.100
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: KFC ; tin plated
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
MBR10100FP
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C463FP
Issued Date : 2009.03.19
Revised Date :2014.04.08
Page No. : 7/7
TO-220FP(M forming) Dimension
Marking:
4
Device Name
Date Code
1
2
3-Lead TO-220FP Plastic Package
CYStek Package Code: FP
Style: Pin 1.Anode 2.Cathode 3.Anode
Inches
Min.
Max.
0.178
0.194
0.028
0.036
0.014
0.021
0.617
0.633
0.274
0.408
0.092
0.108
0.100 TYP.
DIM
A
b
C
D
E
F
e
Millimeters
Min.
Max.
4.53
4.93
0.71
0.91
0.36
0.53
15.67
16.07
6.96
10.36
2.34
2.74
2.54 TYP.
DIM
H1
J1
L
ΦQ
b1
L1
Q1
Inches
Min.
Max.
0.256
0.272
0.101
0.117
0.487
0.503
0.117
0.133
0.045
0.055
0.088
0.104
0.122
0.138
Millimeters
Min.
Max.
6.50
6.90
2.56
2.96
12.37
12.77
2.98
3.38
1.15
1.39
2.23
2.63
3.10
3.50
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: KFC ; tin plated
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MBR10100FP
CYStek Product Specification