Standard Products UT54ALVC2525 Clock Driver 1 to 8 Minimum Skew Data Sheet October 2012 INTRODUCTION The UT54ALVC2525 is a low-voltage, minimum skew, oneto-eight clock driver. The UT54ALVC2525 distributes a single clock to eight, high-drive, outputs with low skew across all outputs during both the tPLH and tPHL transitions making it ideal for signal generation and clock distribution. The output pins act as a single entity and will follow the state of the CLK pin. FEATURES 2.0V to 3.6V Power supply operation Guaranteed pin-to-pin and part-to-part skew Eight LVTTL outputs with high drive strength Operational environment: - Total-dose tolerance: 100 to 300 krad(Si), or 1 Mrad(Si) - SEL Immune to a LET of 111 MeV-cm2/mg HiRel temperature range: -55oC to +125oC Packaging options: - 14-Lead Ceramic Flatpack Standard Microcircuit Drawing: 5962-06233 - QML Q and V O0 O2 NC GND VDD O4 O6 1 2 3 4 5 6 7 UT54ALVC2525 14 13 12 11 10 9 8 O1 O3 CLK VDD GND O5 O7 00 Figure 2. 14-Lead Ceramic Flatpack Pinouts CLK 07 Figure 1: UT54ALVC2525 Block Diagram 1 PIN DESCRIPTION Flatpack Pin No. Name I/O Type 12 CLK I LVTTL 3 1, 2, 6, 7, 8, 9, 13, 14 5, 11 N/C -- -- On O LVTTL Eight output clocks. VDD PWR Power Power supply for internal circuitry and output buffers. 4, 10 VSS PWR Power Ground Description Primary reference clock input. This pin must be driven by an LVTTL or LVCMOS clock source. No connect. OPERATIONAL ENVIRONMENT The UT54ALVC2525 incorporates special design, layout, and process features which allows operation in a limited HiRel environment. Parameter Limit Units Total Ionizing Dose (TID) >1E6 rads(Si) Single Event Latchup (SEL) 1, 2 >111 MeV-cm2/mg Onset Single Event Upset (SEU) LET (@2.0V)3, 5 52 MeV-cm2/mg Onset Single Event Upset (SEU) LET (@3.0V)4, 5 66 MeV-cm2/mg Neutron Fluence 1.0E14 n/cm2 Dose Rate Upset TBD rads(Si)/sec Dose Rate Survivability TBD rads(Si)/sec Notes: 1. The UT54ALVC2525 is latchup immune to particle LETs >111 MeV-cm2/mg. 2. SEL temperature and voltage conditions of TC = +125oC, VDD = 3.6V. 3. SEU temperature and voltage conditions of TC = +25oC, VDD = 2.0V. Tested at 200MHz. 4. SEU temperature and voltage conditions of TC = +25oC, VDD = 3.0V. Tested at 200MHz. 5. For the UT54ALVC2525 SET performance at select operating frequency data ranges, please contact the factory. 2 ABSOLUTE MAXIMUM RATINGS:1 (Referenced to VSS) Symbol Description Limits Units -0.3 to 4.0 V VDD Core Power Supply Voltage VIN Voltage Any Clock Input -0.3 to VDD + 0.3 V Voltage Any Clock Output -0.3 to VDD + 0.3 V +10 mA 1 W -65 to +150 C +150 C 20 C/W >3000 V VOUT II DC Input Current PD Maximum Power Dissipation TSTG TJ JC ESDHBM Storage Temperature Maximum Junction Temperature 2 Thermal Resistance, Junction to Case ESD Protection (Human Body Model) - Class II Notes: 1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions beyond limits indicated in the operational sections of this specification is not recommended. Exposure to absolute maximum rating conditions for extended periods may affect device reliability and performance. 2. Maximum junction temperature may be increased to +175C during burn-in and steady-static life. RECOMMENDED OPERATING CONDITIONS: Symbol Description Limits Units VDD Core Operating Voltage 2.0 to 3.6 V VIN Voltage Clock Input 0 to VDD V Voltage Any Clock Output 0 to VDD V -55 to +125 C VOUT TC Case Operating Temperature 3 DC ELECTRICAL CHARACTERISTICS (Pre- and Post-Radiation)* (VDD = 2.0V to 3.6V; TC = -55C to +125C) Symbol VDD Min. High level input voltage 2.0V 2.75V 3.0V 3.6V 1.25 1.5 1.75 2.0 Low level input voltage 2.0V 2.75V 3.0V 3.6V 0.7 0.8 0.8 0.8 V Low level output voltage IOL = 12mA IOL = 12mA IOL = 12mA IOL = 12mA 2.0V 2.75V 3.0V 3.6V 0.45 0.4 0.4 0.4 V VOH High level output voltage IOH = -12mA IOH = -12mA IOH = -12mA IOH = -12mA 2.0V 2.75V 3.0V 3.6V 1.5 2.2 2.4 3.0 IOS2 Short-circuit output current VOUT = VDD and VSS 2.0V 3.6V -200 -300 200 300 mA Input leakage current VIN = VDD or VSS 3.6V -1 1 Quiescent Supply Current VIN = VDD or VSS 2.0V 1.0 1.0 mA VIH1 VIL1 VOL IIL IDDQ Description Conditions 3.6V PTOTAL3 CIN4 COUT4 Max. Units V V Total power dissipation CL = 20pF 2.0V 2.75V 3.0V 3.6V Input capacitance f = 1MHz 0V 15 pF Output capacitance f = 1MHz 0V 15 pF 1.2 2.7 3.5 5.2 mW/MHz Notes: * Post-radiation performance guaranteed at 25C per MIL-STD-883 Method 1019, Condition A up to a TID level of 1.0E6 rad(Si). 1. Functional tests are conducted in accordance with MIL-STD-883 with the following test conditions: VIH=VIH(min) +20%, -0% VIL=VIL(max)+0%, -50%, as specified herein for the LVTTL and LVCMOS inputs. Devices may be tested using any input voltage within the above specified range, but are guaranteed to VIH(min), VIL (max). 2. Supplied as a design limit. Neither guaranteed nor tested. 3. When measuring the dynamic supply current, all outputs are loaded in accordance with the equivalent test load defined in figure 3. 4. Capacitance is measured for initial qualification and when design changes may affect the input/output capacitance. Capacitance is measured between the designated terminal and the VSS at a frequency of 1MHz and a signal amplitude of 50mV rms maximum. 4 AC ELECTRICAL CHARACTERISTICS (Pre- and Post-Radiation)* (VDD = 2.0V to 3.6V; TC = -55C to +125C) Symbol Description Condition tR, tF3 Input rise/fall time VIH (min) - VIL (max) tPHL1,2 Propagation delay: CLK to On, high-to-low transition Measured as transition time between VIN = VDD÷2 to VOUT = VDD÷2 Propagation delay: CLK to On, low-to-high transition Measured as transition time between VIN = VDD÷2 to VOUT = VDD÷2 tOSHL 2,4,5 Maximum skew: common edge, output-to-output, high-to-low transition Measured as VOn = VDD ÷2 to VOm = VDD÷2 where n,m = 0 to 7; n not equal to m @ fCLK = 200MHz tOSLH 2,4,5 Maximum skew: common edge, output-to-output, low-to-high transition VDD Min. 3.6V Max. Unit 20 ns/V 2.0V 2.75V 3.0V 3.6V 3.5 3.0 2.75 2.25 7.5 5.5 5.25 4.75 ns 2.0V 2.75V 3.0V 3.6V 3.25 2.75 2.5 2.0 7.25 5.25 5.0 4.5 ns 2.0V 3.6V 0.15 0.25 ns Measured as VOn= VDD ÷2 to VOm= VDD÷2 where n,m = 0 to 7; n not equal to m @ fCLK = 200MHz 2.0V 3.6V 0.15 0.25 ns Output rise/fall time Measured as transition time between 20% * VOL and 80% * VOH @ fCLK = 100MHz 2.0V 3.6V 2.4 2.0 ns tPART4,5 Part-part skew Skew between the same output of any two devices under identical settings and conditions (VDD, temp, air flow, frequency, etc). 2.0V 3.6V 0.1 0.15 ns tPBAL1,4 Propagation delay balance: difference between same output, low-to-high and high-to-low transitions 2.0V 2.75V 3.0V 3.6V 0.43 0.3 0.26 0.21 ns tPLH1,2 tORISE &3 tOFALL Measured as transition time between VIN = VDD÷2 to VOUT = VDD÷2 Notes: * Post-radiation performance guaranteed at 25C per MIL-STD-883 Method 1019, Condition A up to a TID level of 1.0E6 rad(Si). 1. Test load = 40pF, terminated to VDD÷2. All outputs are equally loaded. Reference Figure 3 for clock output loading. 2. Reference Figure 4 for AC timing diagram. 3. Supplied only as a design guideline, neither tested nor guaranteed. 4. Guaranteed by characterization, but not tested. 5. Test load = 40pF, terminated to VDD÷2. All outputs are equally loaded. Reference Figure 5 for clock output loading. 5 VDD VDD Qn 150 100 DUT 150 100 CL Figure 3. Test Load Circuit for Dynamic Power Supply Current and AC Measurements Note: This is not the recommended termination for normal user operation. CLK VDD /2 O0 VDD /2 O7 VDD /2 tPHL tPLH tOSHL tOSLH Figure 4. AC Timing Diagram VDDQn 150 DUT 150 CL Figure 5. Test Load Circuit for tOSHL and tOSLH Measurements 6 PACKAGING 1. All exposed metallized areas are gold plated over electroplated nickel per MIL-PRF-38535. 2. The lid is electrically connected to VSS. 3. Lead finishes are in accordance with MIL-PRF-38535. 4. Dimension symbol is in accordance with MIL-PRF-38533. 5. Lead position and colanarity are not measured. 6. ID mark symbol is vendor option. Figure 6. 14-Pin Flatpack Package 7 ORDERING INFORMATION UT54ALVC2525: UT54ALVC2525 - * * * Lead Finish (Notes 1 & 2): (A) = Hot solder dipped (C) = Gold (X) = Factory option (gold or solder) Screening (Notes 3,4) (C) = HiRel Temperature Range flow (-55C to +125C) (P) = Prototype flow Package Type: (U) = 14-Lead Ceramic Flatpack Notes: 1. Lead finish (A,C, or X) must be specified. 2. If an “X” is specified when ordering, then the part marking will match the lead finish and will be either “A” (solder) or “C” (gold). 3. Prototype flow per Aeroflex Manufacturing Flows Document. Tested at 25C only. Lead finish is GOLD ONLY. Radiation neither tested nor guaranteed. 4. HiRel Temperature Range flow per Aeroflex Colorado Springs Manufacturing Flows Document. Devices are tested at -55C, room temp, and 125C. Radiation neither tested nor guaranteed. 8 UT54ALVC2525: SMD 5962 * 06233 ** * * * Lead Finish (Notes 1 & 2): (A) = Hot solder dipped (C) = Gold (X) = Factory Option (gold or solder) Case Outline: (X) = 14-Lead Ceramic Flatpack Class Designator: (Q) = QML Class Q (V) = QML Class V Device Type: (01) = UT54ALVC2525 (Note 3) (02) = UT54ALVC2525 (Note 4) Drawing Number: 06233 Total Dose: (Note 5) (-) = No Radiation Guarantee (R) = 1E5 rads(Si) (F) = 3E5 rads(Si) (G) = 5E5 rads(Si) (H) = 1E6 rads(Si) Federal Stock Class Designator: No options Notes: 1.Lead finish (A,C, or X) must be specified. 2.If an “X” is specified when ordering, part marking will match the lead finish and will be either “A” (solder) or “C” (gold) 3.Available to a maximum RHA level of H. 4.Available to a maximum RHA level of R. Device is irradiated at a dose rate = 50-300 rads(Si)/s in accordance with MIL-STD-883, Method 1019, Condition A, and is guaranteed to a maximum total dose specified. The effective dose rate after extended room temperature anneal = 1 rads(Si)/s per MIL-STD-883, Method 1019, Condition A, section 3.11.2. The total dose specification for these devices only applies to a low dose rate environment. 5.Total dose radiation must be specified when ordering. QML Q and QML V are not available without radiation hardening. 9 Aeroflex Colorado Springs - Datasheet Definition Advanced Datasheet - Product In Development Preliminary Datasheet - Shipping Prototype Datasheet - Shipping QML & Reduced HiRel COLORADO Toll Free: 800-645-8862 Fax: 719-594-8468 INTERNATIONAL Tel: 805-778-9229 Fax: 805-778-1980 NORTHEAST Tel: 603-888-3975 Fax: 603-888-4585 SE AND MID-ATLANTIC Tel: 321-951-4164 Fax: 321-951-4254 WEST COAST Tel: 949-362-2260 Fax: 949-362-2266 CENTRAL Tel: 719-594-8017 Fax: 719-594-8468 www.aeroflex.com [email protected] Aeroflex Colorado Springs, Inc., reserves the right to make changes to any products and services herein at any time without notice. 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