μPC8112TB

DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC8112TB
SILICON MMIC 1st FREQUENCY DOWN-CONVERTER
FOR CELLULAR/CORDLESS TELEPHONE
DESCRIPTION
The PC8112TB is a silicon monolithic integrated circuit designed as 1st frequency down-converter for
cellular/cordless telephone receiver stage. This IC consists of mixer and local amplifier. The PC8112TB features
high impedance output of open collector. Similar ICs of the PC2757TB and PC2758TB feature low impedance
output of emitter follower. These TB suffix ICs which are smaller package than conventional T suffix ICs contribute
to reduce your system size.
The PC8112TB is manufactured using the 20 GHz fT NESAT™III silicon bipolar process. This process uses
silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution
and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
• Excellent RF performance
•
•
•
•
•
•
: IIP3 = –7 dBm@fRFin = 1.9 GHz (reference)
IM3 = –88 dBm@PRFin = –38 dBm, 1.9 GHz (reference)
Similar conversion gain to PC2757 and lower noise figure than PC2758
Minimized carrier leakage
: RFLO = –80 dB@fRFin = 900 MHz (reference)
RFLO = –55 dB@fRFin = 1.9 GHz (reference)
High linearity
: PO(sat) = –2.5 dBm TYP.@fRFin = 900 MHz
PO(sat) = –3 dBm TYP.@fRFin = 1.9 GHz
Low current consumption
: ICC = 8.5 mA TYP.
Supply voltage
: VCC = 2.7 to 3.3 V
High-density surface mounting : 6-pin super minimold package
APPLICATIONS
• 1.5 to 1.9 GHz cellular/cordless telephone (PHS, DECT, PDC1.5G and so on)
• 800 to 900 MHz cellular telephone (PDC800M and so on)
ORDER INFORMATION
Part Number
PC8112TB-E3-A
Package
Markings
6-pin super minimold
C2K
Supplying Form
Embossed tape 8 mm wide.
Pin 1, 2, 3 face the tape perforation side.
Qty 3kpcs/reel.
Remark To order evaluation samples, please contact your local nearby sales office (Part number for sample
order: PC8112TB-A).
Caution Electro-static sensitive devices
Document No. P12808EJ3V0DS00 (3rd edition)
Date Published November 2000 N CP(K)
The mark
shows major revised points.
μPC8112TB
CONTENTS
1.
PIN CONNECTIONS ............................................................................................................................................ 3
2.
PRODUCT LINE-UP ............................................................................................................................................. 3
3.
INTERNAL BLOCK DIAGRAM ........................................................................................................................... 4
4.
SYSTEM APPLICATION EXAMPLE ................................................................................................................... 4
5.
PIN EXPLANATION ............................................................................................................................................. 5
6.
ABSOLUTE MAXIMUM RATINGS ...................................................................................................................... 6
7.
RECOMMENDED OPERATING RANGE ............................................................................................................ 6
8.
ELECTRICAL CHARACTERISTICS .................................................................................................................... 6
9.
STANDARD CHARACTERISTICS FOR REFERENCE ..................................................................................... 7
10. TEST CIRCUIT ..................................................................................................................................................... 7
11. ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD ................................. 8
12. TYPICAL CHARACTERISTICS ........................................................................................................................... 9
12.1 Without Signals .......................................................................................................................................... 9
12.2 IF 100 MHz Matching (fRFin = 900 MHz) .....................................................................................................10
12.3 IF 100 MHz Matching (fRFin = 1.5 GHz) ......................................................................................................12
12.4 IF 240 MHz Matching .................................................................................................................................14
13. S-PARAMETERS .................................................................................................................................................16
13.1 Calibrated on pin of DUT ..........................................................................................................................16
13.2 IF Output Matching ....................................................................................................................................17
14. PACKAGE DIMENSIONS .....................................................................................................................................18
15. NOTE ON CORRECT USE .................................................................................................................................19
16. RECOMMENDED SOLDERING CONDITIONS ...................................................................................................19
2
Data Sheet P12808EJ3V0DS00
μPC8112TB
1. PIN CONNECTIONS
3
2
1
Pin Name
1
RFinput
2
GND
3
LOinput
4
PS
5
VCC
6
IFoutput
(Bottom View)
C2K
(Top View)
Pin No.
4
4
3
5
5
2
6
6
1
2. PRODUCT LINE-UP (TA = +25°C, VCC = VPS = 3.0 V, ZS = ZL = 50 Ω)
Items
No RF
ICC
Part
Number
μPC2757T
900 MHz
1.5 GHz
1.9 GHz
SSB · NF SSB · NF SSB · NF
900 MHz
1.5 GHz
1.9 GHz
900 MHz
1.5 GHz
CG
CG
CG
IIP3
IIP3
1.9 GHz
IIP3
(mA)
(dB)
(dB)
(dB)
(dB)
(dB)
(dB)
(dBm)
(dBm)
(dBm)
5.6
10
10
13
15
15
13
−14
−14
−12
11
9
10
13
19
18
17
−13
−12
−11
8.5
9
11
11
15
13
13
−10
−9
−7
900 MHz
1.5 GHz
1.9 GHz
900 MHz
1.5 GHz
1.9 GHz
PO(sat)
PO(sat)
PO(sat)
RFLO
RFLO
RFLO
(dBm)
(dBm)
(dBm)
(dB)
(dB)
(dB)
−3
−
−8
–
–
–
μPC2757TB
μPC2758T
μPC2758TB
μPC8112T
μPC8112TB
Items
Part
Number
μPC2757T
IF Output
Configuration
Emitter follower
μPC2757TB
μPC2758T
6-pin minimold
6-pin super minimold
+1
−
−4
–
–
–
6-pin minimold
μPC2758TB
μPC8112T
Package
6-pin super minimold
−2.5
−3
−3
−80
−57
−55
Open collector
μPC8112TB
6-pin minimold
6-pin super minimold
Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
Cautions 1. The μPC2757 and μPC2758’s IIP3 are calculated with ΔIM3 = 3 which is the same IM3
inclination as μPC8112. On the other hand, OIP3 of Standard characterisitcs in page 7 is
cross point IP.
2. This document is to be specified for μPC8112TB. The other part number mentioned in this
document should be referred to the data sheet of each part number.
Data Sheet P12808EJ3V0DS00
3
μPC8112TB
3. INTERNAL BLOCK DIAGRAM
RFinput
IFoutput
LOinput
4. SYSTEM APPLICATION EXAMPLE
Digital cordless phone
Low noise Tr.
μPC8112TB
RX
DEMOD.
VCO
SW
÷N
I
Q
PLL
PLL
0˚
I
φ
TX
PA
90˚
Q
4
Data Sheet P12808EJ3V0DS00
μPC8112TB
5. PIN EXPLANATION
Pin
Pin
No.
Name
1
RFinput
Applied
Voltage
(V)
−
Pin Voltage
(V)
1.2
Function and Application
Internal Equivalent Circuit
RF input pin of mixer. This
mixer is designed as double
balanced type.
This pin should be externally
coupled to front stage with DC cut
capacitor.
2
GND
GND
−
Ground pin. This pin must be
connected to the system ground.
Form the ground pattern as wide
as possible and the truck length
as short as possible to minimize
ground impedance.
5
VCC
2.7 to 3.3
−
Supply voltage pin.
This pin should be connected with
bypass capacitor (example: 1 000
pf) to minimize ground
impedance.
6
IFoutput
as same as
−
IF output pin. This output is
VCC voltage
configured with open collector of
through
high impedance. This pin should
external
be externally equipped with
inductor
matching circuit of inductor should
be selected as small resistance
and high frequency use.
3
LOinput
−
1.4
Input pin of local amplifier. This
amplifier is designed as differential type.
This pin should be externally
coupled to local signal source
with DC cut capacitor.
Recommendable input level is
−15 to 0 dBm.
4
PS
VCC or GND
−
Power save control pin. This pin
can control ON/OFF operation
with bias as follows;
Bias: V
VPS
Operation
≥ 2.5
ON
0 to 0.5
OFF
Data Sheet P12808EJ3V0DS00
5
μPC8112TB
6. ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Conditions
Ratings
Unit
Supply Voltage
VCC
TA = +25°C, 5 pin and 6 pin
3.6
V
Total Circuit Current
ICC
TA = +25°C
77.7
mA
Total Power Dissipation
PD
Mounted on double sided copper clad 50 × 50 ×
270
mW
1.6 mm epoxy glass PWB (TA = +85°C)
Operating Ambient Temperature
TA
−40 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
7. RECOMMENDED OPERATING RANGE
Parameter
Supply Voltage
Symbol
MIN.
TYP.
MAX.
Unit
VCC
2.7
3.0
3.3
V
Remarks
5 pin and 6 pin should be applied
to same voltage.
TA
−40
+25
+85
°C
LO Input Power
PLOin
−15
−10
0
dBm
RF Input Frequency
fRFin
0.8
1.9
2.0
GHz
IF Output Frequency
fIFout
100
250
300
MHz
Operating Ambient Temperature
Zs = 50 Ω
With external matching
8. ELECTRICAL CHARACTERISTICS (Unless otherwise specified, TA = +25°C, VCC = VPS = VIFout
= 3.0 V, PLOin = −10 dBm, ZS = ZL = 50 Ω)
Parameter
Circuit Current
Circuit Current at Power Save
Symbol
ICC
ICC(PS)
Test Conditions
MIN.
TYP.
MAX.
Unit
4.9
8.5
11.7
mA
−
−
0.1
μA
fRFin = 900 MHz, fLOin = 1 000 MHz
11.5
15
17.5
dB
fRFin = 1.9 GHz, fLOin = 1.66 GHz
9.5
13
15.5
No input signal
VCC = 3.0 V, VPS = 0.5 V
Mode
Conversion Gain
SSB Noise Figure
Saturated Output Power
CG
SSB•NF
Po(sat)
fRFin = 900 MHz, fLOin = 1 000 MHz
−
9.0
11
fRFin = 1.9 GHz, fLOin = 1.66 GHz
−
11.2
13.2
−6.5
−2.5
−
−7
−3
−
fRFin = 900 MHz, fLOin = 1 000 MHz
fRFin = 1.9 GHz, fLOin = 1.66 GHz
(PRFin = −10 dBm each)
6
Data Sheet P12808EJ3V0DS00
dB
dBm
μPC8112TB
9. STANDARD CHARACTERISTICS FOR REFERENCE
(TA = +25°C, VCC = VPS = VIFout = 3.0 V, PLOin = −10 dBm, ZS = ZL = 50 Ω)
Parameter
Symbol
Test Conditions
Reference
Unit
Conversion Gain
CG
fRFin = 1.5 GHz, fLOin = 1.6 GHz
13
dB
SSB Noise Figure
SSB•NF
fRFin = 1.5 GHz, fLOin = 1.6 GHz
11
dB
dB
LO Leakage at RF pin
RF Leakage at LO pin
LO Leakage at IF pin
3rd Order Distortion Input
Intercept Point
LORF
RFLO
LOif
IIP3
Note
fRFin = 900 MHz, fLOin = 1 000 MHz
−45
fRFin = 1.5 GHz, fLOin = 1.6 GHz
−46
fRFin = 1.9 GHz, fLOin = 1.66 GHz
−45
fRFin = 900 MHz, fLOin = 1 000 MHz
−80
fRFin = 1.5 GHz, fLOin = 1.6 GHz
−57
fRFin = 1.9 GHz, fLOin = 1.66 GHz
−55
fRFin = 900 MHz, fLOin = 1 000 MHz
−32
fRFin = 1.5 GHz, fLOin = 1.6 GHz
−33
fRFin = 1.9 GHz, fLOin = 1.66 GHz
−30
fRFin = 900 MHz, fLOin = 1 000 MHz
−10
fRFin = 1.5 GHz, fLOin = 1.6 GHz
−9
fRFin = 1.9 GHz, fLOin = 1.66 GHz
−7
dB
dB
dBm
Note IIP3 is determined by comparing two method; theoretical calculation and cross point of IM3 curve.
IIP3 = (ΔIM3 × Pin + CG − IM3) ÷ (ΔIM3 − 1) (dBm) [ΔIM3: IM3 curve inclination in linear range]
μPC8112’s ΔIM3 is closer to 3 (theoretical inclination) than μPC2757 and μPC2758 of conventional ICs.
10. TEST CIRCUIT
(Top View)
POWER
SAVE
Signal Generator
50 Ω
1 000 pF
3
LOinput
PS
4
2
GND
VCC
5
C2
Signal Generator
50 Ω
C4, C5
3V
L1
1 000 pF
1
RFinput
IFoutput
C1
50 Ω
6
C6
Spectrum Analyzer
Data Sheet P12808EJ3V0DS00
7
μPC8112TB
11. ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
PS bias
C3
LO
input
C2
PS
C4
GND
VCC
C5
L1
→
Voltage supply
C6
RF
input
Short
Chip
C1
IF
output
Short Chip = 1 000 pF
Component Number
IF 100 MHz Matching
IF 240 MHz Matching
Remarks
C1 to C5
1 000 pF
1 000 pF
CHIP C
C6
5 pF
2 pF
CHIP C
L1
330 nH
84 nH
CHIP L
EVALUATION BOARD CHARACTERS AND NOTE
(1) 35 μm thick double-sided copper clad 35 × 42 × 0.4 mm polyimide board
(2) Back side: GND pattern
(3) Solder plated patterns
(4)
{: Through holes
(5) To mount C6, pattern should be cut.
Caution Test circuit or print pattern in this sheet is for testing IC characteristics.
They are not an
application circuit or recommended system circuit.
In the case of actual system application, external circuits including print pattern and matching
circuit constant of output port should be designed in accordance with IC’s S-parameters and
environmental components.
Remark External circuits of the IC can be referred to following application notes.
• USAGE AND APPLICATION CHARACTERISTICS OF μPC2757, μPC2758, AND μPC8112, 3-V
POWER SUPPLY, 1.9-GHz FREQUENCY DOWN-CONVERTER ICS FOR MOBILE COMMUNICATION
(Document No. P11997E)
8
Data Sheet P12808EJ3V0DS00
μPC8112TB
12. TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified, measured on test
circuits)
12.1 Without Signals
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
12
12
VCC = VPS = VIFout
10
Circuit Current ICC (mA)
Circuit Current ICC (mA)
10
VCC = VPS = VIFout
8
6
4
2
TA = +85°C
8
TA = +25°C
6
TA = –40°C
4
2
0
0
2
3
1
Supply Voltage VCC (V)
4
0
0
2
3
1
Supply Voltage VCC (V)
4
CIRCUIT CURRENT vs.
PS PIN APPLIED VOLTAGE
12
VCC = VIFout
VCC = 3.3 V
Circuit Current ICC (mA)
10
8
VCC = 3.0 V
6
VCC = 2.7 V
4
2
0
0
2
3
1
PS Pin Applied Voltage VPS (V)
4
Data Sheet P12808EJ3V0DS00
9
μPC8112TB
12.2 IF 100 MHz Matching (fRFin = 900 MHz)
–5
–5
–10
–15
–20
IF Output Power of Each Tone PIFout(each) (dBm)
3rd Order Intermodulation Distortion IM3 (dBm)
fRFin = 900 MHz
fLOin = 1 000 MHz
fIFout = 100 MHz
PLOin = –10 dBm
VCC = VPS = VIFout = 3.0 V
–25
–30
–30
–20
–40
–10
RF Input Power PRFin (dBm)
IF Output Power PIFout (dBm)
0
–35
–50
10
IF OUTPUT POWER vs. RF INPUT POWER
0
IF OUTPUT POWER OF EACH TONE,
IM3 vs. RF INPUT POWER
0
–10
Pout
–20
–50
–60
–70
–50
VCC = 2.7 V
–15
–20
fRFin = 900 MHz
fLOin = 1 000 MHz
fIFout = 100 MHz
PLOin = –10 dBm
VCC = VPS = VIFout = 3.0 V
–25
–30
–30
–20
–40
–10
RF Input Power PRFin (dBm)
0
20
10
–40
VCC = 3.0 V
CONVERSION GAIN vs. LO INPUT POWER
20
–30
VCC = 3.3 V
–10
–35
–50
0
IM3
fRFin1 = 900 MHz
fRFin2 = 905 MHz
fLOin = 1 000 MHz
PLOin = –10 dBm
VCC = VPS = VIFout = 3.0 V
fIFout = 100 MHz
–30
–20
–40
–10
RF Input Power PRFin (dBm)
0
Conversion Gain CG (dB)
IF Output Power PIFout (dBm)
IF OUTPUT POWER vs. RF INPUT POWER
15
10
5
0
fRFin = 900 MHz
PRFin = –40 dBm
fLOin = 1 000 MHz
fIFout = 100 MHz
VCC = VPS = VIFout = 3.0 V
–5
–10
–50
Data Sheet P12808EJ3V0DS00
–40
–30
–20
0
–10
LO Input Power PLOin (dBm)
10
μPC8112TB
CONVERSION GAIN vs. SUPPLY VOLTAGE
SSB NOISE FIGURE vs. LO INPUT POWER
20
15
10
5
0
fRFin = 900 MHz
fLOin = 1 000 MHz
fIFout = 100 MHz
VCC = VPS = VIFout = 3.0 V
2
3
3.5
2.5
Supply Voltage VCC (V)
4
SSB Noise Figure SSB•NF (dB)
Conversion Gain CG (dB)
20
18
16
fRFin = 900 MHz
fLOin = 1 000 MHz
fIFout = 100 MHz
VCC = VPS = VIFout = 3.0 V
14
12
10
8
6
–40
–20
–10
–30
LO Input Power PLOin (dBm)
0
CONVERSION GAIN vs.
IF OUTPUT FREQUENCY
20
Conversion Gain CG (dB)
15
10
5
0
–5
–10
fRFin = 900 MHz
PRFin = –40 dBm
PLOin = –10 dBm
VCC = VPS = VIFout = 3.0 V
–15
–20
–25
0
50 100 150 200 250 300 350 400 450 500
IF Output Frequency fIFout (MHz)
Data Sheet P12808EJ3V0DS00
11
μPC8112TB
12.3 IF 100 MHz Matching (fRFin = 1.5 GHz)
0
0
–5
–10
–15
IF Output Power of Each Tone PIFout(each) (dBm)
3rd Order Intermodulation Distortion IM3 (dBm)
fRFin = 1.5 GHz
fLOin = 1.6 GHz
PLOin = –10 dBm
fIFout = 100 MHz
VCC = VPS = VIFout = 3.0 V
–20
–25
–40
–30
–20
–10
0
RF Input Power PRFin (dBm)
IF Output Power PIFout (dBm)
5
–30
–50
12
IF OUTPUT POWER vs. RF INPUT POWER
5
–5
VCC = 3.3 V
IF OUTPUT POWER OF EACH TONE,
IM3 vs. RF OUTPUT POWER
VCC = 2.7 V
–10
VCC = 3.0 V
–15
fRFin = 1.5 GHz
fLOin = 1.6 GHz
PLOin = –10 dBm
fIFout = 100 MHz
VCC = VPS = VIFout = 3.0 V
–20
–25
–30
–50
10
–40
–30
–20
–10
0
RF Input Power PRFin (dBm)
10
CONVERSION GAIN vs. LO INPUT POWER
10
15
0
Pout
–10
–20
–30
–40
–50
–60
–70
–80
–90
–40
IM3
fRFin1 = 1.5 GHz
fRFin2 = 1.505 GHz
fLOin = 1.6 GHz
PLOin = –10 dBm
fIFout = 100 MHz
VCC = VPS = VIFout = 3.0 V
–30
–20
–10
RF Input Power PRFin (dBm)
0
Conversion Gain CG (dB)
IF Output Power PIFout (dBm)
IF OUTPUT POWER vs. RF INPUT POWER
10
5
0
–5
fRFin = 1.5 GHz
fLOin = 1.6 GHz
PRFin = –40 dBm
fIFout = 100 MHz
VCC = VPS = VIFout = 3.0 V
–10
–15
–50
Data Sheet P12808EJ3V0DS00
–40
–30
–20
0
–10
LO Input Power PLOin (dBm)
10
μPC8112TB
CONVERSION GAIN vs. SUPPLY VOLTAGE
SSB NOISE FIGURE vs. LO INPUT POWER
30
10
5
0
fRFin = 1.5 GHz
fLOin = 1.6 GHz
fIFout = 100 MHz
VCC = VPS = VIFout = 3.0 V
2
2.5
3
3.5
4
SSB Noise Figure SSB•NF (dB)
Conversion Gain CG (dB)
15
25
20
15
10
fRFin = 1.5 GHz
fLOin = 1.6 GHz
fIFout = 100 MHz
VCC = VPS = VIFout = 3.0 V
5
0
–40
Supply Voltage VCC (V)
–30
–20
–10
0
LO Input Power PLOin (dBm)
Data Sheet P12808EJ3V0DS00
13
μPC8112TB
12.4 IF 240 MHz Matching
IF OUTPUT POWER vs. RF INPUT POWER
IF OUTPUT POWER vs. RF INPUT POWER
–5
TA = +25°C
–10
TA = –40°C
–15
TA = +85°C
–20
–25
–30
–35
IF Output Power of Each Tone PIFout(each) (dBm)
3rd Order Intermodulation Distortion IM3 (dBm)
–40
–50
14
fRFin = 1.9 GHz
fLOin = 1.66 GHz
PLOin = –10 dBm
fIFout = 240 MHz
VCC = VPS = VIFout = 3.0 V
–30
–20
–40
–10
RF Input Power PRFin (dBm)
IF Output Power PIFout (dBm)
0
IF OUTPUT POWER OF EACH TONE,
IM3 vs. RF INPUT POWER
0
–10
Pout
–30
–50
–60
–70
–50
–15
VCC = 2.7 V
–20
VCC = 3.0 V
–25
fRFin = 1.9 GHz
fLOin = 1.66 GHz
PLOin = –10 dBm
fIFout = 240 MHz
VCC = VPS = VIFout = 3.0 V
–30
–35
–30
–20
–40
–10
RF Input Power PRFin (dBm)
0
15
10
–40
VCC = 3.3 V
–10
CONVERSION GAIN vs. LO INPUT POWER
20
–20
–5
–40
–50
0
IM3
fRFin1 = 1.9 GHz
fRFin2 = 1.905 GHz
fLOin = 1.66 GHz
PLOin = –10 dBm
VCC = VPS = VIFout = 3.0 V
fIFout = 240 MHz
–30
–20
–40
–10
RF Input Power PRFin (dBm)
0
Conversion Gain CG (dB)
IF Output Power PIFout (dBm)
0
10
5
0
–5
fRFin = 1.9 GHz
PRFin = –40 dBm
fLOin = 1.66 GHz
fIFout = 240 MHz
VCC = VPS = VIFout = 3.0 V
–10
–15
–50
Data Sheet P12808EJ3V0DS00
–40
–30
–20
0
–10
LO Input Power PLOin (dBm)
10
μPC8112TB
CONVERSION GAIN vs. SUPPLY VOLTAGE
SSB NOISE FIGURE vs. LO INPUT POWER
20
10
fRFin = 1.9 GHz
PRFin = –40 dBm
fLOin = 1.66 GHz
PLOin = –10 dBm
fIFout = 240 MHz
VCC = VPS = VIFout = 3.0 V
5
0
2
3
3.5
2.5
Supply Voltage VCC (V)
SSB Noise Figure SSB•NF (dB)
Conversion Gain CG (dB)
15
18
16
14
12
10
6
–40
4
–20
–10
–30
LO Input Power PLOin (dBm)
0
5
SSB NOISE FIGURE vs.
OPERATING AMBIENT TEMPERATURE
CONVERSION GAIN vs.
IF OUTPUT FREQUENCY
15
10
5
0
–5
–10
fRFin = 1.9 GHz
PRFin = –40 dBm
PLOin = –10 dBm
VCC = VPS = VIFout = 3.0 V
–15
–20
0
300
400
100
200
500
IF Output Frequency fIFout (MHz)
600
SSB Noise Figure SSB•NF (dB)
15
Conversion Gain CG (dB)
fRFin = 1.9 GHz
fLOin = 1.66 GHz
fIFout = 240 MHz
VCC = VPS = VIFout = 3.0 V
8
14
13
12
11
10
9
8
fRFin = 1.9 GHz
fLOin = 1.66 GHz
PLOin = –10 dBm
VCC = VPS = VIFout = 3.0 V
7
6
5
–40
100
0
60
20
80
40
–20
Operating Ambient Temperature TA (°C)
Remark The graphs indicate nominal characteristics.
Data Sheet P12808EJ3V0DS00
15
μPC8112TB
13. S-PARAMETERS
13.1 Calibrated on pin of DUT
S11
Z
REF 1.0 Units
1
200.0 mUnits/
76.656 Ω –421.67 Ω
hp
S11
Z
REF 1.0 Units
1
200.0 mUnits/
62.711 Ω –224.07 Ω
hp
MARKER 1
500.0 MHz
MARKER 1
500.0 MHz
1
1
2
5
4
RF PORT
VCC = VPS = 3.0V
1:500 MHz 62.711 Ω-j224.07 Ω
2:900 MHz 48.977 Ω-j219.18 Ω
3:1 500 MHz 40.641 Ω-j129.94 Ω
4:1 900 MHz 37.422 Ω-j101.51 Ω
5:2 500 MHz 34.801 Ω-j74.141 Ω
2
3
5
RF PORT
VCC = 3.0V VPS = GND
1:500 MHz 76.656 Ω-j421.67 Ω
2:900 MHz 53.102 Ω-j234.55 Ω
3:1 500 MHz 44.844 Ω-j140.82 Ω
4:1 900 MHz 40.898 Ω-j109.73 Ω
5:2 500 MHz 38.063 Ω-j80.547 Ω
START 0.050000000 GHz
STOP 3.000000000 GHz
4
3
START 0.050000000 GHz
STOP 3.000000000 GHz
S11
Z
REF 1.0 Units
1
200.0 mUnits/
135.53 Ω –575.06 Ω
hp
S11
Z
REF 1.0 Units
1
200.0 mUnits/
169.11 Ω –429.98 Ω
hp
MARKER 1
500.0 MHz
MARKER 1
500.0 MHz
1
1
2
2
5
LO PORT
VCC = VPS = 3.0V
1:500 MHz 169.11 Ω-j429.98 Ω
2:900 MHz 91.875 Ω-j263.7 Ω
3:1 500 MHz 60.781 Ω-j162.56 Ω
4:1 900 MHz 56.789 Ω-j125.66 Ω
5:2 500 MHz 49.652 Ω-j97.602 Ω
4
3
5
LO PORT
VCC = 3.0V VPS = GND
1:500 MHz 135.53 Ω-j575.06 Ω
2:900 MHz 78.266 Ω-j337.66 Ω
3:1 500 MHz 55.883 Ω-j201.43 Ω
4:1 900 MHz 52.734 Ω-j159.63 Ω
5:2 500 MHz 44.262 Ω-j122.66 Ω
START 0.050000000 GHz
STOP 3.000000000 GHz
S22
Z
REF 1.0 Units
1
200.0 mUnits/
201.00 Ω –1.7173 kΩ
hp
16
3
START 0.050000000 GHz
STOP 3.000000000 GHz
S22
Z
REF 1.0 Units
1
200.0 mUnits/
056.56 Ω –1.7468 kΩ
hp
MARKER 1
100.0 MHz
IF PORT
VCC = VPS = 3.0V
1:100 MHz 201.88 Ω-j1.7173 kΩ
2:240 MHz 92.094 Ω-j715.72 Ω
4
MARKER 1
100.0 MHz
START 0.050000000 GHz
STOP 3.000000000 GHz
1
1
2
2
IF PORT
VCC = 3.0V VPS = GND
1:100 MHz 56.56 Ω-j1.7468 kΩ
2:240 MHz 85.5 Ω-j722.22 Ω
Data Sheet P12808EJ3V0DS00
START 0.050000000 GHz
STOP 3.000000000 GHz
μPC8112TB
13.2 IF Output Matching (VCC = VPS = VIFout = 3.0 V) −on Test Circuit−
(This S11 is monitored at IF connector on test circuit fixture)
IF 100 MHz MATCHING
S11 1
hp
U
FS
1:
50.277 Ω
IF 240 MHz MATCHING
–22.559 Ω 70.552 pF
100.000 000 MHz
S11 1
hp
MARKER 1
100 MHz
U
FS 1 :
31.052 Ω
–84.961 mΩ 7.8053 nF
240.000 000 MHz
MARKER 1
240 MHz
1
1
START 50.000 000 MHz
S11
STOP 3 000.000 000 MHz
log MAG. 10 dB/ REF 0 dB
1 : –27.655 dB
hp
102.366 002 MHz
MARKER 1
102.366002 MHz
START 50.000 000 MHz
S11
STOP 3 000.000 000 MHz
log MAG. 10 dB/ REF 0 dB
1 : –13.556 dB
hp
241.770 000 MHz
MARKER 1
241.770000 MHz
1
1
START 90.000 000 MHz
STOP 110.000 000 MHz
START 230.000 000 MHz
STOP 250.000 000 MHz
The data in this page are to make clear the test condition of impedance matched to next stage, not specify the
recommended condition. The S11 smith charts of the test fixture setting IC are normalized to ZO = 50 Ω, because the
IC's load is the measurement equipment of 50 Ω impedance.
In your use, the output return loss value can be helpful information to adjust your circuit matching to next stage.
Data Sheet P12808EJ3V0DS00
17
μPC8112TB
14. PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
2.1±0.1
0.2+0.1
–0.05
0.65
0.65
1.3
2.0±0.2
1.25±0.1
18
Data Sheet P12808EJ3V0DS00
0.15+0.1
–0.05
0 to 0.1
0.7
0.9±0.1
0.1 MIN.
μPC8112TB
15. NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
Keep the track length of the ground pins as short as possible.
(3) The bypass capacitor (example: 1 000 pF) should be attached to the VCC pin.
(4) The matching circuit should be externally attached to the IF output pin.
(5) The DC cut capacitor must be each attached to the input and output pins.
16. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Soldering Condition
Recommended Condition Symbol
Package peak temperature: 235°C or below
IR35-00-3
Time: 30 seconds or less (at 210°C)
Count: 3, Exposure limit: None
VPS
Note
Package peak temperature: 215°C or below
VP15-00-3
Time: 40 seconds or less (at 200°C)
Count: 3, Exposure limit: None
Wave Soldering
Note
Soldering bath temperature: 260°C or below
WS60-00-1
Time: 10 seconds or less
Count: 1, Exposure limit: None
Partial Heating
Note
–
Pin temperature: 300°C
Time: 3 seconds or less (per side of device)
Exposure limit: None
Note
Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Data Sheet P12808EJ3V0DS00
19
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