AON6450 100V N-Channel MOSFET SDMOS TM General Description Product Summary VDS The AON6450 is fabricated with SDMOSTM trench technology that combines excellent RDS(ON) with low gate charge.The result is outstanding efficiency with controlled switching behavior. This universal technology is well suited for PWM, load switching and general purpose applications. 100V ID (at VGS=10V) 52A RDS(ON) (at VGS=10V) < 14.5mΩ RDS(ON) (at VGS = 7V) < 17.5mΩ 100% UIS Tested 100% Rg Tested DFN5X6 Top View D Top View Bottom View 1 8 2 7 3 6 4 5 G PIN1 S Absolute Maximum Ratings TA=25°C unless otherwise noted Symbol Parameter Drain-Source Voltage VDS Gate-Source Voltage Continuous Drain Current VGS TC=25°C Pulsed Drain Current C Continuous Drain Current V A 110 9 IDSM TA=70°C ±25 33 IDM TA=25°C Units V 52 ID TC=100°C Maximum 100 A 7 Avalanche Current C IAR 41 A Repetitive avalanche energy L=0.1mH C TC=25°C EAR 84 mJ Power Dissipation B TC=100°C TA=25°C Power Dissipation A Junction and Storage Temperature Range Rev 1: May 2011 2.3 Steady-State Steady-State RθJA RθJC www.aosmd.com W 1.4 TJ, TSTG Symbol t ≤ 10s W 33 PDSM TA=70°C Thermal Characteristics Parameter Maximum Junction-to-Ambient A Maximum Junction-to-Ambient A D Maximum Junction-to-Case 83 PD -55 to 150 Typ 14 40 1 °C Max 17 55 1.5 Units °C/W °C/W °C/W Page 1 of 7 AON6450 Electrical Characteristics (TJ=25°C unless otherwise noted) Symbol Parameter STATIC PARAMETERS BVDSS Drain-Source Breakdown Voltage Conditions Min ID=250µA, VGS=0V 100 Typ 10 Zero Gate Voltage Drain Current IGSS Gate-Body leakage current VGS(th) Gate Threshold Voltage VDS=VGS ID=250µA 2.8 ID(ON) On state drain current VGS=10V, VDS=5V 110 TJ=55°C 50 VDS=0V, VGS= ±25V 100 VGS=10V, ID=20A 3.3 12.1 14.5 22.8 27.5 VGS=7V, ID=20A 14 17.5 VDS=5V, ID=20A 52 Static Drain-Source On-Resistance gFS Forward Transconductance VSD Diode Forward Voltage IS=1A,VGS=0V 0.7 Maximum Body-Diode Continuous Current G DYNAMIC PARAMETERS Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance Rg Gate resistance VGS=0V, VDS=50V, f=1MHz VGS=0V, VDS=0V, f=1MHz SWITCHING PARAMETERS Qg(10V) Total Gate Charge Qgs Gate Source Charge Qgd Gate Drain Charge tD(on) Turn-On DelayTime tr Turn-On Rise Time tD(off) Turn-Off DelayTime 3.8 VGS=10V, VDS=50V, ID=20A µA nA V A RDS(ON) TJ=125°C Units V VDS=100V, VGS=0V IDSS IS Max mΩ mΩ S 1 V 85 A 3100 pF 2000 2570 170 250 330 pF 50 80 120 pF 0.4 0.8 1.2 Ω 34 43 52 nC 11 14 17 nC 8 13.5 19 nC VGS=10V, VDS=50V, RL=2.5Ω, RGEN=3Ω 15 ns 5 ns 28.5 ns tf Turn-Off Fall Time trr Body Diode Reverse Recovery Time IF=20A, dI/dt=500A/µs 17 24 31 Qrr Body Diode Reverse Recovery Charge IF=20A, dI/dt=500A/µs 75 108 140 5 ns ns nC A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The Power dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any given application depends on the user's specific board design, and the maximum temperature of 150°C may be used if the PCB allow s it. B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep initial TJ =25°C. D. The RθJA is the sum of the thermal impedance from junction to case RθJC and case to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse ratin g. G. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Rev 1: May 2011 www.aosmd.com Page 2 of 7 AON6450 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 110 110 10V 100 7V 90 7.5V 90 6.5V 80 70 70 60 60 ID(A) ID (A) 80 50 6V 40 VDS=5V 100 50 40 30 30 20 10 10 0 0 0 1 2 3 125°C 20 VGS=5.5V 4 25°C 0 5 2 3 4 5 6 7 8 VGS(Volts) Figure 2: Transfer Characteristics (Note E) VDS (Volts) Fig 1: On-Region Characteristics (Note E) 16 Normalized On-Resistance 2.2 15 VGS=7V RDS(ON) (mΩ ) 1 14 13 VGS=10V 12 2 VGS=10V ID=20A 1.8 17 5 2 VGS=7V10 1.6 1.4 1.2 ID=20A 1 0.8 11 0 5 0 10 15 20 25 30 ID (A) Figure 3: On-Resistance vs. Drain Current and Gate Voltage (Note E) 25 50 75 100 125 150 175 0 Temperature (°C) Figure 4: On-Resistance vs. Junction Temperature 18 (Note E) 30 1.0E+02 ID=20A 1.0E+01 25 40 125°C 20 IS (A) RDS(ON) (mΩ ) 1.0E+00 125°C 1.0E-01 1.0E-02 15 1.0E-03 10 25°C 25°C 1.0E-04 1.0E-05 5 5 6 7 8 9 10 VGS (Volts) Figure 5: On-Resistance vs. Gate-Source Voltage (Note E) Rev 1: May 2011 www.aosmd.com 0.0 0.2 0.4 0.6 0.8 VSD (Volts) Figure 6: Body-Diode Characteristics 1.0 (Note E) Page 3 of 7 AON6450 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 3500 10 VDS=50V ID=20A 3000 Ciss Capacitance (pF) VGS (Volts) 8 6 4 2500 2000 1500 Coss 1000 2 Crss 500 0 0 0 10 20 30 40 0 50 Qg (nC) Figure 7: Gate-Charge Characteristics 20 40 60 80 VDS (Volts) Figure 8: Capacitance Characteristics 400 1000.0 TJ(Max)=150°C TC=25°C 350 10µs 100.0 RDS(ON) limited 10.0 300 10µs Power (W) ID (Amps) 100 100µs DC 1ms 1.0 TJ(Max)=150°C TC=25°C 0.1 250 17 5 2 10 200 150 100 50 0.0 0 0.01 0.1 1 10 VDS (Volts) 100 1000 0.0001 0.001 0.01 0.1 1 0 10 Pulse Width (s) 18 Figure 10: Single Pulse Power Rating Junction-toCase (Note F) Figure 9: Maximum Forward Biased Safe Operating Area (Note F) Zθ JC Normalized Transient Thermal Resistance 10 D=Ton/T TJ,PK=TC+PDM.ZθJC.RθJC In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 40 RθJC=1.5°C/W 1 0.1 PD Single Pulse Ton T 0.01 0.00001 0.0001 0.001 0.01 0.1 1 10 100 Pulse Width (s) Figure 11: Normalized Maximum Transient Thermal Impedance (Note F) Rev 1: May 2011 www.aosmd.com Page 4 of 7 AON6450 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 90 TA=25°C 80 50 Power Dissipation (W) IAR (A) Peak Avalanche Current 60 TA=100°C 40 TA=150°C 30 20 10 TA=125°C 70 60 50 40 30 20 10 0 0 0 0.000001 0.00001 0.0001 Time in avalanche, tA (s) Figure 12: Single Pulse Avalanche capability (Note C) 25 50 75 100 150 10000 60 TA=25°C 50 1000 40 Power (W) Current rating ID(A) 125 TCASE (°C) Figure 13: Power De-rating (Note F) 30 20 17 5 2 10 100 10 10 1 0.0001 0 0 25 50 75 100 125 0.01 1 100 TCASE (°C) Figure 14: Current De-rating (Note F) 10000 0 18 150 Pulse Width (s) Figure 15: Single Pulse Power Rating Junction-toAmbient (Note G) Zθ JA Normalized Transient Thermal Resistance 10 D=Ton/T TJ,PK=TA+PDM.ZθJA.RθJA 1 In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 40 RθJA=55°C/W 0.1 PD 0.01 Ton Single Pulse T 0.001 0.0001 0.001 0.01 0.1 1 10 100 1000 Pulse Width (s) Figure 16: Normalized Maximum Transient Thermal Impedance (Note G) Rev 1: May 2011 www.aosmd.com Page 5 of 7 AON6450 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 26 180 30 20 16 Qrr 90 125ºC 0.8 10 12 30 25ºC Irm 5 10 15 20 25 0 30 0 0 IS (A) Figure 17: Diode Reverse Recovery Charge and Peak Current vs. Conduction Current 210 180 125ºC 22 25ºC 18 10 15 125ºC Qrr 10 60 25ºC 125ºC 30 Irm 0 2 0 200 400 600 800 1000 trr 20 1 25ºC 15 25ºC 0.5 S 5 125ºC 0 0 0 di/dt (A/µ µs) Figure 19: Diode Reverse Recovery Charge and Peak Current vs. di/dt Rev 1: May 2011 1.5 25 10 6 30 2 trr (ns) 90 14 25 Is=20A 35 Irm (A) 120 20 40 30 150 Qrr (nC) 5 IS (A) Figure 18: Diode Reverse Recovery Time and Softness Factor vs. Conduction Current 26 Is=20A 0.4 125ºC 8 0 25ºC S 5 10 0 1.2 25ºC 15 14 60 1.6 trr trr (ns) 18 25ºC 20 Irm (A) Qrr (nC) 150 125ºC di/dt=800A/µs 25 22 120 2 24 S 125ºC di/dt=800A/µs S 210 www.aosmd.com 200 400 600 800 1000 di/dt (A/µ µs) Figure 20: Diode Reverse Recovery Time and Softness Factor vs. di/dt Page 6 of 7 AON6450 Gate Charge Test Circuit & Waveform Vgs Qg 10V + + Vds VDC - Qgs Qgd VDC - DUT Vgs Ig Charge Resistive Switching Test Circuit & Waveforms RL Vds Vds Vgs 90% + Vdd DUT VDC - Rg 10% Vgs Vgs td(on) tr td(off) ton tf toff Unclamped Inductive Switching (UIS) Test Circuit & Waveforms L 2 EAR= 1/2 LIAR Vds BVDSS Vds Id + Vdd Vgs Vgs I AR VDC - Rg Id DUT Vgs Vgs Diode Recovery Test Circuit & Waveforms Q rr = - Idt Vds + DUT Vgs Vds Isd Vgs Ig Rev 1: May 2011 L Isd + Vdd t rr dI/dt I RM Vdd VDC - IF Vds www.aosmd.com Page 7 of 7