REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Paragraph 1.5, correct maximum total dose available from 300 Krads (Si) to ≥ 300 Krads (Si). Paragraph 4.3.5.1a, last sentence, correct 5962F0824601 to 5962F0921001. Update boilerplate paragraphs. -gz 11-04-05 Charles F. Saffle REV SHEET REV SHEET REV STATUS REV A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Gary Zahn STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http://www.dscc.dla.mil CHECKED BY Greg Cecil APPROVED BY Charles F. Saffle DRAWING APPROVAL DATE 09-07-15 REVISION LEVEL A MICROCIRCUIT, HYBRID, LINEAR, POSITIVE, LOW DROPOUT, FIXED VOLTAGE REGULATOR SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 1 OF 5962-08246 11 5962-E195-11 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 Federal stock class designator \ F RHA designator (see 1.2.1) 01 Device type (see 1.2.2) 08246 / K Device class designator (see 1.2.3) X Case outline (see 1.2.4) X Lead finish (see 1.2.5) \/ Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device types The device types identify the circuit function as follows: Device type 01 02 Generic number MSK 5823-1.8RH MSK 5823-2.5RH Circuit function Radiation hardened, 3.5 A, 1.8 V voltage regulator Radiation hardened, 3.5 A, 2.5 V voltage regulator 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C, and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-08246 A REVISION LEVEL A SHEET 2 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals X Y See figure 1 See figure 1 8 8 Package style Flat pack with gull wing leads, glass sealed Flat pack with straight leads, glass sealed 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Input voltage (VIN) ...................................................................... Output current ............................................................................ Junction temperature (TJ) .......................................................... Thermal resistance, junction-to-case (JC), TC = +125C ........... Storage temperature .................................................................. Lead temperature (soldering, 10 seconds) ................................ +7.0 V dc 3.5 A 2/ +150C 6.5C/W -65C to +150C +300C 1.4 Recommended operating conditions. Input voltage range (VIN) ............................................................ Case operating temperature range (TC)..................................... +2.9 V dc to +6.5 V dc -55C to +125C 1.5 Radiation features. Maximum total dose available .................................................. ≥ 300 Krads (Si) 3/ 4/ 5/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 1/ 2/ 3/ 4/ 5/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Output current limit is dependent on the value of VIN - VOUT . These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end-point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883, method 1019, condition A. Dose rate shall be in accordance with MIL-STD-883, method 1019, condition A. Bipolar device types may degrade from displacement damage from radiation which could affect RHA levels. These device types have not been characterized for displacement damage. See figure 3. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-08246 A REVISION LEVEL A SHEET 3 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Radiation exposure circuits. The radiation exposure circuits shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of devices. Marking of devices shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DLA Land and Maritime-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime-VA shall affirm that the manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-08246 A REVISION LEVEL A SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Output voltage VOUT Conditions 1/ 2/ 3/ -55C TC +125C unless otherwise specified Group A subgroups VIN = 3.3 V, IOUT = 1.5 A 1 2.97 V VIN 3.63 V 50 mA IOUT 3.0 A 1,2,3 M,D,P,L,R,F 1/ Dropout voltage VDO IOUT = 3.0 A 4/ 1 1,2,3 IOUT = 3.0 A Limits Device type Unit Min Max 01 1.782 1.818 02 2.475 2.525 01 1.710 1.890 02 2.375 2.625 01 1.710 1.890 02 2.375 2.625 01 1.1 02 0.5 V V Current limit 5/ IOUT VIN = 3.3 V 1,2,3 01,02 3.0 Shutdown threshold VST VIN = 3.3 V 1,2,3 01,02 1.0 1.6 V Output voltage at shutdown VOUTSD VIN = VSHDN = 3.3 V, IOUT = 50 mA 1,2,3 01,02 -0.1 +0.1 V 1/ 2/ 3/ 4/ 5/ A Device types 01 and 02 have been characterized through all levels M, D, P, L, R, F of irradiation and tested to 1.5 times at the F level. Pre and post irradiation values are identical unless otherwise specified in table I. When performing post irradiation electrical measurements for any RHA level, TC = +25C. Unless otherwise specified, VIN = 3.3 V, VSHUTDOWN = 0 V, and IOUT = 50 mA. These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end-point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883, method 1019, condition A. Dropout is limited by the minimum value of VIN. Current limit is dependent upon the value of VIN. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-08246 A REVISION LEVEL A SHEET 5 Case outline X. Symbol A A1 øb D/E D1 e e1 L L1 R S1 Millimeters Min Max --4.83 0.076 0.18 0.58 0.69 18.92 19.18 27.18 27.69 2.54 TYP 7.49 7.75 2.79 3.81 0.76 1.27 0.76 REF 5.21 6.22 Inches Min Max --.190 .003 .007 .023 .027 .745 .755 1.070 1.090 .100 TYP .295 .305 .110 .150 .030 .050 .030 REF .205 .245 NOTES: 1. A1 is measured from the bottom of the lead to the bottom of the package. 2. Pin 1 is indicated by the ESD marking on the package. Pin numbers are for reference only. 3. The U. S. Government preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall take precedence. 4. Case outline X weight: 5.5 grams typical. FIGURE 1. Case outlines. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-08246 A REVISION LEVEL A SHEET 6 Case outline Y. Symbol A A1 øb D/E e e1 L S1 Millimeters Min Max --4.57 1.78 2.03 0.58 0.69 18.92 19.18 2.54 TYP 7.49 7.75 10.16 --5.21 6.22 Inches Min Max --.180 .070 .080 .023 .027 .745 .755 .100 TYP .295 .305 .400 --.205 .245 NOTES: 1. Pin 1 is indicated by the ESD class marking. Pin numbers are for reference. 2. The U. S. Government preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall take precedence. 3. Pin numbers are for reference only. 4. Case outline Y weight: 5.8 grams typical. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-08246 A REVISION LEVEL A SHEET 7 Device types 01 and 02 Case outlines X and Y Terminal number Terminal symbol 1 GND 2 GND 3 SHUTDOWN 4 NO CONNECT 5 VOUT 6 VOUT 7 VIN 8 VIN FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-08246 A REVISION LEVEL A SHEET 8 Device types 01 and 02. FIGURE 3. Radiation exposure circuits. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-08246 A REVISION LEVEL A SHEET 9 TABLE II. Electrical test requirements. MIL-PRF-38534 test requirements Subgroups (in accordance with MIL-PRF-38534, group A test table) Interim electrical parameters --- Final electrical parameters 1*, 2, 3 Group A test requirements 1, 2, 3 Group C end-point electrical parameters 1, 2, 3 End-point electrical parameters for radiation hardness assurance (RHA) devices 1 * PDA applies to subgroup 1. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. b. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DLA Land and Maritime-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TC = +125C minimum. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance with MIL-PRF-38534 and as specified herein. 4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, 8, 9, 10, and 11 shall be omitted. 4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534. 4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows: a. End-point electrical parameters shall be as specified in table II herein. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-08246 A REVISION LEVEL A SHEET 10 b. Steady-state life test, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DLA Land and Maritime-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TC = +125C minimum. (3) Test duration: 1,000 hours minimum as specified in 1005 of MIL-STD-883. 4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534. 4.3.5 Radiation Hardness Assurance (RHA) inspection. RHA qualification is required for those devices with the RHA designator as specified herein. End-point electrical parameters for radiation hardness assurance (RHA) devices shall be specified in table II. Radiation testing will be in accordance with the qualifying activity (DLA Land and Maritime-VQ) approved plan and with MIL-PRF-38534, Appendix G. 4.3.5.1 Total dose irradiation testing. Total dose irradiation testing shall be in accordance with MIL-STD-883 method 1019, condition A and as specified herein. Sample testing in accordance with table I shall be performed on a representative device type (similar device) at initial qualification and after any design or process changes which may affect the RHA response. Sample size is a minimum of 8 devices (4 biased and 4 not biased). This sample testing is repeated for each new combination for wafers of active elements on the most complex device. a. Similar device, in this application, means that if two or more device types have the same schematic function (same active circuit design) and contain the same microcircuit and semiconductor elements, then the devices may be considered similar and sample radiation testing would be performed on the device that is most complex of the similar devices. The device types on drawings 5962-08246, 5962-09208, 5962-09209, and 5962-09210 are similar device types. Device type 5962F0921001 is considered the most complex device. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534. 6.4 Record of users. Military and industrial users shall inform DLA Land and Maritime when a system application requires configuration control and the applicable SMD. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-0547. 6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-1081. 6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103 and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DLA Land and Maritime-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-08246 A REVISION LEVEL A SHEET 11 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 11-04-05 Approved sources of supply for SMD 5962-08246 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962F0824601HXA 5962F0824601HXC 5962F0824601HYA 5962F0824601HYC 51651 51651 51651 51651 MSK 5823-1.8HRHG MSK 5823-1.8HRHG MSK 5823-1.8HRH MSK 5823-1.8HRH 5962F0824602HXA 5962F0824602HXC 5962F0824602HYA 5962F0824602HYC 51651 51651 51651 51651 MSK 5823-2.5HRHG MSK 5823-2.5HRHG MSK 5823-2.5HRH MSK 5823-2.5HRH 5962F0824601KXA 5962F0824601KXC 5962F0824601KYA 5962F0824601KYC 51651 51651 51651 51651 MSK 5823-1.8KRHG MSK 5823-1.8KRHG MSK 5823-1.8KRH MSK 5823-1.8KRH 5962F0824602KXA 5962F0824602KXC 5962F0824602KYA 5962F0824602KYC 51651 51651 51651 51651 MSK 5823-2.5KRHG MSK 5823-2.5KRHG MSK 5823-2.5KRH MSK 5823-2.5KRH 1/ 2/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its availability. Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 51651 Vendor name and address M. S. Kennedy Corporation 4707 Dey Road Liverpool, NY 13088 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.