REVISIONS LTR DESCRIPTION A Add device -01XE. Add case Y JC limit. - ro DATE APPROVED 11-01-04 C. SAFFLE CURRENT DESIGN ACTIVITY CAGE CODE 16236 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV A A A A A A A A A A A A A PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Phu H. Nguyen Original date of drawing YY-MM-DD CHECKED BY 08-01-16 Phu H. Nguyen APPROVED BY Thomas M. Hess SIZE A REV AMSC N/A CODE IDENT. NO. DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 TITLE MICROCIRCUIT, DIGITAL-LINEAR, SINGLE SYNCHRONOUS BUCK PULSE MODULATION (PWM) CONTROLLER, MONOLITHIC SILICON DWG NO. V62/08610 16236 A PAGE 1 OF 13 5962-V024-11 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance single synchronous buck pulse width modulation (PWM) controller microcircuit, with an operating temperature range of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturer’s PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/08610 - Drawing number 01 X B Device type (See 1.2.1) Case outline (See 1.2.2) Lead finish (See 1.2.3) 1.2.1 Device type(s). Generic Device type 01 Circuit function ISL6406 Single synchronous buck pulse width modulation (PWM) controller 1.2.2 Case outline(s). The case outlines are as specified herein. Outline letter Number of pins X Y 16 16 JEDEC PUB 95 Package style N/A MO-153 Plastic quad flat Plastic thin shrink small outline 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture: Finish designator A B C D E Z DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO Material Hot solder dip Tin-lead plate Gold plate Palladium Gold flash palladium Other SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08610 PAGE 2 1.3 Absolute maximum ratings. 1/ Supply voltage range, ( VCC ) .............................................................................................. +7.0 V Absolute boot voltage, (VBOOT) ........................................................................................... +15.0 V Upper driver supply voltage, VBOOT – VPHASE ................................................................... +6.0 V Input, Output or I/O voltage .................................................................................................. Maximum junction temperature range .................................................................................. Maximum storage temperature range .................................................................................. Thermal resistance, junction to ambient (θJA) : Case X .............................................................................................................................. Case Y .............................................................................................................................. Thermal resistance, junction to case (θJC) : Case X .............................................................................................................................. Case Y (top) ..................................................................................................................... Electrostatic discharge (ESD) .............................................................................................. GND -0.3 V to VCC +0.3 V -55C to 150C 2/ -65C to 150C 35C/W 90C/W 3/ 4/ 4.5C/W 5/ 27C/W Class 2 1.4 Recommended operating conditions. Supply voltage range ( VCC ) ................................................................................................... 3.3 V ±10% Operating free-air temperature range ( TA ) ............................................................................. -55C to +125C 1/ 2/ 3/ 4/ 5/ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Continuous operation at a TJ 125C and at maximum conditions will reduce the life expectancy of the device to as little as two years. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See manufacturer data for more information. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See manufacturer data for more information. JC, the “case temp” location is the center of the exposed metal pad on the package underside. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08610 PAGE 3 2. APPLICABLE DOCUMENTS JEDEC PUB 95 – Registered and Standard Outlines for Semiconductor Devices (Applications for copies should be addressed to the JEDEC Office, 3103 North 10th Street, Suite 240-S, Arlington, VA 22201-2107 or online at http://www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturer’s part number as shown in 6.3 herein and as follows: A. B. C. Manufacturer’s name, CAGE code, or logo Pin 1 identifier ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturer’s part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. 3.5.3 Block diagram. The block diagram shall be as shown in figure 3. 3.5.4 RT versus frequency. RT versus frequency shall be as shown in figure 4. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08610 PAGE 4 TABLE I. Electrical performance characteristics. 1/ Test Symbol Conditions 2/ unless otherwise specified Limits Min Unit Typical Max 20 55 µA 9.8 11.5 mA VCC supply section Shutdown supply current SYNC/EN = GND Operating supply current 3/ 6.5 RT = 64.9 k Reference voltage section Nominal reference voltage 0.8 Reference voltage tolerance V -2.1 2.1 Error amplifier section Open loop voltage gain 4/ Gain bandwidth product 4/ Slew rate 82 dB 14 4/ MHz COMP = 10 pF 4.65 6.0 9.2 V/µs VCC = 3.3 V, no load 4.7 5.1 5.5 V 5.1 % Charge pump section Nominal charge pump output Charge pump output regulation -5.1 Power on reset section Rising CPVOUT POR threshold 4.1 4.35 4.6 CPVOUT POR threshold hysteresis 0.3 0.5 0.9 RT = 200 k 77 100 122 RT = 64.9 k 247 300 341 RT = 26.1 k 646 715 775 Peak-to-peak ∆VOSC 1.1 1.4 1.7 V 1.1 times the natural switching frequency 110 770 kHz 100 ns V Oscillator section Gate output frequency range Sawtooth amplitude Synchronous frequency range 4/ Minimum synchronous pulse width 4/ 40 PWM maximum duty cycle kHz 96 % See footnote at end of table. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08610 PAGE 5 TABLE I. Electrical performance characteristics - Continued. 1/ Test Gate driver output section Upper gate source current Symbol Limits Conditions 2/ unless otherwise specified Min Typical Max 4/ VBOOT – VPHASE = 4 V Upper gate sink current Lower gate source current Unit VVCC = 3.3 V, VLGATE = 4 V Lower gate sink current -1 A 1 A -1 A 2 A Soft start section Soft start slew rate f = 300 kHz 6.2 Internal digital circuit clock count (Soft start time varies with frequency) 6.7 7.8 ms Clk cycles 2048 Overcurrent section OCSET current source 16 20 23 µA 1/ Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization and/or design. 2/ Over recommended operating conditions. All typical values are for TA = +25C and VCC = 3.3 V, unless otherwise noted. 3/ This is the VCC current consumed when the device is active but not switching. 4/ Guaranteed by design. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08610 PAGE 6 Case X Symbol A A1 A2 b D/E Dimension Millimeters Symbol Min Max 0.80 1.00 D1/E1 0.05 e 1.00 e1 0.28 0.40 S 5.00 BSC P Millimeters Min Max 4.75 BSC 0.80 BSC 2.40 BSC 0.35 0.75 0.60 NOTES: 1. Dimension b applies to the metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. 2. The configuration of the pin 1 identifier is optional, but must be located within the zone indicated. The pin 1 identifier may be either a mold or mark feature. 3. Nominal dimensions are provided to assist with printed circuit board land pattern design efforts, see manufacturer data for more information. 4. Features and dimensions A2, D1, E1 and P are present when anvil singulation method is used and not present for saw singulation FIGURE 1. Case outlines. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08610 PAGE 7 Case Y Symbol A A1 A2 b c D Dimension Millimeters Symbol Min Max 1.10 E 0.05 0.15 e 0.80 1.05 E1 0.19 0.30 L 0.09 0.20 α 4.90 5.10 Millimeters Min Max 4.30 4.50 0.65 BSC 6.25 6.50 0.50 0.70 0o 8o NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-153 AB. 2. Dimensions “D and E1” do not include mold flash, interlead flash, protrusion or gate burrs. Mold flash, interlead flash, protrusion or gate burrs shall not exceed 0.15 mm per side. 3. “L” is the length of terminal for soldering to a substrate. 4. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07 mm. FIGURE 1. Case outlines – Continued. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08610 PAGE 8 Terminal number Case X Case Y Terminal symbol Terminal symbol 1 CPVOUT GND 2 OCSET LGATE 3 CT1 CPVOUT 4 CT2 OCSET 5 RT CT1 6 SYNC/EN CT2 7 FB RT 8 VOUT SYNC/EN 9 COMP FB 10 CPGND VOUT 11 VCC COMP 12 PHASE CPGND 13 BOOT VCC 14 UGATE PHASE 15 GND BOOT 16 LGATE UGATE FIGURE 2. Terminal connections. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08610 PAGE 9 Terminal symbol Terminal Description CPVOUT This pin represents the output of the charge pump. The voltage at this pin is the bias voltage for the integrated circuit. Connect a decoupling capacitor from this pin to ground. The value of the decoupling capacitor should be at least 10x the value of the charge pump capacitor. This pin may be tied to the bootstrap circuit as the source for creating the BOOT voltage. CT1, CT2 These pins are the connections for the external charge pump capacitor. A minimum of a 0.1 µF ceramic capacitor is recommended for proper operation of the integrated circuit. Connect a resistor (ROCSET) from this pin to the drain of the upper MOSFET(VIN). ROCSET, an internal 20 µA current OCSET source (IOCSET), and the upper metal oxide semiconductor field effect transistor (MOSFET) on resistance (rDS(ON)) set (I )(ROCSET ) the converter overcurrent (OC) trip point according to this equation: IPEAK = OCSET An overcurrent trip r DS( ON) cycles the soft start function. VOUT VCC This pin is not used and should be left open. This pin provides bias supply for the integrated circuit. Connect a well decoupled 3.3 V supply to this pin. PHASE Connect this pin to the upper MOSFET’s source. This pin is used to monitor the voltage drop across the upper MOSFET for overcurrent protection. RT Connect an external resistor from this pin to ground for frequency selection. Refer to RT versus frequency curve shown in figure 4 BOOT This pin provides ground referenced bias voltage to the upper MOSFET driver. A bootstrap circuit is used to create a voltage suitable to drive a logic level N-Channel MOSFET. A large (~1 M) resistor should be connected from the pin to GND. The purpose of this resistor is to discharge the BOOT pin during a shutdown condition, SYNC/EN = LOW so that the gate drivers are quickly powered off by this bleed resistor. UGATE Connect this pin to the upper MOSFET’s gate. This pin provides the PWM controlled gate drive for the upper MOSFET. This pin is also monitored by the adaptive shoot-through protection circuitry to determine when the upper MOSFET has turned off. GND This pin represents the signal and power ground for the integrated circuit. Tie this pin to the ground island/plane through the lowest impedance connection available. LGATE Connect this pin to the lower MOSFET’s gate. This pin provides the PWM controlled gate drive for the lower MOSFET. This pin is also monitored by the adaptive shoot-through protection circuitry to determine when the lower MOSFET has turned off. CMOP, FB COMP and FB are the available external pins of the error amplifier. The FB pin is the inverting input of the internal error amplifier and the COMP pin is the error amplifier output. These pins are used to compensate the control feedback loop of the converter. CPGND SYNC/EN This pin represents the signal and power ground for the charge pump. Tie this pin to the ground island/plane through the lowest impedance connection available. This is a dual function pin. To synchronize with an external clock, apply a clock with a frequency 1.1 to 2.0 times higher than the part’s natural frequency to this pin. The device may be disabled by tying this pin to ground. In this shutdown mode, all functions are disabled and the device will draw 55 µA supply current. FIGURE 2. Terminal connections - Continued. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08610 PAGE 10 FIGURE 3. Block diagram. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08610 PAGE 11 FIGURE 4. RT versus frequency. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08610 PAGE 12 4. VERIFICATION 4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices, classification, packaging, and labeling of moisture sensitive devices, as applicable. 5. PREPARATION FOR DELIVERY 5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturer’s standard commercial practices for electrostatic discharge sensitive devices. 6. NOTES 6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum. 6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturer’s data book. The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided. 6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee of present or continued availability as a source of supply for the item. Vendor item drawing administrative control number 1/ Device manufacturer CAGE code Vendor part number 2/ Top side marking V62/08610-01XB 34371 ISL6406MREP ISL6406MREP V62/08610-01YB 34371 ISL6406MVEP ISL6406MVEP V62/08610-01XE 34371 ISL6406MREPZ ISL6406MREPZ 1/ The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation. 2/ Add –TK suffix to vendor part number for 1000 piece quantity with tape and reel packaging option. CAGE code 34371 DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO Source of supply Intersil Corporation 1001 Murphy Ranch Road Milpitas, CA 95035-6803 SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08610 PAGE 13