V6208609

REVISIONS
LTR
DESCRIPTION
A
Update paragraphs to current requirements. - ro
DATE
APPROVED
12-04-04
C. SAFFLE
CURRENT DESIGN ACTIVITY CAGE CODE 16236
HAS CHANGED NAMES TO:
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
Prepared in accordance with ASME Y14.24
Vendor item drawing
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PMIC N/A
PREPARED BY
RICK OFFICER
Original date of drawing
YY-MM-DD
CHECKED BY
RAJESH PITHADIA
07-12-18
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
TITLE
MICROCIRCUIT, LINEAR, DUAL LOW DROPOUT
REGULATOR, MONOLITHIC SILICON
APPROVED BY
ROBERT M. HEBER
SIZE
CODE IDENT. NO.
A
REV
AMSC N/A
DWG NO.
V62/08609
16236
A
PAGE
1
OF
13
5962-V019-13
1. SCOPE
1.1 Scope. This drawing documents the general requirements of a high performance dual low dropout (LDO) regulator microcircuit,
with an operating temperature range of -55°C to +125°C.
1.2 Vendor Item Drawing Administrative Control Number. The manufacturer’s PIN is the item of identification. The vendor item
drawing establishes an administrative control number for identifying the item on the engineering documentation:
V62/08609
-
Drawing
number
01
X
B
Device type
(See 1.2.1)
Case outline
(See 1.2.2)
Lead finish
(See 1.2.3)
1.2.1 Device type(s).
Device type
Generic
01
ISL9000A
Circuit function
Dual low dropout (LDO) regulator
1.2.2 Case outline(s). The case outline(s) are as specified herein.
Outline letter
Number of pins
X
10
JEDEC PUB 95
Package style
MO-229
Dual leadless plastic package,
VOUT1 = 3.3 V, VOUT2 = 1.8 V
1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer:
Finish designator
A
B
C
D
E
Z
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
Material
Hot solder dip
Tin-lead plate
Gold plate
Palladium
Gold flash palladium
Other
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/08609
PAGE
2
1.3 Absolute maximum ratings.
1/
Supply voltage range (VIN) ......................................................................................... +6.0 V
All other pins .............................................................................................................. -0.3 V to VIN + 0.3 V
Power dissipation (PD) :
TA = 100°C ............................................................................................................. 590 mW
TA = 125°C ............................................................................................................. 295 mW
Junction temperature (TJ) .......................................................................................... +150°C
Storage temperature range (TSTG) ............................................................................ -65°C to +150°C
Maximum lead temperature (soldering 10 seconds) .................................................. +300°C
Thermal resistance, junction to case (θJC) ................................................................. 10°C/W 2/
Thermal resistance, junction to ambient (θJA) ............................................................ 50°C/W 3/
1.4 Recommended operating conditions. 4/
Supply voltage range (VIN) ........................................................................................ 2.3 V to 5.5 V
Operating free-air temperature range (TA) ................................................................. -55°C to +125°C
1/
2/
3/
4/
Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under
“recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may
affect device reliability.
For θJC, the case temperature location is the center of the exposed metal pad on the package underside.
The θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with direct attach
features. See manufacturer’s technical brief TB379.
Use of this product beyond the manufacturers design rules or stated parameters is done at the user’s risk. The manufacturer
and/or distributor maintain no responsibility or liability for product used beyond the stated limits.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/08609
PAGE
3
2. APPLICABLE DOCUMENTS
JEDEC Solid State Technology Association
JEDEC PUB 95
–
Registered and Standard Outlines for Semiconductor Devices
(Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA
22201-3834 or online at http://www.jedec.org) .
3. REQUIREMENTS
3.1 Marking. Parts shall be permanently and legibly marked with the manufacturer’s part number as shown in 6.3 herein and as
follows:
A.
B.
C.
Manufacturer’s name, CAGE code, or logo
Pin 1 identifier
ESDS identification (optional)
3.2 Unit container. The unit container shall be marked with the manufacturer’s part number and with items A and C (if applicable)
above.
3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are
as specified in 1.3, 1.4, and table I herein.
3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein.
3.5 Diagrams.
3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1.
3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2.
3.5.3 Block diagram. The block diagram shall be as shown in figure 3.
3.5.4 Timing waveforms. The timing waveforms shall be as shown in figure 4.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
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4
TABLE I. Electrical performance characteristics. 1/
Test
Symbol
Conditions 2/
Temperature,
TA
Device
type
Limits
Unit
Min
Max
2.3
5.5
V
35
µA
56
µA
1.3
µA
1.9
2.3
V
1.6
2.0
V
-0.7
+0.7
%
TJ = +25°C
-0.8
+0.8
%
-55°C to +125°C
-1.8
+1.8
%
100
mA
50
mA
600
mA
500
mV
375
mV
DC characteristics section
Supply voltage
VIN
Ground current
IDD1
One LDO active
Quiescent condition:
IO1 = 0 µA, IO2 = 0 µA
IDD2
Both LDO active
Quiescent condition:
IO1 = 0 µA, IO2 = 0 µA
-55°C to +125°C
01
-55°C to +125°C
01
Shutdown current
IDDS
-55°C to +125°C
01
Under voltage lock out
(UVLO) threshold
VUV+
-55°C to +125°C
01
VUVRegulation voltage
accuracy
Initial accuracy at VIN = VO + 0.5 V,
IO = 10 mA
VIN = VO + 0.5 V to 5.5 V,
IO = 10 µA to 100 mA
Maximum output
current
01
TJ = +25°C
IMAX
Continuous
01
TJ = +125°C
TJ = +150°C
Internal current limit
ILIM
Dropout voltage 3/
VDO1
IO = 100 mA, VO < 2.5 V
VDO3
IO = 100 mA, VO > 2.8 V
Thermal shutdown
temperature
-55°C to +125°C
01
-55°C to +125°C
01
01
+25°C
TSD+
350
145 typical
°C
110 typical
TSDSee footnotes at end of table.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/08609
PAGE
5
TABLE I. Electrical performance characteristics – Continued. 1/
Test
Symbol
Conditions 2/
Temperature,
TA
Device
type
Limits
Min
Unit
Max
AC characteristics section
Ripple rejection 4/
At 1 kHz, IO = 10 mA, VO = 1.8 V,
01
+25°C
90 typical
dB
VIN = 2.8(min), CBYP = 0.1 µF
70 typical
At 10 kHz, IO = 10 mA, VO = 1.8 V,
VIN = 2.8(min), CBYP = 0.1 µF
50 typical
At 100 kHz, IO = 10 mA, VO = 1.8 V,
VIN = 2.8(min), CBYP = 0.1 µF
Output noise
voltage
4/
IO = 100 µA, VO = 1.5 V,
+25°C
01
30 typical
µVrms
CBYP = 0.1 µF,
BW = 10 Hz to 100 kHz
Device start up characteristics section. See figure 4
Device enable time
tEN
Time from assertion of the ENx pin
to when the output voltage reaches
95% of the VO(nom)
-55°C to +125°C
01
525
µs
LDO soft start ramp
rate
tSSR
Slope of linear portion of LDO
output voltage ramp during start up
-55°C to +125°C
01
65
µs/V
EN1, EN2 pin characteristics section
Input low voltage
VIL
-55°C to +125°C
01
-0.3
0.4
V
Input high voltage
VIH
-55°C to +125°C
01
1.4
VIN +
0.3
V
Input leakage current
IIL, IIH
-55°C to +125°C
01
0.1
µA
Pin capacitance
CPIN
+25°C
01
Informative
5 typical
pF
See footnotes at end of table.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/08609
PAGE
6
TABLE I. Electrical performance characteristics – Continued. 1/
Test
Symbol
Conditions 2/
Temperature,
TA
Device
type
Limits
Unit
Min
Max
91
97
87
93
0.4
3.6
POR1 , POR2 pin characteristics section. See figure 4
POR1 , POR2
thresholds
VPOR+
As a percentage of nominal output
voltage
01
-55°C to +125°C
VPORPOR1 delay
01
-55°C to +125°C
tP1LH
tP2LH
CPOR = 0.01 µF
01
-55°C to +125°C
70
POR1 , POR2 pin
internal pull up
resistance
VOL
µs
330
ms
µs
25 typical
tP2HL
POR1 , POR2 pin
output low voltage
ms
25 typical
tP1HL
POR2 delay
%
At IOL = 1.0 mA
RPOR
-55°C to +125°C
01
-55°C to +125°C
01
78
0.2
V
180
kΩ
1/
Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over
the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters
may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization
and/or design.
2/
Unless otherwise specified, VIN = (VO + 0.5 V) to 6.5 V with a minimum VIN of 2.3 V, CIN = 1 µF, CO = 1 µF,
CBYP = 0.0 µF, and CPOR = 0.01 µF.
3/
VOx = 9.8 * VOx(NOM); valid for VOx greater than 1.85 V.
4/
Guaranteed by design and characterization.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/08609
PAGE
7
Case X
FIGURE 1. Case outline.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
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V62/08609
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Case X – continued.
Dimensions
Inches
Symbol
Millimeters
Notes
Min
Max
Min
Max
A
.033
.037
0.85
0.95
A1
---
.001
---
0.05
A2
b
.007 REF
.007
D
D2
.011
0.20
.118 BSC
.091
E
E2
0.20 REF
2.33
.118 BSC
e
3, 6
3.00 BSC
.095
.062
0.30
2.43
3.00 BSC
.066
1.59
.019 BSC
1.69
0.50 BSC
e1
.091
.095
2.33
2.43
k
.007
---
0.20
---
s
.013
.017
0.35
0.45
5, 6
6
NOTES:
1. Controlling dimensions are millimeter, inch dimensions are given for reference only.
2. Dimensioning and tolerance per ASME Y 14.5M-1994.
3. Dimension “b” lead width applies to the metallized terminal and is measured between 0.15 mm ( .005 inch ) and
0.30 mm ( .011 inch ) from the terminal tip.
4. The configuration of the pin 1 identifier is optional, but must be located within the zone indicated.
The pin 1 identifier may be either a mold or mark feature.
5. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance.
6. Nominal dimensions are provide to assist with printed circuit board land pattern design efforts, see manufacturer’s
technical brief TB389.
7. Fall within JEDEC MO-229-WEED-3 except for dimensions E2 and D2.
FIGURE 1. Case outline - Continued.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
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V62/08609
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Device type
01
Case outline
X
Terminal
number
Terminal
symbol
Type
Description
1
VIN
Analog I/O
2
EN1
Low voltage
compatible
CMOS input
LDO – 1 enable
3
EN2
Low voltage
compatible
CMOS input
LDO – 2 enable
4
CBYP
Analog I/O
Reference bypass capacitor pin:
Optionally connect capacitor of value 0.01 µF to 1 µF
between this pin and GND to tune in the desired noise and
PSRR performance.
5
CPOR
Analog I/O
POR2 delay setting capacitor pin:
Connect a capacitor between this pin and GND to delay the
Supply voltage / low dropout (LDO) regulator input:
Connect a 1 µF capacitor to GND.
POR2 output release after LDO-2 output reaches 94% if its
specified voltage level. (200 ms delay per 0.01 µF).
6
GND
Ground
GND is the connection to system ground. Connect to printed
circuit board ground plane.
7
POR1
Open drain
output (1 mA)
Open drain POR output for LDO-1 (active low):
Internally connected to VO1 through 100 kΩ resistor.
8
POR2
Open drain
output (1 mA)
Open drain POR output for LDO-2 (active low):
Internally connected to VO2 through 100 kΩ resistor.
9
VO2
Analog I/O
LDO-2 output:
Connect capacitor of value 1 µF to 10 µF to GND
( 1 µF recommended).
10
VO1
Analog I/O
LDO-1 output:
Connect capacitor of value 1 µF to 10 µF to GND
( 1 µF recommended).
FIGURE 2. Terminal connections.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/08609
PAGE
10
FIGURE 3. Block diagram.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
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DWG NO.
V62/08609
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11
FIGURE 4. Timing waveforms.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/08609
PAGE
12
4. VERIFICATION
4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as
indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices,
classification, packaging, and labeling of moisture sensitive devices, as applicable.
5. PREPARATION FOR DELIVERY
5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturer’s standard commercial
practices for electrostatic discharge sensitive devices.
6. NOTES
6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum.
6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturer’s data book.
The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided.
6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee
of present or continued availability as a source of supply for the item. DLA Land and Maritime maintains an online database of all
current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.
Vendor item drawing
administrative control
number 1/
Device
manufacturer
CAGE code
Vendor part number 2/
V62/08609-01XB
34371
ISL9000AMRNCEP
1/ The vendor item drawing establishes an administrative control number
for identifying the item on the engineering documentation.
2/ Add –TK suffix to vendor part number for 1000 piece quantity with tape
and reel packing option.
CAGE code
34371
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
Source of supply
Intersil Corporation
1001 Murphy Ranch Road
Milpitas, CA 95035-6803
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/08609
PAGE
13