PUSB2X4Y ESD protection for high-speed interfaces Rev. 1 — 5 November 2013 Product data sheet 1. Product profile 1.1 General description The device is designed to protect high-speed interfaces such as USB 2.0 ports against ElectroStatic Discharge (ESD). The device includes four high-level ESD protection diode structures for high-speed signal lines. It is encapsulated in a very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package. All signal lines are protected by a special diode configuration offering ultra low line capacitance of 0.85 pF maximum. This configuration provides protection to downstream components from ESD voltages up to 12 kV contact according to IEC 61000-4-2, level 4. 1.2 Features and benefits System ESD protection for USB 2.0 All signal lines with integrated rail-to-rail clamping diodes for downstream ESD protection of 12 kV according to IEC 61000-4-2, level 4 Line capacitance of 0.85 pF maximum for each channel 1.3 Applications The device is designed for receiver and transmitter port protection in: Portable devices TVs, monitors DVD recorders and players Notebooks, mother boards, graphic cards and ports Set-top boxes and game consoles PUSB2X4Y NXP Semiconductors ESD protection for high-speed interfaces 2. Pinning information Table 1. Pinning Pin Description 1 ESD protection for I/O signals 2 ground 3 ESD protection for I/O signals 4 ESD protection for I/O signals 5 n.c. 6 ESD protection for I/O signals Simplified outline 6 5 4 1 2 3 Graphic symbol 1 3 4 6 2 018aaa176 3. Ordering information Table 2. Ordering information Type number PUSB2X4Y Package Name Description Version SC-88 plastic surface-mounted package; 6 leads SOT363 4. Marking Table 3. Marking codes Type number Marking code[1] PUSB2X4Y PK* [1] * = placeholder for manufacturing site code. 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). PUSB2X4Y Product data sheet Symbol Parameter VI input voltage Conditions VESD electrostatic discharge voltage Min Max Unit 0.5 +5.5 V contact discharge 12 +12 kV air discharge 15 +15 kV pins 1, 3, 4 and 6 to ground; IEC 61000-4-2, level 4 Tamb ambient temperature 40 +85 C Tstg storage temperature 55 +125 C All information provided in this document is subject to legal disclaimers. Rev. — 5 November 2013 © NXP B.V. 2013. All rights reserved. 2 of 11 PUSB2X4Y NXP Semiconductors ESD protection for high-speed interfaces 6. Characteristics Table 5. Characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter Conditions VBR breakdown voltage II = 1 mA 6 IRM reverse leakage current per channel; VI = 5 V - VF forward voltage II = 1 mA - 0.7 VI = 0 V - 0.7 0.85 pF VI = 2.5 V - 0.55 0.75 pF - - 0.1 pF - 0.30 - - 0.21 - positive transient - 0.35 - negative transient - 0.21 - - 3.8 - V - 2.1 - V Cline line capacitance f = 1 MHz Min line capacitance difference f = 1 MHz; VI = 2.5 V [1] rdyn dynamic resistance surge [2] positive transient negative transient VCL clamping voltage positive transient IPP = 4.5 A Max Unit - 9 V - 1 A - V [1] Cline TLP Typ [3] [2] negative transient IPP = 5.2 A PUSB2X4Y Product data sheet [1] This parameter is guaranteed by design. [2] According to IEC 61000-4-5 (8/20 s current waveform). [3] 100 ns Transmission Line Pulse (TLP); 50 ; pulser at 80 ns. All information provided in this document is subject to legal disclaimers. Rev. — 5 November 2013 © NXP B.V. 2013. All rights reserved. 3 of 11 PUSB2X4Y NXP Semiconductors ESD protection for high-speed interfaces aaa-009783 0 aaa-009785 0 S21 (dB) S21 (dB) -20 -4 -40 -8 -60 -12 1 102 10 103 -80 104 102 10 103 Fig 1. 104 f (MHz) f (MHz) Insertion loss; typical values Fig 2. Crosstalk; typical values aaa-009784 1.2 a 0.8 0.4 0 0 2 4 6 VI (V) C line a = --------------------------------C line V = 0 V I Fig 3. Relative capacitance as a function of input voltage; typical values PUSB2X4Y Product data sheet All information provided in this document is subject to legal disclaimers. Rev. — 5 November 2013 © NXP B.V. 2013. All rights reserved. 4 of 11 PUSB2X4Y NXP Semiconductors ESD protection for high-speed interfaces aaa-009786 5 IPP (A) aaa-009787 0 IPP (A) 4 -2 3 2 -4 1 -6 -2.5 0 0 2 3 5 -2.0 -1.5 -1.0 -0.5 0 VCL (V) VCL (V) IEC 61000-4-5; tp = 8/20 s; positive pulse Fig 4. IEC 61000-4-5; tp = 8/20 s; negative pulse Dynamic resistance with positive clamping; typical values Fig 5. Dynamic resistance with negative clamping, typical values aaa-009788 15 I (A) aaa-009789 0 I (A) 12 -3 9 -6 6 -9 3 -12 0 -15 0 4 8 12 -6 VCL (V) -2 0 VCL (V) tp = 100 ns; Transmission Line Pulse (TLP) Fig 6. -4 tp = 100 ns; Transmission Line Pulse (TLP) Dynamic resistance with positive clamping, typical values Fig 7. Dynamic resistance with negative clamping; typical values The device uses an advanced clamping structure, which shows a negative dynamic resistance. This snap-back behavior strongly reduces the clamping voltage to the system behind the ESD protection during an ESD event. Do not connect unlimited DC current sources to the data lines to avoid keeping the ESD protection device in snap-back state after exceeding breakdown voltage (due to an ESD pulse for instance). PUSB2X4Y Product data sheet All information provided in this document is subject to legal disclaimers. Rev. — 5 November 2013 © NXP B.V. 2013. All rights reserved. 5 of 11 PUSB2X4Y NXP Semiconductors ESD protection for high-speed interfaces 7. Package outline 2.2 1.8 6 2.2 1.35 2.0 1.15 1.1 0.8 5 4 2 3 0.45 0.15 pin 1 index 1 0.3 0.2 0.65 0.25 0.10 1.3 Dimensions in mm Fig 8. PUSB2X4Y Product data sheet 06-03-16 Package outline SOT363 (SC-88) All information provided in this document is subject to legal disclaimers. Rev. — 5 November 2013 © NXP B.V. 2013. All rights reserved. 6 of 11 PUSB2X4Y NXP Semiconductors ESD protection for high-speed interfaces 8. Soldering 2.65 solder lands 2.35 1.5 0.4 (2×) 0.6 0.5 (4×) (4×) solder resist solder paste 0.5 (4×) 0.6 (2×) occupied area 0.6 (4×) Dimensions in mm 1.8 Fig 9. sot363_fr Reflow soldering footprint SOT363 (SC-88) 1.5 solder lands 0.3 2.5 4.5 solder resist occupied area 1.5 Dimensions in mm 1.3 1.3 preferred transport direction during soldering 2.45 5.3 sot363_fw Fig 10. Wave soldering footprint SOT363 (SC-88) PUSB2X4Y Product data sheet All information provided in this document is subject to legal disclaimers. Rev. — 5 November 2013 © NXP B.V. 2013. All rights reserved. 7 of 11 PUSB2X4Y NXP Semiconductors ESD protection for high-speed interfaces 9. Revision history Table 6. Revision history Document ID Release date Data sheet status Change notice Supersedes PUSB2X4Y v.1 20131105 Product data sheet - - PUSB2X4Y Product data sheet All information provided in this document is subject to legal disclaimers. Rev. — 5 November 2013 © NXP B.V. 2013. All rights reserved. 8 of 11 PUSB2X4Y NXP Semiconductors ESD protection for high-speed interfaces 10. Legal information 10.1 Data sheet status Document status[1][2] Product status[3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. Definition [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 10.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. PUSB2X4Y Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 1 — 5 November 2013 © NXP B.V. 2013. All rights reserved. 9 of 11 PUSB2X4Y NXP Semiconductors ESD protection for high-speed interfaces Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 11. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PUSB2X4Y Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 5 November 2013 © NXP B.V. 2013. All rights reserved. 10 of 11 PUSB2X4Y NXP Semiconductors ESD protection for high-speed interfaces 12. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact information. . . . . . . . . . . . . . . . . . . . . 10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 5 November 2013 Document identifier: PUSB2X4Y