Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot First QUARTER 2006 ATMEL PROPRIETARY Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product family) 2 3. HTOL (sorted by technology) 3-4 4. Data Retention Bake (sorted by product family) 5 5. Data Retention Bake (sorted by technology) 6 6. Temperature Cycle 7 7. Temperature Humidity Bias & HAST 8 8. Steam Pressure Pot 9 9. Failure Description Detail 10 10. Technology List 11 11. Failure Rate Calculations 12 12. Definitions 13 RELIABILITY MONITOR -- ATMEL PROPRIETARY Reliability Monitor Report Date: February 2, 2006 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process or package family and performing a series of reliability tests to ensure that the reliability has maintained over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C) Failure Rate: 5 FITS (3M device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.7 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking the weighted average of each device’s acceleration factor multiplied by its corresponding device hours. 2. Data Retention Bake (150°C) Failure Rate: 7 FITS (492.5K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.7 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 259 for all groupings. 3. Temperature Cycle (-65°C to 150°C, 500 cycles) * Failure Rate: 0.00% (0 failures out of 888 units) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) * Failure Rate: 0.00% (0 failures out of 590K device-hours) Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) * Failure Rate: 0.00% (0 failures out of 1,244 units) RELIABILITY MONITOR -- ATMEL PROPRIETARY * indicates that preconditioning is performed prior to the stress test. 1 High Temperature Operating Life (sorted by FAMILY) FAMILY QTR 48 Hours 168 Hours 500 Hours REJ SS REJ 4 LAST 4Q 0 54 0 ASIC 4 LAST 4Q 0 0 4,594 7,597 0 2 CCD 4 LAST 4Q 0 0 45 102 0 0 45 102 0 0 4 LAST 4Q 0 23 0 23 4 LAST 4Q 0 300 0 100 4 LAST 4Q 0 0 1,055 5,475 0 0 4 LAST 4Q 0 900 0 299 4 LAST 4Q 0 900 0 4 LAST 4Q 0 299 0 4 LAST 4Q 0 0 743 5,824 0 0 4 LAST 4Q 0 36 0 36 4 LAST 4Q 0 535 0 TX RF Total 4 LAST 4Q 0 0 297 347 0 0 ATMEL 4 LAST 4Q 0 0 6,734 22,392 0 2 ADC DEMUX D-FLASH EEPROM EPLD EPROM FLASH MICRO MUXDAC SRAM SS REJ SS 1K Hours Device-Hours* WAF EFR PPM FITS REJ SS 0 54 54,000 78 0 218 0 0 1,070 2,120 1,810,092 3,272,388 51 97 0 0 10 13 34 52 0 0 34 52 59,848 102,400 78 78 0 196 115 0 23 0 23 46,000 78 0 255 0 100 0 100 109,600 21 0 395 200 1,100 0 0 196 1,096 299,040 1,440,000 180 147 0 17 4 0 299 0 299 327,848 78 0 36 300 0 300 0 300 328,800 348 0 8 100 0 100 0 100 109,552 21 0 395 312 1,270 0 0 312 1,038 467,688 1,521,392 76 76 0 26 8 0 36 0 36 72,000 78 0 164 228 0 225 0 90 172,740 4 0 1,225 187 237 0 0 187 237 0 0 187 237 379,280 429,280 35 33 0 0 69 64 0 0 1,799 5,545 3,015,948 7,986,000 66 103 0 0 5 5 54 0 54 2,173 0 1,135 4,616 1 2,641 700 0 2,200 0 312 0 1,385 0 3,417 0 1,868 9,680 1 6,437 * The Device-Hours computation includes additional read-outs not detailed in the report. RELIABILITY MONITOR -- ATMEL PROPRIETARY 2 High Temperature Operating Life (sorted by TECHNOLOGY) TECH Z92 Z91 Z86 HCCD CMOS HCMOS BIP BICMOS 61 K 58K 57K 56K QTR 48 Hours 168 Hours 500 Hours 1K Hours Device-Hours* WAF EFR PPM FITS 2,034 187 REJ SS REJ SS REJ SS REJ SS 0 877 0 154 0 77 0 77 124,640 4 0 2,741 0 596 0 464 0 310 512,136 10 0 0 0 400 0 93 0 90 0 45 82,740 7 0 1,675 4 LAST 4Q 0 400 0 0 0 0 0 0 19,200 3 0 710 0 50 0 50 0 50 81,680 3 0 0 17,026 4,219 4 LAST 4Q 0 45 0 45 0 34 0 34 59,848 78 0 102 0 102 0 52 0 52 102,400 78 0 0 196 115 4 LAST 4Q 0 321 0 321 0 90 0 90 218,808 110 0 456 0 456 0 225 0 225 353,808 98 0 0 38 26 4 LAST 4Q 0 45 0 45 0 45 0 45 90,000 78 0 45 0 45 0 45 0 45 90,000 78 0 0 131 131 0 90 0 90 0 90 0 90 126,000 78 0 94 0 600 0 200 0 200 0 200 419,200 42 0 600 0 200 0 200 0 200 419,200 42 0 0 52 52 4 LAST 4Q 0 299 0 100 0 100 0 100 109,552 21 0 395 4 LAST 4Q 0 307 2 307 0 228 0 77 165,772 245 0 76 4 LAST 4Q 0 730 0 317 0 317 0 317 553,824 40 0 1,092 0 679 0 679 0 362 757,324 68 0 0 41 18 4 LAST 4Q 0 1,629 0 913 0 414 0 376 513,200 59 0 4,162 0 2,283 1 1,170 0 1,054 1,389,176 91 0 0 30 16 4 LAST 4Q 4 LAST 4Q 4 LAST 4Q 4 LAST 4Q RELIABILITY MONITOR -- ATMEL PROPRIETARY 3 High Temperature Operating Life (sorted by TECHNOLOGY) TECH 55K 46K 44K 43 K 39K 37K 35K 34K 26K 19K ATMEL QTR 48 Hours 168 Hours 500 Hours 1K Hours Device-Hours* WAF EFR PPM FITS REJ SS REJ SS REJ SS REJ SS 0 608 0 608 0 304 0 227 316,572 259 0 11 4 LAST 4Q 0 87 0 87 0 87 0 87 174,000 27 0 137 0 137 0 137 0 137 224,000 26 0 0 195 159 4 LAST 4Q 0 308 0 308 0 77 0 77 115,808 35 0 308 0 308 0 77 0 77 115,808 35 0 0 225 225 4 LAST 4Q 0 210 0 100 0 100 0 100 205,280 42 0 233 0 123 0 123 0 123 251,280 49 0 0 106 75 4 LAST 4Q 0 300 0 100 0 100 0 96 107,600 348 0 900 0 300 0 300 0 296 326,800 238 0 0 24 12 0 600 0 200 0 200 0 200 219,200 213 0 20 0 1,082 0 727 0 227 0 200 314,540 96 0 5,358 0 2,004 0 1,004 0 976 1,318,992 87 0 0 30 8 0 900 0 300 0 300 0 300 328,800 348 0 8 0 100 0 100 0 100 0 100 100,000 85 0 100 0 100 0 100 0 100 100,000 85 0 0 108 108 0 2,244 0 599 0 499 0 499 594,760 94 0 16 0 6,734 0 3,417 0 1,868 0 1,799 3,015,948 66 0 22,392 2 9,680 1 6,437 0 5,545 7,986,000 103 0 0 5 5 4 LAST 4Q 4 LAST 4Q 4 LAST 4Q 4 LAST 4Q 4 LAST 4Q 4 LAST 4Q 4 LAST 4Q * The Device-Hours computation includes additional read-outs not detailed in the report. RELIABILITY MONITOR -- ATMEL PROPRIETARY 4 Data Retention Bake (sorted by FAMILY) FAMILY QTR 168 Hours REJ ADC SS 500 Hours REJ SS 1K Hours REJ Device-Hours AF FITS 259 236 SS 4 LAST 4Q 0 15 0 15 0 15 0 15,000 ASIC 4 LAST 4Q 0 0 77 344 0 0 77 344 0 0 77 344 77,000 344,000 259 259 46 10 CCD 4 LAST 4Q 0 2 0 2 0 0 0 1,000 259 259 3,538 D-FLASH 4 LAST 4Q 0 0 50 200 0 0 50 200 0 0 50 200 50,000 200,000 259 259 71 18 EEPROM 4 LAST 4Q 0 0 50 1,150 0 0 50 1,150 0 0 50 1,150 50,000 1,150,000 259 259 71 3 EPLD 4 LAST 4Q 0 0 50 200 0 0 50 200 0 0 50 200 50,000 200,000 259 259 71 18 EPROM 4 LAST 4Q 0 0 50 200 0 0 50 200 0 0 50 200 50,000 200,000 259 259 71 18 FLASH 4 LAST 4Q 0 50 0 50 0 50 0 50,000 259 259 71 MICRO 4 LAST 4Q 0 0 254 779 0 0 254 779 0 0 177 702 215,500 740,500 259 259 16 5 ATMEL 4 LAST 4Q 0 0 531 2,940 0 0 531 2,940 0 0 454 2,861 492,500 2,900,500 259 259 7 1 RELIABILITY MONITOR -- ATMEL PROPRIETARY 5 Data Retention Bake (sorted by TECHNOLOGY) TECH QTR 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS Device-Hours AF FITS Z92 4 LAST 4Q 0 0 77 154 0 0 77 154 0 0 77 154 77,000 154,000 259 259 46 23 Z91 4 LAST 4Q 0 44 0 44 0 44 44,000 259 80 4 LAST 4Q 0 2 0 2 0 0 1,000 259 3,538 4 LAST 4Q 0 15 0 15 0 15 15,000 259 236 4 LAST 4Q 0 50 0 50 0 50 50,000 259 71 56K 4 LAST 4Q 0 0 77 471 0 0 77 471 0 0 77 471 77,000 471,000 259 259 46 8 39K 4 LAST 4Q 0 0 100 350 0 0 100 350 0 0 100 350 100,000 350,000 259 259 35 10 37K 4 LAST 4Q 0 100 0 100 0 100 100,000 259 35 35K 4 LAST 4Q 0 0 177 1,354 0 0 177 1,354 0 0 100 1,277 138,500 1,315,500 259 259 26 3 34K 4 LAST 4Q 0 0 50 200 0 0 50 200 0 0 50 200 50,000 200,000 259 259 71 18 19K 4 LAST 4Q 0 0 50 200 0 0 50 200 0 0 50 200 50,000 200,000 259 259 71 18 ATMEL 4 LAST 4Q 0 0 531 2,940 0 0 531 2,940 0 0 454 2,861 492,500 2,900,500 259 259 7 1 HCCD BIP 61 K RELIABILITY MONITOR -- ATMEL PROPRIETARY 6 Temperature Cycle PACKAGE QTR 100 Cycles 200 Cycles 500 Cycles 1K Cycles 2K Cycles % Defective REJ SS REJ SS REJ SS REJ SS REJ SS 4 LAST 4Q 0 200 0 200 0 200 0 200 0 0 0.00% 4 LAST 4Q 0 15 0 15 0 15 0 15 0 0 0.00% 4 LAST 4Q 0 50 0 50 0 50 0 0 0 0 0.00% MLF / QFN 4 LAST 4Q 0 0 150 200 0 0 150 200 0 0 150 200 0 0 0 0 0 0 0 0 0.00% 0.00% PDIP 4 LAST 4Q 0 0 127 277 0 0 127 277 0 0 127 277 0 0 127 277 0 0 0 0 0.00% 0.00% PLCC 4 LAST 4Q 0 429 0 429 0 426 0 426 0 0 0.00% SOIC 4 LAST 4Q 0 0 199 1,228 0 0 199 1,228 0 0 199 1,228 0 0 0 798 0 0 0 0 0.00% 0.00% SSOP 4 LAST 4Q 0 321 0 321 0 321 0 0 0 0 0.00% QFP 4 LAST 4Q 0 0 262 511 0 0 262 511 0 0 262 511 0 0 0 204 0 0 0 0 0.00% 0.00% TSOP / VSOP 4 LAST 4Q 0 0 150 400 0 0 150 400 0 0 150 400 0 0 150 400 0 0 0 0 0.00% 0.00% TSSOP 4 LAST 4Q 0 400 0 400 0 400 0 400 0 0 0.00% 4 LAST 4Q 0 0 888 4,031 0 0 888 4,031 0 0 888 4,028 0 0 277 2,720 0 0 0 0 0.00% 0.00% BCC CBGA LCC ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 7 Temperature Humidity Bias / HAST HAST Temperature Humidity Bias 168 Hours 500 Hours 1K Hours 100 Hours Device-Hours* % Defective REJ SS REJ SS REJ SS REJ SS PACKAGE QTR BCC 4 LAST 4Q 0 200 0 200 0 200 0 0 200,000 0.00% 4 LAST 4Q 0 50 0 50 0 0 0 0 25,000 0.00% MLF / QFN 4 LAST 4Q 0 0 149 199 0 0 149 199 0 0 0 0 0 0 0 0 74,500 99,500 0.00% 0.00% PDIP 4 LAST 4Q 0 0 0 0 0 0 0 0 0 0 0 0 0 0 77 227 154,000 454,000 0.00% 0.00% PLCC 4 LAST 4Q 0 153 0 153 0 0 0 100 276,500 0.00% SOIC 4 LAST 4Q 0 0 231 1,133 0 0 231 1,133 0 0 154 902 0 0 0 50 192,500 1,117,500 0.00% 0.00% SSOP 4 LAST 4Q 0 167 0 167 1 167 0 0 167,000 0.60% QFP 4 LAST 4Q 0 0 94 216 0 0 94 216 0 0 44 166 0 0 0 127 69,000 445,000 0.00% 0.00% TSOP / VSOP 4 LAST 4Q 0 0 0 0 0 0 0 0 0 0 0 0 0 0 50 250 100,000 500,000 0.00% 0.00% TSSOP 4 LAST 4Q 0 400 0 400 0 400 0 0 400,000 0.00% 4 LAST 4Q 0 0 474 2,518 0 0 474 2,518 0 1 198 1,835 0 0 127 754 590,000 3,684,500 0.00% 0.03% LCC ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 8 Steam Pressure Pot PACKAGE QTR 96 Hours 168 Hours 240 Hours % Defective REJ SS REJ SS REJ SS 4 LAST 4Q 0 15 0 15 0 0 0.0% 4 LAST 4Q 0 50 0 50 0 0 0.0% MLF / QFN 4 LAST 4Q 0 0 150 200 0 0 150 150 0 0 0 0 0.0% 0.0% QFP 4 LAST 4Q 0 0 269 518 0 172 0 127 0.0% 0.0% PDIP 4 LAST 4Q 0 0 127 277 0 0 127 277 0 0 127 277 0.0% 0.0% PLCC 4 LAST 4Q 0 431 0 277 0 277 0.0% 4 LAST 4Q 0 0 308 1,266 0 650 0 350 0.0% 0.0% 4 LAST 4Q 0 0 240 484 0 90 0 0 0.0% 0.0% TSOP / VSOP 4 LAST 4Q 0 0 150 400 0 0 150 400 0 0 150 400 0.0% 0.0% TSSOP 4 LAST 4Q 0 400 0 400 0 200 0.0% 4 LAST 4Q 0 0 1,244 4,041 0 0 427 2,481 0 0 277 1,631 0.00% 0.00% CBGA LCC SOIC SSOP ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 9 Failure Description Detail Q2-2005 a. High Temperature Operating Life, 2 failures, 168 hour read point, ASIC, AT 58A46A, LQFP-128. Root Cause: Functional Failure (RFO). Q3-2005 a. High Temperature Operating Life, 1 failure, 500 hour read point, ASIC, AT 567A9A, LQFP-144. Root Cause: Bridging (RFO). RELIABILITY MONITOR -- ATMEL PROPRIETARY 10 Technology List FAB TECH TYPE CMOS / BIP LITHOGRAPHY [µm] TYPICAL PRODUCTS / APPLICATIONS 5 15.3 EEPROM 1.8 - 2.3 sEEPROM 5 19.3 EEPROM 1.1 sEEPROM 5 19.5 Embedded Memory Configurator 1.0 Configurator 5 19.6 Embedded Memory 0.7 sEEPROM, MC (Intel core), MC (AVR core) PLD 5 19.7 EPLD 0.5 5 19.76 EPLD 0.5 PLD 5 19.8 CMOS 0.7 ASIC 5 19.8 Embedded Memory Configurator 0.7 5 19.9 Embedded Memory 0.7 sEEPROM, PEROM, EEPROM, Configurator Smartcard, AVR, µC 5 25 BiCMOS 1.0 ASIC 5 26 Logic 0.7 ASIC 5 33.5 FLASH 0.5 5 34 EPROM 0.5 EPROM 5 35.5 Embedded Memory Configurator 0.35 Configurators, sEEPROM, FLASH, Microcontroller, EPLD 5 37 EEPROM 0.35 FLASH, PEROM, DATA FLASH, sEEPROM 5 39 EEPROM 0.25 DATA FLASH 5 39.1 EEPROM 0.25 FLASH, DATA FLASH BiCMOS 0.6 5 42 GFO / CSO 43 ASIC HNO 46 5 55 Logic 0.5 ASIC 5 55.8 CMOS 0.5 ASIC 5 56 Logic 0.35 ASIC 5 56.8 Embedded Memory 0.35 ASIC 7 57.0 CMOS 0.25 ASIC 7 57.5 CMOS 0.21 ASIC 7 58.0 CMOS 0.18 ASIC SJO 61 CMOS 0.18 FLASH HNO BCDMOS 6BD1 0.8 HNO BICMOS ASIC, TX RF RF & Auto ASIC RF & Auto GFO HCCD1 NMOS 2.5 CCD GFO HCCD3 NMOS 1.5 CCD HNO I²L 6IL4 2 ASIC HNO SIGE1 6SG1 0.8 ASIC HNO UHF 6UH6 0.5 ASIC NTO Z86 CMOS Digital 0.8 SRAM,MICRO, VAN DLC NTO Z91 CMOS Digital 0.6 SRAM, ASIC, MICRO NTO Z92 CMOS Digital 0.5 ASIC, MICRO,VAN DLC NTO Z94 CMOS + EPROM 0.5 OTP MICRO HNO Z95 RF & Auto Z96 RF & Auto HNO RELIABILITY MONITOR -- ATMEL PROPRIETARY 11 Failure Rate Calculations Failure Rate: χ2 λ = where, λ χ2 α n AF DH = = = = = = (1 − α 100 , 2⋅n + 2 ) ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = eZ ⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) 22 RELIABILITY MONITOR -- ATMEL PROPRIETARY 12 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage, and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. 22 RELIABILITY MONITOR -- ATMEL PROPRIETARY 13