Si7403DN Datasheet

Si7403DN
New Product
Vishay Siliconix
P-Channel 20-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V)
FEATURES
rDS(on) (W)
ID (A)
0.1 @ VGS = –4.5 V
–4.5
0.135 @ VGS = –2.5 V
–3.8
D TrenchFETr Power MOSFETS: 2.5-V Rated
D New PowerPAKt Package
– Low Thermal Resistance, RthJC
– Low 1.07-mm Profile
–20
APPLICATIONS
D Load Switching
D PA Switching
S
S S
PowerPAKt 1212-8
S
3.30 mm
3.30 mm
1
S
2
S
3
G
G
4
D
8
P-Channel MOSFET
D
7
D
6
D
5
Bottom View
D D
D D
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
10 secs
Steady State
Drain-Source Voltage
VDS
–20
Gate-Source Voltage
VGS
"8
Continuous Drain Current (TJ = 150_C)
_ a
TA = 25_C
V
–4.5
–2.9
–3.2
–2.1
ID
TA = 85_C
Pulsed Drain Current
IDM
continuous Source Current (Diode Conduction)a
IS
TA = 25_C
Maximum Power Dissipationa
Unit
TA = 85_C
Operating Junction and Storage Temperature Range
PD
A
–20
–3.0
–1.3
3.5
1.5
1.9
0.8
TJ, Tstg
W
_C
–55 to 150
THERMAL RESISTANCE RATINGS
Parameter
Symbol
t v 10 sec
Maximum Junction-to-Ambienta
Maximum Junction-to-Case
Steady State
Steady State
RthJA
RthJC
Typical
Maximum
28
35
65
81
4.5
5.6
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 71431
S-03390—Rev. A, 02-Apr-01
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Si7403DN
New Product
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = –250 mA
–0.45
Typ
Max
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
"100
VDS = –20 V, VGS = 0 V
–1
VDS = –20 V, VGS = 0 V, TJ = 70_C
–5
VDS = –5 V, VGS = –4.5 V
–10
VDS = –5 V, VGS = –2.5 V
–4
nA
m
mA
A
VGS = –4.5 V, ID = –3.3 A
0.078
0.1
VGS = –2.5 V, ID = –2.9 A
0.110
0.135
gfs
VDS = –10 V, ID = –3.3 A
8.8
VSD
IS = –1.6 A, VGS = 0 V
0.8
–1.2
8.6
14
Forward Transconductancea
Diode Forward
VDS = 0 V, VGS = "4.5 V
rDS(on)
Voltagea
V
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
3.1
Turn-On Delay Time
td(on)
27
50
tr
17
30
52
80
45
70
50
80
Rise Time
Turn-Off Delay Time
VDS = –10 V, VGS = –4.5 V, ID = –4.5 A
VDD = –10 V, RL = 10 W
ID ^ –1.6 A, VGEN = –4.5 V, RG = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
1.5
IF = –1.6 A, di/dt = 100 A/ms
nC
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
20
20
VGS = 4.5, 4, 3.5 V
TC = –55_C
16
16
3V
I D – Drain Current (A)
I D – Drain Current (A)
125_C
12
2.5 V
8
2V
4
12
25_C
8
4
1.5 V
0
0
0
1
2
3
4
VDS – Drain-to-Source Voltage (V)
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2
5
0
1
2
3
4
VGS – Gate-to-Source Voltage (V)
Document Number: 71431
S-03390—Rev. A, 02-Apr-01
Si7403DN
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Capacitance
On-Resistance vs. Drain Current
1400
0.30
C – Capacitance (pF)
r DS(on)– On-Resistance ( W )
1200
0.24
0.18
VGS = 2.5 V
0.12
VGS = 4.5 V
1000
800
600
Ciss
400
Coss
0.06
200
Crss
0.00
0
0
4
8
12
16
20
0
4
Gate Charge
V GS – Gate-to-Source Voltage (V)
r DS(on)– On-Resistance ( W )
(Normalized)
3
2
1
0
4
6
8
1.4
1.2
1.0
0.8
0.6
–50
10
Qg – Total Gate Charge (nC)
–25
0
25
50
75
100
125
150
TJ – Junction Temperature (_C)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.30
r DS(on)– On-Resistance ( W )
20
I S – Source Current (A)
20
VGS = 4.5 V
ID = 3.3 A
1.6
4
2
16
On-Resistance vs. Junction Temperature
1.8
VDS = 10 V
ID = 3.3 A
0
12
VDS – Drain-to-Source Voltage (V)
ID – Drain Current (A)
5
8
10
TJ = 150_C
TJ = 25_C
0.24
0.18
ID = 3.3 A
0.12
0.06
0.00
1
0
0.25
0.50
0.75
1.00
1.25
VSD – Source-to-Drain Voltage (V)
Document Number: 71431
S-03390—Rev. A, 02-Apr-01
1.50
0
2
4
6
8
VGS – Gate-to-Source Voltage (V)
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Si7403DN
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
Single Pulse Power, Juncion-To-Ambient
0.4
50
40
0.2
Power (W)
V GS(th) Variance (V)
0.3
ID = 250 mA
0.1
30
20
0.0
10
–0.1
–0.2
–50
0
–25
0
25
50
75
100
125
150
0.01
0.1
1
10
100
600
Time (sec)
TJ – Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 68_C/W
3. TJM – TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10–4
10–3
10–2
10–1
1
Square Wave Pulse Duration (sec)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Case
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
Single Pulse
0.05
0.02
0.01
10–4
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4
10–3
10–2
Square Wave Pulse Duration (sec)
10–1
1
Document Number: 71431
S-03390—Rev. A, 02-Apr-01
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Document Number: 91000
Revision: 18-Jul-08
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