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Materials Declaration
Package
Body Size
LeadCount
Option
LQFP
14 X 20 X 1.4
128
Pb Free
Molding Compound
% of Compound
Weight (g)
86.0
2.87 E-01
8.0
2.67 E-02
5.0
1.67 E-02
0.4
1.34 E-03
0.4
1.34 E-03
0.2
6.68 E-04
PPM
293475
27300
17062
1365
1365
682
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Cu
Ni
Si
Mg
Leadframe
% of Leadframe
96.2
3.0
0.7
0.2
PPM
359074
11198
2426
560
PPM
27.5
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
PPM
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
2.50 E-03
100.0
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Sn
External Leadframe Plating
Weight (g)
% of Plating
100.0
6.70 E-03
Item
Epoxy Resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Carbon Black
Item
Item
Molding Compound
Die Attach Paste
Weight (g)
3.52 E-01
1.10 E-02
2.38 E-03
5.48 E-04
6843
Weight (g)
3.50 E-03
PPM
Au
Si
Chip
% of Chip
100.0
Weight (g)
2.40 E-01
PPM
245170
Die Attach
% of Die Attach
74.0
26.0
Weight (g)
1.98 E-02
6.96 E-03
PPM
20238
7111
Ag Filler
Resin
Method
US EPA #3050B
EN1122: 2001 Method B
US EPA #3052
US EPA Method #7196A and #3060A
Analysis performed by GC/MS
Analysis performed by GC/MS
2553
Bond Wires
% of Wire
99.9
Item
Method
US EPA #3052
US EPA #3052
US EPA #3052
US EPA method #7196A and #3060A
Analysis performed by GC/MS
Analysis performed by GC/MS
3577
Package Totals
PPM
Weight (g)
1000000
9.79 E-01
STS-ST-C
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information
ADI Proprietary
3/7/06
Materials Declaration
Package
Body Size
LeadCount
Option
LQFP
14 X 20 X 1.4
128
Sn/Pb
Molding Compound
% of Compound
Weight (g)
86.0
2.87 E-01
8.0
2.67 E-02
5.0
1.67 E-02
0.4
1.34 E-03
0.4
1.34 E-03
0.2
6.68 E-04
PPM
293475
27300
17062
1365
1365
682
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Cu
Ni
Si
Mg
Leadframe
% of Leadframe
96.2
3.0
0.7
0.2
PPM
359074
11198
2426
560
PPM
27.5
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
PPM
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
2.50 E-03
100.0
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Sn
Pb
External Leadframe Plating
Weight (g)
% of Plating
85.0
5.70 E-03
15.0
1.01 E-03
Item
SiO2 Filler
Epoxy Resin
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Carbon Black
Item
Item
Molding Compound
Die Attach Paste
Weight (g)
3.52 E-01
1.10 E-02
2.38 E-03
5.48 E-04
5817
1026
Weight (g)
3.50 E-03
PPM
Au
Si
Chip
% of Chip
100.0
Weight (g)
2.40 E-01
PPM
245170
Die Attach
% of Die Attach
74.0
26.0
Weight (g)
1.98 E-02
6.96 E-03
PPM
20238
7111
Ag Filler
Resin
Method
US EPA #3050B
EN1122: 2001 Method B
US EPA #3052
US EPA Method #7196A and #3060A
Analysis performed by GC/MS
Analysis performed by GC/MS
2553
Bond Wires
% of Wire
99.9
Item
Method
US EPA #3052
US EPA #3052
US EPA #3052
US EPA method #7196A and #3060A
Analysis performed by GC/MS
Analysis performed by GC/MS
3577
Package Totals
PPM
Weight (g)
1000000
9.79 E-01
STS-ST-A
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information
ADI Proprietary
3/7/06