Materials Declaration Package Body Size LeadCount Option LQFP 14 X 20 X 1.4 128 Pb Free Molding Compound % of Compound Weight (g) 86.0 2.87 E-01 8.0 2.67 E-02 5.0 1.67 E-02 0.4 1.34 E-03 0.4 1.34 E-03 0.2 6.68 E-04 PPM 293475 27300 17062 1365 1365 682 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Cu Ni Si Mg Leadframe % of Leadframe 96.2 3.0 0.7 0.2 PPM 359074 11198 2426 560 PPM 27.5 Not Detected Not Detected Not Detected Not Detected Not Detected PPM Ag Internal Leadframe Plating % of Plating Weight (g) 2.50 E-03 100.0 Item Pb Cd Hg Cr+6 PBB PBDE PPM Sn External Leadframe Plating Weight (g) % of Plating 100.0 6.70 E-03 Item Epoxy Resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Carbon Black Item Item Molding Compound Die Attach Paste Weight (g) 3.52 E-01 1.10 E-02 2.38 E-03 5.48 E-04 6843 Weight (g) 3.50 E-03 PPM Au Si Chip % of Chip 100.0 Weight (g) 2.40 E-01 PPM 245170 Die Attach % of Die Attach 74.0 26.0 Weight (g) 1.98 E-02 6.96 E-03 PPM 20238 7111 Ag Filler Resin Method US EPA #3050B EN1122: 2001 Method B US EPA #3052 US EPA Method #7196A and #3060A Analysis performed by GC/MS Analysis performed by GC/MS 2553 Bond Wires % of Wire 99.9 Item Method US EPA #3052 US EPA #3052 US EPA #3052 US EPA method #7196A and #3060A Analysis performed by GC/MS Analysis performed by GC/MS 3577 Package Totals PPM Weight (g) 1000000 9.79 E-01 STS-ST-C Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information ADI Proprietary 3/7/06 Materials Declaration Package Body Size LeadCount Option LQFP 14 X 20 X 1.4 128 Sn/Pb Molding Compound % of Compound Weight (g) 86.0 2.87 E-01 8.0 2.67 E-02 5.0 1.67 E-02 0.4 1.34 E-03 0.4 1.34 E-03 0.2 6.68 E-04 PPM 293475 27300 17062 1365 1365 682 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Cu Ni Si Mg Leadframe % of Leadframe 96.2 3.0 0.7 0.2 PPM 359074 11198 2426 560 PPM 27.5 Not Detected Not Detected Not Detected Not Detected Not Detected PPM Ag Internal Leadframe Plating % of Plating Weight (g) 2.50 E-03 100.0 Item Pb Cd Hg Cr+6 PBB PBDE PPM Sn Pb External Leadframe Plating Weight (g) % of Plating 85.0 5.70 E-03 15.0 1.01 E-03 Item SiO2 Filler Epoxy Resin Phenol Resin Antimony_Sb2O3 Brominated Resin Carbon Black Item Item Molding Compound Die Attach Paste Weight (g) 3.52 E-01 1.10 E-02 2.38 E-03 5.48 E-04 5817 1026 Weight (g) 3.50 E-03 PPM Au Si Chip % of Chip 100.0 Weight (g) 2.40 E-01 PPM 245170 Die Attach % of Die Attach 74.0 26.0 Weight (g) 1.98 E-02 6.96 E-03 PPM 20238 7111 Ag Filler Resin Method US EPA #3050B EN1122: 2001 Method B US EPA #3052 US EPA Method #7196A and #3060A Analysis performed by GC/MS Analysis performed by GC/MS 2553 Bond Wires % of Wire 99.9 Item Method US EPA #3052 US EPA #3052 US EPA #3052 US EPA method #7196A and #3060A Analysis performed by GC/MS Analysis performed by GC/MS 3577 Package Totals PPM Weight (g) 1000000 9.79 E-01 STS-ST-A Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information ADI Proprietary 3/7/06