Materials Declaration Package Body Size LeadCount Option MQFP 28 X 28 208 Pb-Free Molding Compound % of Compound 87.00 7.50 5.50 Weight (g) 4.16 E+00 3.59 E-01 2.63 E-01 PPM 718662 61954 45433 Cu Ni Si Mg Leadframe % of Leadframe 95.90 3.20 0.73 0.18 Weight (g) 7.88 E-01 2.63 E-02 5.96 E-03 1.44 E-03 PPM 136134 4543 1029 248 Ag Internal Leadframe Plating % of Plating Weight (g) 5.98 E-03 100.0 PPM 1032 External Leadframe Plating % of Plating Weight (g) 100.0 3.18 E-02 PPM 5494 Item SiO2 Filler Epoxy resin Phenol Resin Item Item Sn Molding Compound Au Bond Wires % of Wire 99.99 Weight (g) 6.07 E-02 PPM 10488 Si Chip % of Chip 100.0 Weight (g) 7.81 E-02 PPM 13485 Die Attach % of Die Attach 76.0 10.5 8.0 5.5 Weight (g) 6.59 E-03 9.11 E-04 6.94 E-04 4.77 E-04 PPM 1139 157 120 82 Item Ag Filler Diester resin Functionalized urethane Epoxy resin Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Method US EPA 3052. ICP -OES US EPA 3052. ICP -OES US EPA 3052. ICP -OES US EPA 3060A & 7196A. UV-VIS Analysis performed by GC/MS Analysis performed by GC/MS Die Attach Paste Method US EPA 3052. ICP US EPA 3052. ICP US EPA 3052. ICP US EPA 3060A. UV-VIS US EPA 3546. Analysis performed by GC/MS US EPA 3546. Analysis performed by GC/MS Package Totals PPM Weight (g) 1000000 5.79 E+00 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option MQFP 28 X 28 208 SnPb Molding Compound % of Compound Weight (g) 87.00 4.16 E+00 7.50 3.59 E-01 5.50 2.63 E-01 PPM 718662 61954 45433 Cu Ni Si Mg Leadframe % of Leadframe Weight (g) 95.90 7.88 E-01 3.20 2.63 E-02 0.73 5.96 E-03 0.18 1.44 E-03 PPM 136134 4543 1029 248 Ag Internal Leadframe Plating % of Plating Weight (g) 5.98 E-03 100 Sn Pb External Leadframe Plating % of Plating Weight (g) 85 2.70 E-02 15 4.77 E-03 Au Bond Wires % of Wire Weight (g) 99.99 6.07 E-02 Si % of Chip 100 Item SiO2 Filler Epoxy resin Phenol Resin Item Item PPM 1032 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM None Detected US EPA 3052. ICP-OES None Detected US EPA 3052. ICP-OES None Detected US EPA 3052. ICP-OES None Detected US EPA 3060A & 7196A. UV-VIS None Detected Analysis was performed by GC/MS None Detected Analysis was performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM 3 US EPA 3052. ICP-OES None Detected US EPA 3052. ICP-OES None Detected US EPA 3052. ICP-OES None Detected US EPA 3060A & 7196A. UV-VIS None Detected Analysis was performed by GC/MS None Detected Analysis was performed by GC/MS PPM 4670 824 PPM 10488 Chip Item Ag Filler Resin Weight (g) 7.81 E-02 Die Attach Weight (g) % of Die Attach 76.0 6.59 E-03 24.0 2.08 E-03 PPM 13485 PPM 1139 360 Package Totals Weight (g) PPM 1000000 5.79 E+00 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary