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Materials Declaration
Package
Body Size
LeadCount
Option
MQFP
28 X 28
208
Pb-Free
Molding Compound
% of Compound
87.00
7.50
5.50
Weight (g)
4.16 E+00
3.59 E-01
2.63 E-01
PPM
718662
61954
45433
Cu
Ni
Si
Mg
Leadframe
% of Leadframe
95.90
3.20
0.73
0.18
Weight (g)
7.88 E-01
2.63 E-02
5.96 E-03
1.44 E-03
PPM
136134
4543
1029
248
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
5.98 E-03
100.0
PPM
1032
External Leadframe Plating
% of Plating
Weight (g)
100.0
3.18 E-02
PPM
5494
Item
SiO2 Filler
Epoxy resin
Phenol Resin
Item
Item
Sn
Molding Compound
Au
Bond Wires
% of Wire
99.99
Weight (g)
6.07 E-02
PPM
10488
Si
Chip
% of Chip
100.0
Weight (g)
7.81 E-02
PPM
13485
Die Attach
% of Die Attach
76.0
10.5
8.0
5.5
Weight (g)
6.59 E-03
9.11 E-04
6.94 E-04
4.77 E-04
PPM
1139
157
120
82
Item
Ag Filler
Diester resin
Functionalized urethane
Epoxy resin
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Method
US EPA 3052. ICP -OES
US EPA 3052. ICP -OES
US EPA 3052. ICP -OES
US EPA 3060A & 7196A. UV-VIS
Analysis performed by GC/MS
Analysis performed by GC/MS
Die Attach Paste
Method
US EPA 3052. ICP
US EPA 3052. ICP
US EPA 3052. ICP
US EPA 3060A. UV-VIS
US EPA 3546. Analysis performed by GC/MS
US EPA 3546. Analysis performed by GC/MS
Package Totals
PPM
Weight (g)
1000000
5.79 E+00
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
LeadCount
Option
MQFP
28 X 28
208
SnPb
Molding Compound
% of Compound
Weight (g)
87.00
4.16 E+00
7.50
3.59 E-01
5.50
2.63 E-01
PPM
718662
61954
45433
Cu
Ni
Si
Mg
Leadframe
% of Leadframe
Weight (g)
95.90
7.88 E-01
3.20
2.63 E-02
0.73
5.96 E-03
0.18
1.44 E-03
PPM
136134
4543
1029
248
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
5.98 E-03
100
Sn
Pb
External Leadframe Plating
% of Plating
Weight (g)
85
2.70 E-02
15
4.77 E-03
Au
Bond Wires
% of Wire
Weight (g)
99.99
6.07 E-02
Si
% of Chip
100
Item
SiO2 Filler
Epoxy resin
Phenol Resin
Item
Item
PPM
1032
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
None Detected
US EPA 3052. ICP-OES
None Detected
US EPA 3052. ICP-OES
None Detected
US EPA 3052. ICP-OES
None Detected
US EPA 3060A & 7196A. UV-VIS
None Detected
Analysis was performed by GC/MS
None Detected
Analysis was performed by GC/MS
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
Method
PPM
3
US EPA 3052. ICP-OES
None Detected
US EPA 3052. ICP-OES
None Detected
US EPA 3052. ICP-OES
None Detected
US EPA 3060A & 7196A. UV-VIS
None Detected
Analysis was performed by GC/MS
None Detected
Analysis was performed by GC/MS
PPM
4670
824
PPM
10488
Chip
Item
Ag Filler
Resin
Weight (g)
7.81 E-02
Die Attach
Weight (g)
% of Die Attach
76.0
6.59 E-03
24.0
2.08 E-03
PPM
13485
PPM
1139
360
Package Totals
Weight (g)
PPM
1000000
5.79 E+00
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary