Materials Declaration Package Body Size LeadCount Option SC70 - COL -6 Pb-free Item SiO2 Resin Sb2O3 Brominated Epoxy Carbon Black Subtotal Item Fe Ni Mn Si Subtotal Molding Compound % of Compound 81 16 1.4 1 0.6 Leadframe % of Leadframe 58.4 41 0.4 0.2 Weight (g) 2.69 E-03 5.35 E-04 4.65 E-05 3.32 E-05 1.66 E-05 3.32 E-03 PPM 393914 78297 6808 4863 2432 486314 Weight (g) 1.67 E-03 1.20 E-03 1.22 E-05 4.83 E-06 2.88 E-03 PPM 244390 175106 1790 708 421995 Internal Leadframe Plating % of Plating 100 Weight (g) 2.91 E-05 PPM Ag Sn External Leadframe Plating % of Plating 100 Weight (g) 3.37 E-04 PPM 49344 Bond Wires % of Wire 99.99 Weight (g) 2.00 E-05 PPM Au Si Chip % of Chip 100 Weight (g) 2.10 E-04 PPM 30761 Weight (g) 9.30 E-06 9.30 E-06 6.60 E-06 2.40 E-06 2.40 E-06 3.00 E-05 PPM Item Item Epoxy Resin Metal Oxide Glycol ethers Silica Curing agent & hardener Subtotal Die Attach % of Die Attach 31 31 22 8 8 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. UV-VIS. Not Detected Draft IEC 62321. GC-MSD. Not Detected Draft IEC 62321. GC-MSD. Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Die Attach 4263 2929 1362 1362 967 352 352 4394 Package Totals Weight (g) PPM 1000000 6.83 E-03 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD. Materials Declaration Package Body Size LeadCount Option Substance Silica Phenol Resin Epoxy Resin 1 Epoxy Resin 2 Others Carbon Black Subtotal Molding Compound % of Compound 87.3 4.5 3.0 3.0 2.0 0.2 100 Weight (g) 2.90 E-03 1.49 E-04 9.96 E-05 9.96 E-05 6.64 E-05 6.64 E-06 3.32 E-03 PPM 446595 23020 15347 15347 10231 1023 511564 Weight (g) 2.80 E-03 6.75 E-05 3.45 E-06 8.62 E-07 2.87 E-03 PPM 431635 10403 531 133 442702 Internal Leadframe Plating/External Leadframe Plating Substance % of Plating Weight (g) 3.35 E-05 90.91 2.91 E-06 7.91 4.37 E-07 1.19 3.68 E-05 PPM 5156 448 67 5672 Substance Copper Iron Zinc Phosphorus Subtotal Nickel Palladium Gold Subtotal SC70 - COL -6 Pb-free, Halide-free Leadframe % of Leadframe 97.5 2.35 0.12 0.03 Bond Wires % of Wire 99.99 Weight (g) 2.00 E-05 PPM 3082 Substance Doped Silicon Chip % of Chip 100 Weight (g) 2.10 E-04 PPM 32358 Substance Epoxy Resin Metal Oxide Glycol ethers Silica Curing agent & hardener Subtotal Die Attach % of Die Attach 31 31 22 8 8 100 Weight (g) 9.30 E-06 9.30 E-06 6.60 E-06 2.40 E-06 2.40 E-06 3.00 E-05 PPM 1433 1433 1017 370 370 4623 Substance Gold Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Molding Compound PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Die Attach PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Package Totals PPM Weight (g) 1000000 6.49 E-03 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method USEPA 3050B. ICP-OES. EN1122, method B:2001. ICP-OES. USEPA 3052. ICP-OES. EPA 3060A/7196A. UV-VIS. EPA 3540C/3550B. GC-MS. EPA 3540C/3550B. GC-MS. Method Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD. Materials Declaration Package Body Size LeadCount Option Molding Compound % of Compound 87.3 4.5 3.0 3.0 2.0 0.2 100 Weight (g) 2.90 E-03 1.49 E-04 9.96 E-05 9.96 E-05 6.64 E-05 6.64 E-06 3.32 E-03 PPM 446595 23020 15347 15347 10231 1023 511564 Leadframe % of Leadframe 97.5 2.35 0.12 0.03 100 Weight (g) 2.80 E-03 6.75 E-05 3.45 E-06 8.62 E-07 2.87 E-03 PPM 431635 10403 531 133 442702 Internal Leadframe Plating/External Leadframe Plating Substance % of Plating Weight (g) 3.35 E-05 90.91 2.91 E-06 7.91 4.37 E-07 1.19 100.00 3.68 E-05 PPM 5156 448 67 5672 Substance Silica Phenol Resin Epoxy Resin 1 Epoxy Resin 2 Others Carbon Black Subtotal Substance Copper Iron Zinc Phosphorus Subtotal Nickel Palladium Gold Subtotal SC70 - COL -6 NiPdAu Bond Wires % of Wire 99.99 Weight (g) 2.00 E-05 PPM 3082 Substance Doped Silicon Chip % of Chip 100 Weight (g) 2.10 E-04 PPM 32358 Substance Epoxy Resin Metal Oxide Glycol ethers Silica Curing agent & hardener Subtotal Die Attach % of Die Attach 31 31 22 8 8 100 Weight (g) 9.30 E-06 9.30 E-06 6.60 E-06 2.40 E-06 2.40 E-06 3.00 E-05 PPM 1433 1433 1017 370 370 4623 Substance Gold Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Molding Compound PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Die Attach PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Package Totals PPM Weight (g) 1000000 6.49 E-03 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method USEPA 3050B. ICP-OES. EN1122, method B:2001. ICP-OES. USEPA 3052. ICP-OES. EPA 3060A/7196A. UV-VIS. EPA 3540C/3550B. GC-MS. EPA 3540C/3550B. GC-MS. Method Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD. Materials Declaration Package Body Size LeadCount Option Item SiO2 Resin Sb2O3 Brominated Epoxy Carbon Black Subtotal Item Fe Ni Mn Si Subtotal SC70 - COL -6 Sn/Pb Molding Compound % of Compound 81 16 1.4 1 0.6 Leadframe % of Leadframe 58.4 41 0.4 0.2 Internal Leadframe Plating % of Plating 100 Ag Item Sn Pb Subtotal External Leadframe Plating % of Plating 85 15 Weight (g) 2.69 E-03 5.35 E-04 4.65 E-05 3.32 E-05 1.66 E-05 3.32 E-03 PPM 392584 78032 6785 4847 2423 484672 Weight (g) 1.67 E-03 1.20 E-03 1.22 E-05 4.83 E-06 2.88 E-03 PPM 243565 174515 1784 705 420569 Weight (g) 2.91 E-05 PPM Weight (g) 3.06 E-04 5.40 E-05 3.60 E-04 PPM 44672 7883 52555 Bond Wires % of Wire 99.99 Weight (g) 2.00 E-05 PPM Si Chip % of Chip 100 Weight (g) 2.10 E-04 PPM 30657 Weight (g) 9.30 E-06 9.30 E-06 6.60 E-06 2.40 E-06 2.40 E-06 3.00 E-05 PPM Die Attach % of Die Attach 31 31 22 8 8 Molding Compound Method PPM Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. UV-VIS. Not Detected Draft IEC 62321. GC-MSD. Not Detected Draft IEC 62321. GC-MSD. Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Die Attach 4248 Au Item Epoxy Resin Metal Oxide Glycol ethers Silica Curing agent & hardener Subtotal Item Pb Cd Hg Cr+6 PBB PBDE 2919 1358 1358 964 350 350 4380 Package Totals Weight (g) PPM 1000000 6.85 E-03 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD.