pdf

Materials Declaration
Package
Body Size
LeadCount
Option
SC70 - COL
-6
Pb-free
Item
SiO2
Resin
Sb2O3
Brominated Epoxy
Carbon Black
Subtotal
Item
Fe
Ni
Mn
Si
Subtotal
Molding Compound
% of Compound
81
16
1.4
1
0.6
Leadframe
% of Leadframe
58.4
41
0.4
0.2
Weight (g)
2.69 E-03
5.35 E-04
4.65 E-05
3.32 E-05
1.66 E-05
3.32 E-03
PPM
393914
78297
6808
4863
2432
486314
Weight (g)
1.67 E-03
1.20 E-03
1.22 E-05
4.83 E-06
2.88 E-03
PPM
244390
175106
1790
708
421995
Internal Leadframe Plating
% of Plating
100
Weight (g)
2.91 E-05
PPM
Ag
Sn
External Leadframe Plating
% of Plating
100
Weight (g)
3.37 E-04
PPM
49344
Bond Wires
% of Wire
99.99
Weight (g)
2.00 E-05
PPM
Au
Si
Chip
% of Chip
100
Weight (g)
2.10 E-04
PPM
30761
Weight (g)
9.30 E-06
9.30 E-06
6.60 E-06
2.40 E-06
2.40 E-06
3.00 E-05
PPM
Item
Item
Epoxy Resin
Metal Oxide
Glycol ethers
Silica
Curing agent & hardener
Subtotal
Die Attach
% of Die Attach
31
31
22
8
8
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected
Draft IEC 62321. ICP-OES.
Not Detected
Draft IEC 62321. ICP-OES.
Not Detected
Draft IEC 62321. ICP-OES.
Not Detected
Draft IEC 62321. UV-VIS.
Not Detected
Draft IEC 62321. GC-MSD.
Not Detected
Draft IEC 62321. GC-MSD.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Die Attach
4263
2929
1362
1362
967
352
352
4394
Package Totals
Weight (g)
PPM
1000000
6.83 E-03
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MSD.
Draft IEC 62321. GC-MSD.
Materials Declaration
Package
Body Size
LeadCount
Option
Substance
Silica
Phenol Resin
Epoxy Resin 1
Epoxy Resin 2
Others
Carbon Black
Subtotal
Molding Compound
% of Compound
87.3
4.5
3.0
3.0
2.0
0.2
100
Weight (g)
2.90 E-03
1.49 E-04
9.96 E-05
9.96 E-05
6.64 E-05
6.64 E-06
3.32 E-03
PPM
446595
23020
15347
15347
10231
1023
511564
Weight (g)
2.80 E-03
6.75 E-05
3.45 E-06
8.62 E-07
2.87 E-03
PPM
431635
10403
531
133
442702
Internal Leadframe Plating/External Leadframe Plating
Substance
% of Plating
Weight (g)
3.35 E-05
90.91
2.91 E-06
7.91
4.37 E-07
1.19
3.68 E-05
PPM
5156
448
67
5672
Substance
Copper
Iron
Zinc
Phosphorus
Subtotal
Nickel
Palladium
Gold
Subtotal
SC70 - COL
-6
Pb-free, Halide-free
Leadframe
% of Leadframe
97.5
2.35
0.12
0.03
Bond Wires
% of Wire
99.99
Weight (g)
2.00 E-05
PPM
3082
Substance
Doped Silicon
Chip
% of Chip
100
Weight (g)
2.10 E-04
PPM
32358
Substance
Epoxy Resin
Metal Oxide
Glycol ethers
Silica
Curing agent & hardener
Subtotal
Die Attach
% of Die Attach
31
31
22
8
8
100
Weight (g)
9.30 E-06
9.30 E-06
6.60 E-06
2.40 E-06
2.40 E-06
3.00 E-05
PPM
1433
1433
1017
370
370
4623
Substance
Gold
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Molding Compound
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Die Attach
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Package Totals
PPM
Weight (g)
1000000
6.49 E-03
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
USEPA 3050B. ICP-OES.
EN1122, method B:2001. ICP-OES.
USEPA 3052. ICP-OES.
EPA 3060A/7196A. UV-VIS.
EPA 3540C/3550B. GC-MS.
EPA 3540C/3550B. GC-MS.
Method
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MSD.
Draft IEC 62321. GC-MSD.
Materials Declaration
Package
Body Size
LeadCount
Option
Molding Compound
% of Compound
87.3
4.5
3.0
3.0
2.0
0.2
100
Weight (g)
2.90 E-03
1.49 E-04
9.96 E-05
9.96 E-05
6.64 E-05
6.64 E-06
3.32 E-03
PPM
446595
23020
15347
15347
10231
1023
511564
Leadframe
% of Leadframe
97.5
2.35
0.12
0.03
100
Weight (g)
2.80 E-03
6.75 E-05
3.45 E-06
8.62 E-07
2.87 E-03
PPM
431635
10403
531
133
442702
Internal Leadframe Plating/External Leadframe Plating
Substance
% of Plating
Weight (g)
3.35 E-05
90.91
2.91 E-06
7.91
4.37 E-07
1.19
100.00
3.68 E-05
PPM
5156
448
67
5672
Substance
Silica
Phenol Resin
Epoxy Resin 1
Epoxy Resin 2
Others
Carbon Black
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
Subtotal
Nickel
Palladium
Gold
Subtotal
SC70 - COL
-6
NiPdAu
Bond Wires
% of Wire
99.99
Weight (g)
2.00 E-05
PPM
3082
Substance
Doped Silicon
Chip
% of Chip
100
Weight (g)
2.10 E-04
PPM
32358
Substance
Epoxy Resin
Metal Oxide
Glycol ethers
Silica
Curing agent & hardener
Subtotal
Die Attach
% of Die Attach
31
31
22
8
8
100
Weight (g)
9.30 E-06
9.30 E-06
6.60 E-06
2.40 E-06
2.40 E-06
3.00 E-05
PPM
1433
1433
1017
370
370
4623
Substance
Gold
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Molding Compound
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Die Attach
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Package Totals
PPM
Weight (g)
1000000
6.49 E-03
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
USEPA 3050B. ICP-OES.
EN1122, method B:2001. ICP-OES.
USEPA 3052. ICP-OES.
EPA 3060A/7196A. UV-VIS.
EPA 3540C/3550B. GC-MS.
EPA 3540C/3550B. GC-MS.
Method
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MSD.
Draft IEC 62321. GC-MSD.
Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2
Resin
Sb2O3
Brominated Epoxy
Carbon Black
Subtotal
Item
Fe
Ni
Mn
Si
Subtotal
SC70 - COL
-6
Sn/Pb
Molding Compound
% of Compound
81
16
1.4
1
0.6
Leadframe
% of Leadframe
58.4
41
0.4
0.2
Internal Leadframe Plating
% of Plating
100
Ag
Item
Sn
Pb
Subtotal
External Leadframe Plating
% of Plating
85
15
Weight (g)
2.69 E-03
5.35 E-04
4.65 E-05
3.32 E-05
1.66 E-05
3.32 E-03
PPM
392584
78032
6785
4847
2423
484672
Weight (g)
1.67 E-03
1.20 E-03
1.22 E-05
4.83 E-06
2.88 E-03
PPM
243565
174515
1784
705
420569
Weight (g)
2.91 E-05
PPM
Weight (g)
3.06 E-04
5.40 E-05
3.60 E-04
PPM
44672
7883
52555
Bond Wires
% of Wire
99.99
Weight (g)
2.00 E-05
PPM
Si
Chip
% of Chip
100
Weight (g)
2.10 E-04
PPM
30657
Weight (g)
9.30 E-06
9.30 E-06
6.60 E-06
2.40 E-06
2.40 E-06
3.00 E-05
PPM
Die Attach
% of Die Attach
31
31
22
8
8
Molding Compound
Method
PPM
Not Detected
Draft IEC 62321. ICP-OES.
Not Detected
Draft IEC 62321. ICP-OES.
Not Detected
Draft IEC 62321. ICP-OES.
Not Detected
Draft IEC 62321. UV-VIS.
Not Detected
Draft IEC 62321. GC-MSD.
Not Detected
Draft IEC 62321. GC-MSD.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Die Attach
4248
Au
Item
Epoxy Resin
Metal Oxide
Glycol ethers
Silica
Curing agent & hardener
Subtotal
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
2919
1358
1358
964
350
350
4380
Package Totals
Weight (g)
PPM
1000000
6.85 E-03
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MSD.
Draft IEC 62321. GC-MSD.