pdf

Materials Declaration
Package
Body Size
LeadCount
Option
SC70
-5
Pb-Free
Item
OCN
SiO2
Sb2O3
Br
Carbon Black
Item
Fe
Ni
Mn
Si
Ag
Item
Sn
Molding Compound
% of Compound
16
80
2.4
0.6
1
Weight (g)
3.63 E-04
1.82 E-03
5.45 E-05
1.36 E-05
2.27 E-05
PPM
62874
314368
9431
2358
3930
Leadframe
% of Leadframe
58.4
41
0.4
0.2
Weight (g)
1.50 E-03
1.05 E-03
1.02 E-05
5.12 E-06
PPM
258807
181696
1773
886
Internal Leadframe Plating
% of Plating
100
Weight (g)
1.00 E-04
PPM
17311
External Leadframe Plating
% of Plating
100
Weight (g)
5.83 E-04
PPM
100981
Weight (g)
3.33 E-05
PPM
99.99
100
Weight (g)
2.10 E-04
PPM
36353
Weight (g)
5.00 E-06
1.50 E-05
PPM
25
75
Bond Wires
% of Wire
Au
Chip
% of Chip
Si
Item
Resin
Ag Filler
Die Attach
% of Die Attach
Item
Pb
Cd
Hg
Cr+6
Molding Compound
Method
PPM
<10.38
ICP AES
0.0039
ICP AES
Not Detected
ICP AES
Not Detected
DIN 53314
Die Attach Paste
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
<5
<5
<5
<5
Not Detected
Not Detected
Method
ICP AES
ICP AES
ICP AES
ICP AES
5770
866
2597
Package Totals
Weight (g)
PPM
1000000
5.78 E-03
CRS-KS-E
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
07/21/04
Materials Declaration
Package
Body Size
LeadCount
Option
Molding Compound
% of Compound
87.3
4.5
3.0
3.0
2.0
0.2
100
Weight (g)
2.88 E-03
1.49 E-04
9.90 E-05
9.90 E-05
6.60 E-05
6.60 E-06
3.30 E-03
PPM
470742
24265
16177
16177
10784
1078
539223
Leadframe
% of Leadframe
97.5
2.35
0.12
0.03
100
Weight (g)
2.46 E-03
5.94 E-05
3.03 E-06
7.58 E-07
2.53 E-03
PPM
402676
9706
496
124
413001
Internal Leadframe Plating/External Leadframe Plating
Substance
% of Plating
Weight (g)
2.94 E-05
90.91
2.56 E-06
7.91
3.84 E-07
1.19
100.00
3.24 E-05
PPM
4811
418
63
5292
Substance
Silica
Phenol Resin
Epoxy Resin 1
Epoxy Resin 2
Others
Carbon Black
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
Subtotal
Nickel
Palladium
Gold
Subtotal
SC70 - COL
-5
NiPdAu
Bond Wires
% of Wire
99.99
Weight (g)
3.00 E-05
PPM
4902
Substance
Doped Silicon
Chip
% of Chip
100
Weight (g)
2.10 E-04
PPM
34314
Substance
Epoxy Resin
Metal Oxide
Glycol ethers
Silica
Curing agent & hardener
Subtotal
Die Attach
% of Die Attach
31
31
22
8
8
100
Weight (g)
6.20 E-06
6.20 E-06
4.40 E-06
1.60 E-06
1.60 E-06
2.00 E-05
PPM
1013
1013
719
261
261
3268
Substance
Gold
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Molding Compound
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Die Attach
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Package Totals
PPM
Weight (g)
1000000
6.12 E-03
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
USEPA 3050B. ICP-OES.
EN1122, method B:2001. ICP-OES.
USEPA 3052. ICP-OES.
EPA 3060A/7196A. UV-VIS.
EPA 3540C/3550B. GC-MS.
EPA 3540C/3550B. GC-MS.
Method
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MSD.
Draft IEC 62321. GC-MSD.
Materials Declaration
Package
Body Size
LeadCount
Option
Item
OCN
SiO2
Sb2O3
Br
Carbon Black
Item
SC70 -5
Sn/Pb
Molding Compound
% of Compound
16
80
2.4
0.6
1
Weight (g)
3.63 E-04
1.82 E-03
5.45 E-05
1.36 E-05
2.27 E-05
PPM
62874
314368
9431
2358
3930
Weight (g)
1.50 E-03
1.05 E-03
1.02 E-05
5.12 E-06
PPM
258807
181696
1773
886
Internal Leadframe Plating
% of Plating
100
Weight (g)
1.00 E-04
PPM
17311
External Leadframe Plating
% of Plating
85
15
Weight (g)
4.96 E-04
8.75 E-05
PPM
85834
15147
Weight (g)
3.33 E-05
PPM
100
Weight (g)
2.10 E-04
PPM
36353
Weight (g)
5.00 E-06
1.50 E-05
PPM
25
75
Leadframe
% of Leadframe
Fe
Ni
Mn
Si
58.4
41
0.4
0.2
Ag
Item
Sn
Pb
Bond Wires
% of Wire
99.99
Au
Chip
% of Chip
Si
Item
Resin
Ag Filler
Die Attach
% of Die Attach
Molding Compound
Method
PPM
<10.38
ICP AES
0.0039
ICP AES
Not Detected
ICP AES
Not Detected
DIN 53314
Item
Pb
Cd
Hg
Cr+6
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
PPM
<5
ICP AES
<5
ICP AES
<5
ICP AES
<5
ICP AES
Not Detected
Not Detected
Method
5770
866
2597
Package Totals
Weight (g)
PPM
1000000
5.78 E-03
CRS-KS-A
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
07/21/04