Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Biphenyl Resin Carbon black Item Cu Cr Sn Zn TQFP_EP 7 x 7 x 1.0 48 Pb Free Molding Compound % of Compound Weight (g) 88.00 6.98 E-02 11.50 9.12 E-03 0.50 3.97 E-04 PPM 513753 67137 2922 Leadframe % of Leadframe 99.25 0.30 0.25 0.20 PPM 301810 913 758 611 Weight (g) 4.10 E-02 1.24 E-04 1.03 E-04 8.30 E-05 Ag Internal Leadframe Plating Weight (g) % of Plating 5.60 E-04 100.0 Sn External Leadframe Plating Weight (g) % of Plating 100.0 3.64 E-03 Au Bond Wires % of Wire Weight (g) 99.99 1.26 E-03 Item Molding Compound PPM 4122 Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Method US EPA 3050B. ICP-AES EN 1122:2001. ICP-AES US EPA 3052. ICP - AES US EPA 3060A & 7196A. US EPA 3540C. Analysis performed by HPLC/DAD, LC/MS or GC/MS US EPA 3540C. Analysis performed by HPLC/DAD, LC/MS or GC/MS Die Attach Paste Method US EPA 3052. ICP -OES US EPA 3052. ICP -OES US EPA 3052. ICP -OES US EPA 3060A & 7196A . UV-VIS SGS-in house method. Analysis performed by GC/MS SGS-in house method. Analysis performed by GC/MS PPM 26800 PPM 9238 Chip Si Item Ag Resin Anhydride % of Chip 100.0 Die Attach % of Die Attach 70.0 20.0 10.0 Weight (g) 7.34 E-03 PPM 54042 Weight (g) 1.70 E-03 4.86 E-04 2.43 E-04 PPM 12528 3577 1789 Package Totals Weight (g) PPM 1000000 1.36 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 8/30/06 Materials Declaration Package Body Size LeadCount Option TQFP_EP 7 x 7 x 1.0 48 SnPb Molding Compound % of Compound Weight (g) 88.00 6.98 E-02 11.50 9.12 E-03 0.50 3.97 E-04 PPM 512621 66989 2916 Cu Cr Sn Zn Leadframe % of Leadframe Weight (g) 99.25 4.10 E-02 0.30 1.24 E-04 0.25 1.03 E-04 0.20 8.30 E-05 PPM 301145 911 756 610 Internal Leadframe Plating Weight (g) % of Plating 5.60 E-04 100.0 PPM Ag PPM Sn Pb External Leadframe Plating Weight (g) % of Plating 85.0 3.35 E-03 15.0 5.91 E-04 Bond Wires Weight (g) 1.26 E-03 PPM Item SiO2 Filler Biphenyl Resin Carbon black Item Item Au % of Wire 99.99 Molding Compound Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Method US EPA 3050B. ICP-AES EN 1122:2001. ICP-AES US EPA 3052. ICP - AES US EPA 3060A & 7196A. US EPA 3540C. Analysis performed by HPLC/DAD, LC/MS or GC/MS US EPA 3540C. Analysis performed by HPLC/DAD, LC/MS or GC/MS Die Attach Paste 4113 Method US EPA 3052. ICP -OES US EPA 3052. ICP -OES US EPA 3052. ICP -OES US EPA 3060A & 7196A . UV-VIS SGS-in house method. Analysis performed by GC/MS SGS-in house method. Analysis performed by GC/MS 24604 4341 9217 Chip Si Item Ag Resin Anhydride % of Chip 100.0 Weight (g) 7.34 E-03 Die Attach % of Die Attach Weight (g) 70.0 1.70 E-03 20.0 4.86 E-04 10.0 2.43 E-04 PPM 53923 PPM 12500 3569 1785 Package Totals PPM Weight (g) 1000000 1.36 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 8/30/06