pdf

Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Biphenyl Resin
Carbon black
Item
Cu
Cr
Sn
Zn
TQFP_EP
7 x 7 x 1.0
48
Pb Free
Molding Compound
% of Compound
Weight (g)
88.00
6.98 E-02
11.50
9.12 E-03
0.50
3.97 E-04
PPM
513753
67137
2922
Leadframe
% of Leadframe
99.25
0.30
0.25
0.20
PPM
301810
913
758
611
Weight (g)
4.10 E-02
1.24 E-04
1.03 E-04
8.30 E-05
Ag
Internal Leadframe Plating
Weight (g)
% of Plating
5.60 E-04
100.0
Sn
External Leadframe Plating
Weight (g)
% of Plating
100.0
3.64 E-03
Au
Bond Wires
% of Wire
Weight (g)
99.99
1.26 E-03
Item
Molding Compound
PPM
4122
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Method
US EPA 3050B. ICP-AES
EN 1122:2001. ICP-AES
US EPA 3052. ICP - AES
US EPA 3060A & 7196A.
US EPA 3540C. Analysis performed by HPLC/DAD, LC/MS or GC/MS
US EPA 3540C. Analysis performed by HPLC/DAD, LC/MS or GC/MS
Die Attach Paste
Method
US EPA 3052. ICP -OES
US EPA 3052. ICP -OES
US EPA 3052. ICP -OES
US EPA 3060A & 7196A . UV-VIS
SGS-in house method. Analysis performed by GC/MS
SGS-in house method. Analysis performed by GC/MS
PPM
26800
PPM
9238
Chip
Si
Item
Ag
Resin
Anhydride
% of Chip
100.0
Die Attach
% of Die Attach
70.0
20.0
10.0
Weight (g)
7.34 E-03
PPM
54042
Weight (g)
1.70 E-03
4.86 E-04
2.43 E-04
PPM
12528
3577
1789
Package Totals
Weight (g)
PPM
1000000
1.36 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
8/30/06
Materials Declaration
Package
Body Size
LeadCount
Option
TQFP_EP
7 x 7 x 1.0
48
SnPb
Molding Compound
% of Compound
Weight (g)
88.00
6.98 E-02
11.50
9.12 E-03
0.50
3.97 E-04
PPM
512621
66989
2916
Cu
Cr
Sn
Zn
Leadframe
% of Leadframe
Weight (g)
99.25
4.10 E-02
0.30
1.24 E-04
0.25
1.03 E-04
0.20
8.30 E-05
PPM
301145
911
756
610
Internal Leadframe Plating
Weight (g)
% of Plating
5.60 E-04
100.0
PPM
Ag
PPM
Sn
Pb
External Leadframe Plating
Weight (g)
% of Plating
85.0
3.35 E-03
15.0
5.91 E-04
Bond Wires
Weight (g)
1.26 E-03
PPM
Item
SiO2 Filler
Biphenyl Resin
Carbon black
Item
Item
Au
% of Wire
99.99
Molding Compound
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Method
US EPA 3050B. ICP-AES
EN 1122:2001. ICP-AES
US EPA 3052. ICP - AES
US EPA 3060A & 7196A.
US EPA 3540C. Analysis performed by HPLC/DAD, LC/MS or GC/MS
US EPA 3540C. Analysis performed by HPLC/DAD, LC/MS or GC/MS
Die Attach Paste
4113
Method
US EPA 3052. ICP -OES
US EPA 3052. ICP -OES
US EPA 3052. ICP -OES
US EPA 3060A & 7196A . UV-VIS
SGS-in house method. Analysis performed by GC/MS
SGS-in house method. Analysis performed by GC/MS
24604
4341
9217
Chip
Si
Item
Ag
Resin
Anhydride
% of Chip
100.0
Weight (g)
7.34 E-03
Die Attach
% of Die Attach
Weight (g)
70.0
1.70 E-03
20.0
4.86 E-04
10.0
2.43 E-04
PPM
53923
PPM
12500
3569
1785
Package Totals
PPM
Weight (g)
1000000
1.36 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
8/30/06