Materials Declaration Package Body Size LeadCount Option MQFP 32 X 32 X 3.5 (+2.6) 240 Pb Free Item Silica fused Epoxy Cresol Novolac Phenol Novolac Brominated Epoxy resin Antimony trioxide Carbon black Item Cu Ni Si Mg Molding Compound % of Compound 81.00 9.50 6.00 1.60 1.50 0.40 Weight (g) 4.93 E+00 5.79 E-01 3.65 E-01 9.74 E-02 9.13 E-02 2.44 E-02 PPM 668918 78453 49550 13213 12387 3303 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM None Detected US EPA 3052. ICP-OES None Detected US EPA 3052. ICP-OES None Detected US EPA 3052. ICP-OES None Detected US EPA 3060A & 7196A. UV-VIS None Detected Analysis was performed by GC/MS None Detected Analysis was performed by GC/MS Leadframe % of Leadframe 95.90 3.20 0.73 0.18 Weight (g) 1.00 E+00 3.35 E-02 7.59 E-03 1.83 E-03 PPM 136097 4541 1029 248 Item Pb Cd Hg Cr+6 PBB PBDE PPM 3 None Detected None Detected None Detected None Detected None Detected Die Attach Paste Internal Leadframe Plating % of Plating 100.0 Weight (g) 9.60 E-03 PPM Ag Sn External Leadframe Plating % of Plating 100.0 Item Au Si Item Silver filler Diglycidylether bisphenol-F Epoxy resin Gamma Butyrolactone Mixed aryl allyl glycidyl compounds 1302 Weight (g) 4.05 E-02 PPM Bond Wires % of Wire 99.99 Weight (g) 7.73 E-02 PPM 10485 Chip % of Chip 100 Weight (g) 9.94 E-02 PPM 13481 Die Attach % of Die Attach 75.50 10.50 6.00 5.00 3.00 Weight (g) 8.34 E-03 1.16 E-03 6.63 E-04 5.52 E-04 3.31 E-04 PPM 5493 1131 157 90 75 45 Package Totals PPM Weight (g) 1000000 7.37 E+00 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method US EPA 3052. ICP-OES US EPA 3052. ICP-OES US EPA 3052. ICP-OES US EPA 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Materials Declaration Package Body Size LeadCount Option MQFP 32 X 32 X 3.5 (+2.6) 240 SnPb Molding Compound % of Compound 75.0 10.0 6.5 3.0 2.0 0.3 Weight (g) 4.57 E+00 6.09 E-01 3.96 E-01 1.83 E-01 1.22 E-01 1.83 E-02 PPM 636181 84824 55136 25447 16965 2545 Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Cu Cr Sn Zn Leadframe % of Leadframe 99.28 0.22 0.25 0.25 Weight (g) 1.04 E+00 2.30 E-03 2.62 E-03 2.62 E-03 PPM 144718 321 364 364 PPM None Detected None Detected None Detected None Detected None Detected None Detected Ag Internal Leadframe Plating % of Plating Weight (g) 9.60 E-03 100.0 Item Pb Cd Hg Cr+6 PBB PBDE PPM 1338 External Leadframe Plating Weight (g) % of Plating 3.44 E-02 85.0 6.08 E-03 15.0 PPM 4796 846 Item Silica fused Epoxy Cresol Novolac Phenol Novolac Antimony trioxide Brominated Epoxy Resin Carbon Black Item Item Sn Pb Molding Compound Die Attach Paste Au Bond Wires % of Wire 99.99 Weight (g) 7.73 E-02 PPM 10770 Si Chip % of Chip 100 Weight (g) 9.94 E-02 PPM 13847 Die Attach % of Die Attach 75.0 20.0 5.0 Weight (g) 8.29 E-03 2.21 E-03 5.52 E-04 PPM 1154 308 77 Item Ag Filler Resin Curing agent & hardener Method US EPA 3050B. ICP-AES BS EN1122:2001 Method B. ICP-AES US EPA 3052. ICP-AES US EPA 3060A & 7196A Analysis was performed by GC/ECDMS or HPLC/DAD/MS Analysis was performed by GC/ECDMS or HPLC/DAD/MS Package Totals PPM Weight (g) 1000000 7.18 E+00 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Method US EPA 3050B, ICP-AES US EPA 3050B, ICP-AES US EPA 3052, ICP-AES EPA 3060A, UV-VIS USEPA 3450C. Analysis performed by GC/MS USEPA 3450C. Analysis performed by GC/MS