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Materials Declaration
CSP_BGA Stacked Die
7x7mm
81
Pb-free
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Epoxy resin
Phenol resin
Metal Hydroxide & Carbon black
Item
BT-Epoxy
Copper
Nickel
Solder Mask
Epoxy resin
Gold
Molding Compound
% of Compound
83.0
7.0
7.0
3.0
Laminate
% of Laminate
57.4
30.0
4.0
4.0
3.6
1.0
Weight (g)
4.22 E-02
3.56 E-03
3.56 E-03
1.52 E-03
PPM
400056
33740
33740
14460
Weight (g)
1.37 E-02
7.17 E-03
9.56 E-04
9.56 E-04
8.61 E-04
2.39 E-04
PPM
130141
68018
9069
9069
8162
2267
Weight (g)
1.94 E-02
6.01 E-04
1.08 E-04
PPM
183702
5696
1029
Solder Ball
Sn
Ag
Cu
% of Plating
96.4
3.0
0.54
Au
Bond Wires
% of Wire
99.99
Weight (g)
2.71 E-03
PPM
25698
Si
Bottom Die
% of Chip
100.0
Weight (g)
3.08 E-03
PPM
29168
Si
Top Die
% of Chip
100.0
Weight (g)
2.35 E-03
PPM
22313
Si
Spacer
% of Spacer
100.0
Weight (g)
1.09 E-03
PPM
10303
Item
Silicone dioxide
Diester resin
Functionalized ester
Epoxy resin
Polymeric material
Die Attach 1
% of Die Attach
45.0
25.0
15.0
7.5
7.5
Weight (g)
3.11 E-04
1.73 E-04
1.04 E-04
5.18 E-05
5.18 E-05
PPM
2944
1636
981
491
491
Item
Proprietary filler
Proprietary bismaleimide
Die Attach 2
% of Die Attach
40.0
40.0
Weight (g)
9.20 E-05
9.20 E-05
PPM
20.0
4.60 E-05
Die Attach 3
% of Die Attach
Weight (g)
30.0
1.47 E-04
1394
20.0
15.0
15.0
7.5
7.5
9.80 E-05
7.35 E-05
7.35 E-05
3.68 E-05
3.68 E-05
929
697
697
348
348
5.0
2.45 E-05
232
Proprietary polymer
Item
Mixture of fused and amorphous
SiO2
Bismaleimide resin
Di-ester resin
Functionalize ester
Epoxy resin
Polymeric material
1,3-di-2-propenyl-2 benzene,
epoxidized
Weight (g)
1.05 E-01
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
PBDE
Not Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
US EPA 3052
US EPA 3052
US EPA 3052
US EPA 3060A
US EPA 3540C/3550C. Analysis was performed by HPLC/DAD, LC/MS or GC/MS
PBDE
Not Detected
US EPA 3540C/3550C. Analysis was performed by HPLC/DAD, LC/MS or GC/MS
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
US EPA 3050B
EN 1122
US EPA 3052
US EPA 3060A
US EPA 3540C/3550C. Analysis was performed by HPLC/DAD, LC/MS or GC/MS
US EPA 3540C/3550C. Analysis was performed by HPLC/DAD, LC/MS or GC/MS
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Die Attach 3
Method
USEPA 3050B; Analysis was performed by ICP-AES
USEPA 3050B; Analysis was performed by ICP-AES
USEPA 3052; Analysis was performed by ICP-AES
USEPA 3060A; Analysis was performed by UV-VIS
Analysis was performed by GC/MS
Analysis was performed by GC/MS
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Laminate
Method
EPA Method 3052; Analysis was performed by ICP-AES
EPA Method 3052; Analysis was performed by ICP-AES
EPA Method 3052; Analysis was performed by ICP-AES
EPA Method 3060A. Analysis was performed by UV-VIS
Analysis was performed by GC/MS
Analysis was performed by GC/MS
Die Attach 1
Die Attach 2
872
872
436
PPM
PPM
1000000
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Mold Compound
Method
USEPA Method 3050B; Analysis was performed by ICP-AES
EN1122:2001; Analysis was performed by ICP-AES
EPA Method 3052; Analysis was performed by ICP-AES
USEPA 7196A & USEPA 3060A
US EPA 3540C/3550C. Analysis was performed by HPLC/DAD, LC/MS or GC/MS
US EPA 3540C/3550C. Analysis was performed by HPLC/DAD, LC/MS or GC/MS
Item
Pb
Cd
Hg
Cr+6
PBB
SCK-BC-C