Materials Declaration CSP_BGA Stacked Die 7x7mm 81 Pb-free Package Body Size LeadCount Option Item SiO2 Filler Epoxy resin Phenol resin Metal Hydroxide & Carbon black Item BT-Epoxy Copper Nickel Solder Mask Epoxy resin Gold Molding Compound % of Compound 83.0 7.0 7.0 3.0 Laminate % of Laminate 57.4 30.0 4.0 4.0 3.6 1.0 Weight (g) 4.22 E-02 3.56 E-03 3.56 E-03 1.52 E-03 PPM 400056 33740 33740 14460 Weight (g) 1.37 E-02 7.17 E-03 9.56 E-04 9.56 E-04 8.61 E-04 2.39 E-04 PPM 130141 68018 9069 9069 8162 2267 Weight (g) 1.94 E-02 6.01 E-04 1.08 E-04 PPM 183702 5696 1029 Solder Ball Sn Ag Cu % of Plating 96.4 3.0 0.54 Au Bond Wires % of Wire 99.99 Weight (g) 2.71 E-03 PPM 25698 Si Bottom Die % of Chip 100.0 Weight (g) 3.08 E-03 PPM 29168 Si Top Die % of Chip 100.0 Weight (g) 2.35 E-03 PPM 22313 Si Spacer % of Spacer 100.0 Weight (g) 1.09 E-03 PPM 10303 Item Silicone dioxide Diester resin Functionalized ester Epoxy resin Polymeric material Die Attach 1 % of Die Attach 45.0 25.0 15.0 7.5 7.5 Weight (g) 3.11 E-04 1.73 E-04 1.04 E-04 5.18 E-05 5.18 E-05 PPM 2944 1636 981 491 491 Item Proprietary filler Proprietary bismaleimide Die Attach 2 % of Die Attach 40.0 40.0 Weight (g) 9.20 E-05 9.20 E-05 PPM 20.0 4.60 E-05 Die Attach 3 % of Die Attach Weight (g) 30.0 1.47 E-04 1394 20.0 15.0 15.0 7.5 7.5 9.80 E-05 7.35 E-05 7.35 E-05 3.68 E-05 3.68 E-05 929 697 697 348 348 5.0 2.45 E-05 232 Proprietary polymer Item Mixture of fused and amorphous SiO2 Bismaleimide resin Di-ester resin Functionalize ester Epoxy resin Polymeric material 1,3-di-2-propenyl-2 benzene, epoxidized Weight (g) 1.05 E-01 PPM Not Detected Not Detected Not Detected Not Detected Not Detected PBDE Not Detected Item Pb Cd Hg Cr+6 PBB PPM Not Detected Not Detected Not Detected Not Detected Not Detected Method US EPA 3052 US EPA 3052 US EPA 3052 US EPA 3060A US EPA 3540C/3550C. Analysis was performed by HPLC/DAD, LC/MS or GC/MS PBDE Not Detected US EPA 3540C/3550C. Analysis was performed by HPLC/DAD, LC/MS or GC/MS Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method US EPA 3050B EN 1122 US EPA 3052 US EPA 3060A US EPA 3540C/3550C. Analysis was performed by HPLC/DAD, LC/MS or GC/MS US EPA 3540C/3550C. Analysis was performed by HPLC/DAD, LC/MS or GC/MS Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Die Attach 3 Method USEPA 3050B; Analysis was performed by ICP-AES USEPA 3050B; Analysis was performed by ICP-AES USEPA 3052; Analysis was performed by ICP-AES USEPA 3060A; Analysis was performed by UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Laminate Method EPA Method 3052; Analysis was performed by ICP-AES EPA Method 3052; Analysis was performed by ICP-AES EPA Method 3052; Analysis was performed by ICP-AES EPA Method 3060A. Analysis was performed by UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Die Attach 1 Die Attach 2 872 872 436 PPM PPM 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Mold Compound Method USEPA Method 3050B; Analysis was performed by ICP-AES EN1122:2001; Analysis was performed by ICP-AES EPA Method 3052; Analysis was performed by ICP-AES USEPA 7196A & USEPA 3060A US EPA 3540C/3550C. Analysis was performed by HPLC/DAD, LC/MS or GC/MS US EPA 3540C/3550C. Analysis was performed by HPLC/DAD, LC/MS or GC/MS Item Pb Cd Hg Cr+6 PBB SCK-BC-C