Materials Declaration Package Body Size LeadCount Option Item SSOP 5.30 mm 16 Pb-free Molding Compound % of Compound 87.00 10.90 1.50 0.60 Weight (g) 2.50 E-02 3.13 E-03 4.31 E-04 1.72 E-04 2.87 E-02 PPM 248815 31178 4290 1712 285996 Weight (g) 4.95 E-02 1.19 E-03 6.10 E-05 1.50 E-05 5.08 E-02 PPM 492753 11876 607 149 505385 Item Internal Leadframe Plating % of Plating Weight (g) 1.16 E-03 100.0 PPM 11517 Item External Leadframe Plating % of Plating Weight (g) 100.0 2.31 E-03 PPM 23015 SiO2 Filler Epoxy Resin Sb2O3 Br Subtotal Item Cu Fe Zn P Subtotal Ag Sn Leadframe % of Leadframe 97.50 2.35 0.12 0.03 Item Bond Wires % of Wire 99.99 Weight (g) 4.66 E-04 PPM Au Item Si Chip % of Chip 100.0 Weight (g) 1.43 E-02 PPM 142679 Weight (g) 2.02 E-03 5.38 E-04 1.34 E-04 2.69 E-03 PPM 20078 5356 1334 26768 Item Ag Filler Resin Aromatic Amine Subtotal Die Attach % of Die Attach 75.0 20.0 5.0 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Die Attach Paste 4639 Package Totals Weight (g) PPM 1000000 1.00 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Molding Compound Method US EPA 3050B. ICP-AES US EPA 3050B. ICP-AES US EPA 3052. ICP-AES EPA 3060A & 7196A. UV-VIS Analysis performed by GC/MS Analysis performed by GC/MS Method US EPA 3052. ICP-OES US EPA 3052. ICP-OES US EPA 3052. ICP-OES EPA 3060A & 7196A. UV-VIS USEPA 3550/3540C, Analysis performed by GC/MS USEPA 3550/3540C, Analysis performed by GC/MS Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy Resin Sb2O3 Br Subtotal Item Cu Fe Zn P Subtotal SSOP 5.30 mm 16 SnPb Molding Compound % of Compound Weight (g) 2.50 E-02 87.00 10.90 3.13 E-03 1.50 4.31 E-04 0.60 1.72 E-04 2.87 E-02 Leadframe % of Leadframe Weight (g) 97.50 4.95 E-02 2.35 1.19 E-03 0.12 6.10 E-05 0.03 1.50 E-05 5.08 E-02 Ag Internal Leadframe Plating % of Plating Weight (g) 1.16 E-03 100.0 Sn Pb Subtotal External Leadframe Plating % of Plating Weight (g) 85.0 2.13 E-03 15.0 3.75 E-04 2.50 E-03 Item Au Bond Wires % of Wire Weight (g) 99.99 4.66 E-04 PPM Item 248348 31119 4282 1709 285459 Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected US EPA 3050B. ICP-AES Not Detected US EPA 3050B. ICP-AES Not Detected US EPA 3052. ICP-AES Not Detected EPA 3060A & 7196A. UV-VIS Not Detected Analysis performed by GC/MS Not Detected Analysis performed by GC/MS Die Attach Paste PPM 491828 11854 606 149 504436 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected PPM 11496 PPM 21124 3726 24850 PPM 4630 Chip Si Item Ag Filler Resin Aromatic Amine Subtotal % of Chip 100.0 Weight (g) 1.43 E-02 Die Attach % of Die Attach Weight (g) 75.0 2.02 E-03 20.0 5.38 E-04 5.0 1.34 E-04 2.69 E-03 PPM 142411 PPM 20041 5346 1331 26718 Package Totals Weight (g) PPM 1000000 1.01 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method US EPA 3052. ICP-OES US EPA 3052. ICP-OES US EPA 3052. ICP-OES EPA 3060A & 7196A. UV-VIS USEPA 3550/3540C, Analysis performed by GC/MS USEPA 3550/3540C, Analysis performed by GC/MS