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Materials Declaration
Package
Body Size
LeadCount
Option
Item
SSOP
5.30 mm
16
Pb-free
Molding Compound
% of Compound
87.00
10.90
1.50
0.60
Weight (g)
2.50 E-02
3.13 E-03
4.31 E-04
1.72 E-04
2.87 E-02
PPM
248815
31178
4290
1712
285996
Weight (g)
4.95 E-02
1.19 E-03
6.10 E-05
1.50 E-05
5.08 E-02
PPM
492753
11876
607
149
505385
Item
Internal Leadframe Plating
% of Plating
Weight (g)
1.16 E-03
100.0
PPM
11517
Item
External Leadframe Plating
% of Plating
Weight (g)
100.0
2.31 E-03
PPM
23015
SiO2 Filler
Epoxy Resin
Sb2O3
Br
Subtotal
Item
Cu
Fe
Zn
P
Subtotal
Ag
Sn
Leadframe
% of Leadframe
97.50
2.35
0.12
0.03
Item
Bond Wires
% of Wire
99.99
Weight (g)
4.66 E-04
PPM
Au
Item
Si
Chip
% of Chip
100.0
Weight (g)
1.43 E-02
PPM
142679
Weight (g)
2.02 E-03
5.38 E-04
1.34 E-04
2.69 E-03
PPM
20078
5356
1334
26768
Item
Ag Filler
Resin
Aromatic Amine
Subtotal
Die Attach
% of Die Attach
75.0
20.0
5.0
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Die Attach Paste
4639
Package Totals
Weight (g)
PPM
1000000
1.00 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Molding Compound
Method
US EPA 3050B. ICP-AES
US EPA 3050B. ICP-AES
US EPA 3052. ICP-AES
EPA 3060A & 7196A. UV-VIS
Analysis performed by GC/MS
Analysis performed by GC/MS
Method
US EPA 3052. ICP-OES
US EPA 3052. ICP-OES
US EPA 3052. ICP-OES
EPA 3060A & 7196A. UV-VIS
USEPA 3550/3540C, Analysis performed by GC/MS
USEPA 3550/3540C, Analysis performed by GC/MS
Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Epoxy Resin
Sb2O3
Br
Subtotal
Item
Cu
Fe
Zn
P
Subtotal
SSOP
5.30 mm
16
SnPb
Molding Compound
% of Compound
Weight (g)
2.50 E-02
87.00
10.90
3.13 E-03
1.50
4.31 E-04
0.60
1.72 E-04
2.87 E-02
Leadframe
% of Leadframe
Weight (g)
97.50
4.95 E-02
2.35
1.19 E-03
0.12
6.10 E-05
0.03
1.50 E-05
5.08 E-02
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
1.16 E-03
100.0
Sn
Pb
Subtotal
External Leadframe Plating
% of Plating
Weight (g)
85.0
2.13 E-03
15.0
3.75 E-04
2.50 E-03
Item
Au
Bond Wires
% of Wire
Weight (g)
99.99
4.66 E-04
PPM
Item
248348
31119
4282
1709
285459
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected
US EPA 3050B. ICP-AES
Not Detected
US EPA 3050B. ICP-AES
Not Detected
US EPA 3052. ICP-AES
Not Detected
EPA 3060A & 7196A. UV-VIS
Not Detected
Analysis performed by GC/MS
Not Detected
Analysis performed by GC/MS
Die Attach Paste
PPM
491828
11854
606
149
504436
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
PPM
11496
PPM
21124
3726
24850
PPM
4630
Chip
Si
Item
Ag Filler
Resin
Aromatic Amine
Subtotal
% of Chip
100.0
Weight (g)
1.43 E-02
Die Attach
% of Die Attach
Weight (g)
75.0
2.02 E-03
20.0
5.38 E-04
5.0
1.34 E-04
2.69 E-03
PPM
142411
PPM
20041
5346
1331
26718
Package Totals
Weight (g)
PPM
1000000
1.01 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
US EPA 3052. ICP-OES
US EPA 3052. ICP-OES
US EPA 3052. ICP-OES
EPA 3060A & 7196A. UV-VIS
USEPA 3550/3540C, Analysis performed by GC/MS
USEPA 3550/3540C, Analysis performed by GC/MS