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Materials Declaration
Package
Body Size
LeadCount
Option
TSSOP
6.1 mm
48
Pb-Free
Molding Compound
% of Compound
Weight (g)
9
8.80 E-03
85
8.31 E-02
5
4.89 E-03
0.5
4.89 E-04
0.5
4.89 E-04
PPM
45512
429839
25285
2528
2528
Leadframe
% of Leadframe
96.2
3
0.65
0.15
Weight (g)
6.87 E-02
2.14 E-03
4.64 E-04
1.07 E-04
PPM
355446
11085
2402
554
Item
Internal Leadframe Plating
Weight (g)
% of Plating
2.57 E-03
100
PPM
13287
Item
External Leadframe Plating
% of Plating
Weight (g)
4.23 E-03
100
PPM
21887
Item
Biphenyl resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Item
Cu
Ni
Si
Mg
Ag
Sn
Item
Weight (g)
1.89 E-03
PPM
Au
Bond Wires
% of Wire
99.99
Item
Si
Chip
% of Chip
100
Weight (g)
1.36 E-02
PPM
70235
Item
Die Attach
% of Die Attach
25
75
Weight (g)
4.67 E-04
1.40 E-03
PPM
Resin
Ag Filler
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected ICP AES
Not Detected ICP AES
Not Detected ICP AES
Not Detected DIN 53314
Not Detected
SGS In-house Method
Not Detected
SGS In-house Method
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
Method
PPM
<5
ICP AES
<5
ICP AES
<5
ICP AES
<5
ICP AES
Not Detected
Not Detected
9753
2415
7245
Package Totals
PPM
Weight (g)
1000000
1.93 E-01
AMK-RV-C
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
8/12/04
Materials Declaration
Package
Body Size
LeadCount
Option
TSSOP
6.1 mm
48
Sn/Pb
Molding Compound
% of Compound
Weight (g)
9
8.80 E-03
85
8.31 E-02
5
4.89 E-03
0.5
4.89 E-04
0.5
4.89 E-04
PPM
45512
429839
25285
2528
2528
Leadframe
% of Leadframe
96.2
3
0.65
0.15
Weight (g)
6.87 E-02
2.14 E-03
4.64 E-04
1.07 E-04
PPM
355446
11085
2402
554
Item
Internal Leadframe Plating
Weight (g)
% of Plating
2.57 E-03
100
PPM
13287
Item
External Leadframe Plating
% of Plating
Weight (g)
3.60 E-03
85
6.35 E-04
15
PPM
18604
3283
Item
Biphenyl resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Item
Cu
Ni
Si
Mg
Ag
Sn
Pb
Item
Weight (g)
1.89 E-03
PPM
Au
Bond Wires
% of Wire
99.99
Item
Si
Chip
% of Chip
100
Weight (g)
1.36 E-02
PPM
70235
Item
Die Attach
% of Die Attach
25
75
Weight (g)
4.67 E-04
1.40 E-03
PPM
Resin
Ag Filler
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected ICP AES
Not Detected ICP AES
Not Detected ICP AES
Not Detected DIN 53314
Not Detected
SGS In-house Method
Not Detected
SGS In-house Method
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
Method
PPM
<5
ICP AES
<5
ICP AES
<5
ICP AES
<5
ICP AES
Not Detected
Not Detected
9753
2415
7245
Package Totals
PPM
Weight (g)
1000000
1.93 E-01
AMK-RV-A
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
8/12/04