Materials Declaration Package Body Size LeadCount Option TSSOP 6.1 mm 48 Pb-Free Molding Compound % of Compound Weight (g) 9 8.80 E-03 85 8.31 E-02 5 4.89 E-03 0.5 4.89 E-04 0.5 4.89 E-04 PPM 45512 429839 25285 2528 2528 Leadframe % of Leadframe 96.2 3 0.65 0.15 Weight (g) 6.87 E-02 2.14 E-03 4.64 E-04 1.07 E-04 PPM 355446 11085 2402 554 Item Internal Leadframe Plating Weight (g) % of Plating 2.57 E-03 100 PPM 13287 Item External Leadframe Plating % of Plating Weight (g) 4.23 E-03 100 PPM 21887 Item Biphenyl resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Cu Ni Si Mg Ag Sn Item Weight (g) 1.89 E-03 PPM Au Bond Wires % of Wire 99.99 Item Si Chip % of Chip 100 Weight (g) 1.36 E-02 PPM 70235 Item Die Attach % of Die Attach 25 75 Weight (g) 4.67 E-04 1.40 E-03 PPM Resin Ag Filler Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected ICP AES Not Detected ICP AES Not Detected ICP AES Not Detected DIN 53314 Not Detected SGS In-house Method Not Detected SGS In-house Method Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM <5 ICP AES <5 ICP AES <5 ICP AES <5 ICP AES Not Detected Not Detected 9753 2415 7245 Package Totals PPM Weight (g) 1000000 1.93 E-01 AMK-RV-C Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 8/12/04 Materials Declaration Package Body Size LeadCount Option TSSOP 6.1 mm 48 Sn/Pb Molding Compound % of Compound Weight (g) 9 8.80 E-03 85 8.31 E-02 5 4.89 E-03 0.5 4.89 E-04 0.5 4.89 E-04 PPM 45512 429839 25285 2528 2528 Leadframe % of Leadframe 96.2 3 0.65 0.15 Weight (g) 6.87 E-02 2.14 E-03 4.64 E-04 1.07 E-04 PPM 355446 11085 2402 554 Item Internal Leadframe Plating Weight (g) % of Plating 2.57 E-03 100 PPM 13287 Item External Leadframe Plating % of Plating Weight (g) 3.60 E-03 85 6.35 E-04 15 PPM 18604 3283 Item Biphenyl resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Cu Ni Si Mg Ag Sn Pb Item Weight (g) 1.89 E-03 PPM Au Bond Wires % of Wire 99.99 Item Si Chip % of Chip 100 Weight (g) 1.36 E-02 PPM 70235 Item Die Attach % of Die Attach 25 75 Weight (g) 4.67 E-04 1.40 E-03 PPM Resin Ag Filler Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected ICP AES Not Detected ICP AES Not Detected ICP AES Not Detected DIN 53314 Not Detected SGS In-house Method Not Detected SGS In-house Method Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM <5 ICP AES <5 ICP AES <5 ICP AES <5 ICP AES Not Detected Not Detected 9753 2415 7245 Package Totals PPM Weight (g) 1000000 1.93 E-01 AMK-RV-A Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 8/12/04