Materials Declaration Package Body Size LeadCount Option LQFP 12 X 12 X 1.4 80 Pb Free Molding Compound % of Compound 87.5 5.5 3.0 3.0 0.6 0.5 0.3 Item Silica Fused Phenol Resin Epoxy Resin Epoxu, Cresol Novolac Brominated Epoxy Resin Antimony Trioxide Carbon Black Weight (g) 3.58 E-01 2.25 E-02 1.23 E-02 1.23 E-02 2.25 E-03 2.05 E-03 1.23 E-03 PPM 721354 45342 24732 24732 4534 4122 2473 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM 27.50 Not Detected Not Detected Not Detected Not Detected Not Detected Molding Compound Method US EPA Method #3052 US EPA Method #3052 US EPA Method #3052 US EPA Method #7196A and #3060A Analysis was performed by GC/MS Analysis was performed by GC/MS Die Attach Paste Leadframe % of Leadframe 99.3 0.3 0.3 0.2 Weight (g) 6.98 E-02 1.76 E-04 1.76 E-04 1.55 E-04 PPM 140526 354 354 312 Internal Leadframe Plating % of Plating 100.0 Weight (g) 6.23 E-05 PPM External Leadframe Plating % of Plating 100.0 Weight (g) 2.72 E-03 PPM 5483 Bond Wires % of Wire 100.0 Weight (g) 5.20 E-03 PPM 10467 Chip % of Chip 100.0 Weight (g) 6.68 E-03 PPM 13458 Die Attach % of Die Attach 77.5 12.5 8.0 8.0 3.0 Weight (g) 5.76 E-04 9.28 E-05 5.94 E-05 5.94 E-05 2.23 E-05 PPM 1159 187 120 120 45 Item Cu Sn Zn Cr Ag Item Sn Au Si Item Silver flake Diglycidylether bisphenol-F Epoxy resin gamma Butyrolactone Mixed aryl allyl glycidyl compounds Method US EPA Method #3050B EN1122: Method 2001 B US EPA Method #3052 US EPA Method #7196A and #3060A Analysis was performed by GC/MS Analysis was performed by GC/MS 125 Package Totals Weight (g) PPM 1000000 4.97 E-01 AST-ST-B Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 3/30/06 Materials Declaration Package Body Size LeadCount Option LQFP 12 X 12 X 1.4 80 SnPb Item Silica Fused Phenol Resin Epoxy Resin Epoxu, Cresol Novolac Brominated Epoxy Resin Antimony Trioxide Carbon Black Molding Compound % of Compound 87.5 5.5 3.0 3.0 0.6 0.5 0.3 Weight (g) 3.58 E-01 2.25 E-02 1.23 E-02 1.23 E-02 2.25 E-03 2.05 E-03 1.23 E-03 PPM 721354 45342 24732 24732 4534 4122 2473 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected US EPA Method #3052 Not Detected US EPA Method #3052 Not Detected US EPA Method #3052 Not Detected US EPA Method #7196A and #3060A Not Detected Analysis was performed by GC/MS Not Detected Analysis was performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE PPM 27.50 Not Detected Not Detected Not Detected Not Detected Not Detected Die Attach Paste Leadframe % of Leadframe 99.3 0.3 0.3 0.2 Weight (g) 6.98 E-02 1.76 E-04 1.76 E-04 1.55 E-04 PPM 140526 354 354 312 Internal Leadframe Plating % of Plating 100.0 Weight (g) 6.23 E-05 PPM 125 Sn Pb External Leadframe Plating % of Plating 85.0 15.0 Weight (g) 2.31 E-03 4.08 E-04 PPM 4661 823 Au Bond Wires % of Wire 100.0 Weight (g) 5.20 E-03 PPM 10467 % of Chip 100.0 Weight (g) 6.68 E-03 PPM 13458 % of Die Attach 77.5 12.5 8.0 8.0 3.0 Weight (g) 5.76 E-04 9.28 E-05 5.94 E-05 5.94 E-05 2.23 E-05 PPM 1159 187 120 120 45 Item Cu Sn Zn Cr Ag Item Method US EPA Method #3050B EN1122: Method 2001 B US EPA Method #3052 US EPA Method #7196A and #3060A Analysis was performed by GC/MS Analysis was performed by GC/MS Chip Si Die Attach Item Silver flake Diglycidylether bisphenol-F Epoxy resin gamma Butyrolactone Mixed aryl allyl glycidyl compounds Package Totals Weight (g) PPM 1000000 4.97 E-01 AST-ST-A Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 3/30/06