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Materials Declaration
Package
Body Size
LeadCount
Option
LQFP
12 X 12 X 1.4
80
Pb Free
Molding Compound
% of Compound
87.5
5.5
3.0
3.0
0.6
0.5
0.3
Item
Silica Fused
Phenol Resin
Epoxy Resin
Epoxu, Cresol Novolac
Brominated Epoxy Resin
Antimony Trioxide
Carbon Black
Weight (g)
3.58 E-01
2.25 E-02
1.23 E-02
1.23 E-02
2.25 E-03
2.05 E-03
1.23 E-03
PPM
721354
45342
24732
24732
4534
4122
2473
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
27.50
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Molding Compound
Method
US EPA Method #3052
US EPA Method #3052
US EPA Method #3052
US EPA Method #7196A and #3060A
Analysis was performed by GC/MS
Analysis was performed by GC/MS
Die Attach Paste
Leadframe
% of Leadframe
99.3
0.3
0.3
0.2
Weight (g)
6.98 E-02
1.76 E-04
1.76 E-04
1.55 E-04
PPM
140526
354
354
312
Internal Leadframe Plating
% of Plating
100.0
Weight (g)
6.23 E-05
PPM
External Leadframe Plating
% of Plating
100.0
Weight (g)
2.72 E-03
PPM
5483
Bond Wires
% of Wire
100.0
Weight (g)
5.20 E-03
PPM
10467
Chip
% of Chip
100.0
Weight (g)
6.68 E-03
PPM
13458
Die Attach
% of Die Attach
77.5
12.5
8.0
8.0
3.0
Weight (g)
5.76 E-04
9.28 E-05
5.94 E-05
5.94 E-05
2.23 E-05
PPM
1159
187
120
120
45
Item
Cu
Sn
Zn
Cr
Ag
Item
Sn
Au
Si
Item
Silver flake
Diglycidylether bisphenol-F
Epoxy resin
gamma Butyrolactone
Mixed aryl allyl glycidyl compounds
Method
US EPA Method #3050B
EN1122: Method 2001 B
US EPA Method #3052
US EPA Method #7196A and #3060A
Analysis was performed by GC/MS
Analysis was performed by GC/MS
125
Package Totals
Weight (g)
PPM
1000000
4.97 E-01
AST-ST-B
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
3/30/06
Materials Declaration
Package
Body Size
LeadCount
Option
LQFP
12 X 12 X 1.4
80
SnPb
Item
Silica Fused
Phenol Resin
Epoxy Resin
Epoxu, Cresol Novolac
Brominated Epoxy Resin
Antimony Trioxide
Carbon Black
Molding Compound
% of Compound
87.5
5.5
3.0
3.0
0.6
0.5
0.3
Weight (g)
3.58 E-01
2.25 E-02
1.23 E-02
1.23 E-02
2.25 E-03
2.05 E-03
1.23 E-03
PPM
721354
45342
24732
24732
4534
4122
2473
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected US EPA Method #3052
Not Detected US EPA Method #3052
Not Detected US EPA Method #3052
Not Detected US EPA Method #7196A and #3060A
Not Detected Analysis was performed by GC/MS
Not Detected Analysis was performed by GC/MS
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
27.50
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Die Attach Paste
Leadframe
% of Leadframe
99.3
0.3
0.3
0.2
Weight (g)
6.98 E-02
1.76 E-04
1.76 E-04
1.55 E-04
PPM
140526
354
354
312
Internal Leadframe Plating
% of Plating
100.0
Weight (g)
6.23 E-05
PPM
125
Sn
Pb
External Leadframe Plating
% of Plating
85.0
15.0
Weight (g)
2.31 E-03
4.08 E-04
PPM
4661
823
Au
Bond Wires
% of Wire
100.0
Weight (g)
5.20 E-03
PPM
10467
% of Chip
100.0
Weight (g)
6.68 E-03
PPM
13458
% of Die Attach
77.5
12.5
8.0
8.0
3.0
Weight (g)
5.76 E-04
9.28 E-05
5.94 E-05
5.94 E-05
2.23 E-05
PPM
1159
187
120
120
45
Item
Cu
Sn
Zn
Cr
Ag
Item
Method
US EPA Method #3050B
EN1122: Method 2001 B
US EPA Method #3052
US EPA Method #7196A and #3060A
Analysis was performed by GC/MS
Analysis was performed by GC/MS
Chip
Si
Die Attach
Item
Silver flake
Diglycidylether bisphenol-F
Epoxy resin
gamma Butyrolactone
Mixed aryl allyl glycidyl compounds
Package Totals
Weight (g)
PPM
1000000
4.97 E-01
AST-ST-A
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
3/30/06