Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Multi-aromatic Resin Carbon Black LQFP - PQ2 14 X 14 x 1.4 80 Pb Free Molding Compound % of Compound 88.0 11.5 0.5 Molding Compound Weight (g) 2.92 E-01 3.82 E-02 1.66 E-03 PPM 255283 33361 1451 Weight (g) 9.74 E-02 2.94 E-04 2.45 E-04 1.96 E-04 PPM 85055 257 214 171 Leadframe Item Cu Cr Sn Zn % of Leadframe 99.25 0.30 0.25 0.20 Internal Leadframe Plating % of Plating Weight (g) 6.00 E-04 100.0 PPM Ag Item PPM Sn External Leadframe Plating % of Plating Weight (g) 6.37 E-03 100.0 Item PPM Ni External Heat Sink Plating % of Plating Weight (g) 1.63 E-03 100.0 524 Pb Cd Hg Cr+6 PBB PPM None Detected None Detected None Detected None Detected None Detected Method US EPA 3050B. ICP-AES EN 1122:2001. ICP-AES US EPA 3052. ICP - AES US EPA 3060A & 7196A. US EPA 3540C. Analysis performed by HPLC/DAD, LC/MS or GC/MS PBDE None Detected US EPA 3540C. Analysis performed by HPLC/DAD, LC/MS or GC/MS Item Die Attach Paste Pb Cd Hg Cr+6 PBB PPM None Detected None Detected None Detected None Detected None Detected Method US EPA 3052. ICP -OES US EPA 3052. ICP -OES US EPA 3052. ICP -OES US EPA 3060A & 7196A . UV-VIS SGS-in house method. Analysis performed by GC/MS PBDE None Detected SGS-in house method. Analysis performed by GC/MS Item 5562 1422 Weight (g) 2.80 E-03 PPM Au Bond Wires % of Wire 99.99 Si Chip % of Chip 100.0 Weight (g) 3.29 E-02 PPM 28775 Item Ag Filler Resin Anhydride Die Attach % of Die Attach 70.0 20.0 10.0 Weight (g) 3.41 E-03 9.74 E-04 4.87 E-04 PPM Cu Heat Sink % of Heat Sink 100 Weight (g) 6.65 E-01 PPM 581229 2444 2976 851 425 Package Totals Weight (g) PPM 1000000 1.14 E+00 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information ADI Proprietary Materials Declaration Package Body Size LeadCount Option LQFP- PQ2 14 X 14 x 1.4 80 Sn/Pb Molding Compound % of Compound 86.0 13.2 0.5 0.4 Item Molding Compound Weight (g) 2.89 E-01 4.41 E-02 1.68 E-03 1.17 E-03 PPM 251264 38420 1461 1022 Weight (g) 9.74 E-02 2.94 E-04 2.45 E-04 1.96 E-04 PPM 84793 256 213 171 Weight (g) 6.00 E-04 PPM Ag Internal Leadframe Plating % of Plating 100.0 Weight (g) 5.86 E-03 1.03 E-03 PPM Sn Pb External Leadframe Plating % of Plating 85.0 15.0 External Heat Sink Plating % of Plating 100.0 Weight (g) 1.63 E-03 PPM Bond Wires % of Wire 99.99 Weight (g) 2.80 E-03 PPM Chip % of Chip 100.0 Weight (g) 3.29 E-02 PPM 28686 Item Ag Filler Diglycidylether of bisphenol-F Resin Amine Gamma Butyrolactone Mixed aryl allyl glycidyl compounds Die Attach % of Die Attach 70.0 10.0 7.0 5.0 5.0 3.0 Weight (g) 3.13 E-03 4.47 E-04 3.13 E-04 2.24 E-04 2.24 E-04 1.34 E-04 PPM Cu Heat Sink % of Heat Sink 100.0 Weight (g) 6.65 E-01 PPM 579440 SiO2 Filler Biphenyl Resin Sb2O3 Br Leadframe Item % of Leadframe 99.25 0.30 0.25 0.20 Cu Cr Sn Zn Item Item Ni Au Si 522 Item Pb Cd Hg Cr+6 PBB PPM None Detected None Detected None Detected None Detected None Detected Method US EPA 3050B. Analysis was performed by ICP-AES EN 1122 Method B. Analysis was performed by ICP-AES US EPA 3052. Analysis was performed by ICP-AES EPA 3060A & 7196A US EPA 3540 or 3550. Analysis by HPLC/DAD, LC/MS or GC/MS PBDE None Detected US EPA 3540 or 3550. Analysis by HPLC/DAD, LC/MS or GC/MS Item Pb Cd Hg Cr+6 PBB PPM 3.0 ppm None Detected None Detected None Detected None Detected Method US EPA 3052. ICP -OES US EPA 3052. ICP -OES US EPA 3052. ICP -OES US EPA 3060A & 7196A . UV-VIS SGS-in house method. Analysis performed by GC/MS PBDE None Detected SGS-in house method. Analysis performed by GC/MS Die Attach Paste 5101 900 1418 2437 2726 389 273 195 195 117 Package Totals Weight (g) PPM 1000000 1.15 E+00 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information ADI Proprietary