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Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Multi-aromatic Resin
Carbon Black
LQFP - PQ2
14 X 14 x 1.4
80
Pb Free
Molding Compound
% of Compound
88.0
11.5
0.5
Molding Compound
Weight (g)
2.92 E-01
3.82 E-02
1.66 E-03
PPM
255283
33361
1451
Weight (g)
9.74 E-02
2.94 E-04
2.45 E-04
1.96 E-04
PPM
85055
257
214
171
Leadframe
Item
Cu
Cr
Sn
Zn
% of Leadframe
99.25
0.30
0.25
0.20
Internal Leadframe Plating
% of Plating
Weight (g)
6.00 E-04
100.0
PPM
Ag
Item
PPM
Sn
External Leadframe Plating
% of Plating
Weight (g)
6.37 E-03
100.0
Item
PPM
Ni
External Heat Sink Plating
% of Plating
Weight (g)
1.63 E-03
100.0
524
Pb
Cd
Hg
Cr+6
PBB
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
Method
US EPA 3050B. ICP-AES
EN 1122:2001. ICP-AES
US EPA 3052. ICP - AES
US EPA 3060A & 7196A.
US EPA 3540C. Analysis performed by HPLC/DAD, LC/MS or GC/MS
PBDE
None Detected
US EPA 3540C. Analysis performed by HPLC/DAD, LC/MS or GC/MS
Item
Die Attach Paste
Pb
Cd
Hg
Cr+6
PBB
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
Method
US EPA 3052. ICP -OES
US EPA 3052. ICP -OES
US EPA 3052. ICP -OES
US EPA 3060A & 7196A . UV-VIS
SGS-in house method. Analysis performed by GC/MS
PBDE
None Detected
SGS-in house method. Analysis performed by GC/MS
Item
5562
1422
Weight (g)
2.80 E-03
PPM
Au
Bond Wires
% of Wire
99.99
Si
Chip
% of Chip
100.0
Weight (g)
3.29 E-02
PPM
28775
Item
Ag Filler
Resin
Anhydride
Die Attach
% of Die Attach
70.0
20.0
10.0
Weight (g)
3.41 E-03
9.74 E-04
4.87 E-04
PPM
Cu
Heat Sink
% of Heat Sink
100
Weight (g)
6.65 E-01
PPM
581229
2444
2976
851
425
Package Totals
Weight (g)
PPM
1000000
1.14 E+00
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information
ADI Proprietary
Materials Declaration
Package
Body Size
LeadCount
Option
LQFP- PQ2
14 X 14 x 1.4
80
Sn/Pb
Molding Compound
% of Compound
86.0
13.2
0.5
0.4
Item
Molding Compound
Weight (g)
2.89 E-01
4.41 E-02
1.68 E-03
1.17 E-03
PPM
251264
38420
1461
1022
Weight (g)
9.74 E-02
2.94 E-04
2.45 E-04
1.96 E-04
PPM
84793
256
213
171
Weight (g)
6.00 E-04
PPM
Ag
Internal Leadframe Plating
% of Plating
100.0
Weight (g)
5.86 E-03
1.03 E-03
PPM
Sn
Pb
External Leadframe Plating
% of Plating
85.0
15.0
External Heat Sink Plating
% of Plating
100.0
Weight (g)
1.63 E-03
PPM
Bond Wires
% of Wire
99.99
Weight (g)
2.80 E-03
PPM
Chip
% of Chip
100.0
Weight (g)
3.29 E-02
PPM
28686
Item
Ag Filler
Diglycidylether of bisphenol-F
Resin
Amine
Gamma Butyrolactone
Mixed aryl allyl glycidyl compounds
Die Attach
% of Die Attach
70.0
10.0
7.0
5.0
5.0
3.0
Weight (g)
3.13 E-03
4.47 E-04
3.13 E-04
2.24 E-04
2.24 E-04
1.34 E-04
PPM
Cu
Heat Sink
% of Heat Sink
100.0
Weight (g)
6.65 E-01
PPM
579440
SiO2 Filler
Biphenyl Resin
Sb2O3
Br
Leadframe
Item
% of Leadframe
99.25
0.30
0.25
0.20
Cu
Cr
Sn
Zn
Item
Item
Ni
Au
Si
522
Item
Pb
Cd
Hg
Cr+6
PBB
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
Method
US EPA 3050B. Analysis was performed by ICP-AES
EN 1122 Method B. Analysis was performed by ICP-AES
US EPA 3052. Analysis was performed by ICP-AES
EPA 3060A & 7196A
US EPA 3540 or 3550. Analysis by HPLC/DAD, LC/MS or GC/MS
PBDE
None Detected
US EPA 3540 or 3550. Analysis by HPLC/DAD, LC/MS or GC/MS
Item
Pb
Cd
Hg
Cr+6
PBB
PPM
3.0 ppm
None Detected
None Detected
None Detected
None Detected
Method
US EPA 3052. ICP -OES
US EPA 3052. ICP -OES
US EPA 3052. ICP -OES
US EPA 3060A & 7196A . UV-VIS
SGS-in house method. Analysis performed by GC/MS
PBDE
None Detected
SGS-in house method. Analysis performed by GC/MS
Die Attach Paste
5101
900
1418
2437
2726
389
273
195
195
117
Package Totals
Weight (g)
PPM
1000000
1.15 E+00
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information
ADI Proprietary