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Materials Declaration
Package
Body Size
LeadCount
Option
Item
Silica Fused
Epoxy, Cresol Novolac
Phenol Resin
Antimony Trioxide
Brominated Epoxy Resin
Carbon Black
Item
Cu
Ni
Si
Mg
MQFP
10 X 10 x 2.0 (+3.9)
52
Pb Free
Molding Compound
% of Compound
72.61
19.36
4.84
1.45
1.45
0.29
Weight (g)
2.72 E-01
7.24 E-02
1.81 E-02
5.42 E-03
5.42 E-03
1.09 E-03
PPM
526073
140267
35066
10506
10506
2102
Leadframe
% of Leadframe
96.20
3.00
0.65
0.15
Weight (g)
1.00 E-01
6.80 E-04
3.14 E-03
1.57 E-04
PPM
193867
1317
6083
304
Internal Leadframe Plating
% of Plating
100.0
Weight (g)
1.04 E-03
PPM
Ag
Sn
External Leadframe Plating
% of Plating
100.0
Weight (g)
5.53 E-03
PPM
10704
Bond Wires
% of Wire
99.99
Weight (g)
1.45 E-03
PPM
Au
Si
Chip
% of Chip
100.0
Weight (g)
2.78 E-02
PPM
53861
Die Attach
% of Die Attach
72.5
7.5
5.0
5.0
5.0
5.0
Weight (g)
1.70 E-03
1.75 E-04
1.17 E-04
1.17 E-04
1.17 E-04
1.17 E-04
PPM
Item
Item
Ag
Epoxy Resin
Amine
Gamma Butyrolactone
Diglycidylether of bisphenol-F
Mixed aryl glycidyl compound
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
None Detected
US EPA 3052. ICP-OES
None Detected
US EPA 3052. ICP-OES
None Detected
US EPA 3052. ICP-OES
None Detected
US EPA 3060A & 7196A. UV-VIS
None Detected
Analysis was performed by GC/MS
None Detected
Analysis was performed by GC/MS
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
3
None Detected
None Detected
None Detected
None Detected
None Detected
Die Attach Paste
Method
US EPA 3052. ICP-OES
US EPA 3052. ICP-OES
US EPA 3052. ICP-OES
US EPA 3060A & 7196A. UV-VIS
Analysis was performed by GC/MS
Analysis was performed by GC/MS
2009
2803
8361J
3284
339
227
227
227
227
Package Totals
PPM
Weight (g)
1000000
5.16 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary
6650
STS-S-B
Materials Declaration
Package
Body Size
LeadCount
Option
Item
Silica Fused
Epoxy, Cresol Novolac
Phenol Resin
Antimony Trioxide
Brominated Epoxy Resin
Carbon Black
Item
Cu
Ni
Si
Mg
MQFP
10 X 10 x 2.0 (+3.9)
52
Sn/Pb
Molding Compound
% of Compound
72.61
19.36
4.84
1.45
1.45
0.29
Weight (g)
2.72 E-01
7.24 E-02
1.81 E-02
5.42 E-03
5.42 E-03
1.09 E-03
PPM
526073
140267
35066
10506
10506
2102
Leadframe
% of Leadframe
96.20
3.00
0.65
0.15
Weight (g)
1.00 E-01
6.80 E-04
3.14 E-03
1.57 E-04
PPM
193867
1317
6083
304
Weight (g)
1.04 E-03
PPM
Ag
Internal Leadframe Plating
% of Plating
100.0
Sn
Pb
External Leadframe Plating
% of Plating
Weight (g)
85
4.70 E-03
15
8.29 E-04
Item
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
Method
PPM
3.00
US EPA 3052. ICP-OES
None Detected
US EPA 3052. ICP-OES
None Detected
US EPA 3052. ICP-OES
None Detected
US EPA 3060A & 7196A. UV-VIS
Analysis was performed by GC/MS
None Detected
None Detected
Analysis was performed by GC/MS
PPM
9098
1606
Bond Wires
% of Wire
99.99
Weight (g)
1.45 E-03
PPM
Weight (g)
2.78 E-02
PPM
Si
Chip
% of Chip
100.0
Die Attach
% of Die Attach
72.5
7.5
5.0
5.0
5.0
5.0
Weight (g)
1.70 E-03
1.75 E-04
1.17 E-04
1.17 E-04
1.17 E-04
1.17 E-04
PPM
Package Totals
Weight (g)
5.16 E-01
Molding Compound
Method
PPM
None Detected
US EPA 3052. ICP-OES
None Detected
US EPA 3052. ICP-OES
None Detected
US EPA 3052. ICP-OES
None Detected
US EPA 3060A & 7196A. UV-VIS
None Detected
Analysis was performed by GC/MS
None Detected
Analysis was performed by GC/MS
2009
Au
Item
Ag
Epoxy Resin
Amine
Gamma Butyrolactone
Diglycidylether of bisphenol-F
Mixed aryl glycidyl compound
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
2803
53861
3284
339
227
227
227
227
PPM
1000000
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary
STS-S-A