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Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Multi-aromatic Resin
Carbon Black
Subtotal
Item
Cu
Cr
Sn
Zn
Subtotal
Ag
Item
Sn
TQFP - EP
12 X 12
80
Pb-Free
Molding Compound
% of Compound
88
11.5
0.5
Weight (g)
2.11 E-01
2.75 E-02
1.20 E-03
2.39 E-01
PPM
556661
72746
3163
632570
Weight (g)
1.07 E-01
3.23 E-04
2.69 E-04
2.15 E-04
1.08 E-01
PPM
282236
854
711
568
284369
Internal Leadframe Plating
Weight (g)
% of Plating
9.60 E-04
100
PPM
2537
External Leadframe Plating
% of Plating
Weight (g)
100
7.37 E-03
PPM
19474
Leadframe
% of Leadframe
99.25
0.3
0.25
0.2
Au
Bond Wires
% of Wire
99.99
Weight (g)
1.66 E-03
PPM
4395
Si
Chip
% of Chip
100
Weight (g)
1.74 E-02
PPM
46094
Weight (g)
2.80 E-03
7.99 E-04
4.00 E-04
4.00 E-03
PPM
7392
2112
1057
10560
Item
Ag Filler
Resin
Anhydride
Subtotal
Die Attach
% of Die Attach
70
20
10
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Molding Compound
Method
USEPA 3050B. ICP-AES.
EN 1122:2001. ICP-AES
USEPA 3052. ICP-AES
USEPA 3060A & 7196A.
USEPA 3540C or 3550C. Analysis by HPLC/DAD, LC/MS or GC/MS.
USEPA 3540C or 3550C. Analysis by HPLC/DAD, LC/MS or GC/MS.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Die Attach Paste
Method
USEPA 3052. ICP-OES
USEPA 3052. ICP-OES
USEPA 3052. ICP-OES
USEPA 3060A & 7196A. UV-VIS.
Analysis was performed by GC/MS.
Analysis was performed by GC/MS.
Package Totals
PPM
Weight (g)
1000000
3.78 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Multi-aromatic Resin
Carbon Black
Item
Cu
Cr
Sn
Zn
TQFP - EP
12 X 12
80
SnPb
Molding Compound
% of Compound
88
11.5
0.5
Leadframe
% of Leadframe
99.25
0.3
0.25
0.2
Weight (g)
2.08 E-01
2.71 E-02
1.18 E-03
2.36 E-01
PPM
546110
71367
3103
620580
Weight (g)
1.07 E-01
3.23 E-04
2.69 E-04
2.15 E-04
1.08 E-01
PPM
280823
849
707
565
282945
Internal Leadframe Plating
Weight (g)
% of Plating
9.60 E-04
100
Ag
Item
Sn
Pb
External Leadframe Plating
% of Plating
Weight (g)
85
6.78 E-03
15
1.20 E-03
7.98 E-03
PPM
Weight (g)
1.66 E-03
PPM
Si
Chip
% of Chip
100
Weight (g)
2.16 E-02
PPM
56723
Weight (g)
3.16 E-03
9.04 E-04
4.52 E-04
4.52 E-03
PPM
Die Attach
% of Die Attach
70
20
10
Molding Compound
Method
USEPA 3050B. ICP-AES.
EN 1122:2001. ICP-AES
USEPA 3052. ICP-AES
USEPA 3060A & 7196A.
USEPA 3540C or 3550C. Analysis by HPLC/DAD, LC/MS or GC/MS.
USEPA 3540C or 3550C. Analysis by HPLC/DAD, LC/MS or GC/MS.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Die Attach Paste
Method
USEPA 3052. ICP-OES
USEPA 3052. ICP-OES
USEPA 3052. ICP-OES
USEPA 3060A & 7196A. UV-VIS.
Analysis was performed by GC/MS.
Analysis was performed by GC/MS.
PPM
17825
3145
20970
Bond Wires
% of Wire
99.99
Item
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
2524
Au
Ag Filler
Resin
Anhydride
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
4373
8320
2377
1189
11885
Package Totals
PPM
Weight (g)
1000000
3.80 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary