Materials Declaration Package Body Size LeadCount Option Item Silica Fused Epoxy Resin Phenol Resin Carbon Black Subtotal Item Cu Fe Zn P Subtotal LFCSP 3 X 3 X 0.75 mm 10 Pb-free Molding Compound % of Compound Weight (g) 93.70 1.03E-02 3.00 3.30E-04 3.00 3.30E-04 0.30 3.30E-05 1.10 E-02 Leadframe % of Leadframe 97.50 2.35 0.12 0.03 Weight (g) 1.02 E-02 2.38 E-04 1.32 E-05 2.53 E-06 1.04 E-02 PPM 464515 14872 14872 1487 495747 PPM 459235 10726 594 114 470670 Internal Leadframe Plating % of Plating Weight (g) 1.05 E-04 100.0 PPM Ag PPM Sn External Leadframe Plating Weight (g) % of Plating 100.0 1.31 E-04 Item Au Pd Subtotal Si Item Ag Acrylates Bismaleimide Additive Subtotal Bond Wires % of Wire 99.0 1.0 Chip % of Chip 100.0 Die Attach % of Die Attach 85.0 5.0 5.0 5.0 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3060A & 7196A. UV-VIS. Not Detected Analysis performed by GC/MS Not Detected Analysis performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM 3.7 US EPA 3052. ICP-OES Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3060A & 7196A. UV-VIS. Not Detected Analysis performed by GC/MS Not Detected Analysis performed by GC/MS 4754 5909 Weight (g) 9.90 E-05 1.00 E-06 1.00 E-04 PPM Weight (g) 3.78 E-04 PPM 17056 Weight (g) 2.55 E-05 1.50 E-06 1.50 E-06 1.50 E-06 3.00 E-05 PPM 4466 45 4511 1150 68 68 68 1353 Package Totals Weight (g) PPM 1000000 2.22 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Item Silica Fused Epoxy Resin Phenol Resin Carbon Black Subtotal Item Cu Fe Zn P Subtotal LFCSP 3 X 3 X 0.75 mm 10 SnPb Molding Compound % of Compound Weight (g) 93.70 1.03E-02 3.00 3.30E-04 3.00 3.30E-04 0.30 3.30E-05 1.10 E-02 Leadframe % of Leadframe 97.50 2.35 0.12 0.03 Weight (g) 1.02 E-02 2.38 E-04 1.32 E-05 2.53 E-06 1.04 E-02 Ag Internal Leadframe Plating % of Plating Weight (g) 1.05 E-04 100.0 Sn Pb Subtotal External Leadframe Plating Weight (g) % of Plating 85.0 1.19 E-04 15.0 2.10 E-05 1.40 E-04 Item Au Pd Subtotal Si Item Ag Acrylates Bismaleimide Additive Subtotal Bond Wires % of Wire 99.0 1.0 Chip % of Chip 100.0 Die Attach % of Die Attach 85.0 5.0 5.0 5.0 PPM 464326 14866 14866 1487 495546 PPM 459049 10722 594 114 470479 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3060A & 7196A. UV-VIS. Not Detected Analysis performed by GC/MS Not Detected Analysis performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM 3.7 US EPA 3052. ICP-OES Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3060A & 7196A. UV-VIS. Not Detected Analysis performed by GC/MS Not Detected Analysis performed by GC/MS PPM 4753 PPM 5366 947 6313 Weight (g) 9.90 E-05 1.00 E-06 1.00 E-04 PPM Weight (g) 3.78 E-04 PPM 17049 Weight (g) 2.55 E-05 1.50 E-06 1.50 E-06 1.50 E-06 3.00 E-05 PPM 4464 45 4509 1150 68 68 68 1353 Package Totals Weight (g) PPM 1000000 2.22 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary