pdf

Materials Declaration
Package
Body Size
LeadCount
Option
Item
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
Subtotal
Item
Cu
Fe
Zn
P
Subtotal
LFCSP
3 X 3 X 0.75 mm
10
Pb-free
Molding Compound
% of Compound
Weight (g)
93.70
1.03E-02
3.00
3.30E-04
3.00
3.30E-04
0.30
3.30E-05
1.10 E-02
Leadframe
% of Leadframe
97.50
2.35
0.12
0.03
Weight (g)
1.02 E-02
2.38 E-04
1.32 E-05
2.53 E-06
1.04 E-02
PPM
464515
14872
14872
1487
495747
PPM
459235
10726
594
114
470670
Internal Leadframe Plating
% of Plating
Weight (g)
1.05 E-04
100.0
PPM
Ag
PPM
Sn
External Leadframe Plating
Weight (g)
% of Plating
100.0
1.31 E-04
Item
Au
Pd
Subtotal
Si
Item
Ag
Acrylates
Bismaleimide
Additive
Subtotal
Bond Wires
% of Wire
99.0
1.0
Chip
% of Chip
100.0
Die Attach
% of Die Attach
85.0
5.0
5.0
5.0
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected
US EPA 3052. ICP-OES
Not Detected
US EPA 3052. ICP-OES
Not Detected
US EPA 3052. ICP-OES
Not Detected
US EPA 3060A & 7196A. UV-VIS.
Not Detected
Analysis performed by GC/MS
Not Detected
Analysis performed by GC/MS
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
Method
PPM
3.7
US EPA 3052. ICP-OES
Not Detected
US EPA 3052. ICP-OES
Not Detected
US EPA 3052. ICP-OES
Not Detected
US EPA 3060A & 7196A. UV-VIS.
Not Detected
Analysis performed by GC/MS
Not Detected
Analysis performed by GC/MS
4754
5909
Weight (g)
9.90 E-05
1.00 E-06
1.00 E-04
PPM
Weight (g)
3.78 E-04
PPM
17056
Weight (g)
2.55 E-05
1.50 E-06
1.50 E-06
1.50 E-06
3.00 E-05
PPM
4466
45
4511
1150
68
68
68
1353
Package Totals
Weight (g)
PPM
1000000
2.22 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
LeadCount
Option
Item
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
Subtotal
Item
Cu
Fe
Zn
P
Subtotal
LFCSP
3 X 3 X 0.75 mm
10
SnPb
Molding Compound
% of Compound
Weight (g)
93.70
1.03E-02
3.00
3.30E-04
3.00
3.30E-04
0.30
3.30E-05
1.10 E-02
Leadframe
% of Leadframe
97.50
2.35
0.12
0.03
Weight (g)
1.02 E-02
2.38 E-04
1.32 E-05
2.53 E-06
1.04 E-02
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
1.05 E-04
100.0
Sn
Pb
Subtotal
External Leadframe Plating
Weight (g)
% of Plating
85.0
1.19 E-04
15.0
2.10 E-05
1.40 E-04
Item
Au
Pd
Subtotal
Si
Item
Ag
Acrylates
Bismaleimide
Additive
Subtotal
Bond Wires
% of Wire
99.0
1.0
Chip
% of Chip
100.0
Die Attach
% of Die Attach
85.0
5.0
5.0
5.0
PPM
464326
14866
14866
1487
495546
PPM
459049
10722
594
114
470479
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected
US EPA 3052. ICP-OES
Not Detected
US EPA 3052. ICP-OES
Not Detected
US EPA 3052. ICP-OES
Not Detected US EPA 3060A & 7196A. UV-VIS.
Not Detected
Analysis performed by GC/MS
Not Detected
Analysis performed by GC/MS
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
Method
PPM
3.7
US EPA 3052. ICP-OES
Not Detected
US EPA 3052. ICP-OES
Not Detected
US EPA 3052. ICP-OES
Not Detected US EPA 3060A & 7196A. UV-VIS.
Not Detected
Analysis performed by GC/MS
Not Detected
Analysis performed by GC/MS
PPM
4753
PPM
5366
947
6313
Weight (g)
9.90 E-05
1.00 E-06
1.00 E-04
PPM
Weight (g)
3.78 E-04
PPM
17049
Weight (g)
2.55 E-05
1.50 E-06
1.50 E-06
1.50 E-06
3.00 E-05
PPM
4464
45
4509
1150
68
68
68
1353
Package Totals
Weight (g)
PPM
1000000
2.22 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary