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Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Epoxy & Phenol Resin
Carbon black
Subtotal
Item
Cu
Fe
Zn
P
Subtotal
LFCSP
9 X 9 X 0.85 (6.2 mm EP)
64
Pb-free
Molding Compound
% of Compound
86.9
12.8
0.3
Leadframe
% of Leadframe
97.62
2.19
0.11
0.07
Weight (g)
9.32 E-02
1.37 E-02
3.32 E-04
1.07 E-01
PPM
476496
70066
1698
548260
Weight (g)
7.08 E-02
1.59 E-03
8.20 E-05
5.30 E-05
7.25 E-02
PPM
361985
8126
419
271
370801
Internal Leadframe Plating
% of Plating
Weight (g)
7.13 E-04
100
PPM
Ag
PPM
Sn
External Leadframe Plating
% of Plating
Weight (g)
100
3.00 E-04
Item
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
3
Not Detected
Not Detected
Weight (g)
1.58 E-03
PPM
Si
Chip
% of Chip
100
Weight (g)
1.14 E-02
PPM
58340
Weight (g)
1.34 E-03
3.36 E-04
5.00 E-05
5.00 E-05
5.00 E-05
1.83 E-03
PPM
Molding Compound
Method
US EPA 3052. ICP-OES
US EPA 3052. ICP-OES
US EPA 3052. ICP-OES
EPA 3060A & 7196A. UV-VIS
USEPA 3540C/3550C. Analysis performed by GC/MS
USEPA 3540C/3550C. Analysis performed by GC/MS
Die Attach Paste
1534
Au
Die Attach
% of Die Attach
73
18
3
3
3
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
3646
Bond Wires
% of Wire
99.99
Item
Ag
Epoxy Resin
Metal oxide
Curing and hardening agent
Gamma Butyrolactone
Subtotal
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
8060
6873
1718
256
256
256
9359
Package Totals
Weight (g)
PPM
1000000
1.96 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
US EPA 3052. ICP-OES
US EPA 3052. ICP-OES
US EPA 3052. ICP-OES
EPA 3060A & 7196A. UV-VIS
USEPA 3540C/3550C. Analysis performed by GC/MS
USEPA 3540C/3550C. Analysis performed by GC/MS