Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy & Phenol Resin Carbon black Subtotal Item Cu Fe Zn P Subtotal LFCSP 9 X 9 X 0.85 (6.2 mm EP) 64 Pb-free Molding Compound % of Compound 86.9 12.8 0.3 Leadframe % of Leadframe 97.62 2.19 0.11 0.07 Weight (g) 9.32 E-02 1.37 E-02 3.32 E-04 1.07 E-01 PPM 476496 70066 1698 548260 Weight (g) 7.08 E-02 1.59 E-03 8.20 E-05 5.30 E-05 7.25 E-02 PPM 361985 8126 419 271 370801 Internal Leadframe Plating % of Plating Weight (g) 7.13 E-04 100 PPM Ag PPM Sn External Leadframe Plating % of Plating Weight (g) 100 3.00 E-04 Item Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected 3 Not Detected Not Detected Weight (g) 1.58 E-03 PPM Si Chip % of Chip 100 Weight (g) 1.14 E-02 PPM 58340 Weight (g) 1.34 E-03 3.36 E-04 5.00 E-05 5.00 E-05 5.00 E-05 1.83 E-03 PPM Molding Compound Method US EPA 3052. ICP-OES US EPA 3052. ICP-OES US EPA 3052. ICP-OES EPA 3060A & 7196A. UV-VIS USEPA 3540C/3550C. Analysis performed by GC/MS USEPA 3540C/3550C. Analysis performed by GC/MS Die Attach Paste 1534 Au Die Attach % of Die Attach 73 18 3 3 3 PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected 3646 Bond Wires % of Wire 99.99 Item Ag Epoxy Resin Metal oxide Curing and hardening agent Gamma Butyrolactone Subtotal Item Pb Cd Hg Cr+6 PBB PBDE 8060 6873 1718 256 256 256 9359 Package Totals Weight (g) PPM 1000000 1.96 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method US EPA 3052. ICP-OES US EPA 3052. ICP-OES US EPA 3052. ICP-OES EPA 3060A & 7196A. UV-VIS USEPA 3540C/3550C. Analysis performed by GC/MS USEPA 3540C/3550C. Analysis performed by GC/MS