Materials Declaration Package Body Size LeadCount Option Item Byphenyl resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Cu Ni Si Mg TSSOP 4.4 16 Pb-Free Molding Compound % of Compound Weight (g) 9 1.00 E-03 85 9.48 E-03 5 5.58 E-04 0.5 5.58 E-05 0.5 5.58 E-05 PPM 15738 148639 8743 874 874 Leadframe % of Leadframe 96.2 3 0.65 0.15 PPM 552150 17219 3731 861 Weight (g) 3.52 E-02 1.10 E-03 2.38 E-04 5.49 E-05 Ag Internal Leadframe Plating % of Plating Weight (g) 5.00 E-04 100 Sn External Leadframe Plating % of Plating Weight (g) 1.42 E-03 100 Item PPM Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste PPM <5 ICP AES <5 ICP AES <5 ICP AES <5 ICP AES Not Detected Not Detected Method Method PPM 22215 Bond Wires % of Wire 99.99 Weight (g) 3.13 E-04 PPM Si Chip % of Chip 100 Weight (g) 1.36 E-02 PPM 212859 Die Attach % of Die Attach 25 75 Weight (g) 5.34 E-05 1.60 E-04 PPM Item Molding Compound PPM Not Detected ICP AES Not Detected ICP AES Not Detected ICP AES Not Detected DIN 53314 Not Detected ICP AES Not Detected ICP AES 7838 Au Resin Ag Filler Item Pb Cd Hg Cr+6 PBB PBDE 4909 838 2513 AMK-RU-D Package Totals Weight (g) PPM 1000000 6.38 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Item Byphenyl resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Cu Ni Si Mg TSSOP 4.4 16 Sn/Pb Molding Compound % of Compound Weight (g) 9 1.00 E-03 85 9.48 E-03 5 5.58 E-04 0.5 5.58 E-05 0.5 5.58 E-05 PPM 15738 148639 8743 874 874 Leadframe % of Leadframe 96.2 3 0.65 0.15 PPM 552150 17219 3731 861 Weight (g) 3.52 E-02 1.10 E-03 2.38 E-04 5.49 E-05 Ag Internal Leadframe Plating % of Plating Weight (g) 5.00 E-04 100 Sn Pb External Leadframe Plating % of Plating Weight (g) 1.20 E-03 85 2.13 E-04 15 Item PPM Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste PPM <5 ICP AES <5 ICP AES <5 ICP AES <5 ICP AES Not Detected Not Detected Method Method PPM 18882 3332 Bond Wires % of Wire 99.99 Weight (g) 3.13 E-04 PPM Si Chip % of Chip 100 Weight (g) 1.36 E-02 PPM 212859 Die Attach % of Die Attach 25 75 Weight (g) 5.34 E-05 1.60 E-04 PPM Item Molding Compound PPM Not Detected ICP AES Not Detected ICP AES Not Detected ICP AES Not Detected DIN 53314 Not Detected ICP AES Not Detected ICP AES 7838 Au Resin Ag Filler Item Pb Cd Hg Cr+6 PBB PBDE 4909 838 2513 AMK-RU-A Package Totals Weight (g) PPM 1000000 6.38 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary