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Materials Declaration
Package
Body Size
LeadCount
Option
Item
Byphenyl resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Item
Cu
Ni
Si
Mg
TSSOP
4.4
16
Pb-Free
Molding Compound
% of Compound
Weight (g)
9
1.00 E-03
85
9.48 E-03
5
5.58 E-04
0.5
5.58 E-05
0.5
5.58 E-05
PPM
15738
148639
8743
874
874
Leadframe
% of Leadframe
96.2
3
0.65
0.15
PPM
552150
17219
3731
861
Weight (g)
3.52 E-02
1.10 E-03
2.38 E-04
5.49 E-05
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
5.00 E-04
100
Sn
External Leadframe Plating
% of Plating
Weight (g)
1.42 E-03
100
Item
PPM
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
PPM
<5
ICP AES
<5
ICP AES
<5
ICP AES
<5
ICP AES
Not Detected
Not Detected
Method
Method
PPM
22215
Bond Wires
% of Wire
99.99
Weight (g)
3.13 E-04
PPM
Si
Chip
% of Chip
100
Weight (g)
1.36 E-02
PPM
212859
Die Attach
% of Die Attach
25
75
Weight (g)
5.34 E-05
1.60 E-04
PPM
Item
Molding Compound
PPM
Not Detected
ICP AES
Not Detected
ICP AES
Not Detected
ICP AES
Not Detected
DIN 53314
Not Detected
ICP AES
Not Detected
ICP AES
7838
Au
Resin
Ag Filler
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
4909
838
2513
AMK-RU-D
Package Totals
Weight (g)
PPM
1000000
6.38 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
LeadCount
Option
Item
Byphenyl resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Item
Cu
Ni
Si
Mg
TSSOP
4.4
16
Sn/Pb
Molding Compound
% of Compound
Weight (g)
9
1.00 E-03
85
9.48 E-03
5
5.58 E-04
0.5
5.58 E-05
0.5
5.58 E-05
PPM
15738
148639
8743
874
874
Leadframe
% of Leadframe
96.2
3
0.65
0.15
PPM
552150
17219
3731
861
Weight (g)
3.52 E-02
1.10 E-03
2.38 E-04
5.49 E-05
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
5.00 E-04
100
Sn
Pb
External Leadframe Plating
% of Plating
Weight (g)
1.20 E-03
85
2.13 E-04
15
Item
PPM
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
PPM
<5
ICP AES
<5
ICP AES
<5
ICP AES
<5
ICP AES
Not Detected
Not Detected
Method
Method
PPM
18882
3332
Bond Wires
% of Wire
99.99
Weight (g)
3.13 E-04
PPM
Si
Chip
% of Chip
100
Weight (g)
1.36 E-02
PPM
212859
Die Attach
% of Die Attach
25
75
Weight (g)
5.34 E-05
1.60 E-04
PPM
Item
Molding Compound
PPM
Not Detected
ICP AES
Not Detected
ICP AES
Not Detected
ICP AES
Not Detected
DIN 53314
Not Detected
ICP AES
Not Detected
ICP AES
7838
Au
Resin
Ag Filler
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
4909
838
2513
AMK-RU-A
Package Totals
Weight (g)
PPM
1000000
6.38 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary