Materials Declaration Package Body Size LeadCount Option Molding Compound % of Compound Weight (g) 9 5.40 E-03 85 5.10 E-02 5 3.00 E-03 0.5 3.00 E-04 0.5 3.00 E-04 PPM 45510 429817 25283 2528 2528 Leadframe % of Leadframe 96.2 3 0.65 0.15 Weight (g) 3.53 E-02 1.10 E-03 2.38 E-04 5.50 E-05 PPM 297281 9271 2009 464 Item Internal Leadframe Plating Weight (g) % of Plating 1.71 E-03 100 PPM 14424 Item External Leadframe Plating % of Plating Weight (g) 3.35 E-03 100 PPM 28216 Item Byphenyl resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Cu Ni Si Mg Ag Sn Item Bond Wires % of Wire 99.99 Weight (g) 1.49 E-03 PPM 12572 Item Chip % of Chip 100 Weight (g) 1.36 E-02 PPM 114369 Item Die Attach % of Die Attach 25 75 Weight (g) 4.67 E-04 1.40 E-03 PPM Au Si Resin Ag Filler TSSOP 4.4 38 Pb-Free Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected ICP AES Not Detected ICP AES Not Detected ICP AES Not Detected DIN 53314 Not Detected SGS In-house Method Not Detected SGS In-house Method Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM <5 ICP AES <5 ICP AES <5 ICP AES <5 ICP AES Not Detected Not Detected 3932 11797 Package Totals PPM Weight (g) 1000000 1.19 E-01 AMK-RU-D Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 7/21/04 Materials Declaration Package Body Size LeadCount Option Molding Compound % of Compound Weight (g) 9 5.40 E-03 85 5.10 E-02 5 3.00 E-03 0.5 3.00 E-04 0.5 3.00 E-04 PPM 45510 429817 25283 2528 2528 Leadframe % of Leadframe 96.2 3 0.65 0.15 Weight (g) 3.53 E-02 1.10 E-03 2.38 E-04 5.50 E-05 PPM 297281 9271 2009 464 Item Internal Leadframe Plating Weight (g) % of Plating 1.71 E-03 100 PPM 14424 Item External Leadframe Plating % of Plating Weight (g) 2.85 E-03 85 5.03 E-04 15 PPM 23983 4232 Item Byphenyl resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Cu Ni Si Mg Ag Sn Pb Item Bond Wires % of Wire 99.99 Weight (g) 1.49 E-03 PPM 12572 Item Chip % of Chip 100 Weight (g) 1.36 E-02 PPM 114369 Item Die Attach % of Die Attach 25 75 Weight (g) 4.67 E-04 1.40 E-03 PPM Au Si Resin Ag Filler TSSOP 4.4 38 Sn/Pb Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected ICP AES Not Detected ICP AES Not Detected ICP AES Not Detected DIN 53314 Not Detected SGS In-house Method Not Detected SGS In-house Method Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM <5 ICP AES <5 ICP AES <5 ICP AES <5 ICP AES Not Detected Not Detected 3932 11797 Package Totals PPM Weight (g) 1000000 1.19 E-01 AMK-RU-A Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 7/21/04