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Materials Declaration
Package
Body Size
LeadCount
Option
Molding Compound
% of Compound
Weight (g)
9
5.40 E-03
85
5.10 E-02
5
3.00 E-03
0.5
3.00 E-04
0.5
3.00 E-04
PPM
45510
429817
25283
2528
2528
Leadframe
% of Leadframe
96.2
3
0.65
0.15
Weight (g)
3.53 E-02
1.10 E-03
2.38 E-04
5.50 E-05
PPM
297281
9271
2009
464
Item
Internal Leadframe Plating
Weight (g)
% of Plating
1.71 E-03
100
PPM
14424
Item
External Leadframe Plating
% of Plating
Weight (g)
3.35 E-03
100
PPM
28216
Item
Byphenyl resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Item
Cu
Ni
Si
Mg
Ag
Sn
Item
Bond Wires
% of Wire
99.99
Weight (g)
1.49 E-03
PPM
12572
Item
Chip
% of Chip
100
Weight (g)
1.36 E-02
PPM
114369
Item
Die Attach
% of Die Attach
25
75
Weight (g)
4.67 E-04
1.40 E-03
PPM
Au
Si
Resin
Ag Filler
TSSOP
4.4
38
Pb-Free
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected ICP AES
Not Detected ICP AES
Not Detected ICP AES
Not Detected DIN 53314
Not Detected
SGS In-house Method
Not Detected
SGS In-house Method
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
Method
PPM
<5
ICP AES
<5
ICP AES
<5
ICP AES
<5
ICP AES
Not Detected
Not Detected
3932
11797
Package Totals
PPM
Weight (g)
1000000
1.19 E-01
AMK-RU-D
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
7/21/04
Materials Declaration
Package
Body Size
LeadCount
Option
Molding Compound
% of Compound
Weight (g)
9
5.40 E-03
85
5.10 E-02
5
3.00 E-03
0.5
3.00 E-04
0.5
3.00 E-04
PPM
45510
429817
25283
2528
2528
Leadframe
% of Leadframe
96.2
3
0.65
0.15
Weight (g)
3.53 E-02
1.10 E-03
2.38 E-04
5.50 E-05
PPM
297281
9271
2009
464
Item
Internal Leadframe Plating
Weight (g)
% of Plating
1.71 E-03
100
PPM
14424
Item
External Leadframe Plating
% of Plating
Weight (g)
2.85 E-03
85
5.03 E-04
15
PPM
23983
4232
Item
Byphenyl resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Item
Cu
Ni
Si
Mg
Ag
Sn
Pb
Item
Bond Wires
% of Wire
99.99
Weight (g)
1.49 E-03
PPM
12572
Item
Chip
% of Chip
100
Weight (g)
1.36 E-02
PPM
114369
Item
Die Attach
% of Die Attach
25
75
Weight (g)
4.67 E-04
1.40 E-03
PPM
Au
Si
Resin
Ag Filler
TSSOP
4.4
38
Sn/Pb
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected ICP AES
Not Detected ICP AES
Not Detected ICP AES
Not Detected DIN 53314
Not Detected
SGS In-house Method
Not Detected
SGS In-house Method
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
Method
PPM
<5
ICP AES
<5
ICP AES
<5
ICP AES
<5
ICP AES
Not Detected
Not Detected
3932
11797
Package Totals
PPM
Weight (g)
1000000
1.19 E-01
AMK-RU-A
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
7/21/04