Materials Declaration Package Body Size LeadCount Option Item Byphenyl resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Cu Ni Si Mg TSSOP 4.4 8 Pb-Free Molding Compound % of Compound Weight (g) 9 6.27 E-04 85 5.93 E-03 5 3.49 E-04 0.5 3.49 E-05 0.5 3.49 E-05 PPM 19129 180665 10627 1063 1063 Leadframe % of Leadframe 96.2 3 0.65 0.15 PPM 671117 20929 4535 1046 Weight (g) 2.20 E-02 6.87 E-04 1.49 E-04 3.43 E-05 Ag Internal Leadframe Plating % of Plating Weight (g) 3.00 E-04 100 Sn External Leadframe Plating % of Plating Weight (g) 7.60 E-04 100 Item PPM Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM <5 ICP AES <5 ICP AES <5 ICP AES <5 ICP AES Not Detected Not Detected PPM 23169 Bond Wires % of Wire 99.99 Weight (g) 1.57 E-04 PPM Si Chip % of Chip 100 Weight (g) 1.58 E-03 PPM 48166 Die Attach % of Die Attach 25 75 Weight (g) 3.75 E-05 1.13 E-04 PPM Item Molding Compound Method PPM Not Detected ICP AES Not Detected ICP AES Not Detected ICP AES Not Detected DIN 53314 9145 Au Resin Ag Filler Item Pb Cd Hg Cr+6 4773 1143 3430 Package Totals PPM Weight (g) 1000000 3.28 E-02 AMK-RU-D Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 9/21/05 Materials Declaration Package Body Size LeadCount Option Item Byphenyl resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Cu Ni Si Mg TSSOP 4.4 8 Sn/Pb Molding Compound % of Compound Weight (g) 9 6.27 E-04 85 5.93 E-03 5 3.49 E-04 0.5 3.49 E-05 0.5 3.49 E-05 PPM 19129 180665 10627 1063 1063 Leadframe % of Leadframe 96.2 3 0.65 0.15 PPM 671117 20929 4535 1046 Weight (g) 2.20 E-02 6.87 E-04 1.49 E-04 3.43 E-05 Ag Internal Leadframe Plating % of Plating Weight (g) 3.00 E-04 100 Sn Pb External Leadframe Plating % of Plating Weight (g) 6.46 E-04 85 1.14 E-04 15 Item Bond Wires % of Wire 99.99 Au Item Resin Ag Filler Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound PPM Not Detected ICP AES Not Detected ICP AES Not Detected ICP AES Not Detected DIN 53314 Die Attach Paste PPM <5 ICP AES <5 ICP AES <5 ICP AES <5 ICP AES Not Detected Not Detected Method Method 9145 PPM 19693 3.48 E+03 Weight (g) 1.57 E-04 PPM 100 Weight (g) 1.58 E-03 PPM 48166 Die Attach % of Die Attach 25 75 Weight (g) 3.75 E-05 1.13 E-04 PPM Chip % of Chip Si PPM Item Pb Cd Hg Cr+6 4773 1143 3430 Package Totals PPM Weight (g) 1000000 3.28 E-02 AMK-RU-A Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 9/21/05