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Materials Declaration
Package
Body Size
LeadCount
Option
Item
Byphenyl resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Item
Cu
Ni
Si
Mg
TSSOP
4.4
8
Pb-Free
Molding Compound
% of Compound
Weight (g)
9
6.27 E-04
85
5.93 E-03
5
3.49 E-04
0.5
3.49 E-05
0.5
3.49 E-05
PPM
19129
180665
10627
1063
1063
Leadframe
% of Leadframe
96.2
3
0.65
0.15
PPM
671117
20929
4535
1046
Weight (g)
2.20 E-02
6.87 E-04
1.49 E-04
3.43 E-05
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
3.00 E-04
100
Sn
External Leadframe Plating
% of Plating
Weight (g)
7.60 E-04
100
Item
PPM
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
Method
PPM
<5
ICP AES
<5
ICP AES
<5
ICP AES
<5
ICP AES
Not Detected
Not Detected
PPM
23169
Bond Wires
% of Wire
99.99
Weight (g)
1.57 E-04
PPM
Si
Chip
% of Chip
100
Weight (g)
1.58 E-03
PPM
48166
Die Attach
% of Die Attach
25
75
Weight (g)
3.75 E-05
1.13 E-04
PPM
Item
Molding Compound
Method
PPM
Not Detected ICP AES
Not Detected ICP AES
Not Detected ICP AES
Not Detected DIN 53314
9145
Au
Resin
Ag Filler
Item
Pb
Cd
Hg
Cr+6
4773
1143
3430
Package Totals
PPM
Weight (g)
1000000
3.28 E-02
AMK-RU-D
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
9/21/05
Materials Declaration
Package
Body Size
LeadCount
Option
Item
Byphenyl resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Item
Cu
Ni
Si
Mg
TSSOP
4.4
8
Sn/Pb
Molding Compound
% of Compound
Weight (g)
9
6.27 E-04
85
5.93 E-03
5
3.49 E-04
0.5
3.49 E-05
0.5
3.49 E-05
PPM
19129
180665
10627
1063
1063
Leadframe
% of Leadframe
96.2
3
0.65
0.15
PPM
671117
20929
4535
1046
Weight (g)
2.20 E-02
6.87 E-04
1.49 E-04
3.43 E-05
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
3.00 E-04
100
Sn
Pb
External Leadframe Plating
% of Plating
Weight (g)
6.46 E-04
85
1.14 E-04
15
Item
Bond Wires
% of Wire
99.99
Au
Item
Resin
Ag Filler
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
PPM
Not Detected
ICP AES
Not Detected
ICP AES
Not Detected
ICP AES
Not Detected
DIN 53314
Die Attach Paste
PPM
<5
ICP AES
<5
ICP AES
<5
ICP AES
<5
ICP AES
Not Detected
Not Detected
Method
Method
9145
PPM
19693
3.48 E+03
Weight (g)
1.57 E-04
PPM
100
Weight (g)
1.58 E-03
PPM
48166
Die Attach
% of Die Attach
25
75
Weight (g)
3.75 E-05
1.13 E-04
PPM
Chip
% of Chip
Si
PPM
Item
Pb
Cd
Hg
Cr+6
4773
1143
3430
Package Totals
PPM
Weight (g)
1000000
3.28 E-02
AMK-RU-A
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
9/21/05