Materials Declaration Package Body Size LeadCount Option Substance Silica Epoxy Resin Phenol Resin Antimony Trioxide Additive Brominated epoxy Carbon Black Subtotal Substance Iron Nickel Manganese Cobalt Silicon Chromium Aluminum Subtotal SC 70-ISOLATED BACKSIDE -3 Pb-free Molding Compound % of Compound 81.0 10.0 5.0 1.4 1.1 1.0 0.5 100.0 Weight (g) 2.26 E-03 2.79 E-04 1.39 E-04 3.90 E-05 3.07 E-05 2.79 E-05 1.39 E-05 2.79 E-03 PPM 413345 51030 25515 7144 5613 5103 2552 510303 Leadframe % of Leadframe 56.7 41.5 0.8 0.5 0.3 0.1 0.1 100.0 Weight (g) 1.25 E-03 9.13 E-04 1.76 E-05 1.10 E-05 6.60 E-06 2.20 E-06 2.20 E-06 2.20 E-03 PPM 228458 167214 3223 2015 1209 403 403 402924 Substance Internal Leadframe Plating % of Plating 100.0 Weight (g) 4.40 E-06 PPM Silver Substance Tin External Leadframe Plating % of Plating 100.0 Weight (g) 2.00 E-04 PPM 36613 Substance Gold Bond Wires % of Wire 99.9 Weight (g) 3.00 E-05 PPM 5492 Substance Doped Silicon Chip % of Chip 100.0 Weight (g) 2.10 E-04 PPM 38444 Die Attach % of Die Attach 46.0 46.0 8.0 100.0 Weight (g) 1.38 E-05 1.38 E-05 2.00 E-06 2.96 E-05 PPM 2526 2526 366 5419 Substance Epoxy resin Silicon dioxide Curing agent & hardener Subtotal Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Molding Compound PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD. Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Die Attach Paste PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD. 805 Package Totals PPM Weight (g) 5.46 E-03 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Molding Compound % of Compound 87.3 4.5 3.0 3.0 2.0 0.2 100 Weight (g) 2.47 E-03 1.27 E-04 8.49 E-05 8.49 E-05 5.66 E-05 5.66 E-06 2.83 E-03 PPM 466156 24029 16019 16019 10679 1068 533970 Leadframe % of Leadframe 97.5 2.35 0.12 0.03 100 Weight (g) 2.12 E-03 5.10 E-05 2.61 E-06 6.52 E-07 2.17 E-03 PPM 399590 9631 492 123 409836 Internal Leadframe Plating/External Leadframe Plating Substance % of Plating Weight (g) 2.53 E-05 90.91 2.20 E-06 7.91 3.30 E-07 1.19 100.00 2.78 E-05 PPM 4774 415 62 5251 Substance Silica Phenol Resin Epoxy Resin 1 Epoxy Resin 2 Others Carbon Black Subtotal Substance Copper Iron Zinc Phosphorus Subtotal Nickel Palladium Gold Subtotal SC70 - COL -3 NiPdAu Bond Wires % of Wire 99.99 Weight (g) 3.00 E-05 PPM 5660 Substance Doped Silicon Chip % of Chip 100 Weight (g) 2.10 E-04 PPM 39623 Substance Epoxy Resin Metal Oxide Glycol ethers Silica Curing agent & hardener Subtotal Die Attach % of Die Attach 31 31 22 8 8 100 Weight (g) 9.30 E-06 9.30 E-06 6.60 E-06 2.40 E-06 2.40 E-06 3.00 E-05 PPM 1755 1755 1245 453 453 5660 Substance Gold Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Molding Compound PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Die Attach PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Package Totals PPM Weight (g) 1000000 5.30 E-03 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method USEPA 3050B. ICP-OES. EN1122, method B:2001. ICP-OES. USEPA 3052. ICP-OES. EPA 3060A/7196A. UV-VIS. EPA 3540C/3550B. GC-MS. EPA 3540C/3550B. GC-MS. Method Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD. Materials Declaration Package Body Size LeadCount Option Substance Silica Epoxy Resin Phenol Resin Antimony Trioxide Additive Brominated epoxy Carbon Black Subtotal Substance Iron Nickel Manganese Cobalt Silicon Chromium Aluminum Subtotal SC 70-ISOLATED BACKSIDE -3 with Pb Molding Compound % of Compound 81.0 10.0 5.0 1.4 1.1 1.0 0.5 100.0 Weight (g) 2.26 E-03 2.79 E-04 1.39 E-04 3.90 E-05 3.07 E-05 2.79 E-05 1.39 E-05 2.79 E-03 PPM 413345 51030 25515 7144 5613 5103 2552 510303 Leadframe % of Leadframe 56.7 41.5 0.8 0.5 0.3 0.1 0.1 100.0 Weight (g) 1.25 E-03 9.13 E-04 1.76 E-05 1.10 E-05 6.60 E-06 2.20 E-06 2.20 E-06 2.20 E-03 PPM 228458 167214 3223 2015 1209 403 403 402924 Weight (g) 4.40 E-06 PPM Silver Internal Leadframe Plating % of Plating 100.0 Tin Lead Subtotal External Leadframe Plating Weight (g) % of Plating 1.70 E-04 85.0 3.00 E-05 15.0 100.0 2.00 E-04 Substance Substance Method Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD. Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Die Attach Paste PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD. PPM 31121 5492 36613 Bond Wires % of Wire 99.9 Weight (g) 3.00 E-05 PPM 5492 Substance Doped Silicon Chip % of Chip 100.0 Weight (g) 2.10 E-04 PPM 38444 Die Attach % of Die Attach 46.0 46.0 8.0 100.0 Weight (g) 1.38 E-05 1.38 E-05 2.00 E-06 2.96 E-05 PPM 2526 2526 366 5419 Substance Epoxy resin Silicon dioxide Curing agent & hardener Subtotal Molding Compound PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected 805 Gold Substance Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Package Totals PPM Weight (g) 1000000 5.46 E-03 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary