pdf

Materials Declaration
Package
Body Size
LeadCount
Option
Substance
Silica
Epoxy Resin
Phenol Resin
Antimony Trioxide
Additive
Brominated epoxy
Carbon Black
Subtotal
Substance
Iron
Nickel
Manganese
Cobalt
Silicon
Chromium
Aluminum
Subtotal
SC 70-ISOLATED BACKSIDE
-3
Pb-free
Molding Compound
% of Compound
81.0
10.0
5.0
1.4
1.1
1.0
0.5
100.0
Weight (g)
2.26 E-03
2.79 E-04
1.39 E-04
3.90 E-05
3.07 E-05
2.79 E-05
1.39 E-05
2.79 E-03
PPM
413345
51030
25515
7144
5613
5103
2552
510303
Leadframe
% of Leadframe
56.7
41.5
0.8
0.5
0.3
0.1
0.1
100.0
Weight (g)
1.25 E-03
9.13 E-04
1.76 E-05
1.10 E-05
6.60 E-06
2.20 E-06
2.20 E-06
2.20 E-03
PPM
228458
167214
3223
2015
1209
403
403
402924
Substance
Internal Leadframe Plating
% of Plating
100.0
Weight (g)
4.40 E-06
PPM
Silver
Substance
Tin
External Leadframe Plating
% of Plating
100.0
Weight (g)
2.00 E-04
PPM
36613
Substance
Gold
Bond Wires
% of Wire
99.9
Weight (g)
3.00 E-05
PPM
5492
Substance
Doped Silicon
Chip
% of Chip
100.0
Weight (g)
2.10 E-04
PPM
38444
Die Attach
% of Die Attach
46.0
46.0
8.0
100.0
Weight (g)
1.38 E-05
1.38 E-05
2.00 E-06
2.96 E-05
PPM
2526
2526
366
5419
Substance
Epoxy resin
Silicon dioxide
Curing agent & hardener
Subtotal
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Molding Compound
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MSD.
Draft IEC 62321. GC-MSD.
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Die Attach Paste
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MSD.
Draft IEC 62321. GC-MSD.
805
Package Totals
PPM
Weight (g)
5.46 E-03
1000000
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
LeadCount
Option
Molding Compound
% of Compound
87.3
4.5
3.0
3.0
2.0
0.2
100
Weight (g)
2.47 E-03
1.27 E-04
8.49 E-05
8.49 E-05
5.66 E-05
5.66 E-06
2.83 E-03
PPM
466156
24029
16019
16019
10679
1068
533970
Leadframe
% of Leadframe
97.5
2.35
0.12
0.03
100
Weight (g)
2.12 E-03
5.10 E-05
2.61 E-06
6.52 E-07
2.17 E-03
PPM
399590
9631
492
123
409836
Internal Leadframe Plating/External Leadframe Plating
Substance
% of Plating
Weight (g)
2.53 E-05
90.91
2.20 E-06
7.91
3.30 E-07
1.19
100.00
2.78 E-05
PPM
4774
415
62
5251
Substance
Silica
Phenol Resin
Epoxy Resin 1
Epoxy Resin 2
Others
Carbon Black
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
Subtotal
Nickel
Palladium
Gold
Subtotal
SC70 - COL
-3
NiPdAu
Bond Wires
% of Wire
99.99
Weight (g)
3.00 E-05
PPM
5660
Substance
Doped Silicon
Chip
% of Chip
100
Weight (g)
2.10 E-04
PPM
39623
Substance
Epoxy Resin
Metal Oxide
Glycol ethers
Silica
Curing agent & hardener
Subtotal
Die Attach
% of Die Attach
31
31
22
8
8
100
Weight (g)
9.30 E-06
9.30 E-06
6.60 E-06
2.40 E-06
2.40 E-06
3.00 E-05
PPM
1755
1755
1245
453
453
5660
Substance
Gold
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Molding Compound
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Die Attach
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Package Totals
PPM
Weight (g)
1000000
5.30 E-03
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
USEPA 3050B. ICP-OES.
EN1122, method B:2001. ICP-OES.
USEPA 3052. ICP-OES.
EPA 3060A/7196A. UV-VIS.
EPA 3540C/3550B. GC-MS.
EPA 3540C/3550B. GC-MS.
Method
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MSD.
Draft IEC 62321. GC-MSD.
Materials Declaration
Package
Body Size
LeadCount
Option
Substance
Silica
Epoxy Resin
Phenol Resin
Antimony Trioxide
Additive
Brominated epoxy
Carbon Black
Subtotal
Substance
Iron
Nickel
Manganese
Cobalt
Silicon
Chromium
Aluminum
Subtotal
SC 70-ISOLATED BACKSIDE
-3
with Pb
Molding Compound
% of Compound
81.0
10.0
5.0
1.4
1.1
1.0
0.5
100.0
Weight (g)
2.26 E-03
2.79 E-04
1.39 E-04
3.90 E-05
3.07 E-05
2.79 E-05
1.39 E-05
2.79 E-03
PPM
413345
51030
25515
7144
5613
5103
2552
510303
Leadframe
% of Leadframe
56.7
41.5
0.8
0.5
0.3
0.1
0.1
100.0
Weight (g)
1.25 E-03
9.13 E-04
1.76 E-05
1.10 E-05
6.60 E-06
2.20 E-06
2.20 E-06
2.20 E-03
PPM
228458
167214
3223
2015
1209
403
403
402924
Weight (g)
4.40 E-06
PPM
Silver
Internal Leadframe Plating
% of Plating
100.0
Tin
Lead
Subtotal
External Leadframe Plating
Weight (g)
% of Plating
1.70 E-04
85.0
3.00 E-05
15.0
100.0
2.00 E-04
Substance
Substance
Method
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MSD.
Draft IEC 62321. GC-MSD.
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Die Attach Paste
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MSD.
Draft IEC 62321. GC-MSD.
PPM
31121
5492
36613
Bond Wires
% of Wire
99.9
Weight (g)
3.00 E-05
PPM
5492
Substance
Doped Silicon
Chip
% of Chip
100.0
Weight (g)
2.10 E-04
PPM
38444
Die Attach
% of Die Attach
46.0
46.0
8.0
100.0
Weight (g)
1.38 E-05
1.38 E-05
2.00 E-06
2.96 E-05
PPM
2526
2526
366
5419
Substance
Epoxy resin
Silicon dioxide
Curing agent & hardener
Subtotal
Molding Compound
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
805
Gold
Substance
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Package Totals
PPM
Weight (g)
1000000
5.46 E-03
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary