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Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Epoxy Resin
Phenol Resin
Subtotal
Item
Cu
Fe
P
Zn
Subtotal
Ag
Item
Sn
LFCSP
4X4
16
Pb Free
Molding Compound
% of Compound
85
10
5
Weight (g)
1.19 E-02
1.40 E-03
7.01 E-04
1.40 E-02
PPM
345275
40621
20310
406205
Weight (g)
1.72 E-02
4.15 E-04
5.30 E-06
2.12 E-05
1.77 E-02
PPM
499265
12034
154
614
512066
Internal Leadframe Plating
Weight (g)
% of Plating
3.20 E-04
100
PPM
9274
External Leadframe Plating
% of Plating
Weight (g)
100
1.23 E-04
PPM
3576
Leadframe
% of Leadframe
97.5
2.35
0.03
0.12
Au
Bond Wires
% of Wire
99.99
Weight (g)
3.58 E-04
PPM
10361
Si
Chip
% of Chip
100
Weight (g)
1.72 E-03
PPM
49872
Weight (g)
2.24 E-04
7.46 E-05
2.98 E-04
PPM
6484
2161
8646
Item
Ag Filler
Resin
Subtotal
Die Attach
% of Die Attach
75
25
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected EPA Method 3051A/3052. ICP-OES
Not Detected EPA Method 3051A/3052. ICP-OES
Not Detected EPA Method 3051A/3052. ICP-OES
Not Detected EPA Method 3060A & 7196A. UV-VIS.
Not Detected EPA Method 3540C/3550C. GC/M/S.
Not Detected EPA Method 3540C/3550C. GC/M/S.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
3
Not Detected
Not Detected
Die Attach Paste
Method
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3060A & 7196A. UV-VIS.
EPA Method 3540C/3550C. GC/M/S.
EPA Method 3540C/3550C. GC/M/S.
Package Totals
PPM
Weight (g)
1000000
3.45 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Epoxy Resin
Phenol Resin
Subtotal
Item
Cu
Fe
P
Zn
Subtotal
LFCSP
4X4
16
Sn/Pb
Molding Compound
% of Compound
85
10
5
Leadframe
% of Leadframe
97.5
2.35
0.03
0.12
Weight (g)
1.19 E-02
1.40 E-03
7.01 E-04
1.40 E-02
PPM
345275
40621
20310
406205
Weight (g)
1.72 E-02
4.15 E-04
5.30 E-06
2.12 E-05
1.77 E-02
PPM
499265
12034
154
614
512066
Ag
Internal Leadframe Plating
Weight (g)
% of Plating
3.20 E-04
100
Sn
Pb
Subtotal
External Leadframe Plating
% of Plating
Weight (g)
85
1.05 E-04
15
1.85 E-05
1.23 E-04
Item
PPM
PPM
Not Detected
Not Detected
Not Detected
3
Not Detected
Not Detected
Die Attach Paste
Method
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3060A & 7196A. UV-VIS.
EPA Method 3540C/3550C. GC/M/S.
EPA Method 3540C/3550C. GC/M/S.
3039
536
3576
Weight (g)
3.58 E-04
PPM
10361
Si
Chip
% of Chip
100
Weight (g)
1.72 E-03
PPM
49872
Weight (g)
2.24 E-04
7.46 E-05
2.98 E-04
PPM
Die Attach
% of Die Attach
75
25
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Au
Item
Molding Compound
Method
PPM
Not Detected EPA Method 3051A/3052. ICP-OES
Not Detected EPA Method 3051A/3052. ICP-OES
Not Detected EPA Method 3051A/3052. ICP-OES
Not Detected EPA Method 3060A & 7196A. UV-VIS.
Not Detected EPA Method 3540C/3550C. GC/M/S.
Not Detected EPA Method 3540C/3550C. GC/M/S.
9274
Bond Wires
% of Wire
99.99
Ag Filler
Resin
Subtotal
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
6484
2161
8646
Package Totals
PPM
Weight (g)
1000000
3.45 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary