Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy Resin Phenol Resin Subtotal Item Cu Fe P Zn Subtotal Ag Item Sn LFCSP 4X4 16 Pb Free Molding Compound % of Compound 85 10 5 Weight (g) 1.19 E-02 1.40 E-03 7.01 E-04 1.40 E-02 PPM 345275 40621 20310 406205 Weight (g) 1.72 E-02 4.15 E-04 5.30 E-06 2.12 E-05 1.77 E-02 PPM 499265 12034 154 614 512066 Internal Leadframe Plating Weight (g) % of Plating 3.20 E-04 100 PPM 9274 External Leadframe Plating % of Plating Weight (g) 100 1.23 E-04 PPM 3576 Leadframe % of Leadframe 97.5 2.35 0.03 0.12 Au Bond Wires % of Wire 99.99 Weight (g) 3.58 E-04 PPM 10361 Si Chip % of Chip 100 Weight (g) 1.72 E-03 PPM 49872 Weight (g) 2.24 E-04 7.46 E-05 2.98 E-04 PPM 6484 2161 8646 Item Ag Filler Resin Subtotal Die Attach % of Die Attach 75 25 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3060A & 7196A. UV-VIS. Not Detected EPA Method 3540C/3550C. GC/M/S. Not Detected EPA Method 3540C/3550C. GC/M/S. Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected 3 Not Detected Not Detected Die Attach Paste Method EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3060A & 7196A. UV-VIS. EPA Method 3540C/3550C. GC/M/S. EPA Method 3540C/3550C. GC/M/S. Package Totals PPM Weight (g) 1000000 3.45 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy Resin Phenol Resin Subtotal Item Cu Fe P Zn Subtotal LFCSP 4X4 16 Sn/Pb Molding Compound % of Compound 85 10 5 Leadframe % of Leadframe 97.5 2.35 0.03 0.12 Weight (g) 1.19 E-02 1.40 E-03 7.01 E-04 1.40 E-02 PPM 345275 40621 20310 406205 Weight (g) 1.72 E-02 4.15 E-04 5.30 E-06 2.12 E-05 1.77 E-02 PPM 499265 12034 154 614 512066 Ag Internal Leadframe Plating Weight (g) % of Plating 3.20 E-04 100 Sn Pb Subtotal External Leadframe Plating % of Plating Weight (g) 85 1.05 E-04 15 1.85 E-05 1.23 E-04 Item PPM PPM Not Detected Not Detected Not Detected 3 Not Detected Not Detected Die Attach Paste Method EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3060A & 7196A. UV-VIS. EPA Method 3540C/3550C. GC/M/S. EPA Method 3540C/3550C. GC/M/S. 3039 536 3576 Weight (g) 3.58 E-04 PPM 10361 Si Chip % of Chip 100 Weight (g) 1.72 E-03 PPM 49872 Weight (g) 2.24 E-04 7.46 E-05 2.98 E-04 PPM Die Attach % of Die Attach 75 25 Item Pb Cd Hg Cr+6 PBB PBDE PPM Au Item Molding Compound Method PPM Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3060A & 7196A. UV-VIS. Not Detected EPA Method 3540C/3550C. GC/M/S. Not Detected EPA Method 3540C/3550C. GC/M/S. 9274 Bond Wires % of Wire 99.99 Ag Filler Resin Subtotal Item Pb Cd Hg Cr+6 PBB PBDE 6484 2161 8646 Package Totals PPM Weight (g) 1000000 3.45 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary