pdf

Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Epoxy & Phenol Resin
Carbon black
Subtotal
Item
Cu
Fe
Zn
P
Subtotal
Ag
Item
Sn
LFCSP
10 X 10 X 0.85
72
Pb-free
Molding Compound
% of Compound
86.9
12.8
0.3
Weight (g)
1.43 E-01
2.10 E-02
5.09 E-04
1.64 E-01
PPM
510965
75137
1823
587925
Weight (g)
9.76 E-02
2.19 E-03
1.13 E-04
7.30 E-05
1.00 E-01
PPM
349500
7846
405
261
358013
Internal Leadframe Plating
Weight (g)
% of Plating
9.83 E-04
100
PPM
3520
External Leadframe Plating
% of Plating
Weight (g)
100
3.18 E-03
PPM
11388
Leadframe
% of Leadframe
97.62
2.19
0.11
0.07
Au
Bond Wires
% of Wire
99.99
Weight (g)
1.71 E-03
PPM
6131
Si
Chip
% of Chip
100
Weight (g)
8.17 E-03
PPM
29268
Weight (g)
7.70 E-04
1.92 E-04
2.90 E-05
2.90 E-05
2.90 E-05
1.05 E-03
PPM
2757
688
104
104
104
3756
Item
Ag
Epoxy Resin
Metal oxide
Curing and hardening agent
Gamma Butyrolactone
Subtotal
Die Attach
% of Die Attach
73
18
3
3
3
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
3
Not Detected
Not Detected
Molding Compound
Method
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3060A & 7196A. UV-VIS
EPA Method 3540C/3550C. GC/MS.
EPA Method 3540C/3550C. GC/MS.
Die Attach Paste
Package Totals
PPM
Weight (g)
1000000
2.79 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3060A & 7196A. UV-VIS
EPA Method 3540C/3550C. GC/MS.
EPA Method 3540C/3550C. GC/MS.