Materials Declaration Package Body Size LeadCount Option Item SiO2 Resin Sb2O3 Brominated epoxy Carbon Black Subtotal Item Cu Fe Ni Zn Pd P Au Subtotal Item Sn SOT 66 -6 Pb-free Molding Compound % of Compound 79.0 18.0 1.8 1.0 0.2 Weight (g) 1.30 E-03 2.95 E-04 2.95 E-05 1.64 E-05 3.28 E-06 1.64 E-03 PPM 449862 102500 10250 5694 1139 569446 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3060A & 7196A. UV-VIS Not Detected EPA Method 3540C/3550C. GC/MS. Not Detected EPA Method 3540C/3550C. GC/MS. Weight (g) 9.34 E-04 2.19 E-05 1.12 E-05 1.21 E-06 9.70 E-07 2.33 E-07 1.46 E-07 9.70 E-04 PPM 324446 7598 3873 421 337 81 51 336806 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected External Leadframe Plating % of Plating Weight (g) 100 3.00 E-05 PPM 10416 Leadframe % of Leadframe 96.33 2.26 1.15 0.13 0.10 0.02 0.02 Au Bond Wires % of Wire 99.99 Weight (g) 5.00 E-05 PPM 17359 Si Chip % of Chip 100 Weight (g) 1.60 E-04 PPM 55556 Weight (g) 9.30 E-06 9.30 E-06 6.60 E-06 2.40 E-06 2.40 E-06 3.00 E-05 PPM Item Epoxy Resin Metal Oxide Glycol Ethers Silica Curing agent & hardener Subtotal Die Attach % of Die Attach 31 31 22 8 8 Die Attach Paste 3229 3229 2292 833 833 10417 Package Totals Weight (g) PPM 1000000 2.88 E-03 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method EPA Method 3051. ICP-AES. EPA Method 3051. ICP-AES. EPA Method 3051. ICP-AES. EPA Method 3060A & 7196A. UV-VIS EPA Method 3540C/3550C. GC/MS. EPA Method 3540C/3550C. GC/MS. CRS-RY-A