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Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2
Resin
Sb2O3
Brominated epoxy
Carbon Black
Subtotal
Item
Cu
Fe
Ni
Zn
Pd
P
Au
Subtotal
Item
Sn
SOT 66
-6
Pb-free
Molding Compound
% of Compound
79.0
18.0
1.8
1.0
0.2
Weight (g)
1.30 E-03
2.95 E-04
2.95 E-05
1.64 E-05
3.28 E-06
1.64 E-03
PPM
449862
102500
10250
5694
1139
569446
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected
EPA Method 3051A/3052. ICP-OES
Not Detected
EPA Method 3051A/3052. ICP-OES
Not Detected
EPA Method 3051A/3052. ICP-OES
Not Detected
EPA Method 3060A & 7196A. UV-VIS
Not Detected
EPA Method 3540C/3550C. GC/MS.
Not Detected
EPA Method 3540C/3550C. GC/MS.
Weight (g)
9.34 E-04
2.19 E-05
1.12 E-05
1.21 E-06
9.70 E-07
2.33 E-07
1.46 E-07
9.70 E-04
PPM
324446
7598
3873
421
337
81
51
336806
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
External Leadframe Plating
% of Plating
Weight (g)
100
3.00 E-05
PPM
10416
Leadframe
% of Leadframe
96.33
2.26
1.15
0.13
0.10
0.02
0.02
Au
Bond Wires
% of Wire
99.99
Weight (g)
5.00 E-05
PPM
17359
Si
Chip
% of Chip
100
Weight (g)
1.60 E-04
PPM
55556
Weight (g)
9.30 E-06
9.30 E-06
6.60 E-06
2.40 E-06
2.40 E-06
3.00 E-05
PPM
Item
Epoxy Resin
Metal Oxide
Glycol Ethers
Silica
Curing agent & hardener
Subtotal
Die Attach
% of Die Attach
31
31
22
8
8
Die Attach Paste
3229
3229
2292
833
833
10417
Package Totals
Weight (g)
PPM
1000000
2.88 E-03
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
EPA Method 3051. ICP-AES.
EPA Method 3051. ICP-AES.
EPA Method 3051. ICP-AES.
EPA Method 3060A & 7196A. UV-VIS
EPA Method 3540C/3550C. GC/MS.
EPA Method 3540C/3550C. GC/MS.
CRS-RY-A