SUD50N04-06H Datasheet

SUD50N04-06H
Vishay Siliconix
N-Channel 40-V (D-S), 175 °C MOSFET
FEATURES
PRODUCT SUMMARY
V(BR)DSS (V)
rDS(on) (Ω)
ID (A)c
Qg (Typ)
40
0.006 at VGS = 10 V
109
95
• TrenchFET® Power MOSFETS
• 175 °C Junction Temperature
• High Threshold Voltage At High Temperature
RoHS
COMPLIANT
TO-252
D
G
Drain Connected to Tab
G
D
S
Top View
S
Ordering Information: SUD50N04-06H-E3 (Lead (Pb)-free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
40
Gate-Source Voltage
VGS
± 20
TC = 25 °C
Continuous Drain Current (TJ = 175 °C)
a
Power Dissipation
A
100
IAS
50
L = 0.1 mH
EAS
125
mJ
TC = 25 °C
PD
136
W
TJ, Tstg
- 55 to 175
°C
Avalanche Current (Single Pulse)
Repetitive Avalanche Energy (Single Pulse)
77c
IDM
Pulsed Drain Current
V
109c
ID
TC = 100 °C
Unit
Operating Junction and Storage Temperature Range
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambientb
Junction-to-Case
Symbol
t ≤ 10 sec
Steady State
RthJA
RthJC
Typical
Maximum
15
18
40
50
0.85
1.1
Unit
°C/W
Notes:
a. Duty cycle ≤ 1 %.
b. Surface Mounted on 1" FR4 board.
c. Based on maximum allowable Junction Temperature. Package limitation current is 50 A.
Document Number: 72860
S-71661-Rev. C, 06-Aug-07
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SUD50N04-06H
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min
V(BR)DSS
VGS = 0 V, ID = 250 µA
40
VGS(th)
VDS = VGS, ID = 250 µA
3.4
IGSS
VDS = 0 V, VGS = ± 20 V
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
IDSS
± 100
VDS = 40 V, VGS = 0 V
1
VDS = 40 V, VGS = 0 V, TJ = 125 °C
50
VDS = 40 V, VGS = 0 V, TJ = 175 °C
150
ID(on)
VDS = 5 V, VGS = 10 V
50
VGS = 10 V, ID = 20 A
Drain-Source On-State Resistancea
Forward Transconductancea
5.0
rDS(on)
gfs
µA
0.006
0.009
VGS = 10 V, ID = 20 A, TJ = 175 °C
0.012
20
nA
A
0.0049
VGS = 10 V, ID = 20 A, TJ = 125 °C
VDS = 15 V, ID = 15 A
V
50
Ω
S
b
Dynamic
Input Capacitance
Ciss
Output Capacitance
Coss
Reversen Transfer Capacitance
Crss
Total Gate Chargec
Qg
Gate-Source Chargec
Qgs
c
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Time
c
td(on)
c
td(off)
Rise Timec
Turn-Off Delay Time
tr
Fall Timec
6700
VGS = 0 V, VDS = 25 V, f = 1 MHz
pF
600
320
95
VDS = 20 V, VGS = 10 V, ID = 50 A
37
f = 1.0 MHz
1.7
nC
21
VDD = 20 V, RL = 0.4 Ω
ID ≅ 50 A, VGEN = 10 V, Rg = 2.5 Ω
tf
Ω
20
30
95
145
50
75
12
20
ns
Source-Drain Diode Ratings and Characteristics (TC = 25 °C)b
IS
50
Pulsed Current
ISM
100
Forward Voltagea
VSD
IF = 30 A, VGS = 0 V
0.90
1.50
V
trr
IF = 30 A, di/dt = 100 A/µs
40
60
ns
Continuous Current
Reverse Recovery Time
A
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 72860
S-71661-Rev. C, 06-Aug-07
SUD50N04-06H
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C unless noted
100
100
VGS = 10 thru 7 V
6V
80
I D - Drain Current (A)
I D - Drain Current (A)
80
60
40
20
60
40
TC = 125 °C
20
25 °C
5V
- 55 °C
0
0
0
2
4
6
8
0
10
1
2
3
4
5
6
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
160
7
0.010
TC = - 55 °C
25 °C
r DS(on) - On-Resistance (Ω)
g fs - Transconductance (S)
0.008
120
125 °C
80
40
0
VGS = 10 V
0.006
0.004
0.002
0.000
0
10
20
30
40
50
60
0
60
80
100
ID - Drain Current (A)
Transconductance
On-Resistance vs. Drain Current
20
V GS - Gate-to-Source Voltage (V)
Ciss
C - Capacitance (pF)
40
VGS - Gate-to-Source Voltage (V)
8400
6300
4200
2100
Coss
0
20
Crss
0
VDS = 20 V
ID = 50 A
16
12
8
4
0
5
10
15
20
25
30
35
40
0
25
50
75
100
125
150
VDS - Drain-to-Source Voltage (V)
Qg - Total Gate Charge (nC)
Capacitance
Gate Charge
Document Number: 72860
S-71661-Rev. C, 06-Aug-07
175
200
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SUD50N04-06H
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C unless noted
2.0
100
VGS = 10 V
ID = 20 A
I S - Source Current (A)
rDS(on) - On-Resistance
(Normalized)
1.7
1.4
1.1
TJ = 150 °C
TJ = 25 °C
10
0.8
0.5
- 50
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1
- 25
0
25
50
75
100
125
150
175
0.3
0.6
0.9
1.2
TJ - Junction Temperature (°C)
VSD - Source-to-Drain Voltage (V)
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
1.5
Document Number: 72860
S-71661-Rev. C, 06-Aug-07
SUD50N04-06H
Vishay Siliconix
THERMAL RATINGS
1000
125
*Limited
by rDS(on)
100
10 µs
100 µs
I D - Drain Current (A)
I D - Drain Current (A)
100
75
50
Limited By Package
25
0
1 ms
10
10 ms
dc, 100 ms
1
TC = 25 °C
Single Pulse
0.1
0
25
50
75
100
125
150
175
0.1
TC - Case Temperature (°C)
Maximum Avalanche and Drain Current
vs. Case Temperature
1
10
100
VDS - Drain-to-Source Voltage (V)
*VGS > minimum V GS at which rDS(on) is specified
Safe Operating Area
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.02
0.05
Single Pulse
0.01
10- 4
10- 3
10- 2
Square Wave Pulse Duration (sec)
10- 1
1
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability
data, see http://www.vishay.com/ppg?72860.
Document Number: 72860
S-71661-Rev. C, 06-Aug-07
www.vishay.com
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Document Number: 91000
Revision: 18-Jul-08
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