REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Updated drawing to the latest requirements of MIL-PRF-38534. -sld 16-03-07 Charles F. Saffle B Paragraph 1.4: Correct “Supply voltage (VIN - VOUT)” from “-30 V dc to -24 V dc” to “-3.0 V dc to -24 V dc”. -gc 16-06-21 Charles F. Saffle REV SHEET REV SHEET REV STATUS REV B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Gary Zahn STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 CHECKED BY Greg Cecil http://www.landandmaritime.dla.mil/ APPROVED BY Charles F. Saffle DRAWING APPROVAL DATE 10-07-13 REVISION LEVEL B MICROCIRCUIT, HYBRID, LINEAR, NEGATIVE, LOW DROPOUT, ADJUSTABLE VOLTAGE REGULATOR SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 1 OF 5962-09214 13 5962-E432-16 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 Federal stock class designator \ R RHA designator (see 1.2.1) 09214 01 Device type (see 1.2.2) / K Device class designator (see 1.2.3) X Case outline (see 1.2.4) A Lead finish (see 1.2.5) \/ Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices meet the MIL-PRF-38534 specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type 01 Generic number MSK 5973RH Circuit function Radiation hardened, -1.5 A, adjustable voltage regulator 1.2.3 Device class designator. This device class designator is a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C, and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09214 A REVISION LEVEL B SHEET 2 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter U X Y Z Descriptive designator Terminals Package style See figure 1 See figure 1 See figure 1 See figure 1 3 3 3 3 Bottom terminal chip carrier, ceramic TO-257AA with tab, straight leads, glass sealed TO-257AA with tab, leads formed up, glass sealed TO-257AA with tab, leads formed down, glass sealed 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Supply voltage (VIN - VOUT)......................................................... Output current ............................................................................ Junction temperature (TJ) .......................................................... Thermal resistance, junction-to-case (θJC), TC = +125°C: Case outline U ........................................................................ Case outlines X, Y, and Z ....................................................... Storage temperature .................................................................. Lead temperature (soldering, 10 seconds) ................................ -30 V dc -1.5 A 2/ +150°C 4.1°C/W 4.8°C/W -65°C to +150°C +300°C 1.4 Recommended operating conditions. Supply voltage (VIN - VOUT) ........................................................ Case operating temperature range (TC)..................................... -3.0 V dc to -24 V dc -55°C to +125°C 1.5 Radiation features. ≥ 100 Krads (Si) 2/ 3/ 4/ Maximum total dose available .................................................. 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 1/ 2/ 3/ 4/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end-point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883, method 1019, condition A. Dose rate shall be in accordance with MIL-STD-883, method 1019, condition A. Bipolar device types may degrade from displacement damage from radiation which could affect RHA levels. These device types have not been characterized for displacement damage. See figure 3. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09214 A REVISION LEVEL B SHEET 3 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Radiation exposure circuits. The radiation exposure circuits shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of devices. Marking of devices shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DLA Land and Maritime-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime-VA shall affirm that the manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09214 A REVISION LEVEL B SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ 3/ -55°C ≤ TC ≤ +125°C unless otherwise specified Group A subgroups Device type Reference voltage VREF 3.0 V ≤ │(VIN - VOUT) │ ≤ 30 V 1,2,3 01 Adjust pin current IADJ 3.0 V ≤ │(VIN - VOUT) │≤ 30 V 1,2,3 01 Adjust pin current change ∆ IADJ 3.0 V ≤ │(VIN - VOUT) │ ≤ 30 V 1 01 2,3 Line regulation VRLINE 3.0 V ≤ │(VIN - VOUT) │ ≤ 30 V 1 01 2,3 Load regulation VRLOAD VIN = -8 V, VOUT ≤ -5 V, 10 mA ≤ IOUT ≤ 1.5 A 1 01 2,3 Current limit ILIM VIN = -10 V, VOUT -5 V Minimum load current 4/ IMIN │ VIN - VOUT │ = 30 V, TC = +25°C Ripple rejection 4/ RR VOUT = -10 V, COUT = 10 µF, f = 120 Hz 1/ 2/ 3/ 4/ 1,2,3 01 1 01 1,2,3 01 Limits Unit Min Max -1.30 -1.20 V 100 µA -5 5 µA -6 6 -0.02 0.02 -0.05 0.05 -25 25 -50 50 -1.5 %/V mV A 5 66 mA dB Device type 01 has been characterized through all levels M, D, P, L, R of irradiation and tested to 1.5 times the R level. Pre and post irradiation values are identical unless otherwise specified in table I. When performing post irradiation electrical measurements for any RHA level, TC = +25°C. Unless otherwise specified, VIN = VOUT - 5 V, IOUT = -10 mA, COUT = 10 µF. These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end-point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883, method 1019, condition A. Guaranteed by design but not tested. Parameter shall be tested as part of the initial characterization and after design and process changes. Parameter shall be guaranteed to limits specified in table I for all lots not specifically tested. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09214 A REVISION LEVEL B SHEET 5 Case outline U. Symbol A A1 b b1 b2 b3 D D1 E e S1 S2 Millimeters Min Max --3.30 0.305 0.457 9.27 9.78 10.29 10.80 3.30 3.81 3.86 4.11 15.62 16.13 0.76 11.18 11.68 0.89 0.81 1.07 1.14 1.40 Inches Min --.012 .365 .405 .130 .152 .615 .030 .440 .035 .032 .045 Max .130 .018 .385 .425 .150 .162 .635 .460 .042 .055 NOTES: 1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inchpound units shall rule. 2. Lead identification for reference only. 3. Case outline U weight: 2.2 grams typical. FIGURE 1. Case outlines. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09214 A REVISION LEVEL B SHEET 6 Case outline X. Symbol A A1 A2 øb D D1/E e e1 L L1 øP S1 Millimeters Min Max --5.33 0.89 1.14 2.79 3.30 0.71 0.81 16.26 16.76 10.29 10.80 2.54 TYP 5.08 REF 10.16 --13.39 13.64 3.56 3.81 2.73 REF Inches Min Max --.210 .035 .045 .110 .130 .028 .032 .640 .660 .405 .425 .100 TYP .200 REF .400 --.527 .537 .140 .150 .1075 REF NOTES: 1. Pin 1 is indicated by the ESD marking on the package. Pin numbers are for reference only. 2. The U. S. Government preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall take precedence. 3. Case outline X weight: 3.2 grams typical. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09214 A REVISION LEVEL B SHEET 7 Case outline Y. Symbol A A1 A2 øb D D1/E e e1 L L1 L2 øP S1 Millimeters Min Max --5.33 0.89 1.14 2.79 3.30 0.71 0.81 16.26 16.76 10.29 10.80 2.54 TYP 5.08 REF 2.16 2.67 13.39 13.64 5.08 --3.56 3.81 2.73 REF Inches Min Max --.210 .035 .045 .110 .130 .028 .032 .640 .660 .405 .425 .100 TYP .200 REF .085 .105 .527 .537 .200 --.140 .150 .1075 REF NOTES: 1. Pin 1 is indicated by the ESD marking on the package. Pin numbers are for reference only. 2. The U. S. Government preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall take precedence. 3. Case outline Y weight: 3.2 grams typical. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09214 A REVISION LEVEL B SHEET 8 Case outline Z. Symbol A A1 A2 øb D D1/E e e1 L L1 L2 øP S1 Millimeters Min Max --5.33 0.89 1.14 2.79 3.30 0.71 0.81 16.26 16.76 10.29 10.80 2.54 TYP 5.08 REF 2.16 2.67 13.39 13.64 5.08 --3.56 3.81 2.73 REF Inches Min Max --.210 .035 .045 .110 .130 .028 .032 .640 .660 .405 .425 .100 TYP .200 REF .085 .105 .527 .537 .200 --.140 .150 .1075 REF NOTES: 1. Pin 1 is indicated by the ESD marking on the package. Pin numbers are for reference only. 2. The U. S. Government preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall take precedence. 3. Case outline Z weight: 3.2 grams typical. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09214 A REVISION LEVEL B SHEET 9 Device type 01 Case outlines U X, Y, and Z Terminal number Terminal symbol Terminal symbol 1 ADJUST ADJUST 2 VOUT VIN 3 VIN VOUT NOTE: Case outlines X, Y, and Z: The case / mounting flange is isolated from the internal circuitry. FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09214 A REVISION LEVEL B SHEET 10 FIGURE 3. Radiation exposure circuits. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09214 A REVISION LEVEL B SHEET 11 TABLE II. Electrical test requirements. MIL-PRF-38534 test requirements Subgroups (in accordance with MIL-PRF-38534, group A test table) Interim electrical parameters --- Final electrical parameters 1*, 2, 3 Group A test requirements 1, 2, 3 Group C end-point electrical parameters 1, 2, 3 End-point electrical parameters for radiation hardness assurance (RHA) devices 1 * PDA applies to subgroup 1. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. b. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DLA Land and Maritime-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TC = +125°C minimum, or.as specified in accordance with table I of method 1015 of MIL-STD-883. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance with MIL-PRF-38534 and as specified herein. 4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, 8, 9, 10, and 11 shall be omitted. 4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09214 A REVISION LEVEL B SHEET 12 4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows: a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DLA Land and Maritime-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TC = +125°C minimum, or as specified in accordance with table I of method 1005 of MIL-STD-883. (3) Test duration: 1,000 hours minimum as specified in 1005 of MIL-STD-883. 4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534. 4.3.5 Radiation Hardness Assurance (RHA) inspection. RHA qualification is required for those devices with the RHA designator as specified herein. End-point electrical parameters for RHA devices shall be specified in table II. Radiation testing will be in accordance with the qualifying activity (DLA Land and Maritime-VQ) approved plan and with MIL-PRF-38534, Appendix G. 4.3.5.1 Total dose irradiation testing. Total dose irradiation testing shall be in accordance with MIL-STD-883 method 1019, condition A and as specified herein. Testing shall be performed at initial qualification and after any design or process changes which may affect the RHA response of the device type. The initial wafer of the radiation hardened active element shall be tested in the hybrid circuit with a minimum of 8 devices tested (4 devices under bias and 4 devices not under bias) in accordance with MIL-STD-883 method 1019, condition A. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534. 6.4 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires configuration control and the applicable SMD to that system. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108. 6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-1081. 6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors, listed in MIL-HDBK103 and QML-38534, have submitted a certificate of compliance (see 3.7 herein) to DLA Land and Maritime-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09214 A REVISION LEVEL B SHEET 13 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 16-06-21 Approved sources of supply for SMD 5962-09214 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962R0921401HUA 5962R0921401HUC 5962R0921401HXA 5962R0921401HXC 5962R0921401HYA 5962R0921401HYC 5962R0921401HZA 5962R0921401HZC 31597 31597 31597 31597 31597 31597 31597 31597 MSK 5973HRHL MSK 5973HRHL MSK 5973HRHS MSK 5973HRHS MSK 5973HRHU MSK 5973HRHU MSK 5973HRHD MSK 5973HRHD 5962R0921401KUA 5962R0921401KUC 5962R0921401KXA 5962R0921401KXC 5962R0921401KYA 5962R0921401KYC 5962R0921401KZA 5962R0921401KZC 31597 31597 31597 31597 31597 31597 31597 31597 MSK 5973KRHL MSK 5973KRHL MSK 5973KRHS MSK 5973KRHS MSK 5973KRHU MSK 5973KRHU MSK 5973KRHD MSK 5973KRHD 1/ 2/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its availability. Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 31597 Vendor name and address Anaren Incorporated 6635 Kirkville Road East Syracuse, NY 13057-9672 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.